JP2004223785A - Film laminate and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film laminate reduced in irregularity, having good gas barrier properties and capable of avoiding trouble such as peeling, warpage, interfatial reflection or the like. <P>SOLUTION: A flattened layer is laminated on a base material layer made of a plastic film by coating the base material layer with a resin solution prepared by dissolving a material substantially same to the plastic film and an inorganic compound layer is laminated on the flattened layer to form the film laminate. As a solvent for use in the preparation of the resin solution, it is preferable to use a solvent characterized in that the solubility of a resin to be dissolved at 25°C is 3 wt.% or above and a hole is not formed in a plastic film at a speed of 100 μm/100 min or above when the solvent is dropped on the plastic film by the dropping method prescribed in JIS H0400-500. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【００７４】
【発明の効果】
本発明により、ばらつきが少なく良好なガスバリアー性を有し、かつ、剥離、反りあるいは界面反射などの問題を回避できるフィルム積層体を提供することができる。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a film laminate having improved gas barrier properties.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a film in which an inorganic compound layer such as silicon oxide, aluminum oxide or the like is formed on a surface of a laminate (hereinafter sometimes simply referred to as a “film laminate” in the present invention) using a plastic film as a substrate. The laminate is widely used as a film having gas barrier properties in packaging applications such as food packaging and pharmaceutical packaging. In addition to packaging, it is also used as a part of a transparent conductive substrate used for a liquid crystal display device, a touch panel, an electroluminescence display device and the like.
[0003]
With respect to these film laminates, various improvements have been studied for the purpose of improving the water vapor barrier properties and gas barrier properties. For example, one in which the hardness of the plastic film forming the base material layer is defined (for example, see Patent Document 1), one in which the granularity of the inorganic compound layer is defined (for example, see Patent Document 2), and the base material layer are formed. One that defines the surface roughness of the plastic film (for example, see Patent Document 3), one that defines the specific gravity of the inorganic compound layer (for example, see Patent Document 4), and the surface roughness of the plastic film that forms the base material layer. There is one that defines the ratio of the surface roughness after the surface treatment (for example, see Patent Document 5), and an anchor coat is applied to improve the adhesion between the plastic film forming the base material layer and the thin film. (For example, see Patent Document 6).
[0004]
In the present invention and the film laminates described by the methods of Documents 1 to 6, a plastic film is used as a base material. -It is necessary to reduce the gas permeability of inorganic thin films of silicon oxide or the like as a barrier layer, since these deteriorate pharmaceutical products.
[0005]
A film laminate was prepared by directly laminating metal oxides such as aluminum oxide and silicon oxide on a rough film surface.Oxygen gas transmission rate and water vapor transmission rate were measured. In some cases, it could not be manufactured.
[0006]
However, in a film laminate in which a flattening layer is introduced on a plastic film that forms a base material layer as a lamination component, and a metal oxide is laminated thereon, the variation in water vapor transmission rate is low, and the average value is low. It has been found that it can be obtained. That is, it was found that the surface roughness of the film surface was an obstacle to uniform film formation of the metal oxide layer.
[0007]
However, it has been found that when a resin that has been often used for a laminated film is used as a material for a flattening layer, new problems such as peeling, warping, and interfacial reflection are caused. That is, conventionally, in order to improve the adhesion, wet heat durability, transparency, slipperiness, etc. of the laminated film, for example, polyester resin, urethane resin, acrylic resin, ethylene vinyl alcohol resin, vinyl resin, epoxy resin, styrene resin Known resins such as silicon resin, alkyl titanate, and modified resins thereof have been used alone or in combination of two or more, and it has been found that any of them causes a new problem.
[0008]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 2001-096661 (Claims)
[0009]
[Patent Document 2]
JP-A-9-076400 (Claims)
[0010]
[Patent Document 3]
JP-A-3-176123 (claims)
[0011]
[Patent Document 4]
JP-A-5-186622 (Claims)
[0012]
[Patent Document 5]
JP-A-10-244601 (Claims)
[0013]
[Patent Document 6]
Japanese Patent Application Laid-Open No. Hei 3-086538 (Claims)
[0014]
[Problems to be solved by the invention]
An object of the present invention is to solve the above problems and to provide a good film laminate having reduced gas permeability.
[0015]
Still other objects and advantages of the present invention will become apparent from the following description.
