JP2004204134A5 - - Google Patents

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Publication number
JP2004204134A5
JP2004204134A5 JP2002376846A JP2002376846A JP2004204134A5 JP 2004204134 A5 JP2004204134 A5 JP 2004204134A5 JP 2002376846 A JP2002376846 A JP 2002376846A JP 2002376846 A JP2002376846 A JP 2002376846A JP 2004204134 A5 JP2004204134 A5 JP 2004204134A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2002376846A
Other versions
JP2004204134A (ja
JP4355837B2 (ja
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Priority to JP2002376846A priority Critical patent/JP4355837B2/ja
Priority claimed from JP2002376846A external-priority patent/JP4355837B2/ja
Publication of JP2004204134A publication Critical patent/JP2004204134A/ja
Publication of JP2004204134A5 publication Critical patent/JP2004204134A5/ja
Application granted granted Critical
Publication of JP4355837B2 publication Critical patent/JP4355837B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002376846A 2002-12-26 2002-12-26 熱硬化性ポリイミド樹脂組成物、ポリイミド樹脂の製造方法及びポリイミド樹脂 Expired - Fee Related JP4355837B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002376846A JP4355837B2 (ja) 2002-12-26 2002-12-26 熱硬化性ポリイミド樹脂組成物、ポリイミド樹脂の製造方法及びポリイミド樹脂

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002376846A JP4355837B2 (ja) 2002-12-26 2002-12-26 熱硬化性ポリイミド樹脂組成物、ポリイミド樹脂の製造方法及びポリイミド樹脂

Publications (3)

Publication Number Publication Date
JP2004204134A JP2004204134A (ja) 2004-07-22
JP2004204134A5 true JP2004204134A5 (ja) 2005-11-24
JP4355837B2 JP4355837B2 (ja) 2009-11-04

Family

ID=32814193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002376846A Expired - Fee Related JP4355837B2 (ja) 2002-12-26 2002-12-26 熱硬化性ポリイミド樹脂組成物、ポリイミド樹脂の製造方法及びポリイミド樹脂

Country Status (1)

Country Link
JP (1) JP4355837B2 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4552104B2 (ja) * 2003-04-25 2010-09-29 Ｄｉｃ株式会社 熱硬化性ポリイミド樹脂組成物、ポリイミド樹脂の製造方法およびポリイミド樹脂
JP5311871B2 (ja) * 2008-04-23 2013-10-09 京セラケミカル株式会社 導電性接着剤組成物
JP2010006868A (ja) * 2008-06-24 2010-01-14 Kaneka Corp 新規な硬化膜及びその利用
JPWO2010041644A1 (ja) * 2008-10-10 2012-03-08 東洋紡績株式会社 ポリアミドイミド樹脂、該樹脂を用いた接着剤組成物、該接着剤組成物を用いたプリント回路基板用インク、カバーレイフィルム、接着剤シート及びプリント回路基板
CN114276654B (zh) * 2021-11-24 2023-10-17 久耀电子科技（江苏）有限公司 一种树脂组合物、半固化片以及高cti覆铜板

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