JP2004259728A5 - - Google Patents
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- Publication number
- JP2004259728A5 JP2004259728A5 JP2003045585A JP2003045585A JP2004259728A5 JP 2004259728 A5 JP2004259728 A5 JP 2004259728A5 JP 2003045585 A JP2003045585 A JP 2003045585A JP 2003045585 A JP2003045585 A JP 2003045585A JP 2004259728 A5 JP2004259728 A5 JP 2004259728A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing pad
- light
- wavelength range
- transmittance
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 description 32
- 239000000463 material Substances 0.000 description 27
- 238000000034 method Methods 0.000 description 13
- 238000002834 transmittance Methods 0.000 description 12
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 238000004898 kneading Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- -1 vinyl compound Chemical class 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003045585A JP2004259728A (ja) | 2003-02-24 | 2003-02-24 | 研磨パッド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003045585A JP2004259728A (ja) | 2003-02-24 | 2003-02-24 | 研磨パッド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004259728A JP2004259728A (ja) | 2004-09-16 |
| JP2004259728A5 true JP2004259728A5 (https=) | 2006-04-06 |
Family
ID=33112348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003045585A Pending JP2004259728A (ja) | 2003-02-24 | 2003-02-24 | 研磨パッド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004259728A (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005103702A (ja) * | 2003-09-30 | 2005-04-21 | Toyo Tire & Rubber Co Ltd | Ｃｍｐ用研磨パッド及びその梱包方法 |
| JP2007039096A (ja) * | 2005-08-04 | 2007-02-15 | Toyo Tire & Rubber Co Ltd | 研磨パッド梱包物及びその製造方法 |
| JP2007307639A (ja) | 2006-05-17 | 2007-11-29 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
| JP6221172B2 (ja) * | 2013-09-25 | 2017-11-01 | 富士紡ホールディングス株式会社 | 研磨パッド運搬用ボックス、研磨パッド収容部材及び研磨パッドの運搬方法 |
| US9064806B1 (en) * | 2014-03-28 | 2015-06-23 | Rohm and Haas Electronics Materials CMP Holdings, Inc. | Soft and conditionable chemical mechanical polishing pad with window |
| US10086500B2 (en) * | 2014-12-18 | 2018-10-02 | Applied Materials, Inc. | Method of manufacturing a UV curable CMP polishing pad |
-
2003
- 2003-02-24 JP JP2003045585A patent/JP2004259728A/ja active Pending
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