[0016]
[Means for Solving the Problems]
According to one embodiment of the present invention, a flattening layer made of substantially the same kind of material as the plastic film is stacked in contact with the plastic film base layer, and an inorganic compound layer is stacked thereover. A film laminate is provided.
[0017]
The peak-to-valley maximum value of the unevenness of the lamination side surface of the plastic film base layer is 50 nm or less, the plastic film is made of polycarbonate, especially, the biscresol fluorene structure and 2,2-bis (4-hydroxyphenyl) A polycarbonate having a propane structure and a skeletal structure, a thickness of the flattening layer being at least twice the maximum value of the peak-to-valley of the unevenness on the lamination side surface of the plastic film base layer, and a flattening layer. About, the peak-to-valley maximum value of the unevenness of the surface that is not the surface in contact with the laminated side surface of the base material layer (the non-contact surface of the base material layer of the flattening layer) is 10 nm or less; The thickness is at least three times the maximum value of the peak-to-valley of the unevenness of the non-contact surface of the base material layer of the flattening layer. Miniumu, indium, tin, zinc, at least one of metal oxides of the group consisting of titanium and tantalum, nitride, oxynitride, or composed mainly of a mixture thereof, are preferred.
[0018]
According to another aspect of the present invention, a plastic film base material layer, a resin solution obtained by dissolving substantially the same type of material as the plastic film is applied, and a flattening layer is laminated thereon. A method for producing a film laminate obtained by laminating an inorganic compound layer is provided.
[0019]
As a solvent for preparing the resin solution, when the solubility of the resin to be dissolved at 25 ° C. is 3% by weight or more and the solvent is dropped on the plastic film by a dropping method specified in JIS H0400-500, Use a solvent that does not generate pores at a speed of 100 μm / 100 min or more, prepare a base layer made of a plastic film by a solution casting method, and make the laminated side surface of the side contacting a belt carrying a film in the solution casting method. Surface, the maximum value of peak-to-valley of unevenness on the lamination side surface of the plastic film base layer before laminating the flattening layer is 50 nm or less, the plastic film is made of polycarbonate, especially biscresol fluorene Skeleton structure and a 2,2-bis (4-hydroxyphenyl) propane structure The thickness of the flattening layer should be at least twice the maximum value of the peak-to-valley of the unevenness on the lamination side surface of the plastic film base layer before laminating the flattening layer. The peak-to-valley maximum value of the unevenness of the surface of the flattening layer that is not the surface in contact with the lamination side surface of the base material layer (the non-contact surface of the base material layer of the flattening layer) indicates that the inorganic compound layer Before lamination, it is 10 nm or less, and the thickness of the inorganic compound layer is at least three times the maximum value of the peak-to-valley of unevenness of the non-contact surface of the base material layer of the flattening layer before laminating the inorganic compound layer. Wherein the inorganic compound layer is formed of an oxide, nitride, oxynitride, or a metal oxide of at least one metal selected from the group consisting of silicon, aluminum, indium, tin, zinc, titanium, and tantalum. The mixture Used as a component, it is preferable to form by laminating any one of the group consisting of a magnetron sputtering method, an ion plating method, a CVD method, a heating evaporation method, a sol-gel method, and a high frequency induction heating method. .
[0020]
According to the present invention, it is possible to provide a film laminate having good gas barrier properties with little variation and capable of avoiding problems such as peeling, warpage, and interface reflection.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described using tables, examples, and the like. It should be noted that these tables, examples, and the like, and the description are merely examples of the present invention, and do not limit the scope of the present invention. It goes without saying that other embodiments can also belong to the category of the present invention as long as they conform to the gist of the present invention.
[0022]
In contact with the plastic film base layer, a flattening layer made of substantially the same material as the plastic film is laminated, and an inorganic compound layer is laminated thereon to form a film laminate. The surface that is not the side that is in contact with the laminated side surface (the surface of the flattening layer that is not in contact with the base material layer) is excellent in flatness, so that the inorganic compound layer can exhibit good gas barrier properties with little variation, and can be peeled off. It has been found that problems such as warpage or interface reflection can be avoided. By using a flattening layer made of substantially the same material as the plastic film, the chemical and physical affinity with the plastic film is increased, and the warpage, peeling, and refractive index caused by the difference in the coefficient of linear expansion are increased. It is presumed that this is an effect for avoiding problems such as interface reflection due to the difference in
[0023]
It is very preferable that the plastic film used for the base layer of the film laminate according to the present invention is substantially transparent. Further, as long as the transparency of the film laminate is not impaired, additives such as a plasticizer, a filler, an ultraviolet absorber, an antioxidant, an easy adhesive, an easy lubricant, and a coloring agent can be added. The functions exhibited by these additives may be realized by laminating another layer on the film laminate according to the present invention.
