JP2004181654A - Method for ultrasonic welding of case made of resin - Google Patents

Method for ultrasonic welding of case made of resin Download PDF

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Publication number
JP2004181654A
JP2004181654A JP2002348093A JP2002348093A JP2004181654A JP 2004181654 A JP2004181654 A JP 2004181654A JP 2002348093 A JP2002348093 A JP 2002348093A JP 2002348093 A JP2002348093 A JP 2002348093A JP 2004181654 A JP2004181654 A JP 2004181654A
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JP
Japan
Prior art keywords
ultrasonic welding
circuit board
printed circuit
horn
cases
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2002348093A
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Japanese (ja)
Inventor
Yasuo Miyagawa
康夫 宮川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
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Alps Electric Co Ltd
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Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP2002348093A priority Critical patent/JP2004181654A/en
Publication of JP2004181654A publication Critical patent/JP2004181654A/en
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/128—Stepped joint cross-sections
    • B29C66/1282—Stepped joint cross-sections comprising at least one overlap joint-segment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/128—Stepped joint cross-sections
    • B29C66/1284—Stepped joint cross-sections comprising at least one butt joint-segment
    • B29C66/12841—Stepped joint cross-sections comprising at least one butt joint-segment comprising at least two butt joint-segments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B29C66/542—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles joining hollow covers or hollow bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/814—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8145—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the constructional aspects of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/81463—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the constructional aspects of the pressing elements, e.g. of the welding jaws or clamps comprising a plurality of single pressing elements, e.g. a plurality of sonotrodes, or comprising a plurality of single counter-pressing elements, e.g. a plurality of anvils, said plurality of said single elements being suitable for making a single joint
