JP2004220925A - Front surface plate for field emission type display and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a front surface plate for a field emission type display with high reliability, the reduced number of processes compared with a conventional method, improved yield, reduced material cost, the height of a barrier layer of uniform height to a substrate of a large area, and less abnormal discharge, and to provide its manufacturing method. <P>SOLUTION: In the front surface plate for the field emission type display provided with a transparent substrate, a black matrix layer provided with a plurality of opening parts formed in one face of the transparent substrate, and a fluorescent material layer formed on the transparent substrate within the opening parts of the black matrix layer. The opening parts of the black matrix layer are in a concave shape, and inner surfaces of the concave shape opening parts and the black matrix layer are electrically connected with a conductive material. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a front plate used for a field emission display and a method of manufacturing the front plate.
[0002]
[Prior art]
2. Description of the Related Art Liquid crystal displays and plasma displays have been put into practical use as methods for computer display terminals and wall-mounted televisions. Among these flat displays, a field emission display (field emission display (FED)) is characterized by low power consumption, high brightness, high definition, a wide viewing angle, and easy to see. It is expected to spread.
[0003]
Generally, a field emission display has a structure in which a pair of flat insulating substrates, such as glass, consisting of a back plate and a front plate, are arranged to face each other via a spacer member to form a flat vacuum vessel. ing. On one back plate (cathode substrate), there are provided an electron-emitting device (emitter electrode) arranged in a matrix for emitting electrons by an electric signal on a glass substrate, and a gate electrode via an insulating layer. ing. The other front plate (anode electrode) has an anode electrode on a glass substrate and red (R), green (G), and blue (B) colors that emit visible light by electrons emitted from the emitter electrode. And various improvements have been made conventionally.
[0004]
For example, as a front panel of a field emission display, the contrast is improved by reducing the reflectance of external light, and in order to make it easier to see as a display, areas other than the R, G, and B pixels are made of a low-reflection material black. A method of filling with a matrix layer has been performed. Examples of the black matrix layer include a layer formed by vacuum deposition of low-reflection chromium oxide or the like and forming a pattern by photolithography, and a layer formed by printing a black ink layer by printing.
[0005]
On the front panel of the field emission display, the scattering of electrons emitted from the emitter electrode, or the reflected electrons generated when the emitted electrons cause the phosphor to emit light, enter the phosphor layer in another adjacent region. However, there is a problem that the display quality is degraded by lowering the contrast and color purity. For this reason, for example, a black matrix is made to protrude from the phosphor film layer using glass as a base material on the front plate of the field emission display, for example, a rib-shaped convex portion having a height of 50 μm is formed, and the entire surface is made of a conductive thin film. Coating with a layer is performed (see Patent Document 1).
[0006]
However, as shown in Patent Literature 1, when the barrier layer is formed of a glass material which is an insulator, charges are accumulated in the barrier layer, and electrons emitted later due to charge-up of the barrier layer are bent. Since efficient display cannot be performed, there is a problem that a metal thin film forming step for imparting conductivity is indispensable and the step becomes complicated.
[0007]
Therefore, recently, in manufacturing a front panel for a field emission display, a method of forming a barrier by electroplating using a conductive intermediate layer formed on a glass substrate by a vacuum film forming method or the like as a power supply layer. (For example, see Patent Document 2).
[0008]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 11-185873 (page 5, paragraph 0026, FIG. 1)
[Patent Document 2]
JP-A-2002-33058 (pages 8 to 9, FIGS. 11 and 12)
[0009]
[Problems to be solved by the invention]
However, as described in Patent Document 1 and Patent Document 2, when a barrier is formed as a convex portion on a glass substrate provided with a black matrix layer, if the barrier is made of a photosensitive organic material, a material is applied. , Pre-baking, exposure, development, post-baking, phosphor layer formation, conductive film coating, at least seven steps are required, and if the barrier is made of an inorganic insulator by sandblasting, paste application, drying, resist At least 10 steps of coating, exposure, development, sand blasting, resist stripping, baking, phosphor layer formation, and conductive film coating are required, and if the barrier is made of metal by electroplating, resist coating, exposure , Development, electroplating, resist stripping, and formation of a phosphor layer are required. Each of the manufacturing methods requires a long process, which causes a decrease in yield and an increase in manufacturing cost.
[0010]
Therefore, the present invention has been made to solve the above technical problems and problems. The purpose is to reduce the number of steps compared to the conventional method, improve the yield, and further reduce the material cost, and increase the height of the barrier layer with a uniform height even for a large-area substrate. It is an object of the present invention to provide a front panel of a field emission display having high reliability, having a small amount of abnormal discharge, and a method of manufacturing the same.
