JP2004178985A - Manufacturing method and equipment of organic electroluminescent device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method and equipment of an organic EL device capable of making a uniform bonding of an organic EL element board and a sealing film without unevenness in pressing. <P>SOLUTION: The manufacturing method of the organic EL device 2 for sealing an organic EL element 2b by bonding a substrate 2a with the organic EL element 2b formed with a sealing film 2c comprises a process of arranging the substrate 2a on a table 3, a process of arranging the sealing film 2c on the substrate 2a and a process of bonding the substrate 2a and the sealing film 2c by pressing the thermo-compression bonding head 8 on the sealing film 2c with an interposition of flexible members 30, 80 between the table 3 and/or the thermo-compression bonding head 8. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method and an apparatus for manufacturing an organic EL device used for various displays, and more particularly to a method and an apparatus for manufacturing an organic EL device capable of laminating a uniform film without pressing unevenness.
[0002]
[Prior art]
Conventionally, in order to uniformly bond a substrate and a film of an organic EL element with a thermocompression bonding head, high precision parallelism is required between the table surface holding the substrate and the thermocompression bonding head. The tilt adjustment of the thermocompression bonding head was performed with the adjusting screw to secure necessary parallelism.
[0003]
Also, as a conventional technique, even if there are variations in the flatness of the upper surface plate and the lower surface plate for bonding the glass substrates for a liquid crystal display panel and the parallelism at the time of assembling, and furthermore, even if the parallelism in the glass substrate varies, the influence thereof is also considered. There is a bonding apparatus capable of performing bonding with high precision parallelism without such a bonding apparatus (for example, see Patent Document 1).
[0004]
[Patent Document 1]
JP-A-6-18829 (FIGS. 1 to 5)
[0005]
[Problems to be solved by the invention]
However, in the conventional film sealing device described above, the thermocompression bonding head after the tilt adjustment is fixed to the pressing device, so that the entire pressing device becomes a rigid body, and thermal deformation due to heating and deformation due to pressing occur. The parallelism with the table surface required for uniform bonding without uneven pressing was impaired. Further, it has been difficult to follow the variation in flatness between the organic EL element substrate and the sealing film to be bonded.
[0006]
The present invention has been made in view of the above circumstances, and has as its object to provide a method and apparatus for manufacturing an organic EL device capable of uniformly bonding an organic EL element substrate and a sealing film without uneven pressing. And
[0007]
[Means for Solving the Problems]
In order to achieve the above object, a method of manufacturing an organic EL device according to the present invention is a method of manufacturing an organic EL device in which a substrate on which an organic EL element is formed and a sealing film are attached to seal the organic EL element. A step of disposing the substrate on a table; a step of disposing the sealing film on the substrate; and interposing a flexible member on the table and / or the thermocompression head to seal the thermocompression head. Pressurizing against a stop film and bonding the substrate and the sealing film.
[0008]
According to such a method for manufacturing an organic EL device, even if the parallelism between the table and the thermocompression bonding head is impaired, or if the flatness of each of the organic EL element substrate and the sealing film to be bonded varies. In addition, the pressing force of the entire pressing surface is equalized by the action of the flexible member, and the organic EL element substrate and the sealing film are bonded uniformly without pressing unevenness.
[0009]
Further, an apparatus for manufacturing an organic EL device according to the present invention is an apparatus for manufacturing an organic EL device for bonding a substrate on which an organic EL element is formed and a sealing film, and for arranging the organic EL element substrate. And a thermocompression bonding head for thermocompression bonding the sealing film, wherein the table and / or the thermocompression bonding head are provided with a flexible member.
[0010]
According to such an organic EL device manufacturing apparatus, even if the parallelism between the table and the thermocompression bonding head is impaired, the unevenness of the flatness of each of the bonded organic EL element substrate and the sealing film is also reduced. Even so, the pressing force of the entire pressing surface is equalized by the action of the flexible member, so that uniform bonding between the organic EL element substrate and the sealing film without pressing unevenness is possible.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of an organic EL device manufacturing apparatus and an organic EL device manufacturing method according to the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing the overall configuration of a manufacturing apparatus for an organic EL device according to the present invention, and FIGS. 2 and 3 are schematic views of main parts thereof.
[0012]
In the figure, reference numeral 101 denotes an organic EL device manufacturing apparatus of the present invention, which supports a table 3 on which a glass substrate 2 a on which an organic EL element 2 b of an organic EL device 2 is formed on a base 1 and a pressing cylinder 4. And a stand 6 for supporting the pressing block 5 slidably in the vertical direction, and drive control devices 7. In order to prevent the organic EL element 2b from deteriorating, the film sealing needs to be performed in a nitrogen atmosphere. The sealing work section of the film sealing device is housed in the hermetic chamber 20.
[0013]
The sealing film 2c is made of a thermoplastic resin having a thickness of about 80 μm, has a metal thin film such as aluminum, and has an adhesive containing a desiccant for the organic EL element 2b on the side bonded to the glass substrate 2a. Is applied.
[0014]
A pressing block 5 driven by a pressing cylinder 4 and slidable up and down presses the peripheral portion 2d of the sealing film 2c covering the glass substrate 2a while heating and presses the two together to seal the organic EL element 2b. A head block, a heat block for holding a cartridge heater for heating the thermocompression bonding head to about 200 ° C., and a heat insulating material for preventing heat of the heat block from being transmitted to other than the thermocompression head. I have. The heating method of the thermocompression bonding head 8 may be a pulse heating method without using the cartridge heater 9 and the heat block 10.
