JP2004286644A - Pressure sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pressure sensor, making it possible to mount a chip component to be connected to the connector pin, without deteriorating productivity and also increasing the number of parts. <P>SOLUTION: In the connector housing 13, the pressure detection element 16 is installed and its output is taken out from a connector pin 19 through a bonding wire 18. Then, terminals 19a1 to 19c1 of the terminal 19 are arranged in the bottom of a recess 27, formed in the connector housing 13. A chip capacitor 28 for noise preventing measures is soldered or welded with these terminals 19a1 to 19c1 with silver paste at these terminals 19a1 to 19c1 in the bottom surface of the recess 27. In this case, the productivity is enhanced because the chip capacitor 28 can be installed directly, for instance by using a chip mounter, without decomposing the connector housing 13. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a pressure sensor having a chip component connected to a connector pin.
[0002]
[Problems to be solved by the invention]
Conventionally, as a countermeasure against noise of the pressure sensor, as shown in FIG. 4, a chip capacitor 3 is mounted between the connector pins 2 inside the connector of the pressure sensor by soldering. Low.
Instead of such low-reliability soldering, mounting with a highly reliable silver paste is performed.
[0003]
However, as shown in FIG. 4, the space inside the connector 1 of the pressure sensor is very narrow, and in order to join and bond the chip capacitor 2 with silver paste, as shown in FIG. There is a method in which the connector 1a is divided into two connectors 1a and 1b, and the chip capacitor 3 is heated and hardened with silver paste on the connector 1a, and then the connector 1b is integrated with the connector 1a. Overall, the cost increases.
[0004]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a pressure sensor that can mount chip components connected to connector pins without reducing productivity and without increasing the number of components. To provide.
[0005]
[Means for Solving the Problems]
According to the first aspect of the present invention, when the second housing is in a single state, the surface on which the pressure detecting element is mounted is exposed to the outside, so that the chip component can be easily mounted on the same surface with the connector pins and the metal paste. Can be electrically connected to Further, since the chip component is protected by the protection member, the chip component can be isolated from the pressure transmitting medium.
[0006]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
FIG. 2 is a cross-sectional view schematically illustrating the entire pressure sensor. In FIG. 2, the pressure sensor 11 is formed by caulking a metal body housing (corresponding to a first housing) 12 and a resin connector housing (corresponding to a second housing) 13 by caulking. . A depression 14 is formed in the lower surface of the connector housing 13 in the figure, and a depression 15 is formed in the center of the depression 14, and a pressure detecting element 16 is arranged in the depression 15. That is, the pressure detecting element 16 is fixed to the concave portion 15 of the connector housing 13 with an adhesive while being anodically bonded to the glass pedestal 17, and its electrode is provided so as to surround the pressure detecting element 16 through the bonding wire 18. The ground terminal 19a, the Vcc terminal 19b, and the Vout terminal 19c (see FIG. 1C) of the respective connector pins 19 are connected.
[0007]
A pressure introduction hole 20 is formed in the main body housing 12 made of metal. A metal thin disk-shaped sealing diaphragm 21 is attached to the upper surface of the main body housing 12 so as to close the pressure introducing hole 20, and a metal annular pressing member is provided on the outer periphery of the sealing diaphragm 21. 22 is attached. The entire periphery of the pressing member 22 is welded to the main housing 12 via the seal diaphragm 21, whereby one end of the pressure introducing hole 20 is closed by the seal diaphragm 21 in a liquid-tight manner.
[0008]
In a state where the main body housing 12 and the connector housing 13 are integrated, a liquid sealing space 23 is formed between the seal diaphragm 21 and the recessed portion 14 of the connector housing 13, and the liquid sealing space 23 is a pressure transmitting medium. For example, silicone oil 24 is sealed.
[0009]
Since the main body housing 12 and the connector housing 13 are merely brought into close contact with each other by crimping, an O-ring is formed in the groove 25 formed in the connector housing 13 as a means for sealing the liquid filling space 23 in a liquid-tight manner. When the housings 12 and 13 are integrated by caulking, the silicon oil 24 is sealed by crushing the O-ring 26 with a metal flange-shaped pressing member 22 that presses the seal diaphragm 21. .
[0010]
Here, a concave portion 27 is formed in the concave portion 14 of the connector housing 13, and a ground terminal 19 a 1, a Vcc terminal 19 b 1, and a Vout terminal 19 c 1 of each connector pin 19 are provided on the bottom surface of the concave portion 27. That is, each connector pin 19 has its terminals 19a to 19c located so as to surround the pressure detecting element 16 and its shape is set to have each terminal 19a1 to 19c1 located at the bottom surface of the concave portion 27. I have. In this case, as the terminals 19a1 to 19c1 located in the concave portion 27, the ground terminal 19a is located at the center, the Vcc terminal 19b and the Vout terminal 19c are located on both sides thereof, and between the Vcc terminal 19b and the ground terminal 19a and between the Vcc terminal 19a and the Vout terminal. A chip capacitor (corresponding to a chip component) 28 for noise suppression is joined and adhered between the terminal 19c and the ground terminal 19a with a silver paste (corresponding to a metal paste).