[0011]
[Means for Solving the Problems]
In order to solve the above problem, the front panel of the field emission display according to claim 1, a transparent substrate, a black matrix layer having a plurality of openings formed on one surface of the transparent substrate, A front plate of a field emission display comprising a phosphor layer formed on a transparent substrate in an opening of the black matrix layer, wherein the opening of the black matrix layer has a concave shape; The inner surface of the opening and the black matrix layer are electrically connected by a conductive material.
[0012]
According to a second aspect of the present invention, there is provided a front panel of the field emission display, wherein the front panel of the field emission display includes a spacer for defining a distance between the front panel and the rear panel.
[0013]
According to a third aspect of the present invention, in the front panel of the field emission display, the spacer is inserted and held in a groove-shaped opening provided in the black matrix layer.
[0014]
According to a fourth aspect of the present invention, in the front panel of the field emission display, the conductive material is a metal back layer.
[0015]
According to a fifth aspect of the present invention, in the front panel of the field emission display, the conductive material is a transparent conductive film.
[0016]
7. The method for manufacturing a front panel of a field emission display according to claim 6, wherein the black matrix layer includes a transparent substrate, a plurality of openings formed on one surface of the transparent substrate, and the openings of the black matrix layer. A method of manufacturing a front panel of a field emission display having a phosphor layer formed on a transparent substrate in a portion, comprising: forming a black matrix layer on a transparent substrate; and a photolithography method on the black matrix layer. Forming an opening resist pattern by using the resist pattern as a mask, etching the black matrix layer to form an opening, and cutting the black matrix layer opening using the black matrix layer as a mask. Forming a concave shape, and forming a phosphor layer in the concave shape, A step of conducting the inner surface and the black matrix layer of the serial concave shape with a conductive material, in which to have a.
[0017]
8. The method for manufacturing a front panel of a field emission display according to claim 7, wherein: a transparent substrate; a black matrix layer having a plurality of openings formed on one surface of the transparent substrate; and an opening of the black matrix layer. A method of manufacturing a front panel of a field emission display having a phosphor layer formed on a transparent substrate in a portion, comprising: forming a black matrix layer on a transparent substrate; and a photolithography method on the black matrix layer. Forming an opening resist pattern by using the resist pattern as a mask, etching the black matrix layer to form an opening, and cutting the black matrix layer opening using the black matrix layer as a mask. Forming a concave shape, an inner surface of the concave shape and a black matrix A step of conducting a transparent conductive film, is obtained so as to have a step of forming a phosphor layer on the inner surface of the concave shape.
[0018]
According to a method for manufacturing a front panel of a field emission display according to claim 8, the concave opening of the black matrix layer is cut and formed by a wet etching method.
[0019]
The method for manufacturing a front panel of a field emission display according to claim 9, wherein the black matrix layer is formed of one of chromium oxide, titanium oxide, chromium nitride, titanium nitride, chromium oxynitride, and titanium oxynitride. The black matrix layer is formed as a layer structure or a multilayer structure formed by a combination of chromium or titanium and one or more of the foregoing, and the black matrix layer is used as a mask for wet etching when forming the concave shape.
[0020]
According to a tenth aspect of the present invention, there is provided a method of manufacturing a front panel of a field emission display, the method including a step of providing a spacer in a black matrix layer.
[0021]
The method of manufacturing a front panel of a field emission display according to claim 11, wherein the step of providing the spacer includes a step of inserting and holding the spacer into the groove-shaped opening of the transparent substrate. .
[0022]
As described above, in the present invention, the barrier layer is formed not by an additive method such as coating or plating deposition of a barrier material, but by selectively cutting a transparent substrate using glass as a base material. An object of the present invention is to provide a method of manufacturing a front panel of a field emission display formed by a subtractive method.
[0023]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a partial plan view schematically showing a first embodiment of a front panel of a field emission display according to the present invention, and FIG. 2 is a sectional view taken along line AA of FIG. FIG. 3 is a partial plan view schematically showing a second embodiment of the front panel of the field emission display of the present invention, and FIG. 4 is a cross-sectional view taken along line BB of FIG. FIG. 5 is a partial plan view schematically showing a third embodiment of the front panel of the field emission display of the present invention, and FIG. 6 is a cross-sectional view taken along line CC of FIG. FIG. 7 is a partial plan view schematically showing a fourth embodiment of the front panel of the field emission display of the present invention, and FIG. 8 is a cross-sectional view taken along line DD of FIG.