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for ultrasonic welding of a case made of a resin capable of preventing a circuit part therein from being damaged caused by oscillation during the ultrasonic welding. <P>SOLUTION: The first horn 2 and the second horn 3 ultrasonically oscillated by a high frequency oscillator 1 as an oscillation source are provided on an ultrasonic welding machine, and a phase delay part 5 for delaying a phase by 180 degree is provided between the high frequency oscillator 1 and the second horn 3. Then, a printed circuit board 8 on the central part of which a crystal oscillator 9 is implemented is stored in a pair of cases 6 and 7 made of the resin divided into an upper part and a lower part, and these both cases 6 and 7 are jointed at both facing left and right end parts through the printed circuit board, and these jointed faces are welded by the first and the second horns 2 and 3 ultrasonically oscillated by the phase difference of 180 degree. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、プリント基板を内蔵する一対の樹脂製ケースを溶着して一体化する超音波溶着方法に関する。
【０００２】
【従来の技術】
従来より、例えばＳＤ（Ｓｅｃｕｒｅ Ｄｉｇｉｔａｌ）カードと呼ばれる小型メモリカードの製造工程において、各種回路部品が実装されたプリント基板を上下に分割された一対の樹脂製ケース内に収納し、これら両ケースの周縁部を超音波溶着によって接合・一体化するという手法が採用されている。
【０００３】
従来既知の超音波溶着機は、アンビルと呼ばれる加工台や、高周波発振器を振動源として超音波振動するホーン等を備えており、被加工物を加工台に載置した状態でホーンに適当な加圧力のもとで超音波振動を印加することにより、被加工物の接合面を摩擦などによる発熱で溶着するようになっている（例えば、非特許文献１参照）。ここで、ホーンは高周波発振器を振動源として所定の周波数で超音波振動されるが、通常、大型の被加工物を溶着する場合は、２０ＫＨｚで発振する高周波発振器を備えた超音波溶着機が使用され、小型メモリカードのように小型の被加工物を溶着する場合は、４０ＫＨｚで発振する高周波発振器を備えた超音波溶着機が使用されるようになっている。
【０００４】
【非特許文献１】
佐藤敏一著，「特殊加工」，第１版，株式会社養賢堂，昭和５６年１１月２０日，ｐ．１４１−１４２
【０００５】
【発明が解決しようとする課題】
前述したように、従来より知られている樹脂製ケースの超音波溶着方法では、上下に分割された一対の樹脂製ケース内にプリント基板を収納し、これら両ケースの周縁部を所定周波数（例えば４０ＫＨｚ）で超音波振動するホーンによって溶着するようになっているため、超音波溶着時に生じるホーンの振動が内部のプリント基板に作用し、この振動によってプリント基板に実装された回路部品がダメージを受けるという問題があった。特に、プリント基板に音叉型の水晶振動子が実装されている場合、かかる水晶振動子の固有振動数の２次，３次高調波がホーンの振動周波数（４０ＫＨｚ）と近いため、超音波溶着時に共振を起こして水晶振動子が破壊してしまうという問題があった。
【０００６】
本発明は、このような従来技術の実情に鑑みてなされたもので、その目的は、超音波溶着時の振動に起因する内部の回路部品の損傷を防止できる樹脂製ケースの超音波溶着方法を提供することにある。
【０００７】
【課題を解決するための手段】
上述した目的を達成するために、本発明による樹脂製ケースの超音波溶着方法では、上下に分割された一対の樹脂製ケース内にプリント基板を収納し、これら両ケースを前記プリント基板を介して対向する両端部で接合すると共に、これら接合面を１８０度の位相差をもって超音波振動する第１および第２のホーンにより溶着するようにした。
【０００８】
このような構成を採用すると、一対の樹脂製ケースの接合面をプリント基板を介して対向する両端部で超音波溶着する時、第１のホーンから第２のホーンに向かって伝播する振動と第２のホーンから第１のホーンに向かって伝播する振動とが両者の中央部分でキャンセルされるため、この中央部分に配置されたプリント基板の回路部品にはほとんど振動が作用せず、当該回路部品の損傷を防止することができる。
【０００９】
上記の構成において、第１および第２のホーンを１８０度の位相差をもって超音波振動する手段として、第１および第２のホーンのいずれか一方と振動源である高周波発振器との間に位相遅延部を介設することが好ましい。
【００１０】
また、上記の構成において、プリント基板に音叉型の水晶振動子が実装されている場合、この水晶振動子を第１および第２のホーンのほぼ中央に位置させた状態で両ケースの接合面を溶着することが好ましく、このような構成を採用すると、超音波溶着時に水晶振動子にはほとんど外部振動が作用しないため、水晶振動子の破壊を確実に防止することができる。
【００１１】
【発明の実施の形態】
発明の実施の形態について図面を参照して説明すると、図１は本発明の実施形態例に係る樹脂製ケースの超音波溶着方法を示す説明図、図２は超音波溶着時に発生する振動のキャンセル動作を示す説明図である。
【００１２】
図１に示すように、本実施形態例に係る超音波溶着機は、４０ＫＨｚの周波数で発振する高周波発振器１と、この高周波発振器１を振動源として超音波振動する第１および第２のホーン２，３と、被加工物が載置される加工台４とを備えており、高周波発振器１と第２のホーン３との間には位相を１８０度遅れさせる位相遅延部５が介設されている。
【００１３】
被加工物はＳＤカードと呼ばれる小型メモリカードであり、この小型メモリカードは、上下に分割された一対の樹脂製ケース６，７と、これら両ケース６，７の内部に収納されたプリント基板８とを備えている。プリント基板８にはチップ抵抗やチップコンデンサあるいはＩＣ等を含む各種回路部品が実装されており、これら回路部品の１つである音叉型の水晶振動子９はプリント基板８のほぼ中央に実装されている。
