JP2004262577A - Producing method of tape transport device and semiconductor device and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a producing method of a reliable tape transport device and a semiconductor device and the semiconductor device whereby failure of a tape can be prevented, and the tape can be accurately transported. <P>SOLUTION: A plurality of feeding holes 12 are provided on both sides of a tape material 11 in predetermined pitches. A feeding drum 14 having pins 13 inserted into the feeding holes 12 respectively are arranged at least for feeding the tape material 11. The pin 13 arranged on the feeding drum 14 is in a shape of a cone of which tip is not sharp, and is movable at least in a size range of the feeding hole 12. The pin 13 has a margin for matching to the feeding hole 12. Even when a tip range of the pin 13 to be inserted into the predetermined feeding hole 12 of the tape material 11 is abutted with an edge of the feeding hole 12, a topmost of the pin 13 is surely slid into the feeding hole 12. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a tape transport apparatus applicable to a thin tape substrate material or a protective tape or the like having elements mounted thereon, such as TAB (Tape Automated Bonding), a method of manufacturing a semiconductor device, and a semiconductor device.
[0002]
[Prior art]
In recent years, thin tape substrates such as TAB tapes have been becoming thinner. When the tape is thinned to 40 μm or less in the feeding and transporting in the processing device, the tape may be further damaged. An example of a conventional tape feeding and conveying method will be described below.
[0003]
This technology uses a sprocket wheel to transport the tape by inserting and rotating pins into feed holes provided on both sides of the tape. The drive of the sprocket wheel is controlled by a stepping motor so that a constant tape feed is performed. The feed hole of the tape is pressed by a pin as the sprocket wheel rotates. In such a conveyance, when the tape becomes as thin as 40 μm or less, the damage to the tape is large.
[0004]
[Problems to be solved by the invention]
The sprocket hole pitch of the tape and the pin arrangement of the sprocket wheel must be controlled with a certain degree of precision. Particularly, in the feed hole of the tape, the processing accuracy of the hole pitch and the hole size is a problem. If the processing accuracy is poor, there are many cases where the pin does not enter the feed hole accurately. Since the tape is made of a resin material such as polyimide and the pin is made of metal such as stainless steel, there is a concern that the tape may be damaged as the tape becomes thinner. Further, even if the feed hole size and pitch of the tape and the pin pitch of the sprocket wheel are finished with a certain processing accuracy, alignment errors are accumulated between the hole pitch and the pin pitch depending on the length of the tape. Thereby, the positional deviation between the feed hole of the tape and the pin to be inserted becomes remarkable.
As a result, the edge of the tape feed hole may be deformed or damaged, and dust may be generated due to a damaged object, which may hinder subsequent processes.
[0005]
The present invention has been made in view of the above circumstances, and provides a highly reliable tape transport device, a semiconductor device manufacturing method, and a semiconductor device that realize more accurate tape feeding while preventing tape breakage. What you are trying to do.
[0006]
[Means for Solving the Problems]
The tape transport device according to the present invention is provided with a feed drum through which a tape having a plurality of feed holes at a predetermined pitch on both sides is guided, and provided at a predetermined interval on the feed drum, and the tape is transported in accordance with the rotation of the feed drum. A pin to be inserted into the perforated hole, wherein the tip of the pin is movable at least within the size range of the perforated hole when inserted into the perforated hole.
[0007]
According to the tape transport device according to the present invention as described above, the pins inserted into the perforations have a form in which the pins themselves have a margin for alignment with the perforations.
More preferably, the tip of the pin can be moved within a predetermined range based on the installation portion on the drum, and the installation portion has a sphere movable holding mechanism.
In addition, it is more preferable that the tip of the pin can be moved within a predetermined range based on an installation portion on the drum, and the installation portion has a holding portion via an elastic member.
[0008]
Further, in the tape transport device according to the present invention, the pin is further provided with a fixing control mechanism for fixing a position of a leading end of the pin during a predetermined period in which the pin is inserted into a feed hole of the tape. Once the pins are inserted into the feed holes of the tape, it is better not to move the pin positions to improve the feeding accuracy.
[0009]
Further, the tape transport device according to the present invention is characterized in that the tape transport device further comprises a tension adjusting mechanism for the tape, which is controlled in accordance with a predetermined positional relationship between the pin and a feed hole of the tape. While the displacement can be corrected by moving the tip of the pin, the tension is adjusted so that the displacement is controlled in a direction to reduce the displacement.
