JP2004288823A - Substrate carrier system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate carrier system in which an air current generated with the lifting and lowering of a substrate lift is inhibited and the adhesion of a foreign substance on the carried substrate can be prevented. <P>SOLUTION: The substrate carrier system has a lift passage forming body 5, and the substrate lift 7 installed in the forming body 5. An upper substrate carrier line 11a and a lower substrate carrier line 11b are connected to the forming body 5, and the substrate 50 is taken in and out to and from the lift 7. Ventilation sections 17a and 17b conducting a ventilation between the inside and outside of the forming body 5 are formed to the forming body 5. The substrate lift 7 has a substrate placing section 21 and clean-air blow-out devices 23 spraying clean air against the substrate 50 placed on the placing section 21. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate transport system provided with a substrate elevator for vertically transporting a substrate, and more particularly to a substrate transport system equipped with a substrate elevator capable of suitably transporting a substrate used for an RGB color filter or the like.
[0002]
[Prior art]
In order to efficiently manufacture a substrate such as an RGB color filter, it is necessary to appropriately transport such a substrate to various processing lines. Various processing lines are not necessarily provided on the same plane, and when a substrate is transported between processing lines not provided on the same plane, means for moving the substrate in the vertical direction is required. As a means for moving the substrate 50 in the vertical direction, a substrate transport system 1 having a substrate elevator 7 as shown in FIGS. 3 and 4 has been widely used in the past.
[0003]
The substrate transport system 1 shown in FIGS. 3 and 4 includes a hoistway forming body 5 that forms the hoistway 3, a substrate hoist 7 that moves up and down the hoistway 3, and an upper part that is provided in front of the substrate hoist 7. It includes a substrate transport line 11a and a lower substrate transport line 11b provided at a stage subsequent to the substrate elevator 7. Each of the substrate elevator 7, the upper substrate transfer line 11 a, and the lower substrate transfer line 11 b has a carry-in port 31 for carrying in the substrate 50 from the outside and a carry-out port 33 for carrying out the substrate 50 to the outside, The portions other than the carry-in port 31 and the carry-out port 33 are covered with the cover 15, and have a substantially closed structure. Further, a filter device (clean air blowing device) 23 for purifying outside air and blowing it into the inside is attached to the cover 15 of the hoistway forming body 5, the upper substrate transfer line 11a and the lower substrate transfer line 11b. Clean air from which foreign matter has been removed (clean air) is blown into the interior.
[0004]
In such a substrate transport system 1, the substrate 50 sent via the upper substrate transport line 11a is carried into the substrate elevator 7 in the substrate elevator 7 and is placed on the substrate platform 21 (see FIG. 3). ). Then, the substrate 50 is lowered to the height of the lower substrate transport line 11b together with the substrate elevator 7 and is carried out to the lower substrate transport line 11b. Then, the substrate 50 is sent to the subsequent stage via the lower substrate transfer line 11b. On the other hand, the substrate elevator 7 rises again to the height of the upper substrate transport line 11a and prepares for a new substrate 50 to be carried into the substrate elevator 7 (see FIG. 4). By using such a substrate transfer system 1, the substrate 50 can be smoothly moved in the vertical direction, and the substrate 50 is transferred from the upper substrate transfer line 11a provided above to the lower substrate transfer line 11b provided below. Can be conveyed continuously.
[0005]
[Problems to be solved by the invention]
Inside the conventional substrate elevator 7 described above, as the substrate elevator 7 moves up and down, an airflow such as an upflow (upflow) or a downflow (downflow) shown in FIGS. 3 and 4 is generated. In particular, when the substrate elevator 7 moves up and down while the substrate 50 is placed, or when the substrate elevator 7 moves up and down at a relatively high speed, such an airflow is likely to occur. When the substrate elevator 7 has the above-described configuration, the influence of the airflow generated as the substrate elevator 7 moves up and down is controlled by the upper substrate transfer line via the entrance 31 and the exit 33. 11a and the lower substrate transfer line 11b. Due to the influence of such airflow, air is blown onto the substrate 50 being transported on the upper substrate transport line 11a and the lower substrate transport line 11b and the substrate 50 placed on the substrate platform 21 of the substrate elevator 7. As a result, foreign matter in the air may adhere.
