JP2004221167A - Electronic component mounting method and mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting method and mounting apparatus in which the mounting accuracy and fall of quality of a circuit board due to the interference of nozzle and electronic component can be prevented while electronic components are mounted in higher density to the circuit board using an existing attraction nozzle. <P>SOLUTION: The nozzle is allocated to the position deviated from the center of an electronic component so that the size of nozzle 3 stuck out from the electronic component 1c in the direction adjacent to the electronic component 1c is determined smaller than the predetermined value. Thereafter, the electronic components are attracted. Accordingly, the nozzle is never placed in contact with an adjacent mounted electronic component 1b. Moreover, loading accuracy can be improved and excellent product can also be manufactured. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention provides an electronic component mounting method in which various components such as electronic components are sucked and held by a suction nozzle, and the above sucked and held components are automatically mounted at predetermined positions on a substrate to be mounted, such as a printed circuit board. And a mounting device.
[0002]
[Prior art]
Generally, in an electronic component mounting apparatus, as shown in FIG. 4, a component supply unit 2 for supplying an electronic component 1, a nozzle 3 for sucking the electronic component 1 from the component supply unit 2, and a positioning unit for positioning the nozzle 3 are provided. The XY robot 4 includes a XY robot 4, a camera 5 which is a measuring unit for measuring the position of the electronic component 1 to which the nozzle 3 is attracted with respect to the nozzle 3, and a substrate holding unit 7 for holding a substrate 6. After the nozzle 3 is positioned above the component supply unit 2 by the XY robot 4, the nozzle 3 sucks and holds the electronic component 1. Next, the electronic component 1 to be sucked and held by the nozzle 3 is measured by the camera 5, the mounting position above the substrate holding unit 7 is corrected based on the measurement result, the XY robot 4 positions the nozzle 3, and the substrate 6 The parts are mounted on.
[0003]
2. Description of the Related Art In recent years, with the reduction in size and weight of electronic devices typified by mobile phones, the size of electronic components and the distance between adjacent electronic components have also been reduced in electronic circuit boards. As electronic components, those having a size of 1 mm × 0.5 mm or 0.6 mm × 0.3 mm are mainstream, and adjacent electronic components are becoming extremely small at intervals of 0.2 mm or 0.1 mm.
[0004]
In a conventional electronic component mounting apparatus, such a minute electronic component is sucked and held by a nozzle and mounted.However, the size of the nozzle to be sucked is equal to or slightly smaller than the size of the electronic component. It is getting bigger. This is because if the size of the electronic component is smaller than that of the electronic component, the size of the suction port becomes smaller and the suction force is reduced, which leads to a suction error and increases the number of electronic components to be discarded. Also, by reducing the size of the nozzle, the strength of the tip of the nozzle is reduced, and there is a possibility that the nozzle may be clogged. Due to such a size of the nozzle, the portion 9 where the nozzle 3 protrudes from the sucked electronic component 1 as shown in FIG. 5, as shown in FIG. There is a possibility that the contact with the electronic component 1b may deteriorate the mounting accuracy and result in a defective product.
[0005]
In order to solve this problem, as in Japanese Patent Application Laid-Open No. 2000-286600 (Japanese Patent Application No. 11-088500), an electronic component sucked in a measuring unit is measured to determine whether there is interference between the nozzle and the mounted electronic component. There is a method such as mounting after doing.
[0006]
[Patent Document 1]
JP 2000-286600 A
[Problems to be solved by the invention]
However, as long as the nozzle is larger than or equal to the electronic component, it is inevitable that the nozzle will protrude beyond the electronic component in many cases. For this reason, there is a problem that the amount of electronic components to be discarded increases. In addition, the method of inverting by 180 ° after the determination and performing the re-determination also has a problem that it cannot be applied to a polar electronic component.
