JP2004214652A5 - - Google Patents
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- Publication number
- JP2004214652A5 JP2004214652A5 JP2003422290A JP2003422290A JP2004214652A5 JP 2004214652 A5 JP2004214652 A5 JP 2004214652A5 JP 2003422290 A JP2003422290 A JP 2003422290A JP 2003422290 A JP2003422290 A JP 2003422290A JP 2004214652 A5 JP2004214652 A5 JP 2004214652A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/331,901 US6760208B1 (en) | 2002-12-30 | 2002-12-30 | Distributive capacitor for high density applications |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004214652A JP2004214652A (ja) | 2004-07-29 |
| JP2004214652A5 true JP2004214652A5 (enExample) | 2007-01-11 |
| JP4417095B2 JP4417095B2 (ja) | 2010-02-17 |
Family
ID=30770802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003422290A Expired - Fee Related JP4417095B2 (ja) | 2002-12-30 | 2003-12-19 | 高密度用途向け分布キャパシタ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6760208B1 (enExample) |
| JP (1) | JP4417095B2 (enExample) |
| KR (1) | KR100542846B1 (enExample) |
| CN (1) | CN100472676C (enExample) |
| GB (1) | GB2397173B (enExample) |
| TW (1) | TWI326459B (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100645625B1 (ko) * | 2004-12-01 | 2006-11-15 | 삼성전기주식회사 | 커패시터 내장형 인쇄회로기판 및 그 제조방법 |
| KR100598118B1 (ko) | 2005-01-12 | 2006-07-10 | 삼성전자주식회사 | 적층형 인쇄회로기판 |
| US20070153490A1 (en) * | 2005-12-30 | 2007-07-05 | Benham John R | Methods and apparatus for electromagnetically sampling signals using socket-package interface based interposer |
| US8094429B2 (en) * | 2009-06-22 | 2012-01-10 | Industrial Technology Research Institute | Multilayer capacitors and methods for making the same |
| CN102412913B (zh) * | 2011-10-24 | 2016-09-14 | 惠州Tcl移动通信有限公司 | 一种测试系统和移动通讯终端的天线调试方法 |
| US9035714B2 (en) * | 2012-07-03 | 2015-05-19 | Cisco Technology, Inc. | Parasitic capacitance compensating transmission line |
| US9595217B2 (en) | 2013-12-05 | 2017-03-14 | Samsung Display Co., Ltd. | Trace structure for improved electrical signaling |
| US10153238B2 (en) | 2014-08-20 | 2018-12-11 | Samsung Display Co., Ltd. | Electrical channel including pattern voids |
| US9461810B2 (en) | 2014-09-18 | 2016-10-04 | Samsung Display Co., Ltd. | Multi-drop channels including reflection enhancement |
| KR102293487B1 (ko) * | 2014-10-31 | 2021-08-25 | 현대모비스 주식회사 | 차량용 레이더의 임피던스 매칭 회로를 결정하기 위한 방법 |
| CN104617081B (zh) * | 2015-01-30 | 2018-07-27 | 天津中科海高微波技术有限公司 | 应用于单片微波集成电路的连接线以及连接线的设计方法 |
| TWI584526B (zh) | 2015-12-04 | 2017-05-21 | 財團法人工業技術研究院 | 積層式天線結構 |
| CN107995770B (zh) * | 2017-11-10 | 2021-04-02 | 惠科股份有限公司 | 一种柔性扁平排线和显示面板 |
| WO2020132187A1 (en) * | 2018-12-20 | 2020-06-25 | Avx Corporation | Multilayer electronic device including a high precision inductor |
| DE102020125942A1 (de) * | 2020-10-05 | 2022-04-07 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Elektrisches oder elektronisches Steuergerät |
| KR102826542B1 (ko) * | 2022-03-18 | 2025-06-26 | 삼성전자주식회사 | 다층 기판을 갖는 전자 장치 및 그 제조 방법 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1273267A (en) * | 1968-04-01 | 1972-05-03 | Itek Corp | Photographic process for producing electrical components |
| DE3714672A1 (de) * | 1987-05-02 | 1988-11-17 | Telefunken Electronic Gmbh | Rc-leitung |
| US6185354B1 (en) * | 1998-05-15 | 2001-02-06 | Motorola, Inc. | Printed circuit board having integral waveguide |
| US6103134A (en) * | 1998-12-31 | 2000-08-15 | Motorola, Inc. | Circuit board features with reduced parasitic capacitance and method therefor |
| JP2002033560A (ja) * | 2000-07-17 | 2002-01-31 | Alps Electric Co Ltd | 電子回路基板の製造方法 |
| US6606793B1 (en) * | 2000-07-31 | 2003-08-19 | Motorola, Inc. | Printed circuit board comprising embedded capacitor and method of same |
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2002
- 2002-12-30 US US10/331,901 patent/US6760208B1/en not_active Expired - Lifetime
-
2003
- 2003-12-10 TW TW092134841A patent/TWI326459B/zh not_active IP Right Cessation
- 2003-12-17 GB GB0329180A patent/GB2397173B/en not_active Expired - Fee Related
- 2003-12-19 JP JP2003422290A patent/JP4417095B2/ja not_active Expired - Fee Related
- 2003-12-30 KR KR1020030100466A patent/KR100542846B1/ko not_active Expired - Lifetime
- 2003-12-30 CN CNB200310124024XA patent/CN100472676C/zh not_active Expired - Lifetime