[0006]
That is, when the substrate elevator 7 moves up and down, the air pressure fluctuates easily above and below the substrate elevator 7 and inside the upper substrate transport line 11a and the lower substrate transport line 11b, and airflow is likely to occur. For example, when the substrate elevator 7 is raised (up), the pressure below the substrate mounting part 21 and the inside of the lower substrate transfer line 11b is negative, while when the substrate elevator 7 is lowered (down), the substrate is lifted. Negative pressure is applied to the upper part of the mounting part 21 and the inside of the upper substrate transfer line 11a. In a place where such a negative pressure is formed, dirty outside air containing foreign matter is introduced through each of the carry-in ports 31, the carry-out ports 33, or the minute gaps formed in the cover 15, the hoistway forming body 5, and the like. May invade. Therefore, the substrate 50 placed on the substrate placing portion 21 of the substrate elevator 7 and the substrate 50 being transported on each of the transport lines 11a and 11b are affected by the airflow generated as the substrate elevator 7 moves up and down. As a result, outside air containing foreign matter may be blown. In such a case, foreign matter adheres to the substrate 50 in the upper substrate transfer line 11a or the lower substrate transfer line 11b, and finally, a final product (such as an RGB color filter) formed on the substrate 50 The yield will be degraded.
[0007]
The present invention has been made in consideration of the above-described matters, and can suppress an airflow generated as the substrate elevator moves up and down, thereby preventing foreign matter from adhering to a substrate being transported. It is an object to provide a substrate transfer system.
[0008]
[Means for Solving the Problems]
The present invention relates to a hoistway forming body having an outer peripheral portion and forming a hoistway inside, a substrate mounting portion for mounting a loaded substrate, and a substrate mounted on the substrate mounting portion. A substrate elevating device which is provided inside the hoistway forming body and is capable of moving up and down the hoistway formed by the hoistway forming body; and Connected to a body, an upper substrate transport line for taking the substrate in and out of the substrate elevator, and connected to a position lower than a connection position of the upper substrate transport line to the hoistway forming body in the hoistway forming body, A lower substrate transport line for taking the substrate in and out of the substrate elevator, wherein the hoistway forming body is provided with a ventilation portion capable of ventilating between the inside and the outside of the hoistway forming body as the substrate elevator moves up and down. Formed It is a substrate conveying system wherein are.
[0009]
According to the present invention, when the substrate elevator is moved up and down, ventilation is performed through the ventilation part, so that the momentum of the airflow generated below the substrate elevator is suppressed, and the influence of the airflow is caused by the upper substrate transfer line and the lower substrate. It is difficult to reach the transfer line, and it is possible to prevent the clean air blown by the clean air blowing device from blowing air that mixes foreign substances into the substrate mounted on the substrate mounting portion.
[0010]
It is preferable that the ventilation portion is formed at a position of the hoistway forming body below a connection position of the upper substrate transfer line to the hoistway forming body. Further, it is preferable that the ventilation portion is formed at a position of the hoistway forming body below a connection position of the lower substrate transport line to the hoistway forming body. In the present invention, such a ventilation portion can be provided on the outer peripheral portion of the hoistway forming body or the like.
[0011]
It is preferable that an opening is formed between the substrate elevator and an outer peripheral portion of the hoistway forming body so as to allow ventilation between the inside and the outside of the hoistway forming body.
[0012]
The clean air ejection device has an air purification unit that purifies air outside the substrate elevator into clean air, and clean air that is blown against a substrate placed on the substrate placement unit is: It is preferable that the clean air is purified by the air purifying unit.
[0013]
It is preferable that an opening is formed between the substrate elevator and an outer peripheral portion of the hoistway forming body so as to allow ventilation between the inside and the outside of the hoistway forming body.
[0014]
The clean air ejection device has an air purification unit that purifies air outside the substrate elevator into clean air, and clean air purified by the air purification unit is placed on the substrate placement unit. It is preferable that the spray be applied to the substrate.