[0008]
Accordingly, an object of the present invention has been made in view of the above-described conventional problems, and while an electronic component is mounted on a circuit board at a high density using an existing suction nozzle, the circuit board due to interference between the nozzle and the electronic component is provided. Provided are a method and an apparatus for mounting an electronic component, which can prevent deterioration in mounting accuracy and quality of the electronic component.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, the present invention is configured as follows.
[0010]
According to the first aspect of the present invention, a component supply unit positioning step of positioning the nozzle above the component supply unit;
A suction step of suctioning an electronic component to be mounted from the component supply unit by the positioned nozzle;
A mounting positioning step of positioning the nozzle that has sucked the electronic component with respect to a mounting area of the board on which the electronic component to be mounted is mounted,
In the electronic component mounting method having a mounting step of moving the nozzle toward the substrate and mounting the sucked electronic component on the substrate,
In the component supply unit positioning step, the protruding amount of the nozzle from the electronic component to be mounted in the approach direction from the mounting region on the substrate to the already mounted electronic component adjacent to the mounting region, An electronic component mounting method, wherein the nozzle is positioned at a position deviated from the center of the electronic component to be mounted above the component supply unit so as to be smaller than a nozzle interference distance.
[0011]
According to the second aspect of the present invention, in the component supply unit positioning step, the approaching direction is a shortest distance from the mounting area on the board to the already mounted electronic component adjacent to the mounting area. And the nozzle interference distance is a dimension of a gap between the electronic component already mounted adjacently and the electronic component to be mounted when the electronic component to be mounted is mounted in the mounting area. The amount of protrusion of the nozzle from the electronic component to be mounted in the direction of the electronic component already mounted adjacently is the nozzle interference distance, and the electronic component already mounted adjacently. The component and the electronic component to be mounted when the electronic component to be mounted is mounted in the mounting area are smaller than the gap between the electronic component to be mounted and the electronic component to be mounted. To provide an electronic component mounting method according to the first aspect which is adapted to position the nozzle.
[0012]
According to the third aspect of the present invention, a component supply unit that supplies an electronic component to be mounted, a nozzle that sucks and holds the electronic component to be mounted from the component supply unit, and mounts the electronic component to be mounted. A board holding unit that holds a board having a mounting area, and an electronic component mounting apparatus including a positioning unit that positions the nozzle above the component supply unit and the board holding unit.
In the component supply unit positioning step, the protruding amount of the nozzle from the electronic component to be mounted in the approach direction from the mounting region on the substrate to the already mounted electronic component adjacent to the mounting region, The apparatus further includes a control unit that performs positioning of the nozzle at a position deviated from the center of the electronic component to be mounted so as to be smaller than the nozzle interference distance, and subsequently performs operation control to perform suction. Provided is an electronic component mounting apparatus.
[0013]
According to the fourth aspect of the present invention, the control unit may determine that the approach direction is a direction along the shortest distance from the mounting area on the board to the electronic component already mounted adjacent to the mounting area. The nozzle interference distance is a dimension of a gap between the electronic component already mounted adjacently and the electronic component to be mounted when the electronic component to be mounted is mounted in the mounting area. The amount of protrusion of the nozzle from the electronic component to be mounted in the direction in which the electronic component already mounted adjacently is present is the nozzle interference distance, and the electronic component already mounted adjacently. And positioning the nozzle at a position deviated from the center of the electronic component to be mounted so as to be smaller than the gap between the electronic component to be mounted and the electronic component to be mounted when the electronic component to be mounted is mounted in the mounting area. To provide an electronic component mounting apparatus according to the third aspect which is adapted to operate controls to perform.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0015]
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
[0016]
FIG. 1 is a schematic configuration diagram showing a configuration of an electronic component mounting apparatus for embodying an electronic component mounting method according to an embodiment of the present invention. The electronic component mounting apparatus includes a plurality of parts cassettes 2a which are an example of a component supply unit that supplies the electronic components 1, a plurality of nozzles 3 capable of holding the plurality of electronic components 1 by suction, and a suctioned electronic component. A camera 5, which is a measuring unit for measuring the position of one of the nozzles 3, a substrate holding unit 7, which holds the substrate 6, an XY robot 4, which is a positioning unit for positioning the nozzle 3, and a component supply operation of the parts cassette 2a. The control unit 8 (see FIG. 7) controls various operations such as raising and lowering the nozzle 3, suction and release operations of the nozzle 3, recognition operation of the camera 5, and driving of the XY robot 4.