【００１４】
次に、このように概略構成された小型メモリカードの両ケース６，７を超音波溶着する工程について説明する。
【００１５】
まず、プリント基板８に水晶振動子９を含む各種回路部品を実装した後、このプリント基板８を上下に分割されたケース６，７の内部に収納し、両ケース６，７をそれぞれの外周縁で接合させる。次に、これら両ケース６，７を超音波溶着機の加工台４に載置した後、図１の左端側の接合面の真上に第１のホーン２を押し当てると共に、図１の右端側の接合面の真上に第２のホーン３を押し当てた状態で、第１および第２のホーン２，３に超音波振動を印加する。その結果、第１および第２のホーン２，３の真下に位置する接合面が摩擦などによる発熱で溶着し、両ケース６，７の左右両端部が接合・一体化される。その際、第１および第２のホーン２，３は高周波発振器１を振動源として４０ＫＨｚの周波数で振動するが、高周波発振器１と第２のホーン３との間に位相遅延部５が介設されているため、第１および第２のホーン２，３から１８０度の位相差をもつ振動が発生することになる。
【００１６】
図２はこの時に発生する振動が被加工物である両ケース６，７を伝播する様子を模式的に示すものであり、図２（ａ）中の領域Ｓ１は第１のホーン２に対応する両ケース６，７の接合面で、同じく領域Ｓ２は第２のホーン３に対応する両ケース６，７の接合面である。また、図２（ｂ）中の実線Ｐ１は第１のホーン２で発生する振動のパワーを示し、同じく破線Ｐ２は第２のホーン３で発生する振動のパワーを示している。
【００１７】
この図２から明らかなように、第１のホーン２で発生する振動Ｐ１は領域Ｓ１の近傍で最もパワーが大きく、領域Ｓ１から領域Ｓ２に向かってそのパワーが減衰しながら伝播する。これとは逆に、第２のホーン３で発生する振動Ｐ２は領域Ｓ２の近傍で最もパワーが大きく、領域Ｓ２から領域Ｓ１に向かってそのパワーが減衰しながら伝播する。そして、これら第１および第２のホーン２，３で発生する振動Ｐ１，Ｐ２は互いに１８０度の位相差をもっているため、矢印Ａで示す領域Ｓ１と領域Ｓ２の中央部分において、第１および第２のホーン２，３で発生する振動Ｐ１，Ｐ２がキャンセルされることになる。すなわち、両ケース６，７の内部に収納されたプリント基板８について見ると、その中央部分Ａで第１および第２のホーン２，３の振動Ｐ１，Ｐ２がキャンセルされるため、プリント基板８の中央部分Ａにはほとんど振動が作用しなくなる。したがって、両ケース６，７の両端の接合面を超音波溶着する時に、プリント基板８の中央部分Ａ内に実装された水晶振動子９にはほとんど外部振動が作用しなくなり、水晶振動子９の破壊を確実に防止することができる。
【００１８】
なお、両ケース６，７の残りの接合面（図２の領域Ｓ３と領域Ｓ４）については必ずしも超音波溶着を行わなくても良いが、必要に応じて上記と同様の超音波溶着を行うことも可能である。この場合においても、領域Ｓ３から領域Ｓ４に向かって伝播する一方の振動と領域Ｓ４から領域Ｓ３に向かって伝播する他方の振動とが両者の中央部分でキャンセルされるため、プリント基板８の中央部に実装された水晶振動子９にはほとんど外部振動が作用しなくなり、水晶振動子９の破壊を確実に防止することができる。
【００１９】
上述した実施形態例にあっては、上下に分割された一対の樹脂製ケース６，７の内部に中央部に水晶振動子９が実装されたプリント基板８を収納し、これら両ケース６，７をプリント基板を介して対向する左右両端部で接合すると共に、これら接合面を１８０度の位相差をもって超音波振動する第１および第２のホーン２，３により溶着するようにしたので、両ケース６，７の接合面を第１および第２のホーン２，３で超音波溶着する時、第１のホーン２から第２のホーン３に向かって伝播する振動Ｐ１と第２のホーン３から第１のホーン２に向かって伝播する振動Ｐ２とが両者の中央部分でキャンセルされ、プリント基板８の中央部に実装された水晶振動子９が超音波溶着時の振動に起因して破壊されることを確実に防止できる。
【００２０】
なお、上記実施形態例では、小型メモリカードの両ケース６，７を超音波溶着する場合について説明したが、上下に分割された一対の樹脂製ケース内にプリント基板を収納した被加工物であれば、小型メモリカード以外の被加工物にも本発明による樹脂製ケースの超音波溶着方法を適用することができる。
【００２１】
また、上記実施形態例では、プリント基板８の中央部に音叉型の水晶振動子９を実装した場合について説明したが、かかる水晶振動子９のみならず他の回路部品、特に、片持ち部品と呼ばれる回路部品をプリント基板８の中央部に実装した場合も同様の効果を期待することができる。
【００２２】
【発明の効果】
本発明は、以上説明したような形態で実施され、以下に記載されるような効果を奏する。
【００２３】
上下に分割された一対の樹脂製ケース内にプリント基板を収納し、これら両ケースをプリント基板を介して対向する両端部で接合すると共に、これら接合面を１８０度の位相差をもって超音波振動する第１および第２のホーンにより溶着するようにしたので、両ケースの接合面をプリント基板を介して対向する両端部で超音波溶着する時、第１のホーンから第２のホーンに向かって伝播する振動と第２のホーンから第１のホーンに向かって伝播する振動とが両者の中央部分でキャンセルされ、この中央部分に配置されたプリント基板の回路部品が溶着時の振動に起因して損傷することを防止できる。特に、プリント基板の中央部に音叉型の水晶振動子を実装した場合、超音波溶着時に水晶振動子にはほとんど外部振動が作用しないため、水晶振動子の破壊を確実に防止することができる。
【図面の簡単な説明】
【図１】本発明の実施形態例に係る樹脂製ケースの超音波溶着方法を示す説明図である。
【図２】超音波溶着時に発生する振動のキャンセル動作を示す説明図である。
【符号の説明】
１ 高周波発振器
２ 第１のホーン
３ 第２のホーン
４ 加工台
５ 位相遅延部
６，７ 樹脂製ケース
８ プリント基板
９ 水晶振動子[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an ultrasonic welding method for welding and integrating a pair of resin cases containing a printed circuit board.
