JP2004172361A - Substrate mounting structure of coil component for power supply device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a highly reliable and small substrate mounting structure of a power supply device coil component, which has a simple structure. <P>SOLUTION: The structure is provided with an insulating substrate 22 where circuit patterns 24 in prescribed shapes are installed on a surface and a rear face, a fitting through hole 26 formed in a prescribed position of the substrate 22, and electrode terminals 28 formed near the fitting through hole 26 and in the circuit patterns 24 at the surface and the rear face of the substrate 22. Drawing lines 40 have a coil 35 engaged to the fitting through hole 26 with allowance, and are ends of a coil winding wire 37 of the coil component 35. The lines are connected to the electrode terminals 28 at the two sides of the substrate 22 through the fitting through hole 26. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate mounting structure of a coil device for a power supply device in which a coil component is mounted on a printed circuit board of a power supply device for various electronic devices.
[0002]
[Prior art]
[Patent Document 1] Japanese Patent Publication No. 8-8180 Conventionally, as electronic devices have become thinner, thinner coil components have been demanded and commercialized. However, if the coil component itself is too thin, the floor area must be increased in order to obtain predetermined performance. In order to solve such a problem, for example, as shown in FIG. 6, a mounting hole 2 is provided at a predetermined position of a substrate 1, and a coil component 3 is provided by being dropped into the mounting hole 2. There was a mounting structure. In the coil component 3, a winding 5 is wound around a bobbin 4, and a core 6 is attached to the center and outside of the bobbin 4 and the winding 5. Each lead 5 a of the winding 5 is connected to terminals 7 provided on both sides of the bobbin 4. The terminal 7 is folded and superimposed on the front surface 1 a of the substrate 1 and is connected to a circuit pattern 8 printed in a predetermined shape on the front surface 1 a of the substrate 1. The substrate 1 is provided with a through hole 9 at a predetermined position, and the circuit patterns 8 on the front surface 1a and the back surface 1b of the substrate 1 are electrically connected to each other. Various electronic components 10 and 11 are mounted on the front side 1 a and the back side 1 b of the substrate 1 and connected to the circuit pattern 8.
[0003]
In addition, as shown in FIG. 7, there is another type in which the coil component 12 is provided by being dropped into the mounting through hole 2 of the substrate 1. The coil component 12 is provided with a block-shaped base 14, on which terminals 16 and 18 are insert-molded. A core 20 is provided on the base 14, and the winding 5 is wound around the core 20. Each lead wire 5a of the winding 5 is connected to terminals 16 and 18, and the terminals 16 and 18 extend into the mounting through hole 2 on the back side 1b of the board 1 and are provided on the back side 1b of the board 1 at predetermined intervals. It is connected to a circuit pattern 8 printed in a shape.
[0004]
In addition, in order to respond to the miniaturization of products, the number of turns is reduced as much as possible, and in order to increase the operating frequency, each winding is divided into a sandwich structure in which they are overlapped with each other to increase the coupling coefficient between the windings. A small transformer for mounting on a board is disclosed in Japanese Patent Publication No. 8-8108.
[0005]
[Problems to be solved by the invention]
In the conventional technique shown in FIGS. 6 and 7, a plurality of terminals are provided only on one surface of the substrate 1, and a large installation space for the electrode terminals on the front and back surfaces of the substrate 1 is required. Further, the terminals cannot be made very thin to secure the mounting strength, and a certain thickness is required. On the other hand, in order to ensure insulation between the terminals, it is necessary to keep a certain interval. Therefore, in a limited mounting space, the number of terminals cannot be increased, which hinders high density. Further, through-holes 9 are required to supply electric current to the electronic components 10 and 11 on the front and back surfaces of the substrate 1, and other electronic components cannot be mounted at the positions where the through-holes 9 are formed. It was. Furthermore, a large current flows through the through-hole 9, which may cause heat generation, which may increase loss and decrease reliability.
