JP2004286292A - Hot water supply device - Google Patents

Hot water supply device Download PDF

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Publication number
JP2004286292A
JP2004286292A JP2003078387A JP2003078387A JP2004286292A JP 2004286292 A JP2004286292 A JP 2004286292A JP 2003078387 A JP2003078387 A JP 2003078387A JP 2003078387 A JP2003078387 A JP 2003078387A JP 2004286292 A JP2004286292 A JP 2004286292A
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hot water
temperature
storage tank
heat
heat exchanger
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JP3900098B2 (en
Inventor
Jun Iwase
潤 岩瀬
Hisasuke Sakakibara
久介 榊原
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Denso Corp
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Denso Corp
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/12—Hot water central heating systems using heat pumps

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  • Heat-Pump Type And Storage Water Heaters (AREA)
  • Steam Or Hot-Water Central Heating Systems (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently operate a hot water supply system. <P>SOLUTION: This hot water supply device is constituted so as to supply high temperature hot water to a floor heating panel 30, and heat supply hot and cold water by circulating the hot water flowing out of the floor heating panel 30 to a second hot water supply heat exchanger 42. Thus, since the temperature of return hot water dropped in the temperature after finishing heat radiation by the second hot water supply heat exchanger 42 drops up to about the temperature of tap water supplied to the second hot water supply heat exchanger 42, even if the return hot water flowing out of the second hot water supply heat exchanger 42 is returned to the lower side of a hot water storage tank 10, a temperature rise in low temperature water on the lower side of the hot water storage tank 10 can be prevented. As a result, because of the reduction in a temperature difference between the low temperature water and a high temperature refrigerant can be prevented when heating the low temperature water on the lower side of the hot water storage tank 10 by a heat pump unit 20 (a high pressure side heat exchanger 22), reduction in quantity of heat applicable to the hot water from the heat pump unit 20 can be prevented. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、給湯装置に関するもので、温水を用いた床暖房等の暖房及び台所や風呂に温水を供給する給湯を行う給湯装置に適用して有効である。
【０００２】
【従来の技術】
従来の温水を用いた暖房システムは、貯湯タンクの上方側から高温の温水を取り出し、この高温の温水を熱源として暖房を行った後、温度の低下した温水を貯湯タンクの下方側に戻すとともに、貯湯タンク内の低温の温水、つまり貯湯タンクの下方側に溜まった温水を加熱することにより、再び高温の温水を生成している（例えば、特許文献１参照）。
【０００３】
【特許文献１】
特開昭５９−７７２３３号公報
【０００４】
【発明が解決しようとする課題】