[0002]
[Prior art]
Conventionally, in a small memory card manufacturing process called, for example, an SD (Secure Digital) card, a printed circuit board on which various circuit components are mounted is housed in a pair of resin cases divided vertically, and the peripheral edges of both cases The technique of joining and integrating the parts by ultrasonic welding is employed.
[0003]
Conventionally known ultrasonic welding machines include a processing table called an anvil and a horn that ultrasonically vibrates using a high-frequency oscillator as a vibration source, and an appropriate addition is applied to the horn while the workpiece is placed on the processing table. By applying ultrasonic vibration under pressure, the joining surfaces of the workpieces are welded by heat generated by friction or the like (for example, see Non-Patent Document 1). Here, the horn is ultrasonically vibrated at a predetermined frequency using a high-frequency oscillator as a vibration source. Usually, when welding a large workpiece, an ultrasonic welder equipped with a high-frequency oscillator that oscillates at 20 KHz is used. In the case of welding a small workpiece such as a small memory card, an ultrasonic welding machine including a high-frequency oscillator that oscillates at 40 KHz is used.
[0004]
[Non-Patent Document 1]
Toshikazu Sato, “Special Processing”, 1st Edition, Yokendo Co., Ltd., November 20, 1981, p. 141-142
[0005]
[Problems to be solved by the invention]
As described above, in the conventionally known ultrasonic welding methods for resin cases, a printed circuit board is accommodated in a pair of upper and lower resin cases, and the peripheral portions of both cases are set to a predetermined frequency (for example, Since the welding is performed by a horn that vibrates ultrasonically at 40 KHz), the vibration of the horn generated during ultrasonic welding acts on the internal printed circuit board, and the circuit components mounted on the printed circuit board are damaged by this vibration. There was a problem. In particular, when a tuning fork type crystal resonator is mounted on a printed circuit board, the second and third harmonics of the natural frequency of the crystal resonator are close to the vibration frequency (40 KHz) of the horn. There was a problem that the crystal resonator was destroyed due to resonance.
[0006]
The present invention has been made in view of the situation of the prior art as described above, and an object of the present invention is to provide an ultrasonic welding method for a resin case that can prevent damage to internal circuit components due to vibration during ultrasonic welding. It is to provide.
[0007]
[Means for Solving the Problems]
In order to achieve the above-described object, in the ultrasonic welding method for a resin case according to the present invention, a printed circuit board is accommodated in a pair of upper and lower resin cases, and both the cases are placed via the printed circuit board. While joining at both opposing ends, these joining surfaces were welded by first and second horns that vibrated ultrasonically with a phase difference of 180 degrees.
[0008]
When such a configuration is adopted, when ultrasonically welding the joint surfaces of a pair of resin cases at both ends facing each other through the printed circuit board, vibrations propagating from the first horn toward the second horn and the first Since the vibration propagating from the second horn toward the first horn is canceled at the central portion of the both, the circuit component of the printed circuit board arranged at the central portion is hardly affected by the vibration. Can prevent damage.
[0009]
In the above configuration, as means for ultrasonically vibrating the first and second horns with a phase difference of 180 degrees, a phase delay is provided between one of the first and second horns and the high-frequency oscillator that is the vibration source. It is preferable to interpose a part.
[0010]
Further, in the above configuration, when a tuning fork type crystal resonator is mounted on the printed circuit board, the joint surfaces of both cases are placed with the crystal resonator positioned substantially at the center of the first and second horns. It is preferable to weld, and when such a configuration is adopted, since the external vibration hardly acts on the crystal resonator during ultrasonic welding, the crystal resonator can be reliably prevented from being broken.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is an explanatory view showing an ultrasonic welding method for a resin case according to an embodiment of the present invention, and FIG. 2 is a diagram for canceling vibrations generated during ultrasonic welding. It is explanatory drawing which shows operation | movement.