[0024]
(1st Embodiment)
1 and 2 show a first embodiment of the present invention, and FIG. 9 shows a process chart for explaining a manufacturing method of the first embodiment. A description will be given based on FIGS. 1, 2 and 9. As shown in FIGS. 1 and 2, a front panel 1 of a field emission display according to the present invention includes a transparent substrate 2 and a black matrix layer 3 formed on one surface of the transparent substrate 2. 3 has a plurality of openings 4, each of which has a concave shape depressed from the surface of the transparent substrate. Red (R), green The front plate 1 is filled with one of phosphor materials that emit light of each color of (G) and blue (B), and the front plate 1 includes a phosphor layer 5 in which a large number of sets of three matrix-like phosphor screens of each of RGB are arranged. Make up. Further, a metal back layer 6 made of a conductive material is formed on the inner surface of the concave opening 4 including the black matrix layer 3 and the phosphor layer 5, and the concave opening 4 and the black matrix layer 3 are electrically connected. I have.
The metal back layer 6 covers the black matrix layer 3 and the phosphor layer 5, but for convenience, FIG. 1 shows a state in which the metal back layer on the phosphor layer 5 is removed.
[0025]
As the transparent substrate 2 constituting the front panel 1 of the field emission display of the present invention, a glass substrate conventionally used for a field emission display, for example, an alkali-free glass substrate such as a liquid crystal display application or a plasma display application, a low An alkali glass substrate, a soda lime glass substrate, a quartz substrate, or the like can be used, and the thickness can be about 0.5 mm to 3 mm.
[0026]
The role of the black matrix layer 3 used in the front panel 1 of the field emission display of the present invention is to improve the contrast at the time of displaying an image in the field emission display. A metal oxide, a metal nitride, and a metal oxynitride are provided. Further, in order to provide a function of a conduction circuit for making the entire front plate 1 as the anode substrate the same potential, it is usually preferable to laminate a conductive metal thin film on the low reflection film. In the method of manufacturing the front panel 1 of the field emission display according to the present invention, when the opening of the black matrix layer 3 is formed in a concave shape, the transparent substrate is formed by using the black matrix layer 3 as a wet etching mask. Since the concave shape is formed by wet etching, a hydrofluoric acid-resistant metal-based thin film is used for the black matrix layer 3.
Such a black matrix layer 3 has a one-layer structure of one of chromium oxide, titanium oxide, nitride chromium nitride, titanium nitride, oxynitride chromium oxynitride, and titanium oxynitride, or A multilayer structure of a combination of chromium or titanium and one or more of the above is used, and is formed in a thickness of about 0.04 μm to 0.3 μm by a vacuum deposition method such as a vacuum evaporation method or a sputtering method. For example, a two-layer structure of chromium oxide / chromium or a three-layer structure of chromium oxide / chromium / chromium oxide can be given.
[0027]
The size, formation pitch, and the like of the concave openings 4 of the black matrix layer 3 can be appropriately set according to the formation pitch of the electron-emitting devices on the back plate and the formation pitch of the gate electrodes. The depth of the concave opening 4 from the transparent substrate surface can be set in the range of 20 μm to 100 μm. The shape of the opening 4 is rectangular in the illustrated example, but is not limited thereto. For example, the cross-sectional shape can be appropriately set to a polygon, an ellipse, or the like.
[0028]
The phosphor layer 5 includes a red light-emitting phosphor layer 5R, a green light-emitting phosphor layer 5G, and a blue light-emitting phosphor layer 5B, and has a concave shape by a commonly used photolithography method, screen printing method, or the like. It is formed inside the shape opening.
There is no particular limitation on the phosphor used, and a phosphor conventionally used in a field emission display device can be used. Specifically, for example, as a red light emitting phosphor, Y ₂ O ₃ : Eu, Y ₂ SiO ₅ : Eu, Y ₃ Al ₅ O ₁₂ : Eu, YBO ₃ : Eu, SnO ₂ : Eu, ScBO ₃ : Eu, Zn ₃ (PO ₄ ) ₂ : Mn, GdBO ₃ : Eu, LuBO ₃ : Eu, Y ₂ O ₂ S: Eu or the like is used, and Zn is used as a green light-emitting phosphor. ₂ SiO ₄ : Mn, BaAl ₁₂ O ₁₉ : Mn, BaMgAl ₁₄ O ₂₃ : Mn, LuBO ₃ : Tb, ScBO ₃ : Tb, Sr ₆ Si ₃ O ₃ Cl ₄ : Eu, ZnBaO ₄ : Mn, ZnO: Zn, Gd ₂ O ₂ S: Tb, ZnGa ₂ O ₄ : Mn and the like, and as a blue light emitting phosphor, Y ₂ SiO ₅ : Ce, BaMgAl ₁₄ O ₂₃ : Eu, CaWO ₄ : Pb, ZnS: Ag, ZnMgO, ZnGaO ₄ , ZnS: Ag or the like can be used.