[0017]
The control unit 8 previously inputs and stores a suction shift amount in consideration of a distance L of a gap between the mounting area 1a of the electronic component 1c to be mounted and the adjacent electronic component 1b as described later. The control unit 8 controls the XY robot 4 to position the nozzle 3 above the parts cassette 2a and at a position shifted from the center of the electronic component 1 by the above-described suction shift amount. Then, after lowering the nozzle 3, the electronic component 1 is sucked and held by the nozzle 3, and the nozzle 3 is raised. After that, the control unit 8 controls the XY robot 4 to stop the nozzle 3 above the camera 5, and causes the camera 5 to measure the position of the sucked electronic component 1 with respect to the nozzle 3. The control unit 8 corrects the positioning destination of the nozzle 3 above the substrate holding unit 7 based on the result of the measurement by the camera 5, controls the XY robot 4 to position the nozzle 3, and picks up the electronic component 1. Is mounted on the substrate 6, ie, the mounting area 1a where the sucked electronic component 1 is mounted. The correction is performed by the control unit 8, and when the position of the sucked electronic component 1c with respect to the nozzle 3 is shifted by more than the predetermined suction shift amount, the shift amount measured by the camera 5 By correcting the nozzle 3 (in other words, the sucked electronic component 1c) at the time of positioning the substrate 6 with respect to the mounting area 1a of the substrate 6, the sucked electronic component 1c is mounted with the above-mentioned predetermined suction shift amount. It is designed to be mounted in the area 1a.
[0018]
FIG. 2 is a flowchart illustrating an example of a method of determining the suction shift amount from the size of the nozzle 3 and the size of the electronic component 1. FIG. 3 is an explanatory diagram showing the size (width) of the nozzle 3, the size (width) of the electronic component 1, and the gap between the mounted electronic component 1b and the mounting area 1a adjacent to each other.
[0019]
As shown in FIG. 7, the control unit 8 includes a storage unit 8A that stores various information necessary for operation control in the control unit 8, and a calculation unit 8B that performs calculation based on the information stored in the storage unit 8A. And a comparison / determination unit 8C that performs comparison / determination based on the calculation result in the calculation unit 8B, and the operation is controlled by the control unit 8 respectively.
[0020]
The storage unit 8A stores information such as the position and size of the mounting area of each of the electronic components 1b and 1c on the board 6, and the mounted mounted electronic component 1b on the board 6; Let L be the gap between the mounting area 1a of the electronic component 1c to be mounted, W be the size (width) of the electronic component 1c to be mounted on the mounting area 1a, and N be the size (width) of each nozzle 3. The value is stored. In addition, a suction shift amount described later is also stored in the storage unit 8A. The calculation unit 8B calculates the difference {(N−W) / 2}, the suction shift amount, and the like. The comparison determination unit 8C compares and determines the result calculated by the calculation unit 8B with the data stored in the storage unit 8A.
[0021]
Therefore, when component mounting is first performed, in step S1 of FIG. 2, necessary information is read from the storage unit 8A by the control unit 8 and the mounted electronic component 1b adjacent to the board 6 and the next mounted The gap between the electronic component 1c and the mounting area 1a is L, the size (width) of the electronic component 1c mounted in the mounting area 1a is W, and the size (width) of each nozzle 3 is N. It is assumed that the nozzle protrudes on both sides.