[0006]
Also, in the case of the small transformer for board mounting disclosed in Japanese Patent Publication No. 8-8108, since the lead wire of the coil winding is connected to only one side of the board, a large space for terminals and a through hole are required. There is the same problem as above. Further, there is a problem that the equivalent series resistance of the substrate coil increases, the loss increases, and the efficiency decreases due to the restriction that the copper foil thickness of the general-purpose printed circuit board is about 100 μm or less. To increase the number of circuits, it is necessary to use a printed circuit board having a large number of layers, but this leads to an increase in cost. When the number of windings is increased by connecting the coils of each layer in series, a through hole is necessary for the series connection, and a large current flows through the through hole as in the above, which may cause heat generation, increasing loss and increasing reliability. There is a risk of decline.
[0007]
SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems of the related art, and has as its object to provide a substrate mounting structure of a coil component for a power supply device which has a simple structure, has high reliability, and can be easily miniaturized. Aim.
[0008]
[Means for Solving the Problems]
The present invention provides an insulating substrate having a circuit pattern of a predetermined shape provided on the front and back surfaces, a mounting through hole formed at a predetermined position on the substrate, and a front and back surface of the substrate near the mounting through hole. An electrode terminal connected to the circuit pattern of (1), a coil component which is loosely fitted into the mounting through hole, and an end of a coil winding of the coil component is pulled out and positioned to protrude to the side. In addition, the present invention provides a substrate mounting structure for a coil device for a power supply device, comprising a lead wire connected to the electrode terminals on the front and back of the substrate via the mounting holes.
[0009]
The coil component is provided with a coil of a plurality of circuits wound by a plurality of coil windings and a core penetrating the plurality of coils, and the coil windings of the plurality of circuits are magnetically coupled to form one coil. It may be formed on a part.
[0010]
The present invention also provides an insulating substrate having a circuit pattern of a predetermined shape provided on the front and back surfaces, a mounting through-hole formed at a predetermined position on the substrate, and a fitting in the mounting through-hole with a margin. And a plurality of bobbins each having a plurality of terminals are arranged with respect to the mounting hole of the substrate, and each lead wire of the plurality of coil windings is connected to the bobbin. Wound around each terminal, each terminal of the plurality of bobbins is connected to the electrodes on the front and back of the substrate around the mounting hole, and a core passes through the coil windings of the plurality of bobbins and is magnetically coupled to form one coil. 4 is a circuit board mounting structure of a power supply coil component formed on a component.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIGS. 1 and 2 illustrate a first embodiment of the present invention. In this embodiment, a substrate mounting structure 21 of a coil component for a power supply device is provided with an insulating substrate 22. A circuit pattern 24 having a predetermined shape is provided on the side surface 22a and the back side surface 22b.
[0012]
At a predetermined position of the substrate 22, a rectangular mounting hole 26 into which a coil component 35 described later is dropped and mounted is formed. Two electrode terminals 28 connected to the circuit pattern 24 are provided on the front side surface 22a of the substrate 22 near one edge 26a of the mounting through hole 26. Three electrode terminals 28 connected to the circuit pattern 24 are provided in the vicinity of the edge 26b facing the edge 26a of the mounting through hole 26. Similarly, two electrode terminals 28 are provided near the edge 26a of the mounting hole 26 and three electrode terminals 28 are provided near the edge 26b on the rear side surface 22b of the substrate 22. A through hole 30 penetrating the substrate 22 is provided outside the edge portion 26 a of the mounting through hole 26 of the substrate 22, and a conductor is provided on an inner peripheral surface of the through hole 30 so that the surface of the substrate 22 The circuit pattern 24 on the side surface 22a and the back side surface 22b is electrically connected. Various electronic components 32 and 34 are attached to predetermined positions on the front side surface 22a and the back side surface 22b of the board 22 by being connected to the circuit pattern 24, respectively.
