JP2004221534A5 - - Google Patents

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Publication number
JP2004221534A5
JP2004221534A5 JP2003350842A JP2003350842A JP2004221534A5 JP 2004221534 A5 JP2004221534 A5 JP 2004221534A5 JP 2003350842 A JP2003350842 A JP 2003350842A JP 2003350842 A JP2003350842 A JP 2003350842A JP 2004221534 A5 JP2004221534 A5 JP 2004221534A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003350842A
Other languages
Japanese (ja)
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JP2004221534A (ja
JP4149891B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2003350842A priority Critical patent/JP4149891B2/ja
Priority claimed from JP2003350842A external-priority patent/JP4149891B2/ja
Publication of JP2004221534A publication Critical patent/JP2004221534A/ja
Publication of JP2004221534A5 publication Critical patent/JP2004221534A5/ja
Application granted granted Critical
Publication of JP4149891B2 publication Critical patent/JP4149891B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003350842A 2002-12-27 2003-10-09 コンデンサとコンデンサ内蔵回路基板、ならびにそれらの製造方法 Expired - Fee Related JP4149891B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003350842A JP4149891B2 (ja) 2002-12-27 2003-10-09 コンデンサとコンデンサ内蔵回路基板、ならびにそれらの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002379231 2002-12-27
JP2003350842A JP4149891B2 (ja) 2002-12-27 2003-10-09 コンデンサとコンデンサ内蔵回路基板、ならびにそれらの製造方法

Publications (3)

Publication Number Publication Date
JP2004221534A JP2004221534A (ja) 2004-08-05
JP2004221534A5 true JP2004221534A5 (cg-RX-API-DMAC7.html) 2006-07-06
JP4149891B2 JP4149891B2 (ja) 2008-09-17

Family

ID=32911234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003350842A Expired - Fee Related JP4149891B2 (ja) 2002-12-27 2003-10-09 コンデンサとコンデンサ内蔵回路基板、ならびにそれらの製造方法

Country Status (1)

Country Link
JP (1) JP4149891B2 (cg-RX-API-DMAC7.html)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4599997B2 (ja) * 2004-11-08 2010-12-15 凸版印刷株式会社 固体電解コンデンサを内蔵した配線基板の製造方法
JP4736451B2 (ja) * 2005-02-03 2011-07-27 パナソニック株式会社 多層配線基板とその製造方法、および多層配線基板を用いた半導体パッケージと電子機器
CN101180693B (zh) * 2005-05-18 2011-10-26 三洋电机株式会社 层叠型固体电解电容器及其制造方法
JP4839824B2 (ja) * 2005-12-21 2011-12-21 パナソニック株式会社 コンデンサ内蔵基板およびその製造方法
JP2007201065A (ja) * 2006-01-25 2007-08-09 Hitachi Aic Inc コンデンサ内蔵基板
JP5003226B2 (ja) * 2007-03-20 2012-08-15 日本電気株式会社 電解コンデンサシート及び配線基板、並びに、それらの製造方法
JP4812118B2 (ja) 2007-03-23 2011-11-09 Ｎｅｃトーキン株式会社 固体電解コンデンサ及びその製造方法
JP5211777B2 (ja) * 2008-03-17 2013-06-12 富士通株式会社 電解キャパシタ及びその製造方法並びに配線基板
CN117577590A (zh) 2017-12-27 2024-02-20 株式会社村田制作所 半导体复合装置及其所使用的封装基板
JPWO2021132220A1 (cg-RX-API-DMAC7.html) * 2019-12-25 2021-07-01
JP7697852B2 (ja) * 2021-09-16 2025-06-24 パナソニックホールディングス株式会社 固体電解コンデンサ

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