[0015]
It is preferable that the substrate lift further includes a lift cover provided so as to cover the substrate mounting portion. The elevator cover can be provided so as to cover, for example, an upper side and / or a lower side of the substrate mounting portion. With the lift cover, it is possible to prevent air (air) other than clean air from being blown against the substrate placed on the substrate placing portion. Further, when the lift cover has an air-permeable opening, clean air blown from the clean air jetting device to the substrate on the substrate mounting portion can be jetted outward from the opening. It becomes.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
[0017]
As shown in FIG. 1, the substrate transport system 1 according to the present embodiment includes a hoistway forming body 5 that forms a hoistway 3, a substrate hoist 7 provided inside the hoistway forming body 5, An upper substrate transport line 11a and a lower substrate transport line 11b connected to the body 5 are provided.
[0018]
The upper substrate transfer line 11a is located above the lower substrate transfer line 11b, and both the upper substrate transfer line 11a and the lower substrate transfer line 11b are arranged on a substantially horizontal plane. Therefore, the lower substrate transport line 11b is connected to a position below the connection position of the upper substrate transport line 11a to the hoistway path forming body 5 in the hoistway path forming body 5. For this reason, when comparing the connection position with respect to the hoistway forming body 5, the upper substrate transfer line 11a is connected to the upper position of the hoistway forming body 5, and the lower substrate transfer line 11b is connected to the lower position of the hoistway forming body 5. (See FIG. 1).
[0019]
As shown in FIG. 1, the upper substrate transport line 11a and the lower substrate transport line 11b cover the transport conveyors 13a and 13b for transporting the substrate 50 and the periphery of the transport conveyors 13a and 13b. It has outside air blocking covers 15a and 15b provided. The transport conveyors 13a and 13b are configured by combining a plurality of rollers, so that the supplied substrate 50 can be automatically transported in the horizontal direction. The outside air blocking covers 15a and 15b prevent the outside air from entering the upper substrate transfer line 11a or the lower substrate transfer line 11b, and the outside air is blocked with respect to the substrate 50 transferred on the transfer conveyors 13a and 13b. Is prevented from being sprayed. The upper substrate transport line 11a having such a configuration is adapted to carry the substrate 50 supplied from outside the present substrate transport system 1 into the substrate elevator 7. On the other hand, the lower substrate transport line 11b transports the substrate 50 unloaded from the substrate elevator 7 to the subsequent stage of the substrate transport system 1.
[0020]
The hoistway forming body 5 has a bottom part 5a and an outer peripheral part 5b provided so as to surround above the bottom part 5a. The bottom portion 5a and the outer peripheral portion 5b of the hoistway forming body 5 are provided integrally, and the hoistway 3 extending in the vertical direction is defined therein.
[0021]
Ventilation portions 17a and 17b are formed in the outer peripheral portion 5b of the hoistway formation body 5, and ventilation can be performed between the inside and the outside of the hoistway formation body 5 through the ventilation portions 17a and 17b. ing. In the present embodiment, the outer peripheral portion 5b of the hoistway formation body 5 is located below the connection position of the upper substrate transport line 11a to the hoistway formation body 5, and is located below the hoistway formation body 5. At a position above the connection position of the substrate transport line 11b, a mesh ventilation portion 17a formed in a mesh shape such as a punching plate is formed. In addition, a slit-shaped ventilation portion 17b formed in a slit shape is formed at a position of the outer peripheral portion 5b of the hoistway forming body 5 below a position where the lower substrate transfer line 11b is connected to the hoistway forming body 5. . In addition, through such a mesh-shaped ventilation portion 17a and a slit-shaped ventilation portion 17b, air can be freely ventilated between the inside and the outside of the hoistway forming body 5.
[0022]
The substrate elevator 7 is provided with a substrate mounting portion 21 for mounting the substrate 50 loaded from the upper substrate transfer line 11a, and clean air (clean) for the substrate 50 mounted on the substrate mounting portion 21. A filter device (clean air blowing device) 23 for blowing air, and elevator covers 27a and 27b provided to cover the substrate mounting portion 21. The substrate elevator 7 having the substrate mounting portion 21, the filter device 23, and the elevator covers 27a and 27b can vertically move the elevator 3 formed inside the elevator formation member 5 in the vertical direction. Is configured.