[0013]
A coil component 35 is provided in the mounting through hole 26. The coil component 35 is provided in a cylindrical shape with a plurality of air core coils 36 around which a coil winding 37 is wound superposed. The air core coil 36 may be a fusion coil to prevent deformation. An E-shaped core 38 is attached to the center of the superposed air-core coils 36 so as to penetrate from the front and back of the substrate 22. The E-shaped core 38 is provided with a pair of the same shape attached in the center axis direction of the air-core coil 36 and provided with their end faces connected to each other, and is magnetically coupled to form one coil component 35. Each lead wire 40 of the plurality of air-core coils 36 is connected to a predetermined electrode terminal 28 through the mounting through hole 26. The connection of the electrode terminal 28 is appropriately selected, such as soldering.
[0014]
Next, the method of assembling the mounting structure 21 is as follows. The coil component 35 is dropped so that the axial direction of the air-core coil 23 matches the insertion direction of the mounting through-hole 26, and the lead wire 40 is passed through the mounting through-hole 26 and the electrode terminal 28. After that, the E-shaped core 38 is attached to the air-core coil 36. Alternatively, the lead wire 40 may be connected to the electrode terminal 28 after the E-shaped core 38 is attached to the air core coil 36 in advance. Further, the E-shaped core 38 may be appropriately fixed to the inner peripheral surface of the mounting through-hole 26 with an adhesive 42.
[0015]
According to the mounting structure 21 of this embodiment, the lead wire 40 is provided on the surface of the substrate 22 on the side where the predetermined electronic components 32 and 34 are provided so that a large current does not flow through the through hole 30. Can be inserted, and any one of the electrode terminals 28 on the front side surface 22a and the back side surface 22b of the substrate 22 can be selected. As a result, it is not necessary to flow a large current from the air-core coil 36 to the through hole 30, heat generation in the through hole 30 is suppressed, energy loss is reduced, and reliability is improved. Furthermore, since the number of electrode terminals 28 can be increased to about twice that of the case of only one side, a multifunctional transformer having a large number of circuits can be realized with a small-sized substrate. For example, it is possible to take out many outputs with one transformer, and it is possible to easily configure a multi-output power supply device. Further, since a large number of control auxiliary coils can be provided integrally, the number of circuit components can be reduced, and the size of the power supply device can be reduced.
[0016]
Next, a second embodiment of the present invention will be described with reference to FIG. Here, the same components as those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted. In the mounting structure 44 of this embodiment, a coil component 46 is dropped and mounted in the mounting through hole 26 of the substrate 22. The coil component 46 is provided with a pair of bobbins 48 and 50 arranged in the axial direction, and the coil winding 37 is wound around the axes of the bobbins 48 and 50, respectively.
[0017]
On the sides of the bobbins 48 and 50, a plurality of plate-shaped terminals 52 projecting to both sides are integrally provided. A lead wire 40 of the coil winding 37 is drawn out of the bobbins 48 and 50, and is wound around and connected to each terminal 52 through the mounting through hole 26. Each terminal 52 is connected to an electrode of the circuit pattern 24 on the front side surface 22a and the back side surface 22b of the substrate 22, and is fixed by soldering or the like. The pair of bobbins 48 and 50 are overlapped in the axial direction, and the E-shaped core 38 is attached from outside the bobbins 48 and 50. The E-shaped core 38 penetrates the centers of the bobbins 48 and 50, is provided with their end faces connected to each other, and is magnetically coupled to form one coil component 46.
[0018]
According to the mounting structure 44 of this embodiment, the same effects as those of the above embodiment can be obtained, miniaturization and thinning can be achieved, and reliability can be improved.
[0019]
Next, a third embodiment of the present invention will be described with reference to FIGS. Here, the same components as those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted. In the mounting structure 54 of this embodiment, a coil component 56 is dropped and mounted in the mounting through hole 26 of the substrate 22. The coil component 56 is provided in a tubular shape by stacking a plurality of air-core coils 60 made of a flat wire 58. An E-shaped core 38 is attached to the outside of each superimposed air core coil 60. The E-shaped core 38 is provided with a pair of the same shape attached in the direction of the center axis of the air-core coil 60, provided with their end faces connected to each other, and magnetically coupled to form one coil component 56.