[0015]
In the present embodiment, the thermocompression bonding head 8 is made of stainless steel, is formed in an inverted concave shape having a flat rectangular shape in plan view and a flat flat shape in front view, and two right and left pressing end faces 8a, 8a have a width of 2 mm and a length of 2 mm. It is formed in an elongated flat shape of 50 mm in length. The pressing block 5 is rotatable about a vertical axis, descends in the state shown in the figure, heat-presses the sealing films 2c to the left and right edges of the square glass substrate, and then rises and rotates 90 °. Then, the entire periphery is sealed by descending again and thermocompression bonding to the front and rear edges. Although the thermocompression bonding head 8 of the present embodiment has two left and right pressing end faces 8a, 8a, there is a type in which only one pressing end face 8a is provided. In this case, in order to seal the entire periphery, the pressing block 5 is rotated 90 ° at a time, and four times of thermocompression bonding are performed.
[0016]
On the table 3, there is provided a flat plate 30 having a larger area than the substrate 2a such as silicon rubber or fluoro rubber as a flexible member, and the substrate 2a is disposed thereon.
[0017]
Further, as shown in FIG. 3, the pressing end faces 8a, 8a of the pressure bonding head 8 may be formed of a heat conductive non-metallic heat-resistant flexible member 80 such as fluoro rubber. In this manner, the pressure bonding head 8 itself has “similarity” and also gently transmits heat to the sealing film 2c, so that the sealing film 2c does not burn out during pressure bonding. Further, as shown in FIG. 3, if the pressing end faces 8 a, 8 a of the pressure bonding head 8 are made of a heat-resistant flexible member 80 and the flexible member 30 is also provided on the table 3, the “further” is achieved. Sex "can be enhanced.
[0018]
Next, a method of manufacturing an organic EL device using the above-described manufacturing apparatus will be described. The glass substrate 2a on which the organic EL element 2b is formed is arranged on a flat plate 30 made of a flexible material such as silicon rubber or fluorine rubber on the table 3, and then the sealing film 2c is arranged on the glass substrate 2a. Then, the pressing cylinder 4 is extended, the pressing block 5 is lowered, and the right and left edges of the sealing film 2c and the glass substrate 2a are pressed by the pressing ends 8a, 8a of the thermocompression bonding head 8 heated to about 200 ° C. 2d and 2d are pressed and both are thermocompression-bonded. Thereafter, the pressing cylinder 4 is contracted to raise the pressing block 5 and then rotated by 90 °, the pressing cylinder 4 is extended again, the pressing block 5 is lowered, and the front and rear edges are pressed to perform thermocompression bonding. Perform peripheral sealing.
[0019]
When performing the above-mentioned thermocompression bonding, even if the parallelism between the table 3 and the thermocompression bonding head 8 is impaired, the unevenness of the flatness of each of the organic EL element substrate 2a and the sealing film 2c to be adhered. Even if there is, the pressing force of the entire pressing surface is equalized by the copying action of the deformation of the flat plate 30 made of the flexible member, and the organic EL element substrate 2a and the sealing film 2c are uniformly bonded without uneven pressing.
[0020]
Further, instead of the flat plate 30 made of a flexible member on the table 3, the pressing end faces 8a, 8a of the pressure bonding head 8 are formed of a heat conductive non-metallic heat-resistant flexible member 80 such as fluoro rubber. When the thermocompression bonding is performed, the sealing film 2c is bonded without burning off due to the conformity and gentle heat conductivity of the compression head 8 itself. Further, when the pressing end faces 8a, 8a of the pressure bonding head 8 are formed of the heat-resistant flexible member 80 and the flat plate 30 made of the flexible member is also provided on the table 3, thermocompression bonding is performed. Since the height is even higher, even if the parallelism between the table 3 and the thermocompression bonding head 8 is considerably impaired, or even if the flatness of the organic EL element substrate 2a and the sealing film 2c to be bonded varies considerably. The pressing force of the entire pressing surface is equalized by the copying effect of the deformation of both flexible members, and the organic EL element substrate 2a and the sealing film 2c are uniformly bonded without pressing unevenness.
[Brief description of the drawings]
FIG. 1 is a perspective view showing the overall configuration of an organic EL device manufacturing apparatus according to the present invention.
FIG. 2 is a schematic view of a main part of an organic EL device manufacturing apparatus according to the present invention.
FIG. 3 is a schematic view of a main part of an organic EL device manufacturing apparatus according to the present invention.
[Explanation of symbols]
Reference Signs List 1 base 2 organic EL device 2a organic EL element substrate 2b organic EL element 2c sealing film 2d peripheral part 3 table 4 pressing cylinder 5 pressing block 6 stand 7 drive control equipment 8 thermocompression head 8a pressing end face 9 cartridge heater 10 heat Block 11 Heat insulating material 20 Airtight chamber 30 Flat plate 80 made of flexible member Heat-resistant flexible member

Claims (2)

A method for manufacturing an organic EL device in which a substrate on which an organic EL element is formed and a sealing film are attached to seal the organic EL element,
Arranging the substrate on a table;
Arranging the sealing film on the substrate,
A step of interposing a flexible member on a table and / or a thermocompression bonding head, pressing the thermocompression bonding head against the sealing film, and bonding the substrate and the sealing film;
A method for manufacturing an organic EL device, comprising: An organic EL device manufacturing apparatus for bonding a substrate on which an organic EL element is formed and a sealing film,
A table for arranging the organic EL element substrate,
And a thermocompression bonding head for thermocompression bonding the sealing film,
An apparatus for manufacturing an organic EL device, comprising a table and / or a thermocompression head provided with a flexible member.

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