ところで、貯湯タンクには、約８０℃〜９０℃程度の高温の温水が保温貯蔵されており、この高温の温水を用いて例えば床暖房を行うと、床暖房用熱交換器にて放熱を終えた戻り温水の温度は、約４０℃〜５０℃となり、この戻り水の温度は、通常、貯湯タンク内の低温の温水温度より高い。
【０００５】
このため、ヒートポンプユニット等の加熱装置の加熱温度と加熱対象である温水との温度が小さくなり、加熱装置から温水に与えることができる熱量が減少してしまう。
【０００６】
また、加熱装置としてヒートポンプ装置を用いると、図４からも明らかなように、ヒートポンプ装置の高圧側熱交換器から温水に与えることができる熱量が減少しても圧縮機の動力は同じであるため、ヒートポンプ装置の運転効率が低下してしまう。
【０００７】
本発明は、上記点に鑑み、第１には、従来と異なる新規な給湯装置を提供し、第２には、給湯装置を効率よく運転することを目的とする。
【０００８】
【課題を解決するための手段】
本発明は、上記目的を達成するために、請求項１に記載の発明では、温水を保温貯蔵する貯湯タンク（１０）と、加熱されて高温になった温水を貯湯タンク（１０）に供給する温水生成手段（２０）と、貯湯タンク（１０）内の温水から熱の供給を受けて作動する第１受熱機器（３０）と、第１受熱機器（３０）にて熱を与えて温度が低下した温水から熱の供給を受けて作動する第２受熱機器（４２）とを備えることを特徴とする。
【０００９】
これにより、貯湯タンク（１０）に戻る温水の温度を十分に低下させるることができるので、温水と温水生成手段（２０）との温度差が小さくなってしまうことを防止でき、温水生成手段（２０）から温水に与えることができる熱量が減少してしまうことを防止できる。
【００１０】
請求項２に記載の発明では、貯湯タンク（１０）及び第１、２受熱機器（３０、４２）を繋ぐ温水回路は閉回路であり、かつ、この閉回路に封入された温水は防錆作用を有する流体であることを特徴とするものである。
【００１１】
請求項３に記載の発明では、温水生成手段（２０）は、貯湯タンク（１０）内の温水のうち下方側に位置する低温の温水を加熱し、加熱されて高温になった温水を貯湯タンク（１０）の上方側に戻し、第１、２受熱機器（３０、４２）のうち少なくとも一方の受熱機器に熱を与えて温度が低下した戻り温水の温度が、低温の温水の温度より高いときに、貯湯タンク（１０）内のうち戻り温水の温度と略等しい温度の温水が溜まっている温度層に戻り温水を戻す温水戻し手段（５１、５２、６１、６２）を備えることを特徴とする。
【００１２】
これにより、貯湯タンク（１０）の下方側に溜まった低温の温水と温水生成手段（２０）との温度差が小さくなってしまうことを確実に防止できるので、温水生成手段（２０）から温水に与えることができる熱量が減少してしまうことを防止できる。
【００１３】
因みに、上記各手段の括弧内の符号は、後述する実施形態に記載の具体的手段との対応関係を示す一例である。
【００１４】
【発明の実施の形態】
（第１実施形態）
本実施形態は、本発明に係る給湯装置を家庭用の給湯装置に用いたもので、図１は本実施形態に係る給湯装置の模式図である。
【００１５】
この給湯装置は、温水を保温貯蔵する貯湯タンク１０、貯湯タンク１０内の温水のうち下方側に位置する低温の温水を加熱し、加熱されて高温になった温水を貯湯タンク１０の上方側に戻す温水生成手段をなすヒートポンプユニット２０、貯湯タンク１０内の温水を熱源として室内の暖房を行う床暖房パネル３０、及び貯湯タンク１０内の温水を熱源として給湯水を加熱する給湯用の第１、２熱交換器４１、４２等からなるものである。
【００１６】
そして、貯湯タンク１０、床暖房パネル３０及び第２給湯用熱交換器４２を繋ぐ温水回路Ｌ１、及び貯湯タンク１０及び第１給湯用熱交換器４１を繋ぐ温水回路Ｌ２は、共に温水を他から供給されることなく温水が何度も循環する閉回路となっており、かつ、これらの閉回路Ｌ１、Ｌ２には、防錆作用を有する流体が所定量封入されている。
【００１７】
なお、本実施形態では、防錆作用を有する流体、つまり温水としてエチレングリコール系の不凍液が混入された水を採用している。
【００１８】
また、床暖房パネル３０は、貯湯タンク１０の上方側から取り出された下方側に位置する温水より温度の高い高温水にて床を加熱することにより室内の暖房を行う第１受熱機器であり、第２給湯用熱交換器４２は、床暖房パネル３０にて熱を与えて温度が低下した温水から熱の供給を受けて給湯水を加熱する第２受熱機器であり、第１給湯用熱交換器４１は、貯湯タンク１０の上方側から取り出された高温水から熱の供給を受けて給湯水を加熱する熱交換器である。
【００１９】
なお、ポンプ１１〜１３は温水を循環させるもので、第１、２熱交換器４１、４２では、温水と給湯水とが対向流れで熱交換される。
【００２０】
また、ヒートポンプユニット２０は、冷媒を吸入圧縮する圧縮機２１、圧縮機２１から吐出した高温の冷媒と給湯用の温水とを熱交換する高圧側熱交換器２２、高圧側熱交換器２２から流出した冷媒を減圧する減圧器２３、及び減圧された低温の冷媒と外気とを熱交換する低圧側熱交換器２４を有し、低温側の熱を高温側に移動させる周知の蒸気圧縮式ヒートポンプ装置である。なお、高圧側熱交換器２２は、ポンプ２５により冷媒流れと温水流れとが対向流れとなるように構成されている。
【００２１】
なお、本実施形態では、冷媒として二酸化炭素を用いて高圧側冷媒圧力を冷媒の臨界圧力以上まで上昇させるとともに、かつ、減圧器２３は高圧側熱交換器２２を流出した冷媒温度に基づいてヒートポンプユニット２０の成績係数が所定値以上となるようにその開度を調節して高圧側冷媒圧力を制御している。
【００２２】
また、圧縮機２１の回転数は、高圧側熱交換器２２にて所望の熱量が発生するように制御される。具体的には、低圧側熱交換器２４から吸熱できる熱量が小さいときには回転数を上昇させ、吸熱できる熱量が大きいときには回転数を低下させる。
【００２３】
さらに、本実施形態では、高圧側熱交換器２２に流入する冷媒の温度を８０℃〜９０℃以上とするとともに、高圧側熱交換器２２と貯湯タンク１０との間で温水を循環させるポンプ１３の回転数、つまり高圧側熱交換器２２と貯湯タンク１０との間で循環させる温水流量を制御することにより、８０℃〜９０℃以上の高温の温水が貯湯タンク１０の上部に供給されるようにしている。
【００２４】