[0012]
As shown in FIG. 1, an ultrasonic welder according to this embodiment includes a high-frequency oscillator 1 that oscillates at a frequency of 40 KHz, and first and second horns 2 that ultrasonically vibrate using the high-frequency oscillator 1 as a vibration source. , 3 and a processing table 4 on which a workpiece is placed, and a phase delay unit 5 is provided between the high frequency oscillator 1 and the second horn 3 to delay the phase by 180 degrees. Yes.
[0013]
The workpiece is a small memory card called an SD card. The small memory card includes a pair of upper and lower resin cases 6 and 7 and a printed circuit board 8 housed in both the cases 6 and 7. And. Various circuit components including a chip resistor, a chip capacitor, and an IC are mounted on the printed circuit board 8, and a tuning fork type crystal resonator 9, which is one of these circuit components, is mounted almost at the center of the printed circuit board 8. Yes.
[0014]
Next, a process of ultrasonic welding the two cases 6 and 7 of the small memory card schematically configured as described above will be described.
[0015]
First, various circuit components including the crystal unit 9 are mounted on the printed circuit board 8, and then the printed circuit board 8 is accommodated in the cases 6 and 7 divided into upper and lower parts. Join with. Next, after placing both the cases 6 and 7 on the processing table 4 of the ultrasonic welding machine, the first horn 2 is pressed right above the joint surface on the left end side in FIG. 1 and the right end in FIG. Ultrasonic vibration is applied to the first and second horns 2 and 3 with the second horn 3 pressed against the joint surface on the side. As a result, the joint surface located directly below the first and second horns 2 and 3 is welded by heat generated by friction or the like, and the left and right ends of both cases 6 and 7 are joined and integrated. At that time, the first and second horns 2 and 3 vibrate at a frequency of 40 KHz using the high frequency oscillator 1 as a vibration source, but a phase delay unit 5 is interposed between the high frequency oscillator 1 and the second horn 3. Therefore, vibrations having a phase difference of 180 degrees are generated from the first and second horns 2 and 3.
[0016]
FIG. 2 schematically shows how the vibration generated at this time propagates through the two cases 6 and 7 which are workpieces, and a region S1 in FIG. 2A corresponds to the first horn 2. Similarly, the region S <b> 2 is a joint surface between the cases 6 and 7 corresponding to the second horn 3 at the joint surface between the cases 6 and 7. Also, the solid line P1 in FIG. 2B indicates the vibration power generated in the first horn 2, and the broken line P2 similarly indicates the vibration power generated in the second horn 3.
[0017]
As is clear from FIG. 2, the vibration P1 generated in the first horn 2 has the largest power in the vicinity of the region S1, and propagates while the power is attenuated from the region S1 to the region S2. On the contrary, the vibration P2 generated in the second horn 3 has the largest power in the vicinity of the region S2, and propagates while the power is attenuated from the region S2 to the region S1. Since the vibrations P1 and P2 generated by the first and second horns 2 and 3 have a phase difference of 180 degrees, the first and second horns are formed in the central portion of the region S1 and the region S2 indicated by the arrow A. The vibrations P1 and P2 generated by the horns 2 and 3 are cancelled. That is, when looking at the printed circuit board 8 housed in both the cases 6 and 7, the vibrations P1 and P2 of the first and second horns 2 and 3 are canceled at the central portion A. The vibration hardly acts on the central portion A. Therefore, when ultrasonic welding is performed on the joint surfaces at both ends of both cases 6 and 7, external vibration hardly acts on the crystal resonator 9 mounted in the central portion A of the printed circuit board 8, and the crystal resonator 9 Destruction can be reliably prevented.
[0018]
It should be noted that ultrasonic welding is not necessarily performed on the remaining joint surfaces (region S3 and region S4 in FIG. 2) of both cases 6 and 7, but ultrasonic welding similar to the above is performed as necessary. Is also possible. Also in this case, since one vibration propagating from the region S3 toward the region S4 and the other vibration propagating from the region S4 toward the region S3 are canceled at the central portion of both, the central portion of the printed circuit board 8 is obtained. External vibration hardly acts on the crystal resonator 9 mounted on the crystal resonator 9, and the crystal resonator 9 can be reliably prevented from being broken.
[0019]
In the above-described embodiment, the printed circuit board 8 having the crystal unit 9 mounted in the center is accommodated in a pair of resin cases 6 and 7 divided into upper and lower parts. Are joined by the first and second horns 2 and 3 that are ultrasonically vibrated with a phase difference of 180 degrees. When ultrasonically welding the joint surfaces of 6 and 7 with the first and second horns 2 and 3, the vibration P 1 propagating from the first horn 2 toward the second horn 3 and the second horn 3 to the second The vibration P2 propagating toward the horn 2 is canceled at the central portion of both, and the crystal resonator 9 mounted on the central portion of the printed circuit board 8 is destroyed due to vibration during ultrasonic welding. Can be reliably prevented.