[0029]
In the first embodiment of the present invention, the black matrix layer 3 and the inner surface of the concave opening 4 including the phosphor layer 5 are formed on the black matrix layer 3 in order to suppress the voltage charging phenomenon occurring in the phosphor layer due to the irradiation of the electron beam. The metal back layer 6 is formed of a conductive material. By providing the metal back layer 6, conductivity is given to the inner wall surface of the concave opening 4, and conduction is provided with the black matrix layer.
[0030]
In the field emission display using the front panel according to the present invention, the electron beam emitted from the rear panel collides with the phosphor layer 5 located at the corresponding opening 4 of the black matrix layer, and the phosphor layer 5 is formed. The display is performed by emitting light. Secondary electrons and scattered electrons of the electron beam emitted at this time are blocked and captured by the wall surface of the concave-shaped opening 4 provided with conductivity, so that crosstalk to adjacent cells and charging of the wall surface are performed. It is possible to prevent the display quality from deteriorating due to an increase or the like.
[0031]
(Manufacturing method of the first embodiment)
The manufacturing method according to the first embodiment will be described with reference to FIG. A two-layer film of a low-reflection metal compound such as chromium oxide and chromium is provided in this order on a transparent substrate 2 such as a glass substrate by a vacuum film forming method such as sputtering or vapor deposition, and then a photolithography method is formed on the two-layer film. A photoresist pattern for forming an opening is formed (not shown) by etching, the exposed two-layer film is removed by etching based on this photoresist pattern, and then the photoresist pattern is peeled off. A patterned conductive black matrix layer 3 and an opening 4 'are formed thereon (FIG. 9A).
Note that the photoresist pattern is not necessarily stripped at this stage, but may be stripped after the transparent substrate is etched in the next step.
[0032]
Next, using a glass etchant such as hydrofluoric acid or buffered hydrofluoric acid, the opening 4 'of the black matrix layer is etched to form a concave opening 4 (FIG. 9B). At this time, if a black matrix layer is provided on the film surface of the black matrix layer 3 with a hydrofluoric acid-based etchant such as chromium oxide / chromium or titanium nitride / titanium, a mask pattern for glass etching can be newly formed. It is possible to perform etching without forming.
[0033]
The depth of the etched portion of the concave opening 4 can be set in the range of 20 μm to 100 μm. Generally, dipping wet etching is an isotropic etching in which the amount of cutting in the thickness direction of the substrate and the amount of side etching in the lateral direction are equal, so the etching depth is the pattern of the black matrix layer opening 4 '. Limited by size and pattern pitch. On the other hand, if the spray etching is performed, the amount of etching in the substrate thickness direction becomes larger than the amount of side etching, so that the limitation on the etching depth due to the pattern size and the like becomes smaller. Therefore, spray etching is preferable. Spray etching is performed by masking a non-etched area around the black matrix layer of the transparent substrate 2 with a resin film or the like that is resistant to hydrofluoric acid, or by using a jig to prevent the surrounding area from being exposed to an etchant. The effect of the liquid can be avoided.
[0034]
Next, a phosphor layer 5G is formed in the concave opening 4 of the black matrix layer (FIG. 9C). In the present invention, the phosphor layer constituting the front plate can be formed using the same method and material as in the conventional field emission display. That is, the same red light-emitting phosphor layer, green light-emitting phosphor layer, and blue light-emitting phosphor layer as conventionally used materials are formed into a concave opening by photolithography, screen printing, or the like, which is the same as the conventional method. It can be formed in the part 4. FIG. 9 illustrates the green light emitting phosphor layer 5G.
[0035]
Next, after the phosphor layer 5G is formed, the surfaces of the phosphor layer 5G and the black matrix layer 3 are coated with Al in order to impart conductivity to the inner wall surface of the concave opening 4 and establish electrical conduction with the black matrix layer 3. And the like are obliquely deposited to form a metal back layer 6 having a thickness of several nm to several tens nm to obtain a front panel 1 of a field emission display (FIG. 9D). By providing the metal back layer 6, the voltage charging phenomenon that occurs in the phosphor layer 5G due to the irradiation of the electron beam can be suppressed.
[0036]
(Second embodiment)
3 and 4 show a second embodiment of the present invention, and FIG. 10 shows a part of a process for explaining a manufacturing method according to the second embodiment. A description will be given based on FIGS. 3, 4, and 10.