また、第１バルブ５１は第１給湯用熱交換器４１から流出する戻り温水を、貯湯タンク２１内のうち中間温度相当の温水が溜まっている中間高さ部に戻す場合と、低温水が溜まった貯湯タンク１０の下方側に戻す場合とを切り替える弁手段である。
【００２５】
温度センサ６１は第１給湯用熱交換器４１から流出する戻り温水の温度を検出する温度検出手段であり、第１バルブ５１は温度センサ６１の検出温度に基づいて制御される。
【００２６】
また、第２バルブ５２は床暖房パネル３０から流出する戻り温水を、貯湯タンク２１内のうち中間温度相当の温水が溜まっている中間高さ部に戻す場合と、低温水が溜まった貯湯タンク１０の下方側に戻す場合とを切り替える弁手段である。
【００２７】
温度センサ６２は床暖房パネル３０から流出する戻り温水の温度を検出する温度検出手段であり、第２バルブ５２は温度センサ６２の検出温度に基づいて制御される。
【００２８】
なお、本実施形態では、第１、２バルブ５１、５２及び温度センサ６１、６２等が特許請求の範囲に記載された「温水戻し手段」に相当する。
【００２９】
因みに、両戻り水が戻る貯湯タンク１０の位置は、戻り温水の温度と略等しい温度の温水が溜まっている温度層に対応する位置であり、本実施形態では、予め試験により確認された位置に戻すように、その予め戻り位置が固定されているが、本実施形態は、これに限定されるものではなく、例えば特願２００１−３８９３１０号出願のごとく、複数箇所の戻り位置を予め設定しておき、戻り温水の温度に応じて実際に戻す戻し位置を変更してもよい。
【００３０】
次に、本実施形態に係る給湯装置の特徴的作動及びその効果を述べる。
【００３１】
１．床暖房のみを行う場合
ポンプ１２を停止した状態でポンプ１１を稼動させて床暖房パネル３０に高温（例えば、９０℃）の温水を供給するとともに、床暖房パネル３０にて放熱を終えて温度が低下した戻り温水の温度が、貯湯タンク１０下方側に溜まった低温水の温度より高いとき、又は所定温度より高いには、第２バルブ５２を開いて、貯湯タンク１０内のうち戻り温水の温度と略等しい温度の温水が溜まっている中間温度層に戻り温水を戻す。
【００３２】
逆に、低下した戻り温水の温度が、貯湯タンク１０下方側に溜まった低温水の温度以下のとき、又は所定温度以下のときには、第２バルブ５２を閉じて戻り温水を低温水が溜まった貯湯タンク１０の下方側に戻す。
【００３３】
これにより、貯湯タンク１０下方側の低温水をヒートポンプユニット２０（高圧側熱交換器２２）にて低温水を加熱する際に、低温水と高温冷媒との温度差が小さくなってしまうことを防止できるので、ヒートポンプユニット２０から温水に与えることができる熱量が減少してしまうことを防止でき、ヒートポンプユニット２０、つまり給湯装置を効率よく運転することができる。
【００３４】
２．床暖房を行いながら給湯を行う場合
２．１ 第１モード
ポンプ１１を稼動させて床暖房パネル３０に高温の温水を供給するとともに、床暖房パネル３０から流出する温水を第２給湯用熱交換器４２に循環させて給湯水を加熱する。
【００３５】
このとき、床暖房パネル３０に供給する温水温度が例えば約９０℃であるとすると、床暖房パネル３０から流出して第２給湯用熱交換器４２に流入する温水の温度は約５０℃となるので、この５０℃の温水にて給湯水を加熱すれば、約４０℃〜５０℃の給湯水を供給することができる。
【００３６】
したがって、第２給湯用熱交換器４２にて放熱を終えて温度が低下した戻り温水の温度は、第２給湯用熱交換器４２に供給される水道水の温度、つまり加熱される前の温度（例えば、９℃〜１７℃）程度まで低下するので、第２給湯用熱交換器４２から流出する戻り温水を貯湯タンク１０の下方側に戻しても、貯湯タンク１０下方側の低温水の温度が上昇してしまうことを防止できる。
【００３７】
延いては、貯湯タンク１０下方側の低温水をヒートポンプユニット２０（高圧側熱交換器２２）にて低温水を加熱する際に、低温水と高温冷媒との温度差が小さくなってしまうことを防止できるので、ヒートポンプユニット２０から温水に与えることができる熱量が減少してしまうことを防止でき、ヒートポンプユニット２０、つまり給湯装置を効率よく運転することができる。
【００３８】
２．２ 第２モード
ところで、最終的にユーザに供給される給湯水の温度は、混合栓により冷水（水道水）と加熱された給湯水との混合比率を調節するにより決定され、かつ、混合栓に供給される給湯水の温度は、給湯装置から供給される高温の給湯水の流量を調節することにより、例えば所定温度に維持される。
【００３９】
しかし、給湯水の流量を小さくしてもユーザが求める給湯温度を得ることができないとき、又は第２給湯用熱交換器４２から流出する給湯水の温度が所定温度以下のときには、ポンプ１２を稼動させて第２給湯用熱交換器４２から流出した給湯水を第１給湯用熱交換器４１にて更に加熱してユーザが求める給湯温度の給湯水を供給する。
【００４０】
因みに、ポンプ１２は、温度センサ６３により検出された給湯水の温度がユーザが求める給湯温度又は所定温度となるように第１給湯用熱交換器４１に供給する高温水、つまり貯湯タンク１０の上方側から第１給湯用熱交換器４１に供給する温水の流量を調節する。
【００４１】
このとき、第１給湯用熱交換器４１にて放熱を終えて温度が低下した戻り温水の温度が、貯湯タンク１０下方側に溜まった低温水の温度より高いとき、又は所定温度より高いには、第１バルブ５１を開いて、貯湯タンク１０内のうち戻り温水の温度と略等しい温度の温水が溜まっている中間温度層に戻り温水を戻す。
【００４２】
逆に、低下した戻り温水の温度が、貯湯タンク１０下方側に溜まった低温水の温度以下のとき、又は所定温度以下のときには、第１バルブ５１を閉じて戻り温水を低温水が溜まった貯湯タンク１０の下方側に戻す。
【００４３】
３．給湯のみ行う場合
ポンプ１１を停止した状態でポンプ１２を稼動させて第２給湯用熱交換器４２から流出した給湯水を第１給湯用熱交換器４１にて加熱してユーザが求める給湯温度の給湯水を供給する。
【００４４】
なお、ポンプ１２及び第１バルブ５１の制御は、床暖房を行いながら給湯を行う場合の第２モードと同じである。
【００４５】
（第２実施形態）