[0020]
The coil component 56 is provided by being dropped so that the axial direction of the air-core coil 60 matches the insertion direction of the mounting through-hole 26, and each lead wire 62 of the plurality of air-core coils 60 is attached to a predetermined electrode terminal 28. And is connected by spot welding or the like.
[0021]
According to the mounting structure 54 of this embodiment, the coil 60 having the flat wire 58 has the same effects as those of the above-described embodiment, and can be reduced in size and thickness, and the reliability can be improved. .
[0022]
The substrate mounting structure of the coil device for a power supply device of the present invention is not limited to the above embodiments, and can be appropriately changed. The material, shape, number of coils, etc. of the windings of the coil component can be freely set.
[0023]
【The invention's effect】
In the substrate mounting structure of the coil device for a power supply device according to the present invention, since the lead wire of the winding is attached to the electrode terminal so as to pass through the mounting hole of the coil component, the substrate can be mounted without passing through the through hole. It is possible to connect the lead wire of the coil winding to the electronic component on the opposite side, and to achieve a simple structure, high reliability, and a thinner board mounting structure. Further, since the number of electrode terminals attached to the substrate can be increased as compared with the case of only one side, a multifunctional power supply device having a large number of circuits can be realized.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view of a substrate mounting structure of a power supply coil component according to an embodiment of the present invention.
FIG. 2 is a plan view of a substrate mounting structure of the coil component for a power supply device of the embodiment.
FIG. 3 is a longitudinal sectional view of a substrate mounting structure of a coil device for a power supply device according to a second embodiment of the present invention.
FIG. 4 is a longitudinal sectional view of a substrate mounting structure of a power supply coil component according to a third embodiment of the present invention.
FIG. 5 is a plan view of a substrate mounting structure of the coil component for a power supply device of the embodiment.
FIG. 6 is a longitudinal sectional view of a conventional board mounting structure of a power supply coil component for a power supply device.
FIG. 7 is a longitudinal sectional view of a conventional board mounting structure of a power supply coil component for a power supply device.
[Explanation of symbols]
Reference Signs List 21 board mounting structure 22 board 24 circuit pattern 26 mounting hole 28 electrode terminal 30 through hole 32, 34 electronic component 35 coil component 36 air core coil 37 coil winding 38 E-type core 40 lead wire

Claims (3)

An insulating substrate having a circuit pattern of a predetermined shape provided on the front and back surfaces, a mounting through hole formed at a predetermined position on the substrate, and a circuit pattern on the front and back surfaces of the substrate in the vicinity of the mounting through hole. The connected electrode terminal, a coil component which is loosely fitted in the mounting hole, and an end of a coil winding of the coil component is pulled out and laterally protruded, and the substrate And a lead wire connected to the front and back electrode terminals via the mounting through-holes. The coil component is provided with a plurality of circuit coils wound by a plurality of coil windings, and a core penetrating the plurality of coils. The coil windings of the plurality of circuits are magnetically coupled to form one coil. The substrate mounting structure for a coil component for a power supply device according to claim 1, wherein the component is formed on a component. An insulating substrate having a circuit pattern of a predetermined shape provided on the front and back surfaces, a mounting through-hole formed at a predetermined position on the substrate, and a coil component fitted with a clearance in the mounting through-hole In the coil component, a plurality of bobbins each having a plurality of terminals are arranged with respect to the mounting hole of the board, and each lead wire of the plurality of coil windings is wound around each terminal of the bobbin. Each terminal of the plurality of bobbins is connected to electrodes on the front and back of the substrate around the mounting hole, and a core penetrates and is magnetically coupled to the coil windings of the plurality of bobbins to form a single coil component. A substrate mounting structure for a coil component for a power supply device.

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