[0023]
The substrate mounting portion 21 has a conveyor structure in which a plurality of rollers are combined, and automatically moves the substrate 50 loaded from the outside (the upper substrate transport line 11a or the lower substrate transport line 11b) to an appropriate position. While being placed, the placed substrate 50 can be automatically carried out to the outside (upper substrate transfer line 11a or lower substrate transfer line 11b). The filter device 23 has an air purifier 24 for purifying air (outside air) outside the substrate elevator 7 into clean air (clean air). The clean air purified by the air purifier 24 is mounted on the substrate. The spray is applied to the substrate 50 mounted on the mounting portion 21. The elevator covers 27a and 27b are provided so as to cover the upper side and the lower side of the substrate mounting portion 21, and the elevator cover 27a that covers the upper side of the substrate mounting portion 21 has no opening. The lift cover 27b which is formed in a flat plate shape and covers the lower side of the substrate mounting portion 21 is formed in a punching plate shape having an opening. The elevator covers 27a and 27b having such a configuration prevent air (air) other than the clean air from the filter device 23 from being blown to the substrate 50 placed on the substrate placing portion 21. It has become.
[0024]
Further, filter devices 23a and 23b similar to the filter device 23 included in the substrate elevator 7 are attached to the outside air blocking covers 15a and 15b of the upper substrate transport line 11a and the lower substrate transport line 11b. These filter devices 23a, 23b blow clean air purified by the air purifiers 24a, 24b into the outside air blocking covers 15a, 15b of the upper substrate transport line 11a or the lower substrate transport line 11b. ing. Accordingly, the inside of the outside air blocking cover 15a of the upper substrate transfer line 11a and the inside of the outside air blocking cover 15b of the lower substrate transfer line 11b are kept substantially filled with the clean air blown by the filter devices 23a and 23b. .
[0025]
On the other hand, between the substrate elevator 7 and the outer peripheral portion 5b of the hoistway formation body 5, an opening 25 that allows ventilation between the inside and the outside of the hoistway formation body 5 is formed. Since the substrate lift 7 vertically moves up and down the vertically extending hoistway 3, the opening 25 is maintained in an open state even when the substrate lift 7 is moved up and down, so that free ventilation is possible. I have.
[0026]
Next, the operation of the substrate transport system 1 according to the present embodiment having such a configuration will be described.
[0027]
In the substrate transport system 1 of the present embodiment, first, the substrate elevator 7 is arranged at a position (upper transport position) where the substrate mounting section 21 and the upper substrate transport line 11a are at substantially the same height, and the upper substrate transport Prepare for the substrate 50 sent via the line 11a. Then, the substrate 50 is carried into the substrate elevator 7 via the upper substrate transport line 11a, and the substrate 50 is placed on the substrate platform 21 of the substrate elevator 7 (see FIG. 1). Then, as shown in FIG. 1, the substrate elevator 7 having the substrate 50 mounted on the substrate mounting part 21 descends on the hoistway 3.
[0028]
At this time, clean air is continuously blown from the filter device 23 to the substrate 50 mounted on the substrate mounting portion 21. By blowing clean air on the substrate 50 in this way, it is possible to prevent air around the substrate mounting portion 21 from being blown onto the substrate 50, and to remove foreign matter mixed in the air. Adhering to the substrate 50 is effectively prevented.
[0029]
On the other hand, when the substrate elevator 7 descends, ventilation is appropriately performed between the inside and the outside of the hoistway forming body 5 through the ventilation part (mesh ventilation part 17a, slit ventilation part 17b) and the opening 25. The pressure in the space S defined by the bottom 5a and the outer peripheral portion 5b of the hoistway forming body 5 and the substrate lift 7 can be stably maintained at a substantially constant pressure (atmospheric pressure in the present embodiment). Thereby, the momentum of the airflow generated below the substrate elevator 7 as the substrate elevator 7 descends can be effectively suppressed, and the influence of the airflow reaches the upper substrate transport line 11a and the lower substrate transport line 11b. Can be prevented.
[0030]
Further, the elevator covers 27a and 27b can prevent the air other than the clean air from the filter device 23 from being blown to the substrate 50 placed on the substrate placing portion 21. In this way, the elevating covers 27a and 27b prevent the air that mixes foreign matter from being blown onto the substrate 50 mounted on the substrate mounting portion 21 due to the influence of the air current generated as the substrate elevating device 7 descends. Can be prevented.