本実施形態は、図２に示すように、温度センサ６２を廃止し、床暖房のみを行う場合には、床暖房パネル３０から流出する戻り温水の温度によらず、床暖房パネル３０から流出する戻り温水を中間温度層に戻り温水を戻すものである。
【００４６】
（第３実施形態）
本実施形態は、図３に示すように、温度センサ６１を廃止し、第１給湯用熱交換器４１にて給湯水を加熱する場合には、第１給湯用熱交換器４１から流出する戻り温水の温度によらず、床暖房パネル３０から流出する戻り温水を中間温度層に戻り温水を戻すものである。
【００４７】
（第４実施形態）
本実施形態は、図５に示すように第１給湯用熱交換器４１と第２給湯用熱交換器４２を並列に配置し、ユーザが求める給水温度をコントロールするものである。
【００４８】
（その他の実施形態）
上述の実施形態では、貯湯タンク１０内の温水から熱の供給を受けて作動する受熱機器として床暖房パネル３０を例に本発明を説明したが、本発明はこれに限定されるものではなく、受熱機器として浴槽内の温水の保温、追い炊きや浴室乾燥機等としてもよく、その用途は限定されるものではない。
【００４９】
また、上述の実施形態では、温水生成手段としてヒートポンプユニット２０を用いたが、本発明はこれに限定されるものではなく、例えばシーズヒータや燃焼器等を温水生成手段として採用してもよい。
【図面の簡単な説明】
【図１】本発明の第１実施形態に係る給湯装置の模式図である。
【図２】本発明の第２実施形態に係る給湯装置の模式図である。
【図３】本発明の第３実施形態に係る給湯装置の模式図である。
【図４】ヒートポンプ装置のｐ−ｈ線図である。
【図５】本発明の第５実施形態に係る給湯装置の模式図である。
【符号の説明】
１０…貯湯タンク１、２０…ヒートポンプユニット、
３０…床暖房パネル、４１…第１給湯用熱交換器、
４２…第２給湯用熱交換器。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a hot water supply device, and is effective when applied to a hot water supply device that performs heating such as floor heating using hot water and hot water for supplying hot water to a kitchen or bath.
[0002]
[Prior art]
A conventional heating system using hot water takes out high-temperature hot water from the upper side of the hot water storage tank, performs heating using the high-temperature hot water as a heat source, and then returns the low-temperature hot water to the lower side of the hot water storage tank, By heating the low-temperature hot water in the hot-water storage tank, that is, the hot water collected on the lower side of the hot-water storage tank, high-temperature hot water is generated again (for example, see Patent Document 1).
[0003]
[Patent Document 1]
JP-A-59-77233
[Problems to be solved by the invention]
By the way, in the hot water storage tank, high-temperature hot water of about 80 ° C. to 90 ° C. is insulated and stored. When, for example, floor heating is performed using this high-temperature hot water, heat release is finished by the floor heating heat exchanger. The temperature of the returned hot water is about 40 ° C. to 50 ° C., and the temperature of the returned water is usually higher than the low-temperature hot water in the hot water storage tank.
[0005]
For this reason, the heating temperature of the heating device such as a heat pump unit and the temperature of the hot water to be heated become small, and the amount of heat that can be given to the hot water from the heating device decreases.
[0006]
When a heat pump device is used as the heating device, as is clear from FIG. 4, even if the amount of heat that can be given to the hot water from the high-pressure side heat exchanger of the heat pump device decreases, the power of the compressor is the same. As a result, the operation efficiency of the heat pump device is reduced.