[0020]
In the above embodiment, the case of ultrasonic welding the both cases 6 and 7 of the small memory card has been described. However, it may be a workpiece in which a printed circuit board is housed in a pair of upper and lower resin cases. For example, the ultrasonic welding method of the resin case according to the present invention can be applied to a workpiece other than the small memory card.
[0021]
In the above embodiment, the case where the tuning fork type crystal resonator 9 is mounted on the central portion of the printed circuit board 8 has been described. However, not only the crystal resonator 9 but also other circuit components, particularly cantilever components, The same effect can be expected when a so-called circuit component is mounted on the central portion of the printed circuit board 8.
[0022]
【The invention's effect】
The present invention is implemented in the form as described above, and has the effects described below.
[0023]
A printed circuit board is housed in a pair of upper and lower divided resin cases, and both cases are bonded to each other at opposite ends via the printed circuit board, and these bonded surfaces are ultrasonically vibrated with a phase difference of 180 degrees. Since welding is performed by the first and second horns, the ultrasonic waves are welded to the opposite ends of both cases through the printed circuit board, so that the propagation from the first horn to the second horn occurs. And the vibration propagating from the second horn toward the first horn are canceled at the center part of both, and the circuit components of the printed circuit board arranged at the center part are damaged due to the vibration at the time of welding. Can be prevented. In particular, when a tuning fork type crystal resonator is mounted at the center of the printed circuit board, external vibration hardly acts on the crystal resonator during ultrasonic welding, so that destruction of the crystal resonator can be reliably prevented.
[Brief description of the drawings]
FIG. 1 is an explanatory view showing an ultrasonic welding method for a resin case according to an embodiment of the present invention.
FIG. 2 is an explanatory view showing a canceling operation of vibrations generated during ultrasonic welding.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 High frequency oscillator 2 1st horn 3 2nd horn 4 Processing stand 5 Phase delay parts 6 and 7 Resin case 8 Printed circuit board 9 Crystal oscillator

Claims (3)

上下に分割された一対の樹脂製ケース内にプリント基板を収納し、これら両ケースを前記プリント基板を介して対向する両端部で接合すると共に、これら接合面を１８０度の位相差をもって超音波振動する第１および第２のホーンにより溶着したことを特徴とする樹脂製ケースの超音波溶着方法。A printed circuit board is housed in a pair of upper and lower divided resin cases, and both cases are bonded to each other at opposite ends via the printed circuit board. A method for ultrasonic welding of a resin case, characterized by being welded by first and second horns. 請求項１の記載において、前記第１および第２のホーンのいずれか一方と高周波発振器との間に位相遅延部が介設されてことを特徴とする樹脂製ケースの超音波溶着方法。2. The method of ultrasonic welding of a resin case according to claim 1, wherein a phase delay portion is interposed between one of the first and second horns and the high frequency oscillator. 請求項１または２の記載において、前記プリント基板に音叉型の水晶振動子が実装されており、この水晶振動子を前記第１および第２のホーンのほぼ中央に位置させた状態で前記両ケースの接合面を溶着したことを特徴とする樹脂製ケースの超音波溶着方法。3. The tuning case according to claim 1, wherein a tuning fork type crystal resonator is mounted on the printed circuit board, and the two cases are positioned in the center of the first and second horns. A method for ultrasonic welding of a resin case, characterized in that the joint surface of the resin is welded.
JP2002348093A 2002-11-29 2002-11-29 Method for ultrasonic welding of case made of resin Ceased JP2004181654A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105387600A (en) * 2014-08-22 2016-03-09 大金工业株式会社 Hollow part and manufacturing method thereof
JP2016049549A (en) * 2014-09-01 2016-04-11 ダイキン工業株式会社 Hollow component and method of manufacturing the same
JP2016210183A (en) * 2015-05-08 2016-12-15 ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ Methods and apparatus for repairing composite materials

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105387600A (en) * 2014-08-22 2016-03-09 大金工业株式会社 Hollow part and manufacturing method thereof
JP2016049549A (en) * 2014-09-01 2016-04-11 ダイキン工業株式会社 Hollow component and method of manufacturing the same
JP2016210183A (en) * 2015-05-08 2016-12-15 ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ Methods and apparatus for repairing composite materials

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