[0011]
In FIG. 3 showing the connector housing 13 in cross section, a sealing material 29 as a protection member is potted on each of the terminals 19a to 19c and 19a1 to 19c1, thereby ensuring the liquid tightness of the connector pin 19 with respect to the silicon oil 24. And the chip capacitor 28 is protected so as to be isolated from the silicon oil 24.
[0012]
Next, a method of manufacturing the pressure sensor having the above configuration will be described.
First, the glass pedestal 17 and the pressure detecting element 16 are fixed to the concave portion 15 of the connector housing 12, and are electrically connected to the connector pins 19 by the bonding wires 18.
[0013]
Next, a silver paste is applied to the terminals 19a to 19c located on the bottom surface of the concave portion 27 by a dispenser, and then a chip capacitor 28 is mounted by a chip mounter.
Then, the chip capacitor 28 is bonded and adhered to the terminals 19a to 19c by heat curing (see FIG. 1B), and then the sealing material 29 is potted to the terminal portions 19a to 19c and 19a1 to 19c1 (FIG. 1 (c)).
[0014]
Next, the O-ring 26 is disposed at the position shown in FIG. 1, and the pressure detecting element 16 side of the connector housing 13 is turned up (upside down in FIG. 2). The silicon oil 24 is weighed at a constant weight, and is metered by a dispenser or the like. Alternatively, the connector housing 13 may be placed on a weighing machine, and the silicone oil 24 may be injected, and the injection may be stopped when the weight increases by a certain amount, so that the amount of the silicon oil becomes a certain amount. The certain amount in this case is an amount in which the seal diaphragm 21 becomes an ideal diaphragm shape as the pressure sensor 11 when the silicone oil 24 is sealed.
[0015]
Next, the main body housing 12 to which the seal diaphragm 21 is welded all around is lowered so as to fit into the connector housing 13 while keeping the horizontal from above, and is pressed until the upper end surface 13a of the connector housing 13 and the pressing member 22 are sufficiently in contact with each other. The main body housing 12 is fixed by caulking all around.
The pressure sensor 11 can be manufactured as described above.
[0016]
According to such an embodiment, the chip capacitor 28 for noise suppression is mounted on the same surface of the connector housing 13 on which the pressure detecting element 16 is mounted. 19 can be easily joined and bonded to the 19 terminals 19a1 to 19c1, and the connection reliability of the chip capacitor 28 can be ensured. Therefore, unlike the conventional example in which the connector housing is divided in order to mount the chip capacitor in the connector housing with silver paste, the chip capacitor 28 can be mounted without dividing the connector housing 13, and the production is improved. A pressure sensor can be produced without deterioration in performance.
Moreover, as a result of mounting the chip capacitor 28 on the same surface as the pressure detecting element 16, the chip capacitor 28 can be mounted by the chip mounter following mounting of the pressure detecting element 16, and productivity can be further improved.
[0017]
The present invention is not limited to the above embodiment, and may be applied to mounting of chip components other than chip capacitors according to the circuit configuration.
[Brief description of the drawings]
FIG. 1 is a plan view of a connector housing showing a manufacturing procedure according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of a pressure sensor. FIG. 3 is a cross-sectional view of a main part of the connector housing. Top view of connector [Figure 5] Cross-sectional view of connector [Explanation of reference numerals]
11 is a pressure sensor, 12 is a main body housing (first housing), 13 is a connector housing (second housing), 19 is a connector pin, 23 is a liquid sealing space, 24 is silicone oil (pressure transmission medium), and 28 is A chip capacitor (chip component) 28 is a sealing material (protective member).

Claims (2)

A first housing having a diaphragm that is displaced in accordance with the pressure of a pressure working medium introduced from outside;
A second housing having a pressure detection element that converts the applied pressure into a signal and outputs the signal,
A liquid sealing space closed by the diaphragm and the second housing in a state where the first housing and the second housing are integrated;
A pressure transmission medium sealed in the liquid sealing space;
A connector pin provided on the second housing, for outputting a signal from the pressure detecting element;
In the pressure sensor including the connector pin and the connected chip component,
The chip component is mounted on the same surface of the second housing on which the pressure detecting element is mounted, electrically connected to the connector pin and metal paste, and separated from the pressure transmitting medium by a protection member. Pressure sensor. The pressure sensor according to claim 1, wherein the chip component is a chip capacitor.

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