[0007]
In view of the above points, the present invention firstly provides a novel hot water supply device different from the conventional one, and secondly, aims to operate the hot water supply device efficiently.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, according to the first aspect of the present invention, a hot water storage tank (10) for keeping hot water warmly stored and hot water heated to a high temperature are supplied to the hot water storage tank (10). Hot water generating means (20), a first heat receiving device (30) that operates by receiving heat from hot water in a hot water storage tank (10), and heat is applied by the first heat receiving device (30) to lower the temperature. A second heat receiving device (42) that operates by receiving heat supplied from the heated water.
[0009]
Thus, the temperature of the hot water returning to the hot water storage tank (10) can be sufficiently reduced, so that the temperature difference between the hot water and the hot water generating means (20) can be prevented from becoming small, and the hot water generating means ( 20) It is possible to prevent the amount of heat that can be given to warm water from decreasing.
[0010]
According to the second aspect of the present invention, the hot water circuit connecting the hot water storage tank (10) and the first and second heat receiving devices (30, 42) is a closed circuit, and the hot water sealed in the closed circuit has a rust-preventive action. Wherein the fluid has the following characteristics.
[0011]
According to the third aspect of the present invention, the hot water generating means (20) heats the low-temperature hot water located on the lower side of the hot water in the hot water storage tank (10), and stores the hot water heated to a high temperature in the hot water storage tank. Returning to the upper side of (10), when the temperature of the returned hot water whose temperature has been reduced by applying heat to at least one of the first and second heat receiving devices (30, 42) is higher than the temperature of the low-temperature hot water And hot water returning means (51, 52, 61, 62) for returning hot water to a temperature layer in which hot water having a temperature substantially equal to the temperature of the returned hot water in the hot water storage tank (10) is stored. .
[0012]
This can reliably prevent the temperature difference between the low-temperature hot water stored in the lower side of the hot-water storage tank (10) and the hot water generating means (20) from being reduced, so that the hot water generating means (20) switches to the hot water. The amount of heat that can be given can be prevented from decreasing.
[0013]
Incidentally, reference numerals in parentheses of the above-mentioned units are examples showing the correspondence with specific units described in the embodiments described later.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
(1st Embodiment)
In the present embodiment, the hot water supply apparatus according to the present invention is used for a domestic hot water supply apparatus, and FIG. 1 is a schematic diagram of the hot water supply apparatus according to the present embodiment.
[0015]
This hot water supply device is configured to heat a hot water storage tank 10 for storing hot water while keeping low-temperature hot water located at a lower side of the hot water in the hot water storage tank 10, and to transfer the heated hot water having a high temperature to an upper side of the hot water storage tank 10. A heat pump unit 20 serving as returning hot water generating means, a floor heating panel 30 for heating the room using hot water in the hot water storage tank 10 as a heat source, and a first hot water supply for heating hot water using hot water in the hot water storage tank 10 as a heat source; 2 is composed of heat exchangers 41, 42 and the like.
[0016]
The hot water circuit L1 connecting the hot water storage tank 10, the floor heating panel 30 and the second hot water supply heat exchanger 42, and the hot water circuit L2 connecting the hot water storage tank 10 and the first hot water supply heat exchanger 41 both supply hot water from the others. A closed circuit in which hot water circulates many times without being supplied is provided, and a predetermined amount of a fluid having an anticorrosive action is sealed in these closed circuits L1 and L2.
[0017]
In the present embodiment, a fluid having an antirust effect, that is, water mixed with an ethylene glycol-based antifreeze is used as warm water.
[0018]
The floor heating panel 30 is a first heat receiving device that heats the room by heating the floor with high-temperature water having a higher temperature than the hot water located on the lower side taken out from the upper side of the hot water storage tank 10, The second hot water supply heat exchanger 42 is a second heat receiving device for heating the hot water by receiving heat from hot water whose temperature has been reduced by applying heat from the floor heating panel 30, and the first heat exchange for hot water supply. The heater 41 is a heat exchanger that heats hot water by supplying heat from high-temperature water taken out from the upper side of the hot water storage tank 10.
[0019]
In addition, the pumps 11 to 13 circulate hot water, and the first and second heat exchangers 41 and 42 exchange heat between hot water and hot water in opposite flows.
[0020]
The heat pump unit 20 also has a compressor 21 for sucking and compressing the refrigerant, a high-pressure side heat exchanger 22 for exchanging heat between the high-temperature refrigerant discharged from the compressor 21 and hot water for hot water supply, and an outflow from the high-pressure side heat exchanger 22. Vacuum decompressor 23 for decompressing the compressed refrigerant, and a low-pressure heat exchanger 24 for exchanging heat between decompressed low-temperature refrigerant and the outside air, and is a well-known vapor compression heat pump device for transferring low-temperature heat to high-temperature side. It is. In addition, the high-pressure side heat exchanger 22 is configured such that the refrigerant flow and the hot water flow are opposed to each other by the pump 25.
[0021]
In the present embodiment, the pressure of the high-pressure side refrigerant is increased to the critical pressure of the refrigerant or higher using carbon dioxide as the refrigerant, and the decompressor 23 performs the heat pump based on the temperature of the refrigerant flowing out of the high-pressure side heat exchanger 22. The opening degree is adjusted so that the coefficient of performance of the unit 20 becomes a predetermined value or more, and the high-pressure side refrigerant pressure is controlled.