[0024]
The method for producing the base material layer is not particularly limited, and it can be produced by a known method such as a melt extrusion film forming method, a solution cast film forming method, and an inflation film forming method. Further, a non-stretched film or a stretched film may be used. It should be noted that, depending on the application, the material may not be transparent, and in such a case, there is no need to limit the transparency of the additives and the like.
[0025]
The material that can be used as the plastic film is not particularly limited, and examples thereof include polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyarylate, polycycloolefin, polyether sulfone, and a photocurable acrylic polymer. As the polycarbonate, a polycarbonate having a 2,2-bis (4-hydroxyphenyl) propane structure (bisphenol A structure) as a skeleton structure, and particularly a polycarbonate having a biscresol fluorene structure and a bisphenol A structure as a skeleton structure are preferable. Polycarbonate having a biscresol fluorene structure and a bisphenol A structure as a skeleton structure has a high glass transition temperature and thus has excellent heat resistance of a plastic film, and is more preferably used in applications such as a transparent conductive substrate. Note that the biscresol fluorene structure and the 2,2-bis (4-hydroxyphenyl) propane structure mean that -OH at both ends of biscresol fluorene or 2,2-bis (4-hydroxyphenyl) propane is -O-. Means the structure.
[0026]
The “flattening layer made of substantially the same material as the plastic film” according to the present invention means that the material forming the flattening layer has the same or almost the same chemical composition as the material forming the plastic film. And that the chemical and physical properties are the same or almost the same. For example, when the plastic film is made of an aromatic polycarbonate in which biscresol fluorene and bisphenol A are used as aromatic dihydroxy compounds, the same proportions of biscresol fluorene and 2,2-bis ( 4-hydroxyphenyl) propane and aromatic dihydroxy compounds as aromatic dihydroxy compounds, or a mixture thereof in a different proportion, or a part of the aromatic dihydroxy compound is converted to another dihydroxy compound such as 1,4-cyclohexanedimethanol. A case where a copolymer replaced with a compound is used can be exemplified. Whether or not they are of substantially the same species or have almost the same chemical composition, whether or not the chemical and physical properties are almost the same, actually make a film laminate, flatness, By evaluating the releasability, warpage, etc., it can be appropriately determined depending on whether or not the object of the present invention is satisfied. In general, those in which the copolymerization ratio is changed to about 20% by weight with respect to the material forming the plastic film, or those in which other copolymer components or additives are added up to 10% by weight are suitable.
[0027]
In addition, the flattening layer according to the present invention means a layer for realizing a surface that is flatter than the surface of the laminated surface of the plastic film base material layer. The specific degree of flattening can be determined according to the actual situation. A specific preferable degree of flattening will be described later.
[0028]
The lamination side face of the plastic film base layer according to the present invention may be either one or both sides of the plastic film base layer.
[0029]
It is preferable that the peak-to-valley maximum value of the unevenness on the lamination side surface of the plastic film base layer according to the present invention is 50 nm or less. This value may be measured by laminating the flattening layer if possible, or more simply, may be measured before forming the flattening layer.
[0030]
The maximum value of the peak-to-valley of the surface irregularities is the maximum value of the height of the top of the convex portion and the maximum of the depth of the bottom of the concave portion when measuring the surface irregularity for a predetermined area on a certain surface. It means the difference from the value. Specifically, for example, the maximum height (Ry) specified in JIS B0601-1994 can also be used. As the measuring device, an optical interference microscope or an atomic force microscope can be used. For example, if the measurement is performed using an optical interference microscope WycoNT3300 (manufactured by Veeco), the attached analysis software can be used as it is.
[0031]
When this value is 50 nm or less, the flattening effect of the flattening layer is easily exerted, and the gas barrier properties are less liable to be easily exhibited.
[0032]
The requirement that the maximum value of the peak-to-valley of the surface unevenness is 50 nm or less may be satisfied at any part of the lamination side surface of the plastic film base material layer. Measurement is preferable because the reliability of the entire product of the film laminate is improved.