[0031]
Then, the substrate elevator 7 descends to a position (a lower transfer position) at which the substrate mounting portion 21 and the lower substrate transfer line 11b have substantially the same height, and stops. Then, the substrate 50 placed on the substrate platform 21 of the substrate elevator 7 is carried out to the lower substrate transport line 11b, and is sent to the subsequent stage of the present substrate transport system 1 via the lower substrate transport line 11b. On the other hand, the substrate elevator 7 from which the substrate 50 has been unloaded from the substrate mounting portion 21 is moved up the hoistway 3 and is disposed at the upper transport position, and the new substrate 50 sent via the upper substrate transport line 11a is moved. Prepare. Then, when the substrate 50 is carried into the substrate elevator 7 from the upper substrate transport line 11a, the substrate elevator 7 transports the substrate 50 to the lower substrate transport line 11b in the same manner as described above. In this way, the substrate 50 continuously sent through the upper substrate transfer line 11a is continuously sent to the lower substrate transfer line 11b via the substrate elevator 7.
[0032]
Various devices constituting the upper substrate transport line 11a, the substrate elevator 7 and the lower substrate transport line 11b are appropriately controlled by a control device (not shown), and the substrate 50 is moved upward and downward by the substrate elevator 7. The substrate is appropriately transferred from the transfer line 11a to the lower substrate transfer line 11b.
[0033]
The above description is for the case where the substrate 50 is transported from the upper substrate transport line 11a to the lower substrate transport line 11b. However, the case where the substrate 50 is transported from the lower substrate transport line 11b to the upper substrate transport line 11a ( In FIG. 2), the various devices of the substrate transfer system 1 function in substantially the same manner.
[0034]
That is, in such a case, the substrate 50 is carried into the substrate elevator 7 arranged at the lower transport position from the lower substrate transport line 11 b, and the substrate 50 is placed on the substrate platform 21. Then, the substrate elevator 7 moves up the hoistway 3 (see FIG. 2). While the substrate elevator 7 is being lifted, clean air is continuously blown from the filter device 23 to the substrate 50 placed on the substrate platform 21, and air around the substrate platform 21 and Foreign matter mixed in the air is prevented from being sprayed on the substrate 50. On the other hand, between the inside and the outside of the hoistway formation body 5, ventilation is performed through the ventilation part (mesh ventilation part 17 a, slit-like ventilation part 17 b) and the opening 25, and the bottom part of the hoistway formation body 5 is formed. The air pressure in the space S defined by the 5a, the outer peripheral portion 5b, and the substrate elevator 7 is stably kept substantially constant. Thereby, the momentum of the airflow generated below the substrate elevator 7 with the rise of the substrate elevator 7 is suppressed, and the influence of the airflow is prevented from reaching the upper substrate transport line 11a and the lower substrate transport line 11b. . The elevator covers 27a and 27b prevent the air that mixes foreign substances from being blown onto the substrate 50 placed on the substrate platform 21 due to the influence of the air current generated by the rise of the substrate elevator 7. Can be. Then, the substrate elevator 7 rises to the upper transfer position and stops, and the substrate 50 mounted on the substrate mounting portion 21 is carried out to the upper substrate transfer line 11a and passes through the upper substrate transfer line 11a. The substrate is transferred to the subsequent stage of the substrate transfer system 1. On the other hand, the substrate elevator 7 from which the substrate 50 has been unloaded from the substrate mounting portion 21 moves down the hoistway 3 and is arranged at the lower transport position, and the new substrate 50 sent via the lower substrate transport line 11b is moved. Prepare. In this way, the substrate 50 continuously sent through the lower substrate transfer line 11b is continuously sent to the upper substrate transfer line 11a via the substrate elevator 7.