[0022]
Further, the rotation speed of the compressor 21 is controlled so that a desired amount of heat is generated in the high-pressure side heat exchanger 22. Specifically, when the amount of heat that can absorb heat from the low-pressure side heat exchanger 24 is small, the rotation speed is increased, and when the amount of heat that can absorb heat is large, the rotation speed is decreased.
[0023]
Further, in the present embodiment, the temperature of the refrigerant flowing into the high-pressure side heat exchanger 22 is set to 80 ° C. to 90 ° C. or higher, and the pump 13 for circulating hot water between the high-pressure side heat exchanger 22 and the hot water storage tank 10 is used. , That is, the hot water flow rate circulating between the high-pressure side heat exchanger 22 and the hot water storage tank 10 is controlled so that high-temperature hot water of 80 ° C. to 90 ° C. or more is supplied to the upper portion of the hot water storage tank 10. I have to.
[0024]
The first valve 51 returns the return hot water flowing out of the first hot water supply heat exchanger 41 to an intermediate height portion of the hot water storage tank 21 where hot water equivalent to the intermediate temperature is stored, and when the low temperature water is stored. This is valve means for switching between returning to the lower side of the hot water storage tank 10.
[0025]
The temperature sensor 61 is temperature detecting means for detecting the temperature of the return hot water flowing out of the first hot water supply heat exchanger 41, and the first valve 51 is controlled based on the temperature detected by the temperature sensor 61.
[0026]
The second valve 52 is used to return the return hot water flowing out of the floor heating panel 30 to an intermediate height portion in the hot water storage tank 21 where hot water equivalent to the intermediate temperature is stored, and to store the hot water in the hot water storage tank 10 in which low-temperature water is stored. This is valve means for switching between returning to the lower side.
[0027]
The temperature sensor 62 is temperature detecting means for detecting the temperature of the return hot water flowing out of the floor heating panel 30, and the second valve 52 is controlled based on the temperature detected by the temperature sensor 62.
[0028]
In the present embodiment, the first and second valves 51 and 52, the temperature sensors 61 and 62, and the like correspond to "hot water returning means" described in the claims.
[0029]
Incidentally, the position of the hot water storage tank 10 to which both return waters return is a position corresponding to a temperature layer in which hot water having a temperature substantially equal to the temperature of the return hot water is stored. In the present embodiment, the position is a position confirmed in advance by a test. The return position is fixed in advance so as to return, but the present embodiment is not limited to this. For example, as in Japanese Patent Application No. 2001-389310, a plurality of return positions are set in advance. Alternatively, the actual return position may be changed according to the temperature of the return hot water.
[0030]
Next, the characteristic operation of the hot water supply apparatus according to the present embodiment and the effects thereof will be described.
[0031]
1. When only the floor heating is performed, the pump 11 is operated with the pump 12 stopped, and high-temperature (for example, 90 ° C.) hot water is supplied to the floor heating panel 30. When the lowered temperature of the return hot water is higher than the temperature of the low-temperature water collected below the hot water storage tank 10 or higher than a predetermined temperature, the second valve 52 is opened to open the temperature of the return hot water in the hot water storage tank 10. Return to the intermediate temperature layer where hot water at a temperature substantially equal to the temperature is stored, and return the hot water.
[0032]
Conversely, when the lowered temperature of the returned hot water is equal to or lower than the temperature of the low-temperature water stored below the hot-water storage tank 10 or equal to or lower than a predetermined temperature, the second valve 52 is closed to return the returned hot water to the hot-water storage where the low-temperature water is stored. Return to the lower side of the tank 10.
[0033]
This prevents the temperature difference between the low-temperature water and the high-temperature refrigerant from being reduced when the low-temperature water on the lower side of the hot water storage tank 10 is heated by the heat pump unit 20 (the high-pressure side heat exchanger 22). Therefore, it is possible to prevent the amount of heat that can be given to the hot water from the heat pump unit 20 from decreasing, and to operate the heat pump unit 20, that is, the hot water supply device efficiently.
[0034]
2. When hot water is supplied while floor heating is performed 2.1 The first mode pump 11 is operated to supply high-temperature hot water to the floor heating panel 30, and the hot water flowing out of the floor heating panel 30 is supplied to the second heat exchanger for hot water supply. The hot water is heated by circulating through 42.
[0035]
At this time, if the temperature of the hot water supplied to the floor heating panel 30 is, for example, about 90 ° C., the temperature of the hot water flowing out of the floor heating panel 30 and flowing into the second hot water supply heat exchanger 42 is about 50 ° C. Therefore, if the hot water is heated with the hot water of 50 ° C., hot water of about 40 ° C. to 50 ° C. can be supplied.