[0010]
In the method of manufacturing a semiconductor device according to the present invention, when a tape-shaped circuit board having a plurality of feed holes at a predetermined pitch on both sides is conveyed according to the rotation of the feed drum, each pin provided on the feed drum receives the feed It is characterized in that insertion with adjustment of the position of the leading end that allows room for alignment with a hole is realized, and mounting processing of an IC chip on the tape-shaped circuit board is performed before or after the feed drum.
[0011]
According to the method of manufacturing a semiconductor device according to the present invention as described above, each pin is inserted into the feed hole while adjusting the position of the tip to provide a margin for alignment with the feed hole. Thus, the tape-shaped circuit board is conveyed while the damage is kept to a minimum according to the rotation of the feed drum. Reliability is improved in the mounting process of the IC chip.
[0012]
In the method of manufacturing a semiconductor device according to the present invention, when the pins provided on the feed drum are inserted into the feed holes of the tape-shaped circuit board, the tip positions thereof are fixed. It has a period. Once the pins are inserted into the feed holes of the tape-like circuit board, it is better not to move the pin positions to improve the feeding accuracy.
[0013]
Still preferably, in the method of manufacturing a semiconductor device according to the present invention, the method further includes a step of adjusting a tension at the time of transporting the tape-shaped circuit board according to at least a predetermined positional relationship between the pins and the feed holes of the tape. It is characterized by the following. While the displacement can be corrected by adjusting the position of the tip of the pin, the tension is adjusted so that the displacement is reduced.
[0014]
A semiconductor device according to the present invention is characterized by being formed using the above-described tape transport device according to the present invention or the above-described method for manufacturing a semiconductor device. It contributes to mass production of highly reliable devices with tape circuit boards.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a schematic view showing a main part mechanism for explaining a tape transport device according to a first embodiment of the present invention. FIG. 2 is a detailed view of the mechanism based on the relationship between the transported tape and the pin positions in FIG.
The tape material 11 is provided with a plurality of feed holes 12 on both sides at a predetermined pitch. At the time of transporting the tape material 11, at least a tension adjusting mechanism 10 is provided behind. A feed drum 14 having at least a pin 13 inserted into each of the feed holes 12 is provided at the front. A work station (not shown) may be provided between these components. When the tape material 11 is a TAB tape, for example, bonding (not shown) of chips (collective bonding) or various inspections such as probing of already mounted chips are performed as the work station. If the tape material 11 is a protective tape, a recess for chip protection may be formed. That is, the tape material 11 is transported by a predetermined distance and is processed by a target work station.
[0016]
The pin 13 arranged on the feed drum 14 has a conical shape with a sharp tip, and is movable at least within the size range of the feed hole 12. Therefore, the vertical axis of the pin 13 is not always fixed. Here, as shown in FIG. 2, the installation part 21 of the pin 13 in the feed drum 14 has a sphere movable holding mechanism 22. The movable holding mechanism 22 has a holding form that surrounds at least half of the sphere around the installation part 21 (oblique lines) except for the frontage 23. The tip of the pin 13 projects from the stopper hole 24 and is movable within a predetermined range. The size of the stopper hole 24 is set so that the tip of the pin 13 is movable within the size range of the feed hole 12 of the tape material 11.
[0017]
The provision of the movable holding mechanism 22 for the pin 13 enables flexible control of the transport of the tape material 11 and errors in the positions of the perforations. The states A, B, and C in FIG. 1 are shown by the positional relationship (states A, B, and C) of the tape 11 and the pins 13 in FIG. 2, respectively. That is, the pin 13 to be inserted into the predetermined perforation hole 12 of the tape material 11 ensures that the leading end of the pin 13 slides into the perforation hole 12 even if the front end region is over the edge of the perforation hole 12. Inserted, minimizing damage.
[0018]
According to the tape transport device according to the first embodiment, the pin 13 inserted into the feed hole 12 of the tape material 11 has a mode of having an allowance for alignment with the feed hole 12 by itself. Thus, if there is an error in the driving of the tension adjusting mechanism 10 or in the arrangement pitch or the positional relationship of the feed holes 12, if the tip of the pin 13 slightly touches the edge of the feed hole 12, Move to be surely inserted into the feed hole 12. Thereby, damage to the tape material 11 during conveyance can be minimized.
In addition, other than the movable holding mechanism 22 as shown in FIG. 2 described above, various configurations for realizing a mode in which the pin 13 is made movable within the size range of the feed hole 12 of the tape material 11 are conceivable.
[0019]
FIG. 3 is a schematic view showing a main mechanism for describing a tape transport device according to a second embodiment of the present invention. FIG. 4 is a detailed view of the mechanism based on the relationship between the transported tape and the pin positions in FIG. The same parts as those in the first embodiment will be described with the same reference numerals.