[0022]
Next, in step S2, the arithmetic unit 8B is ２ of the difference (N−W) between the size (width) N of the nozzle 3 and the size (width) W of the mounted electronic component 1c. N−W) / 2}. Then, the difference {(N−W) / 2} obtained by the calculation unit 8B is compared with the gap L by the comparison judgment unit 8C. That is, when the difference {(N−W) / 2} is smaller than the gap L, the suction shift amount is set to 0 by the comparison determination unit 8C in step S3. That is, {(N−W) / 2} which is a half value of the difference (N−W) between the size N of the nozzle 3 and the size W of the electronic component 1 c is smaller than the gap L. This means that the distance between the adjacent mounted electronic component 1b is sufficiently large and there is no possibility that the nozzle 3 will interfere with the adjacent mounted electronic component 1b. It is not necessary to shift the center of the electronic component 1c with respect to the center of the electronic component 1c, and it is determined that the center of the electronic component 1 is to be suctioned, and the control unit 8 controls the positioning, suction, and mounting operations by the XY robot 4 and the nozzle 3. .
[0023]
On the other hand, when the difference {(N−W) / 2} is equal to or larger than the gap L, the suction shift amount is set to {(N−W−L) / 2} by the comparison determination unit 8C in step S4. . That is, this is a case where the distance between the adjacent mounted electronic component 1b is small and the possibility of interference (in other words, contact) is high, and the center of the nozzle 3 is shifted from the center of the electronic component 1c by the suction shift amount ｛( (N−W−L) / 2} is determined to be shifted. Based on this determination, the suction shift amount {(N−W−L) / 2} is stored in the storage unit 8A, and the control unit 8 controls the electronic component 1c at the center of the nozzle 3 as described above. The XY robot 4 is controlled at the time of positioning with respect to the center of the electronic component 1, and the nozzle 3 is positioned above the parts cassette 2a and at a position shifted from the center of the electronic component 1 by the above-described shift amount of suction, and the subsequent suction and mounting operations are performed. Let As described above, by setting the suction shift amount of the center of the nozzle 3 with respect to the center of the electronic component 1c to {(N−W−L) / 2}, when the electronic component 1c is sucked by the nozzle 3, Control is performed such that the center of the nozzle 3 is shifted from the center of the electronic component 1c by {(N−W−L) / 2} in the direction opposite to the mounting area 1a and the adjacent electronic component 1b. As a result, when the electronic component 1c shifted and sucked by the nozzle 3 is mounted in the mounting area 1a, the distance between the nozzle 3 and the adjacent mounted electronic component 1b is at least L / 2 or more, so that interference occurs. Absent. The reason why the shift amount is {(N−W−L) / 2} is that if the shift amount is too large, there is a high possibility that the component cannot be sucked.
[0024]
According to the above embodiment, since the nozzle 3 is sucked while being shifted from the center of the electronic component 1 by the suction shift amount, the distance between the adjacent mounted electronic component 1b and the nozzle 3 is maintained by a value that does not interfere, and Therefore, the mounting accuracy can be improved and a good product can be produced.
[0025]
Note that by appropriately combining any of the various embodiments described above, the effects of the respective embodiments can be achieved.
[0026]
【The invention's effect】
According to the electronic component mounting method and the mounting apparatus of the present invention, the nozzle 3 is sucked while being shifted by the suction shift amount from the center of the electronic component 1, so that the distance between the adjacent mounted electronic component and the nozzle does not interfere. When mounting electronic components that have a very small distance between adjacent electronic components, the nozzle does not contact adjacent mounted electronic components, improving mounting accuracy and improving non-defective products. Can be produced.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram showing an electronic component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a flowchart illustrating a method of determining a suction shift amount in the electronic component mounting apparatus according to the embodiment.
FIG. 3 is an explanatory diagram illustrating a size of a nozzle 3 and a size of an electronic component 1 and a gap between an adjacent mounted electronic component 1b and a mounting area 1a.