[0036]
Therefore, the temperature of the return hot water whose temperature has been reduced after the heat radiation in the second hot water supply heat exchanger 42 has ended is the temperature of tap water supplied to the second hot water supply heat exchanger 42, that is, the temperature before heating. (For example, 9 ° C. to 17 ° C.), so that even if the return hot water flowing out of the second hot water supply heat exchanger 42 is returned to the lower side of the hot water storage tank 10, Can be prevented from rising.
[0037]
As a result, when the low-temperature water on the lower side of the hot-water storage tank 10 is heated by the heat pump unit 20 (the high-pressure side heat exchanger 22), the temperature difference between the low-temperature water and the high-temperature refrigerant is reduced. Therefore, it is possible to prevent the amount of heat that can be given from the heat pump unit 20 to the hot water from decreasing, and it is possible to efficiently operate the heat pump unit 20, that is, the hot water supply device.
[0038]
2.2 Second Mode By the way, the temperature of the hot water finally supplied to the user is determined by adjusting the mixing ratio of the cold water (tap water) and the heated hot water by the mixing tap, and The temperature of the hot water supplied to the tap is maintained, for example, at a predetermined temperature by adjusting the flow rate of the high-temperature hot water supplied from the water heater.
[0039]
However, when the hot water supply temperature desired by the user cannot be obtained even when the flow rate of the hot water is reduced, or when the temperature of the hot water flowing out of the second hot water supply heat exchanger 42 is equal to or lower than a predetermined temperature, the pump 12 is operated. Then, the hot water supplied from the second hot water supply heat exchanger 42 is further heated by the first hot water supply heat exchanger 41 to supply hot water having a hot water temperature required by the user.
[0040]
By the way, the pump 12 supplies high-temperature water to be supplied to the first hot-water supply heat exchanger 41 such that the temperature of the hot-water supply water detected by the temperature sensor 63 becomes the hot-water supply temperature required by the user or a predetermined temperature, that is, above the hot-water storage tank 10. The flow rate of the hot water supplied to the first hot water supply heat exchanger 41 from the side is adjusted.
[0041]
At this time, when the temperature of the return hot water whose temperature has been reduced after the heat release in the first hot water supply heat exchanger 41 is higher than the temperature of the low-temperature water accumulated on the lower side of the hot water storage tank 10 or higher than a predetermined temperature. Then, the first valve 51 is opened to return the hot water to the intermediate temperature layer in the hot water storage tank 10 where hot water having a temperature substantially equal to the temperature of the returned hot water is stored.
[0042]
Conversely, when the lowered temperature of the returned hot water is equal to or lower than the temperature of the low-temperature water stored below the hot-water storage tank 10 or equal to or lower than a predetermined temperature, the first valve 51 is closed to return the returned hot water to the hot-water storage where the low-temperature water is stored. Return to the lower side of the tank 10.
[0043]
3. When only hot water supply is performed, the pump 12 is operated while the pump 11 is stopped, and the hot water flowing out of the second hot water supply heat exchanger 42 is heated by the first hot water supply heat exchanger 41 to obtain a hot water supply temperature desired by the user. Supply hot water.
[0044]
The control of the pump 12 and the first valve 51 is the same as in the second mode in which hot water is supplied while floor heating is performed.
[0045]
(2nd Embodiment)
In the present embodiment, as shown in FIG. 2, when the temperature sensor 62 is abolished and only floor heating is performed, the temperature sensor 62 flows out of the floor heating panel 30 regardless of the temperature of the return hot water flowing out of the floor heating panel 30. The return hot water is returned to the intermediate temperature layer and the hot water is returned.
[0046]
(Third embodiment)
In the present embodiment, as shown in FIG. 3, when the temperature sensor 61 is abolished and the hot water is heated by the first hot water supply heat exchanger 41, the return flow from the first hot water supply heat exchanger 41 is returned. Regardless of the temperature of the hot water, the return hot water flowing out of the floor heating panel 30 returns to the intermediate temperature layer and returns the hot water.
[0047]
(Fourth embodiment)
In this embodiment, as shown in FIG. 5, a first hot water supply heat exchanger 41 and a second hot water supply heat exchanger 42 are arranged in parallel to control a water supply temperature required by a user.
[0048]
(Other embodiments)
In the above-described embodiment, the present invention has been described by taking the floor heating panel 30 as an example of the heat receiving device that operates by receiving supply of heat from the hot water in the hot water storage tank 10, but the present invention is not limited to this. The heat receiving device may be a device for keeping warm water in a bathtub, additional cooking, a bathroom dryer, or the like, and its use is not limited.
[0049]
Further, in the above-described embodiment, the heat pump unit 20 is used as the hot water generating means. However, the present invention is not limited to this. For example, a sheath heater, a combustor, or the like may be adopted as the hot water generating means.
[Brief description of the drawings]
FIG. 1 is a schematic diagram of a hot water supply apparatus according to a first embodiment of the present invention.
FIG. 2 is a schematic diagram of a water heater according to a second embodiment of the present invention.
FIG. 3 is a schematic diagram of a hot water supply apparatus according to a third embodiment of the present invention.