3, 4, and 10, parts corresponding to those in FIGS. 1, 2, and 9 are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0037]
As shown in FIGS. 3 and 4, the front panel 11 of the field emission display according to the present invention has a structure in which spacers 7 are provided on the front panel 1 of the field emission display according to the first embodiment. I have. That is, a transparent substrate 2 and a black matrix layer 3 formed on one surface of the transparent substrate 2 are provided. The black matrix layer 3 has a plurality of openings 4, and the openings 4 Each of the concave-shaped openings 4 is filled with one of phosphor materials that emit light of each color of RGB, and the front plate 11 is a matrix-shaped phosphor screen of each color of RGB. Is a structure in which many sets of three are arranged. Further, a spacer 7 is provided on the black matrix layer 3 via a metal back layer 6 while being supported by a spacer holding member 8.
Although the metal back layer 6 covers the black matrix layer 3 and the phosphor layer 5, for convenience, FIG. 3 shows a state in which the metal back layer on the phosphor layer 5 is removed.
[0038]
The transparent substrate 2, the black matrix layer 3, the concave shape 4, the phosphor layer 5, and the metal back layer 6 constituting the front plate 11 of the present invention use the same materials as in the first embodiment and are manufactured by the same manufacturing method. Can be formed.
[0039]
The spacer 7 has a reinforcing function of defining a distance between the front panel and the rear panel and maintaining a vacuum withstand voltage of the field emission display. Therefore, it withstands atmospheric pressure, maintains uniform flatness so that the transparent substrate does not bend over the entire display, does not affect the trajectory of the electron beam emitted from the electron-emitting device (emitter electrode) on the back plate, and emits gas. It is required to have characteristics such as low stability and stability in vacuum. As a material having such characteristics, the spacer 7 is usually made of glass, ceramics, or a material in which a conductive metal thin film is provided on the surface of glass or ceramics by vapor deposition or the like. The shape of the spacer 7 can be a plate shape, a bar shape, a cruciform column shape, or the like, and the size and pitch can be appropriately set according to the black matrix layer 3 and the phosphor layer 5. Is designed to fit within the area of the black matrix layer. The height of the spacer 7 that defines the distance between the front plate and the back plate is usually used in a range of about 1 to 2 mm.
[0040]
In this embodiment, the spacer 7 is sandwiched between the spacer holding members 8 and is fixed on the transparent substrate 2 via the metal back layer 6 and the black matrix layer 3. In order to prevent charge-up due to electrons, the spacer holding member 8 is formed by forming a metal such as nickel by a pattern plating method, or bonding a material obtained by imparting conductivity to ceramics, glass, or the like onto the transparent substrate 2 with a glass paste or the like. Can be used. The shape and size of the spacer holding member 8 can be set arbitrarily.
[0041]
(Manufacturing method of the second embodiment)
As shown in FIG. 10, a spacer holding member 8 is provided on a black matrix layer 3 of a front panel 1 (FIG. 10A) of the field emission display obtained in the first embodiment via a metal back layer 6. To form The spacer holding member 8 is formed by forming a metal such as nickel by a pattern plating method, or by bonding a material obtained by imparting conductivity to ceramics or glass onto the transparent substrate 2 with a glass paste or the like. The shape and size of the spacer holding member 8 can be set arbitrarily within a range that does not affect the display on the black matrix layer 3.
[0042]
Next, the front plate 11 of the field emission display of the second embodiment is formed by sandwiching the spacer 7 between the spacer holding supports 8 (FIG. 10B).
[0043]
In the field emission display using the front panel 11 of the present invention, the electron beam emitted from the rear panel collides with the phosphor layer 5 located at the opening 4 of the corresponding black matrix layer, and the phosphor layer 5 Is displayed to perform display. The secondary electrons and the scattered electrons of the electron beam emitted at this time are blocked and captured by the wall surface of the opening 4, so that the display quality is prevented from deteriorating due to crosstalk to adjacent cells, charge-up of spacers, and the like. be able to.
[0044]
(Third embodiment)
FIGS. 5 and 6 show a third embodiment of the present invention, and FIGS. 11 and 12 show steps for explaining the manufacturing method of the third embodiment. This will be described with reference to FIGS. 5 and 6 and FIGS.
5, FIG. 6, FIG. 11, and FIG. 12, parts corresponding to those in FIG. 1, FIG. 2, and FIG. 9 are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0045]
The front plate 21 of the field emission display according to the present invention has a structure in which the spacer 7 is held in the groove-shaped opening 9 provided in the transparent substrate 2. That is, a transparent substrate 2 and a black matrix layer 3 formed on one surface of the transparent substrate 2 are provided. The black matrix layer 3 has a plurality of openings 4, and the openings 4 Each of the concave shaped openings 4 is filled with one of phosphor materials that emit light of each of RGB colors, and the front plate 21 has a matrix-like phosphor screen of each of the RGB colors. It has a structure in which many sets of three are arranged. Further, a spacer 7 is fitted and held in a groove-shaped opening 9 provided in the black matrix layer 3.