When transporting the tape material 11, at least a tension adjusting mechanism 10 is provided at the rear, and a feed drum 34 having at least a pin 33 inserted into each of the feed holes 12 is provided at the front. Further, a position detection mechanism 35 of the feed hole 12 is provided at a stage before the conveyance of the tape material 11 reaches the feed drum 34. The position detection mechanism 35 includes a photoelectric tube function for monitoring the edge of the perforation hole 12, detects a conveyance delay and advance error of the tape material 11 by detecting the position of the perforation hole 12, and reflects the error in the control of the tension adjustment mechanism 10. As the position detection mechanism 35, an optical camera may be used.
[0020]
The pin 33 disposed on the feed drum 34 has a conical shape with a sharp tip, and is movable at least within the size range of the feed hole 12. Therefore, the vertical axis of the pin 33 is not always fixed. Here, as shown in FIG. 4, the installation portion 41 of the pin 33 in the feed drum 34 has a movable holding mechanism 42 via an elastic member. As the elastic member of the installation section 41, various spring members such as a thin wire bundle, a leaf spring, and a coil shape, various rubber and elastic resin members, and the like can be considered. The tip of the pin 33 extending from the frontage 43 projects from the stopper hole 44 and is movable within a predetermined range. The size of the stopper hole 44 is set so that the tip of the pin 33 is movable within the size range of the feed hole 12 of the tape material 11.
[0021]
By having such a movable holding mechanism 42 for the pin 33, it is possible to flexibly cope with errors in the transport control of the tape material 11 and the perforation hole position. The states A, B, and C in FIG. 3 are shown by the positional relationships (states A, B, and C) of the tape material 11 and the pins 33 in FIG. 4, respectively. That is, the pin 33 to be inserted into the predetermined perforation hole 12 of the tape material 11 ensures that the leading end of the pin 33 slides into the perforation hole 12 even if the front end region is over the edge of the perforation hole 12. Inserted, minimizing damage. Further, the tension adjustment mechanism 10 is feedback-controlled by the position detection mechanism 35 of the feed hole 12. Thereby, the transport can always be controlled so that the tip of the pin 33 enters at least the feed hole 12.
[0022]
In the tape transport device according to the second embodiment as well, the pins 33 inserted into the feed holes 12 of the tape material 11 have a mode of fitting themselves to the feed holes 12. Accordingly, if there is an error in the driving of the tension adjusting mechanism 10 or the arrangement pitch or the positional relationship of the feed holes 12, if the tip of the pin 33 slightly touches the edge of the feed hole 12, Move to be surely inserted into the feed hole 12. The alignment between the pin 33 and the feed hole 12 can be controlled in a direction not to be deteriorated by the drive control of the tension adjusting mechanism 10 using the position detection mechanism 35. That is, the positional shift between the pin 33 and the feed hole 12 can be controlled. Is controlled by the tension adjusting mechanism 10 in a direction to reduce the positional deviation while the correction can be made by the movement of. Thereby, damage to the tape material 11 during conveyance can be minimized. The drive control of the tension adjusting mechanism 10 may be performed by adding the position detecting mechanism 35 and the like to the first embodiment.
[0023]
FIG. 5 is a schematic view showing a main part mechanism for describing a tape transport device according to a third embodiment of the present invention. The same parts as those in the first embodiment are denoted by the same reference numerals. As in the first embodiment, when the tip of the pin 13 is inserted into the feed hole 12 of the tape material 11, it is in a movable state at least within the size range of the feed hole 12.
In this embodiment, a fixing control mechanism 51 for fixing the position of the tip of the pin 13 during the predetermined period during which the pin 13 is inserted into the feed hole 12 of the tape material 11 is added. The fixed control mechanism 51 includes, for example, an elastic roller 52. The elastic roller 52 is composed of a relatively soft synthetic resin member or the like. The elastic roller 52 rotates while pressing the pin 13 for a predetermined period according to the rotation of the feed drum 14. Once the pin 13 is inserted into the feed hole 12 of the tape material 11, the position of the pin 13 does not move even slightly, leading to an improvement in feed accuracy. Further, it is possible to increase the tension of the tape material 11 and also perform the feed correction. Therefore, a configuration in which such a fixed control mechanism 51 is added is also useful. Of course, it may be added to the configuration of the second embodiment shown in FIGS. The fixing control mechanism 51 may have other configurations, such as a control mechanism for fixing the position of the pin 13 (or 33) for a predetermined period inside the feed drum 14 (or 34).