[0035]
As described above, according to the present embodiment, ventilation is performed between the inside and the outside of the hoistway formation body 5 through the ventilation portions 17a and 17b and the opening 25, and the ventilation is caused by the elevation of the substrate elevator 7. The momentum of the airflow is suppressed. Accordingly, the influence of the airflow is unlikely to reach the upper substrate transport line 11a or the lower substrate transport line 11b, and even when the substrate elevator 7 moves up and down the hoistway 3, the upper substrate transport line 11a or Air is less likely to be blown onto the substrate 50 in the lower substrate transfer line 11b. For this reason, it is possible to effectively prevent foreign matters mixed in the air from being sprayed and adhered to the substrate 50 in the upper substrate transfer line 11a or the lower substrate transfer line 11b.
[0036]
In addition, when the substrate elevator 7 moves up and down, clean clean air is blown from the filter device 23 to the substrate 50 placed on the substrate placement unit 21. Thus, it is possible to prevent the air around the substrate mounting portion 21 from being blown to the substrate 50, and to prevent foreign substances from adhering to the substrate 50.
[0037]
In the outer peripheral portion 5b of the hoistway formation body 5, a ventilation portion (mesh ventilation portion 17a, slit-like ventilation portion 17b) is provided below the connection position of the upper substrate transfer line 11a to the hoistway formation body 5. Is formed. For this reason, when the substrate elevator 7 descends from the upper transport position, the inside of the elevator shaft forming body 5 (the bottom and outer peripheral portions of the elevator shaft forming body and the substrate elevator) are connected through the ventilation portions 17a and 17b. Smooth ventilation can be performed between the partitioned space S) and the outside. On the other hand, a ventilation portion (slit-shaped ventilation portion 17b) is formed at a position below the connection position of the lower substrate transport line 11b to the hoistway formation body 5 in the outer peripheral portion 5b of the hoistway formation body 5. For this reason, when the substrate elevator 7 rises from the lower transport position, the inside of the hoistway formation body 5 (the bottom and outer periphery of the hoistway formation body and the substrate elevator) are formed through the ventilation portion 17b. Smooth ventilation can be performed between the space S) and the outside. As described above, when the substrate elevator 7 moves up and down, appropriate ventilation is performed between the outside and the inside of the hoistway forming body 5 via the ventilation sections 17a and 17b. For this reason, the air pressure in the space S defined by the bottom 5a and the outer peripheral portion 5b of the hoistway forming body 5 and the substrate elevator 7 is efficiently and stably maintained, and the momentum of the air current generated by the elevation of the substrate elevator 7 Can be effectively suppressed. When the substrate elevator 7 rises from the lower transfer position, the mesh ventilation portion 17a is gradually positioned below the substrate elevator 7 as the substrate elevator 7 moves upward. Also in the mesh ventilation part 17a located below the elevator 7, smooth ventilation is performed between the inside and the outside of the hoistway formation body 5.
[0038]
In addition, when the substrate elevator 7 is moved up and down, the ventilation between the inside and the outside of the shaft formation 5 is also performed in the opening 25 formed between the substrate elevator 7 and the outer peripheral portion 5b of the shaft formation 5. Done. For this reason, the pressure in the space S defined by the bottom 5a and the outer peripheral portion 5b of the hoistway forming body 5 and the substrate elevator 7 is kept more stable, and the force of the airflow generated by the elevation of the substrate elevator 7 is further increased. It can be suppressed effectively.
[0039]
In addition, by using the filter device 23 having the air purification unit 24, the air outside the substrate elevator 7 can be effectively used.
[0040]
In addition, the elevator covers 27a and 27b prevent the air mixed with foreign matter from being blown against the substrate 50 placed on the substrate platform 21 due to the influence of the airflow generated by the elevation of the substrate elevator 7. Can be prevented. Accordingly, it is possible to prevent foreign matter in the air from adhering to the substrate 50 placed on the substrate placing portion 21. In particular, by covering the substrate mounting portion 21 with the elevator cover 27a having an opening, clean air from the filter device 23 is blown out of the substrate elevator 7 through the opening, and the substrate elevator 7 is opened. Is prevented from being blown onto the substrate 50 placed on the substrate placing portion 21 more effectively.
[0041]
Note that the present invention is not limited to the above-described embodiment, and various design changes and the like can be added as needed.