Although the metal back layer 6 covers the black matrix layer 3 and the phosphor layer 5, for convenience, FIG. 3 shows a state in which the metal back layer on the phosphor layer 5 is removed.
[0046]
The transparent substrate 2, the black matrix layer 3, the concave shape 4, the phosphor layer 5 and the metal back layer 6 constituting the front plate 21 of the present invention use the same materials as in the first embodiment and are manufactured by the same manufacturing method. Can be formed. Further, the same material as that of the second embodiment can be used for the spacer 7.
[0047]
In the field emission display using the front panel 21 of the present invention, the electron beam emitted from the rear panel collides with the phosphor layer 5 located at the corresponding opening 4 of the black matrix layer, and the phosphor layer 5 Is displayed to perform display. Secondary electrons and scattered electrons of the electron beam emitted at this time are blocked and captured by the wall surface of the opening 4, so that display quality is prevented from deteriorating due to crosstalk to an adjacent cell or charge-up of the wall surface. be able to.
[0048]
(Manufacturing method of the third embodiment)
A manufacturing method according to the third embodiment will be described with reference to FIG. 11 and FIG.
A two-layer film of a low-reflection metal compound such as chromium oxide and chromium is provided in this order on a transparent substrate 2 such as a glass substrate by a vacuum film forming method such as sputtering or vapor deposition, and then a photolithography method is formed on the two-layer film. A photoresist pattern for forming an opening is formed (not shown) by etching, the exposed two-layer film is removed by etching based on this photoresist pattern, and then the photoresist pattern is peeled off. A patterned conductive black matrix layer 3 and openings 4 'and 9' are formed thereon (FIG. 11A). Note that the photoresist pattern is not necessarily stripped at this stage, but may be stripped after the transparent substrate is etched in the next step.
[0049]
Next, using a glass etchant such as hydrofluoric acid or buffered hydrofluoric acid, the openings 4 ′ and 9 ′ of the black matrix layer are etched to form the concave openings 4 and the groove openings 9 ( FIG. 11 (b)). At this time, if a black matrix layer is provided on the film surface of the black matrix layer 3 with a hydrofluoric acid-based etchant such as chromium oxide / chromium or titanium nitride / titanium, a mask pattern for glass etching can be newly formed. It is possible to perform etching without forming.
The depth of the etched portion of the concave opening 4 can be set in the range of 20 μm to 100 μm. The depth of the groove-shaped opening 9 is the same as the depth of the concave-shaped opening 4.
[0050]
Next, a phosphor layer 5G is formed in the concave opening 4 of the black matrix layer (FIG. 11C). In the present invention, the phosphor layer 5G constituting the front plate can be formed using the same method and material as those of the conventional field emission display. That is, the same red light-emitting phosphor layer, green light-emitting phosphor layer, and blue light-emitting phosphor layer as conventionally used materials are formed into a concave opening by photolithography, screen printing, or the like, which is the same as the conventional method. It can be formed in the part 4.
[0051]
Next, after the phosphor layer 5G is formed, the surfaces of the phosphor layer 5G and the black matrix layer 3 are coated with Al in order to impart conductivity to the inner wall surface of the concave opening 4 and establish electrical conduction with the black matrix layer 3. Then, a metal back layer 6 having a thickness of several nm to several tens nm is formed by oblique deposition (FIG. 12D).
[0052]
Next, the front plate 21 of the field emission display is formed by fitting and fixing the spacer 7 into the groove-shaped opening 9 provided in the black matrix layer 3 (FIG. 12E).
[0053]
(Fourth embodiment)
7 and 8 show a fourth embodiment of the present invention, and FIG. 13 shows a process chart for explaining a manufacturing method of the fourth embodiment. A description will be given based on FIGS. 7, 8 and 13.
In FIGS. 7, 8 and 13, parts corresponding to those in FIGS. 1, 2 and 9 are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0054]
In the first to third embodiments, the form in which the metal back layer is provided as the conductive substance has been described. However, in the fourth embodiment, as shown in FIG. 7 and FIG. After forming 4, the transparent conductive material 10 can be provided. The front plate 31 of the field emission display according to the fourth embodiment is provided with the concave opening 4 of the black matrix layer, and then charges the inner surface of the concave opening 4 and the surface of the black matrix layer 3 with voltage. A transparent conductive film 10 such as indium tin oxide (ITO) or tin oxide is formed as a conductive material that suppresses the phenomenon, and after the inner surface of the concave shape 4 and the black matrix layer 3 are conducted, the transparent conductive film 10 is then formed. The phosphor layer 5G is formed in the concave opening 4 provided.