FIG. 4 is a schematic configuration diagram showing a conventional mounting machine.
FIG. 5 is a schematic view illustrating a state in which a nozzle and a mounted component interfere with each other.
FIG. 6 is a schematic view showing a state in which a nozzle and a mounted component interfere with each other.
FIG. 7 is a block diagram showing a connection relationship between a control unit and other devices and members in the electronic component mounting apparatus according to the embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Electronic component, 1a ... Mounting area, 1b ... Mounted electronic component, 1c ... Mounted electronic component, 2 ... Component supply part, 2a ... Parts cassette, 3 ... Nozzle, 4 ... XY robot, 5 ... Camera, 6 ... board, 7 ... board holding part, 8 ... control part.

Claims (4)

A component supply unit positioning step of positioning the nozzle above the component supply unit;
A suction step of suctioning an electronic component to be mounted from the component supply unit by the positioned nozzle;
A mounting positioning step of positioning the nozzle that has sucked the electronic component with respect to a mounting area of the board on which the electronic component to be mounted is mounted,
In the electronic component mounting method having a mounting step of moving the nozzle toward the substrate and mounting the sucked electronic component on the substrate,
In the component supply unit positioning step, the protruding amount of the nozzle from the electronic component to be mounted in the approach direction from the mounting region on the substrate to the already mounted electronic component adjacent to the mounting region, An electronic component mounting method, wherein the nozzle is positioned at a position deviated from the center of the electronic component to be mounted above the component supply unit so as to be smaller than a nozzle interference distance. In the component supply unit positioning step, the approaching direction is a direction along the shortest distance from the mounting area on the substrate to the already mounted electronic component adjacent to the mounting area, and the nozzle interference distance Is the dimension of the gap between the electronic component already mounted adjacent to the electronic component to be mounted and the electronic component to be mounted when the electronic component to be mounted is mounted in the mounting area. The amount of protrusion of the nozzle from the electronic component to be mounted in the direction in which the electronic component is to be mounted is the nozzle interference distance, and the electronic component already mounted adjacent to the electronic component to be mounted is The nozzle is positioned at a position deviated from the center of the electronic component to be mounted so as to be smaller than the gap between the electronic component to be mounted when the electronic component is mounted in the mounting area. Electronic component mounting method according to claim 1 which is. A component supply unit for supplying an electronic component to be mounted, a nozzle for sucking and holding the electronic component to be mounted from the component supply unit, and a substrate holding unit for holding a substrate having a mounting area for mounting the electronic component to be mounted And an electronic component mounting apparatus including a positioning unit that positions the nozzle above the component supply unit and the substrate holding unit.
In the component supply unit positioning step, the protruding amount of the nozzle from the electronic component to be mounted in the approach direction from the mounting region on the substrate to the already mounted electronic component adjacent to the mounting region, The apparatus further includes a control unit that performs positioning of the nozzle at a position deviated from the center of the electronic component to be mounted so as to be smaller than the nozzle interference distance, and subsequently performs operation control to perform suction. Electronic component mounting equipment. The control unit, the approach direction is a direction along the shortest distance from the mounting area on the board to the already mounted electronic components adjacent to the mounting area, the nozzle interference distance, The dimension of a gap between the electronic component already mounted adjacent to the electronic component to be mounted and the electronic component to be mounted when the electronic component to be mounted is mounted in the mounting area, and the electronic component already mounted adjacent to the electronic component. The amount of protrusion of the nozzle from the electronic component to be mounted in the direction of the component is the nozzle interference distance, and the electronic component already mounted adjacent to the electronic component to be mounted is The operation control is performed such that the nozzle is positioned at a position deviated from the center of the electronic component to be mounted so as to be smaller than the gap with the electronic component to be mounted when the electronic component is mounted in the mounting area. Electronic component mounting apparatus according to claim 3 in which the.

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