[0033]
The thickness of the flattening layer according to the present invention is not limited as long as the object of the present invention is not impaired, but is preferably at least twice the maximum value of the peak-to-valley, and preferably at least three times. Is more preferable. This is because the flattening effect is sufficiently exhibited.
[0034]
The thickness of the flattening layer may be determined by any method as long as the thickness is measured for the same film laminate lot as the peak-to-valley value is measured. More specifically, it is sufficient to measure several points or more for one lot and obtain the average value. When there are a plurality of measured peak-to-valley maximum values, the maximum value may be twice or three times or more of the maximum value.
[0035]
The specific level of flattening by the flattening layer is that of the flattening layer, which is not the surface in contact with the lamination side surface of the base material layer (the non-contact surface of the flattening layer with the base material layer). The peak-to-valley maximum value of the unevenness is preferably 10 nm or less, more preferably 5 nm or less. This value may be a value measured after forming the inorganic compound layer, if possible, or more simply a value measured before forming the inorganic compound layer.
[0036]
As for the thickness of the inorganic compound layer according to the present invention, when the peak-to-valley maximum value of the unevenness of the non-contact surface of the base material layer of the flattening layer is three times or more, a gas permeability with little variation can be realized. In particular, it was found that the water vapor transmission rate could be reduced. The thickness of the inorganic compound layer may be determined by any method as long as the thickness is measured for the same film laminate lot as the peak-to-valley value is measured. More specifically, it is sufficient to measure several points or more for one lot and obtain the average value. When there are a plurality of measured peak-to-valley maximum values, the maximum value may be three times or more of the maximum value.
[0037]
The specific value of the thickness of the inorganic compound layer is preferably 10 nm or more in order to form a continuous film, and is preferably 200 nm or less from the viewpoint of preventing warpage and cracking. A thickness between 20 nm and 40 nm is more preferred.
[0038]
When the inorganic compound is formed as a thin film, if the peak-to-valley value is large, a shadow effect is caused on the film surface, and a portion where the thin film is not laminated may be generated. It has been found that this problem can be substantially suppressed when a thin film of an inorganic compound is laminated with a thickness of three times or more the peak-to-valley value.
[0039]
Generally, metals, oxides, nitrides, oxynitrides, and the like are suitably used as the inorganic compound layer according to the present invention. Specifically, the main component is an oxide, nitride, oxynitride, or a mixture thereof of at least one metal from the group consisting of silicon, aluminum, indium, tin, zinc, titanium, and tantalum. Is preferred. Note that other components may coexist as long as they do not contradict the spirit of the present invention. Aluminum oxide and silicon oxide are more preferably used industrially in terms of water vapor barrier properties, transparency, and low cost.
[0040]
The film laminate according to the present invention is prepared by laminating a flattening layer made of substantially the same kind of material as the plastic film on a plastic film base layer, and laminating an inorganic compound layer thereon. can do. For the preparation of the flattening layer, any known method may be adopted, and examples thereof include a method of applying a solution, removing a solvent, and a method of attaching a material of a film. However, on the base material layer made of a plastic film, a resin solution obtained by dissolving substantially the same kind of material as the plastic film is applied, a flattening layer is stacked, and an inorganic compound layer is stacked thereon. The method is preferred.
[0041]
By applying the resin solution, the plastic film base layer and the flattening layer can be laminated without chemical and physical distortions, so that the gas barrier properties of the inorganic compound layer can be exhibited with less variation and good, and It is easy to avoid problems such as peeling, warping, and interfacial reflection. By producing the above-described film laminate according to the present invention by such a method, it is possible to stably produce a film laminate having good gas barrier properties.
[0042]
As for the resin solution, it is preferable to use a solvent having a low dissolution rate with respect to the plastic film forming the base material layer and having high solubility of the resin to be dissolved.
[0043]
If a solvent with a high dissolution rate and high solubility is used, the plastic film that forms the base layer will be dissolved during the process of introducing the flattening layer onto the film surface, which proves to be inappropriate as a flattening layer. Was.
[0044]
When a solvent having a low dissolution rate and low solubility with respect to the resin to be dissolved is used, the solution hardly contains the target resin, so that it is difficult to form a flattening layer.