[0024]
A method for manufacturing a semiconductor device will be described using the above embodiments. A tape material 11 having a plurality of feed holes 12 on both sides at a predetermined pitch, for example, a tape-like circuit board, is transported according to the rotation of the feed drum 14 (or 34). Each of the pins 13 (or 33) provided on the feed drum 14 realizes insertion with adjustment of the position of the leading end to create a margin in the feed hole 12, and before or after the feed drum 14 (or 34). The mounting process of the IC chip on the circuit board is performed. The tension at the time of transporting the tape-shaped circuit board is adjusted in accordance with the positional relationship between the pins 13 and the feed holes 12. Thus, the tension is adjusted while the displacement can be corrected by adjusting the position of the tip of the pin, and control is performed in a direction to reduce the displacement.
[0025]
According to the above-described method for manufacturing a semiconductor device, each pin is inserted into the feed hole with the adjustment of the position of the leading end for providing a margin for alignment with the feed hole of the tape-shaped circuit board. Thus, the tape-shaped circuit board is conveyed while the damage is kept to a minimum according to the rotation of the feed drum. As a result, the reliability in the mounting process of the IC chip is improved, and it contributes to mass production of a device with a highly reliable tape circuit board.
[0026]
As described above, according to each of the embodiments and the method, the pin inserted into the perforation hole has a form in which the pin itself has a margin for matching with the perforation hole. Thus, the tape material is conveyed while the damage is kept to a minimum according to the rotation of the feed drum. In particular, when the processing accuracy of the feed hole in a partial area of the tape material is poor, or when an error occurs temporarily in the tape feed accuracy, the positional displacement damage can be minimized. As a result, it is possible to hardly cause edge deformation, breakage, dust generation or the like of the tape feed hole. Therefore, concerns that hinder subsequent processes are eliminated. As a result, it is possible to provide a highly reliable tape transport device, a method of manufacturing a semiconductor device, and a semiconductor device that realize more accurate tape feeding while preventing breakage of the tape.
[Brief description of the drawings]
FIG. 1 is an outline view of a main part mechanism of a tape transport device according to a first embodiment.
FIG. 2 is a detailed view of a part of the mechanism in FIG.
FIG. 3 is an outline view of a main part mechanism of a tape transport device according to a second embodiment.
FIG. 4 is a detailed view of a part of the mechanism in FIG. 3;
FIG. 5 is a schematic view of a main part mechanism of a tape transport device according to a third embodiment.
[Explanation of symbols]
11 Tape material, 12 Feed hole, 13, 33 Pin, 14, 34 Feed drum, 21 Installation part, 22, 42 Movable holding mechanism, 23, 43 Frontage, 24, 44 Stopper hole, 35 ... Position detection mechanism, 41 ... Installation part, 51 ... Fixed control mechanism, 52 ... Elastic roller.

Claims (10)

A feed drum to which a tape having a plurality of feed holes at a predetermined pitch on both sides is guided,
A pin provided at a predetermined interval on the feed drum and inserted into a feed hole of the tape in accordance with the rotation of the feed drum;
With
The tip of the pin is movable in at least the dimension range of the feed hole when inserted into the feed hole. 2. The tape transport device according to claim 1, wherein the tip of the pin can move within a predetermined range based on a mounting portion on the drum, and the mounting portion has a sphere movable holding mechanism. 3. The tape transport device according to claim 1, wherein a tip of the pin is movable within a predetermined range based on a mounting portion on the drum, and the mounting portion has a holding portion via an elastic member. 4. The tape according to any one of claims 1 to 3, wherein the pin further comprises a fixing control mechanism whose tip position is fixed during a predetermined period during which the pin is inserted into a feed hole of the tape. Transport device. The tape transport device according to any one of claims 1 to 4, further comprising a tension adjusting mechanism for the tape, which is controlled in accordance with a predetermined positional relationship between the pin and a feed hole of the tape. When a tape-shaped circuit board having a plurality of feed holes at a predetermined pitch on both sides is conveyed according to the rotation of the feed drum, each pin provided on the feed drum is aligned with the feed hole, and a tip position adjustment that creates a margin is provided. To achieve insertion
A method of manufacturing a semiconductor device, wherein an IC chip is mounted on the tape-shaped circuit board before or after the feed drum. 7. The semiconductor according to claim 6, wherein each pin provided on the feed drum has a period in which a tip position thereof is fixed when the pin is inserted into the feed hole of the tape-shaped circuit board. Device manufacturing method. 8. The manufacturing method of a semiconductor device according to claim 6, further comprising a step of adjusting a tension at the time of transporting the tape-shaped circuit board according to at least a predetermined positional relationship between the pins and the feed holes of the tape. Method. A semiconductor device formed using the tape transport device according to claim 1. A semiconductor device formed using the method for manufacturing a semiconductor device according to claim 6.

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