JP2004281896A5 - - Google Patents
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- Publication number
- JP2004281896A5 JP2004281896A5 JP2003073925A JP2003073925A JP2004281896A5 JP 2004281896 A5 JP2004281896 A5 JP 2004281896A5 JP 2003073925 A JP2003073925 A JP 2003073925A JP 2003073925 A JP2003073925 A JP 2003073925A JP 2004281896 A5 JP2004281896 A5 JP 2004281896A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- semiconductor device
- semiconductor substrate
- resin layer
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 29
- 239000000758 substrate Substances 0.000 claims 13
- 239000011347 resin Substances 0.000 claims 10
- 229920005989 resin Polymers 0.000 claims 10
- 238000004519 manufacturing process Methods 0.000 claims 7
- 238000002161 passivation Methods 0.000 claims 4
- 230000002093 peripheral effect Effects 0.000 claims 3
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003073925A JP3726906B2 (ja) | 2003-03-18 | 2003-03-18 | 半導体装置及びその製造方法、回路基板並びに電子機器 |
| US10/802,668 US7057282B2 (en) | 2003-03-18 | 2004-03-17 | Semiconductor device and method for manufacturing the same, circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003073925A JP3726906B2 (ja) | 2003-03-18 | 2003-03-18 | 半導体装置及びその製造方法、回路基板並びに電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004281896A JP2004281896A (ja) | 2004-10-07 |
| JP2004281896A5 true JP2004281896A5 (cg-RX-API-DMAC7.html) | 2005-08-25 |
| JP3726906B2 JP3726906B2 (ja) | 2005-12-14 |
Family
ID=33289703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003073925A Expired - Fee Related JP3726906B2 (ja) | 2003-03-18 | 2003-03-18 | 半導体装置及びその製造方法、回路基板並びに電子機器 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7057282B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP3726906B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007115958A (ja) * | 2005-10-21 | 2007-05-10 | Seiko Epson Corp | 半導体装置 |
| JP2007115957A (ja) | 2005-10-21 | 2007-05-10 | Seiko Epson Corp | 半導体装置及びその製造方法 |
| US10483132B2 (en) * | 2012-12-28 | 2019-11-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Post-passivation interconnect structure and method of forming the same |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2730492B2 (ja) | 1994-10-25 | 1998-03-25 | 日本電気株式会社 | 半導体装置 |
| JP3618212B2 (ja) | 1998-01-08 | 2005-02-09 | 松下電器産業株式会社 | 半導体装置及びその製造方法 |
| JPH11224885A (ja) | 1998-02-06 | 1999-08-17 | Matsushita Electron Corp | 半導体装置 |
| US6396145B1 (en) * | 1998-06-12 | 2002-05-28 | Hitachi, Ltd. | Semiconductor device and method for manufacturing the same technical field |
| WO2000055898A1 (en) | 1999-03-16 | 2000-09-21 | Seiko Epson Corporation | Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| JP3729680B2 (ja) | 1999-06-03 | 2005-12-21 | 株式会社ルネサステクノロジ | 半導体装置の製造方法および半導体装置 |
| JP4015787B2 (ja) | 1999-09-03 | 2007-11-28 | 松下電器産業株式会社 | 半導体装置の製造方法 |
| JP3399456B2 (ja) | 1999-10-29 | 2003-04-21 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
| JP3452043B2 (ja) | 1999-10-29 | 2003-09-29 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
| US6707153B2 (en) | 2000-03-23 | 2004-03-16 | Seiko Epson Corporation | Semiconductor chip with plural resin layers on a surface thereof and method of manufacturing same |
| JP2004104102A (ja) * | 2002-08-21 | 2004-04-02 | Seiko Epson Corp | 半導体装置及びその製造方法、回路基板並びに電子機器 |
-
2003
- 2003-03-18 JP JP2003073925A patent/JP3726906B2/ja not_active Expired - Fee Related
-
2004
- 2004-03-17 US US10/802,668 patent/US7057282B2/en not_active Expired - Lifetime