[0055]
As shown in the second and third embodiments, the front plate 31 of the present embodiment may be configured such that a spacer is further provided on the groove-shaped opening provided on the black matrix layer or the transparent substrate (FIG. Not shown).
[0056]
(Manufacturing method of the fourth embodiment)
The manufacturing method according to the fourth embodiment will be described with reference to FIG.
A two-layer film of a low-reflection metal compound such as chromium oxide and chromium is provided in this order on a transparent substrate 2 such as a glass substrate by a vacuum film forming method such as sputtering or vapor deposition, and then a photolithography method is formed on the two-layer film. A photoresist pattern for forming an opening is formed (not shown) by etching, the exposed two-layer film is removed by etching based on this photoresist pattern, and then the photoresist pattern is peeled off. A patterned conductive black matrix layer 3 and an opening 4 'are formed thereon (FIG. 13A). Note that the photoresist pattern is not necessarily stripped at this stage, but may be stripped after the transparent substrate is etched in the next step.
[0057]
Next, using a glass etchant such as hydrofluoric acid or buffered hydrofluoric acid, the opening 4 'of the black matrix layer is etched to form a concave opening 4 (FIG. 13B). At this time, if a black matrix layer is provided on the film surface of the black matrix layer 3 with a hydrofluoric acid-based etchant such as chromium oxide / chromium or titanium nitride / titanium, a mask pattern for glass etching can be newly formed. It is possible to perform etching without forming.
The depth of the etched portion of the concave opening 4 can be set in the range of 20 μm to 100 μm.
[0058]
Next, a transparent conductive film 10 is formed by a method such as sputtering or vapor deposition in order to impart conductivity to the inner wall surface and the bottom of the concave opening 4 and to establish conduction with the black matrix layer 3 (FIG. 13 ( c)).
[0059]
Next, a phosphor layer 5G is provided in the concave opening 4 of the black matrix layer to form the front panel 31 of the field emission display (FIG. 13D). In the present invention, the phosphor layer 5G constituting the front plate can be formed using the same method and material as those of the conventional field emission display. That is, the same red light-emitting phosphor layer, green light-emitting phosphor layer, and blue light-emitting phosphor layer as conventionally used materials are formed into a concave opening by photolithography, screen printing, or the like, which is the same as the conventional method. It can be formed in the part 4.
[0060]
【Example】
A two-layer thin film of a 50-nm chromium oxide film and a 100-nm chromium film was formed on a soda-lime glass substrate by a sputtering method to form a conductive black matrix layer having a thickness of 150 nm. A photosensitive resist was applied to a thickness of 1 μm on the black matrix layer, exposed and developed to form a resist pattern. Subsequently, the exposed chromium of the black matrix layer and the chromium oxide of the lower layer were removed by etching with a chromium etchant (MR-E2000, manufactured by The Inktec Co., Ltd.) to obtain a black matrix layer opening for a pixel.
[0061]
Next, while the resist pattern was left, the opening of the black matrix layer was spray-etched with a hydrofluoric acid aqueous solution to remove the resist pattern, thereby forming a concave opening having a depth of 80 μm.
[0062]
Subsequently, R, G, and B phosphor layers are formed in the concave openings of the black matrix layer by a screen printing method, and then Al is obliquely applied to the black matrix layer and the phosphor layers to a thickness of 10 nm. A metal back layer was formed by vapor deposition to obtain a front panel of the field emission display of the present invention.
[0063]
By combining this front plate and a separately manufactured back plate to produce and display a field emission display, high quality images were obtained.
[0064]
【The invention's effect】
As described above in detail, in the field emission display using the front panel of the present invention, the electron beam emitted from the rear panel collides with the phosphor layer located at the concave opening of the corresponding black matrix layer. Then, display is performed by causing the phosphor layer to emit light. Secondary electrons and scattered electrons of the electron beam emitted at this time are blocked and captured by the wall surface of the concave opening, so that display quality is deteriorated due to crosstalk to adjacent cells or charge-up of spacers. Can be prevented.
[0065]
Therefore, the front plate of the field emission display according to the present invention does not require a process for forming a barrier layer as in the related art, and furthermore, the black matrix layer is used as a mask for glass etching, thereby shortening the manufacturing process of the front plate. As a result, the yield can be improved and the material cost can be reduced. In addition, since the transparent substrate also plays the role of the conventional barrier layer, the structure has a high strength in terms of structure, and plays a role of a barrier layer having a uniform height even for a large-area substrate. Have reliability. Furthermore, since the phosphor layer formed in the concave opening is formed not only on the bottom surface but also on the surrounding wall surface, there is an advantage that the phosphor application surface increases and the luminous efficiency by the electron beam increases.