[0042]
For example, in the above-described embodiment, a case has been described in which the substrate 50 is vertically moved between two transport lines arranged vertically (between the upper substrate transport line 11a and the lower substrate transport line 11b). However, the present invention can be suitably applied to the case where the substrate 50 is vertically moved between three or more transfer lines arranged in the vertical direction. That is, in the above-described embodiment, a center transfer line (not shown) is provided between the upper substrate transfer line 11a and the lower substrate transfer line 11b. In addition to the above, the present invention is also applied to the case where the substrate 50 is vertically moved between “between the upper substrate transfer line 11a and the center transfer line” or “between the lower substrate transfer line 11b and the center transfer line”. Therefore, substantially the same operation and effect as those of the above embodiment can be expected.
[0043]
【The invention's effect】
As described above, according to the substrate transport system of the present invention, since ventilation is performed between the inside and the outside of the hoistway formation body through the ventilation part, the lower part of the substrate elevator is moved with the elevation of the substrate elevator. The generated air current is effectively suppressed. This makes it difficult for the airflow to affect the upper substrate transport line and the lower substrate transport line, thereby preventing the air containing foreign matter from being blown against the substrates in the upper substrate transport line and the lower substrate transport line. it can. Also, since clean air is blown by the clean air blowing device on the substrate mounted on the substrate mounting portion, it is necessary to prevent air containing foreign matter from being blown against the substrate. Can be. In this manner, foreign matter is prevented from being blown onto the substrate transferred between the upper substrate transfer line and the lower substrate transfer line via the substrate elevator, thereby preventing foreign matter from being applied to the substrate. Adherence can be effectively prevented.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating a schematic configuration of a substrate transfer system according to the present invention, and is a diagram illustrating a substrate transfer system that transfers a substrate from an upper substrate transfer line to a lower substrate transfer line.
FIG. 2 is a diagram illustrating a schematic configuration of a substrate transfer system according to the present invention, and is a diagram illustrating a substrate transfer system that transfers a substrate from a lower substrate transfer line to an upper substrate transfer line.
FIG. 3 is a diagram showing a schematic configuration of a conventional substrate transfer system.
FIG. 4 is a diagram showing a schematic configuration of a conventional substrate transport system.
[Explanation of symbols]
1 Board transfer system
3 hoistway
5 hoistway formation
7 Substrate elevator
11a Upper substrate transfer line
11b Lower substrate transfer line
15a, 15b Outside air blocking cover
5a Bottom of hoistway formation
5b Outer periphery of hoistway forming body
17a, 17b ventilation section
21 Substrate mounting part
23 Filter device
24 Air Purification Department
25 opening
27a, 27b Elevator cover
50 substrates

Claims (6)

A hoistway forming body that has an outer peripheral portion and forms a hoistway inside,
A substrate mounting portion for mounting the loaded substrate and a clean air ejecting device for blowing clean air to the substrate mounted on the substrate mounting portion; A substrate elevator provided inside and capable of elevating the hoistway formed by the hoistway forming body,
An upper substrate transport line connected to the hoistway forming body and for taking a substrate in and out of the substrate elevator.
A lower substrate transport line connected to a position lower than a connection position of the upper substrate transport line with respect to the hoistway former in the hoistway former, and taking a substrate in and out of the substrate elevator.
A substrate transport system, wherein a ventilation portion is formed in the hoistway forming body so as to allow ventilation between the inside and the outside of the hoistway forming body as the substrate elevator moves up and down. 2. The substrate transport system according to claim 1, wherein the ventilation unit is formed at a position below a connection position of the upper substrate transport line with respect to the hoistway former in the hoistway former. 3. . The substrate according to claim 1, wherein the ventilation portion is formed at a position lower than a connection position of the lower substrate transport line with respect to the hoistway forming body in the hoistway forming body. Transport system. 4. An opening which allows ventilation between the inside and the outside of the hoistway forming body is formed between the substrate elevator and the outer peripheral part of the hoistway forming body. A substrate transport system according to any one of the above. The clean air ejection device has an air purification unit that purifies air outside the substrate elevator into clean air,
The clean air blown against the substrate placed on the substrate placing section is clean air purified by the air purifying section. Substrate elevator. The substrate lift according to any one of claims 1 to 5, wherein the substrate lift further includes a lift cover provided so as to cover the substrate mounting portion.

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