[0045]
On the other hand, when a solvent having a low dissolution rate and a high solubility is used, a flattening layer having substantially the same composition as the substrate layer can be introduced without substantially dissolving the plastic film forming the substrate layer. Do you get it.
[0046]
In a solvent having a low dissolution rate, the time required to prepare a resin solution may be extremely long. In such a case, the dissolution rate can be increased by refluxing the solvent, stirring the resin solution, or the like. Therefore, it may be preferable to use a solvent that can increase the dissolution rate by these dissolution rate acceleration methods.
[0047]
Here, the expression “high solubility” means that the objective resin can be dissolved in a solvent at 25 ° C. in an amount of 3% by weight or more at 25 ° C. for the purpose of the present invention.
[0048]
The slow dissolution rate can be based on the fact that when a solvent is dropped on a plastic film by a dropping method specified in JIS H0400-500, pores are not formed at a rate of 100 μm / 100 minutes or more. . More specifically, a plastic film having a thickness of 100 μm was prepared under the same conditions as those used for the film laminate, and when a solvent was dropped, it was determined that a through hole was not formed in the film even after dripping for 100 minutes. It can be. In the case of a dissolution rate higher than this, the plastic film forming the base layer is dissolved in the solvent volatilization step after the application of the flattening layer, so that the proportion of the plastic film to be dissolved increases, so that the shape of the film surface changes. Problem easily occurs.
[0049]
The solvent used for the resin solution may be any solvent as long as it has the above properties, and when using a polycarbonate having a biscresol fluorene structure and a bisphenol A structure as a skeleton structure as in Examples, cyclohexanone is preferable. . Further, a mixed solvent in which a solvent having a high solubility is mixed with a solvent having a low solubility and the solubility is appropriately adjusted can also be used.
[0050]
The method for applying the resin solution is not particularly limited, and a known method such as a roll coater, a gravure coater, or a spin coater can be used.
[0051]
The lamination side surface of the plastic film base layer may be either a surface on the side in contact with the belt carrying the film in the solution casting method or a surface on the opposite side, or both, but may be a solution casting method. When a plastic film is produced by the method described above, the surface on the side in contact with the belt carrying the film is more preferable. In the case of the solution casting method, the surface of the film that is in contact with the belt carrying the film has a higher peak-to-valley value than the surface that is not in contact with the belt, and this is the cause of the variation in gas barrier properties. This is because it can be one of the causes.
[0052]
A known method can be used for forming the inorganic oxide layer. As specific examples, a magnetron sputtering method, an ion plating method, a CVD method, a heating evaporation method, a sol-gel method, a high-frequency induction heating method and the like can be adopted.
[0053]
In general, metals, oxides, nitrides, oxynitrides, and the like are suitably used as a raw material for forming the inorganic compound layer. Specifically, the main component is an oxide, nitride, oxynitride, or a mixture thereof of at least one metal from the group consisting of silicon, aluminum, indium, tin, zinc, titanium, and tantalum. Is preferred. Note that other components may coexist as long as they do not contradict the spirit of the present invention. Aluminum oxide and silicon oxide are more preferably used industrially in terms of water vapor barrier properties, transparency, and low cost.
[0054]
The film laminate obtained in the present invention has high gas barrier properties. Therefore, for example, due to its high water vapor barrier property, it can be suitably used for food packaging applications and pharmaceutical packaging applications, which dislike transmission of moisture. In addition, a transparent substrate having a low water vapor transmission rate is required, such as a liquid crystal display, an electroluminescent display, and an electronic paper, and as a material for various display elements, a transparent conductive film or a protective layer alone or on a film laminate, an easy adhesion layer, It can be used in a form laminated with a lubricating layer or the like, or in a form in which these are attached.
[0055]
【Example】
Next, examples and comparative examples of the present invention will be described in detail. The method of measuring and evaluating the film in the following examples is as follows.
[0056]
<Measurement of peak-to-valley maximum value of surface irregularities>
As the optical interference microscope, Wyco (registered trademark) NT3300 manufactured by Veeco was used. It was measured. One measurement site was arbitrarily selected from the samples. Note that the measurement was performed before stacking the flattening layer for the base material layer and before forming the inorganic compound layer for the flattening layer.