[Brief description of the drawings]
FIG. 1 is a partial plan view showing a first embodiment of a front panel of a field emission display according to the present invention.
FIG. 2 is a schematic cross-sectional view taken along line AA of FIG.
FIG. 3 is a partial plan view showing a front panel of a field emission display according to a second embodiment of the present invention.
FIG. 4 is a schematic cross-sectional view taken along line BB of FIG. 3;
FIG. 5 is a partial plan view showing a front panel of a field emission display according to a third embodiment of the present invention.
FIG. 6 is a schematic cross-sectional view taken along line CC of FIG.
FIG. 7 is a partial plan view showing a front panel of a field emission display according to a fourth embodiment of the present invention.
FIG. 8 is a schematic cross-sectional view taken along line DD of FIG. 5;
FIG. 9 is a process diagram illustrating a method for manufacturing the front panel of the field emission display according to the first embodiment of the present invention.
FIG. 10 is a process chart for explaining a part of the method of manufacturing the front plate of the field emission display according to the second embodiment of the present invention;
FIG. 11 is a process diagram illustrating a method of manufacturing a front panel of a field emission display according to a third embodiment of the present invention.
FIG. 12 is a process chart illustrating a method of manufacturing the front panel of the field emission display according to the third embodiment of the present invention, following FIG. 11;
FIG. 13 is a process chart illustrating a method for manufacturing a front panel of a field emission display according to a fourth embodiment of the present invention.
[Explanation of symbols]
1, 11, 21, 31 Front plate of field emission display of the present invention
2 Transparent substrate
3 Black matrix layer
4 'Black matrix layer opening
4 Black matrix layer concave shape opening
5 phosphor layer
5R red phosphor layer
5B Blue phosphor layer
5G green phosphor layer
6 Metal back layer
7 Spacer
8 Spacer holding member
9 Groove opening for spacer holding

Claims (11)

Field emission including a transparent substrate, a black matrix layer having a plurality of openings formed on one surface of the transparent substrate, and a phosphor layer formed on the transparent substrate in the openings of the black matrix layer On the front panel of
The front plate of a field emission display, wherein the black matrix layer opening has a concave shape, and the inner surface of the concave shape opening and the black matrix layer are electrically connected by a conductive material. The front panel of claim 1, further comprising a spacer for defining a distance between the front panel and the rear panel of the field emission display. 3. The front panel according to claim 2, wherein the spacer is inserted and held in a groove-shaped opening provided in the black matrix layer. 4. The front panel of a field emission display according to claim 1, wherein the conductive material is a metal back layer. 4. The front panel according to claim 1, wherein the conductive material is a transparent conductive film. Field emission including a transparent substrate, a black matrix layer having a plurality of openings formed on one surface of the transparent substrate, and a phosphor layer formed on the transparent substrate in the openings of the black matrix layer In a method of manufacturing a front panel of a type display,
Forming a black matrix layer on a transparent substrate,
Forming an opening resist pattern by photolithography on the black matrix layer, and using the resist pattern as a mask, etching the black matrix layer to form an opening;
Using the black matrix layer as a mask, cutting the black matrix layer opening to form a concave shape,
Forming a phosphor layer in the concave shape,
Electrically connecting the inner surface of the concave shape and the black matrix layer with a conductive material. Field emission including a transparent substrate, a black matrix layer having a plurality of openings formed on one surface of the transparent substrate, and a phosphor layer formed on the transparent substrate in the openings of the black matrix layer In a method of manufacturing a front panel of a type display,
Forming a black matrix layer on a transparent substrate,
Forming an opening resist pattern by photolithography on the black matrix layer, and using the resist pattern as a mask, etching the black matrix layer to form an opening;
Using the black matrix layer as a mask, cutting the black matrix layer opening to form a concave shape,
A front plate of a field emission display, comprising: a step of connecting the inner surface of the concave shape and the black matrix layer with a transparent conductive film; and a step of forming a phosphor layer on the inner surface of the concave shape. Manufacturing method. 8. The method according to claim 6, wherein the concave opening of the black matrix layer is cut by a wet etching method. The black matrix layer has a single-layer structure of one of chromium oxide, titanium oxide, chromium nitride, titanium nitride, chromium oxynitride, and titanium oxynitride, or a multilayer structure of a combination of chromium or titanium and one or more of the above. 9. The method according to claim 8, wherein the black matrix layer is used as a mask for wet etching when the concave shape is formed. The method of manufacturing a front panel of a field emission display according to claim 6, wherein the method of manufacturing a front panel of the field emission display includes a step of providing a spacer on a black matrix layer. 11. The method according to claim 10, wherein the step of providing the spacer includes the step of inserting and holding the spacer into the groove-shaped opening of the transparent substrate.

Images