FIG. 4 is a ph diagram of the heat pump device.
FIG. 5 is a schematic diagram of a hot water supply apparatus according to a fifth embodiment of the present invention.
[Explanation of symbols]
10 hot water storage tank 1, 20 heat pump unit
30: floor heating panel, 41: heat exchanger for the first hot water supply,
42 ... second heat exchanger for hot water supply.

Claims (3)

温水を保温貯蔵する貯湯タンク（１０）と、
加熱されて高温になった温水を前記貯湯タンク（１０）に供給する温水生成手段（２０）と、
前記貯湯タンク（１０）内の温水から熱の供給を受けて作動する第１受熱機器（３０）と、
前記第１受熱機器（３０）にて熱を与えて温度が低下した温水から熱の供給を受けて作動する第２受熱機器（４２）とを備えることを特徴とする給湯装置。A hot water storage tank (10) for keeping hot water warm;
Hot water generating means (20) for supplying hot water heated to a high temperature to the hot water storage tank (10);
A first heat receiving device (30) that operates by receiving heat from hot water in the hot water storage tank (10);
A hot water supply apparatus comprising: a second heat receiving device (42) that operates by receiving heat supplied from hot water whose temperature has been reduced by applying heat in the first heat receiving device (30). 前記貯湯タンク（１０）及び前記第１、２受熱機器（３０、４２）を繋ぐ温水回路は閉回路であり、かつ、この閉回路に封入された温水は防錆作用を有する流体であることを特徴とする請求項１に記載の給湯装置。The hot water circuit connecting the hot water storage tank (10) and the first and second heat receiving devices (30, 42) is a closed circuit, and the hot water sealed in the closed circuit is a fluid having an antirust effect. The hot water supply device according to claim 1, wherein 前記温水生成手段（２０）は、前記貯湯タンク（１０）内の温水のうち下方側に位置する低温の温水を加熱し、加熱されて高温になった温水を前記貯湯タンク（１０）の上方側に戻し、
前記第１、２受熱機器（３０、４２）のうち少なくとも一方の受熱機器に熱を与えて温度が低下した戻り温水の温度が、前記低温の温水の温度より高いときに、前記貯湯タンク（１０）内のうち前記戻り温水の温度と略等しい温度の温水が溜まっている温度層に前記戻り温水を戻す温水戻し手段（５１、５２、６１、６２）を備えることを特徴とする請求項１又は２に給湯装置。The hot water generating means (20) heats low-temperature hot water located on the lower side of the hot water in the hot water storage tank (10), and supplies the heated hot water to the upper side of the hot water storage tank (10). Back to
When the temperature of the return hot water whose temperature has been reduced by applying heat to at least one of the first and second heat receiving devices (30, 42) is higher than the temperature of the low-temperature hot water, the hot water storage tank (10 3. The method according to claim 1, further comprising hot water return means (51, 52, 61, 62) for returning the return hot water to a temperature layer in which hot water having a temperature substantially equal to the temperature of the return hot water is stored. 2. Hot water supply device.
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WO2008123187A1 (en) * 2007-03-27 2008-10-16 Daikin Industries, Ltd. Heat pump type hot water supply apparatus and heating hot water supply apparatus
WO2008123188A1 (en) * 2007-03-30 2008-10-16 Daikin Industries, Ltd. Heating hot water supply apparatus
JP2008267792A (en) * 2007-03-27 2008-11-06 Daikin Ind Ltd Heat pump type hot water supply apparatus
JP2009047370A (en) * 2007-08-21 2009-03-05 Osaka Gas Co Ltd Heat storage radiation system
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CN103868127A (en) * 2014-03-01 2014-06-18 双良节能系统股份有限公司 Afterburning-type lithium bromide absorption heat exchange system capable of simultaneously providing two loops of hot water
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CN103868126A (en) * 2014-03-01 2014-06-18 双良节能系统股份有限公司 Afterburning-type lithium bromide absorption heat exchange system capable of simultaneously providing two loops of hot water
CN103868129A (en) * 2014-03-01 2014-06-18 双良节能系统股份有限公司 Lithium bromide absorption heat exchange system capable of simultaneously providing two loops of hot water
CN103868130A (en) * 2014-03-01 2014-06-18 双良节能系统股份有限公司 After-burning lithium bromide absorption type heat exchange system
CN103868127A (en) * 2014-03-01 2014-06-18 双良节能系统股份有限公司 Afterburning-type lithium bromide absorption heat exchange system capable of simultaneously providing two loops of hot water
CN103868127B (en) * 2014-03-01 2016-04-27 双良节能系统股份有限公司 The band afterburning suction-type lithium bromide heat-exchange system of two-way hot water is provided simultaneously
CN105737236A (en) * 2016-03-16 2016-07-06 北京建筑大学 Two-grade evaporation efficiency improvement type jet heat exchanger unit and application
CN105737236B (en) * 2016-03-16 2019-03-19 北京建筑大学 A kind of double flash evaporation Synergistic type jetting type heat exchange unit and application

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