[0057]
After performing a two-dimensional tilt process on the surface roughness image obtained by the measurement, a HighPass filter process is performed to remove a waviness component having a period of 40.00 / mm or more, and a histogram of the unevenness height distribution is obtained. In addition, accidental irregularities caused by sudden abnormalities were removed. Specifically, components having a height of 100 nm or more were excluded. Thereafter, a difference between the maximum value of the height of the top of the convex portion and the maximum value of the depth of the bottom of the concave portion was obtained.
[0058]
The measurement was repeated five times, and the average value of the five values of the difference between the maximum value of the height of the top of the convex portion and the maximum value of the depth of the bottom of the concave portion was determined as the peak of the unevenness of the surface according to the present invention. Two valley maximum.
[0059]
<Thickness of flattening layer>
The refractive index of the resin used for the coating layer was measured with an Abbe refractometer. Using a resin solution dissolved in a solvent, a coat layer was formed on the surface of a polyethylene terephthalate film under the same conditions as those for forming the film laminate of the example. The spectral spectrum of the film having the coated layer was measured, and the measurement result was used to calculate the film thickness using analysis software Aspect Plus Thickness manufactured by Spectra Corp.
[0060]
<Thickness of inorganic compound layer>
With respect to the film laminates obtained in Examples and Comparative Examples, the amount of metal atoms laminated was measured by an X-ray fluorescence analyzer, and the amount was converted to the thickness of oxide.
[0061]
<Water vapor transmission rate>
As a representative of the gas permeability, the water vapor transmission rate was measured at a temperature of 40 ° C. and a relative humidity of 100% using a water vapor transmission rate measuring apparatus (Permatran-W1 manufactured by MOCON). In this measurement, the water vapor transmission rate was 0.1 g / (m ² ・ 24h) Those having the following values were determined to have good water vapor barrier properties.
[0062]
<Heat release test>
The film laminates obtained in Examples and Comparative Examples were left under the conditions of 60 ° C. and 90% relative humidity for 200 hours, and subjected to a cross-cut peel test according to the method of JIS K-5400. Was evaluated as ○ (good), and those with peeled portions were evaluated as x (poor).
[0063]
[Example 1]
A polycarbonate having a skeleton structure of a biscresol fluorene structure and a bisphenol A structure in a ratio of 50 mol: 50 mol was dissolved in dichloromethane, and the solution was cast on a belt by a solution casting method to produce a film having a thickness of 120 μm.
[0064]
On the other hand, a polycarbonate having a skeletal structure having a biscresol fluorene structure and a bisphenol A structure in the same ratio as described above was mixed in cyclohexanone so as to be 6% by weight, dissolved under a reflux condition of 130 ° C., and cooled to room temperature. A resin solution was prepared.
[0065]
Then, using the above film as a base material layer, the above resin solution is applied to the belt contact surface (the film surface which was in contact with the belt at the time of film production) with a spin coater, and the solvent was removed in a 130 ° C. hot bath. After volatilization, a flattening layer having a thickness of 300 nm was laminated. On the surface of the flattening layer, a silicon oxide film was formed as an inorganic compound layer to a thickness of 33 nm by an argon sputtering method to produce a transparent film laminate.
[0066]
In addition, cyclohexanone was able to dissolve the polycarbonate up to 25% by weight at 25 ° C.
[0067]
Separately, a polycarbonate having a skeleton structure of a biscresol fluorene structure and a bisphenol A structure in the same ratio as described above is dissolved in dichloromethane, and solution cast on a belt by a solution casting method to produce a film having a thickness of 100 μm. When the solvent was dropped by a dropping method specified in JIS H0400-500, no through hole was formed even after 100 minutes.
[0068]
[Comparative Example 1]
A silicon oxide film was formed as an inorganic compound on the polycarbonate film used in Example 1 without forming a flattening layer, thereby producing a transparent film laminate.
[0069]
[Example 2]
A transparent film laminate was produced in the same manner as in Example 1 except that the thickness of the flattening layer was set to 90 nm.
[0070]
[Comparative Example 2]
Instead of the resin solution of Example 1, a resin solution prepared by mixing aminopropyltrimethoxysilane and organosilane and adding distilled water, 1-methoxy-2-propanol, acetic acid, and butanol as adjuvants was used. Except for the above, a transparent film laminate was produced in the same manner as in Example 1.
[0071]
[Example 3]
A film laminate was produced in the same manner as in Example 1 except that the thickness of the inorganic compound layer was changed to 9 nm.
[0072]
Table 1 summarizes the results of the above Examples and Comparative Examples.
[0073]
[Table 1]

[0074]
【The invention's effect】
According to the present invention, it is possible to provide a film laminate having good gas barrier properties with little variation and capable of avoiding problems such as peeling, warpage, and interface reflection.

Claims (18)

A film laminate in which a flattening layer made of substantially the same material as the plastic film is laminated on a plastic film base layer, and an inorganic compound layer is laminated thereon. 2. The film laminate according to claim 1, wherein the peak-to-valley maximum value of the unevenness on the lamination side surface of the plastic film base layer is 50 nm or less. The film laminate according to claim 1, wherein the plastic film is made of polycarbonate. The film laminate according to claim 3, wherein the polycarbonate is a polycarbonate having a skeleton structure of a biscresol fluorene structure and a 2,2-bis (4-hydroxyphenyl) propane structure. The film laminate according to any one of claims 1 to 4, wherein the thickness of the flattening layer is at least twice the maximum value of the peak-to-valley of the unevenness on the lamination side surface of the plastic film base layer. Regarding the flattening layer, the peak-to-valley maximum value of the unevenness of the surface that is not the surface in contact with the lamination side surface of the base layer (the non-contact surface of the flattening layer with the base layer) is 10 nm or less. The film laminate according to claim 1. The film laminate according to any one of claims 1 to 6, wherein the thickness of the inorganic compound layer is at least three times the maximum value of the peak-to-valley of the unevenness of the non-contact surface of the base layer of the flattening layer. . The inorganic compound layer contains, as a main component, an oxide, nitride, oxynitride, or a mixture thereof of at least one metal selected from the group consisting of silicon, aluminum, indium, tin, zinc, titanium, and tantalum. The film laminate according to any one of claims 1 to 7. A film laminate obtained by applying a resin solution obtained by dissolving substantially the same kind of material as the plastic film to a plastic film base layer, laminating a flattening layer, and laminating an inorganic compound layer thereon Manufacturing method. As a solvent for preparing the resin solution, when the solubility of the resin to be dissolved at 25 ° C. is 3% by weight or more and the solvent is dropped on the plastic film by a dropping method specified in JIS H0400-500. The method for producing a film laminate according to claim 9, wherein a solvent that does not form pores at a rate of 100 µm / 100 minutes or more is used. Producing the plastic film base layer by a solution casting method,
The lamination side surface is a surface on the side in contact with the belt carrying the film in the solution casting method,
A method for producing a film laminate according to claim 9. The method for producing a film laminate according to any one of claims 9 to 11, wherein a maximum value of peak-to-valley of unevenness on a lamination side surface of the plastic film base layer before laminating a flattening layer is 50 nm or less. . The method for producing a film laminate according to any one of claims 9 to 12, wherein the plastic film is made of polycarbonate. The method for producing a film laminate according to claim 13, wherein the polycarbonate is a polycarbonate having a skeleton structure of a biscresol fluorene structure and a 2,2-bis (4-hydroxyphenyl) propane structure. The thickness of the flattening layer is set to be twice or more the maximum value of the peak-to-valley of the unevenness on the lamination side surface of the plastic film base layer before the flattening layer is stacked. 15. The method for producing a film laminate according to any one of 14. Regarding the flattening layer, the peak-to-valley maximum value of the unevenness of the surface (the non-contacting surface of the flattening layer of the base material layer) which is not the surface in contact with the lamination side surface of the base material layer is equal to the inorganic compound layer. The method for producing a film laminate according to any one of claims 9 to 15, wherein the thickness is 10 nm or less before lamination. The thickness of the inorganic compound layer is set to be three times or more the maximum value of the peak-to-valley of the unevenness of the non-contact surface of the base layer of the flattening layer before the inorganic compound layer is laminated. 17. The method for producing a film laminate according to any one of claims 16 to 16. The inorganic compound layer,
Silicon, aluminum, indium, tin, zinc, titanium and tantalum at least one of the group consisting of metal oxide, nitride, oxynitride, or a mixture thereof as a main component,
Magnetron sputtering method, ion plating method, CVD method, heat evaporation method, sol-gel method, formed by laminating any one of the group consisting of high-frequency induction heating method,
A method for producing a film laminate according to any one of claims 9 to 17.