JP2004157121A - 運動感知基板を検査する方法と装置 - Google Patents

運動感知基板を検査する方法と装置 Download PDF

Info

Publication number
JP2004157121A
JP2004157121A JP2003374619A JP2003374619A JP2004157121A JP 2004157121 A JP2004157121 A JP 2004157121A JP 2003374619 A JP2003374619 A JP 2003374619A JP 2003374619 A JP2003374619 A JP 2003374619A JP 2004157121 A JP2004157121 A JP 2004157121A
Authority
JP
Japan
Prior art keywords
substrate
chuck
acceleration
chuck portion
needle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003374619A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004157121A5 (enExample
Inventor
Stefan Schneidewind
シュテファン・シュナイデヴィント
Claus Dietrich
クラウス・ディートリッヒ
Joerg Kiesewetter
イエルク・キーゼヴェッター
Hans-Michael Werner
ハンス−ミヒャエル・ヴェルナー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cascade Microtech Dresden GmbH
Original Assignee
SUSS MicroTec Test Systems GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10258375A external-priority patent/DE10258375A1/de
Application filed by SUSS MicroTec Test Systems GmbH filed Critical SUSS MicroTec Test Systems GmbH
Publication of JP2004157121A publication Critical patent/JP2004157121A/ja
Publication of JP2004157121A5 publication Critical patent/JP2004157121A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P21/00—Testing or calibrating of apparatus or devices covered by the preceding groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0035—Testing
    • B81C99/005—Test apparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2003374619A 2002-11-01 2003-11-04 運動感知基板を検査する方法と装置 Pending JP2004157121A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10251377 2002-11-01
DE10258375A DE10258375A1 (de) 2002-11-01 2002-12-12 Verfahren zur Haltevorrichtung zum Testen von bewegungssensitiven Substraten

Publications (2)

Publication Number Publication Date
JP2004157121A true JP2004157121A (ja) 2004-06-03
JP2004157121A5 JP2004157121A5 (enExample) 2006-12-07

Family

ID=32231874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003374619A Pending JP2004157121A (ja) 2002-11-01 2003-11-04 運動感知基板を検査する方法と装置

Country Status (3)

Country Link
US (1) US20040119492A1 (enExample)
JP (1) JP2004157121A (enExample)
FR (1) FR2847384B1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008089350A (ja) * 2006-09-29 2008-04-17 Tokyo Electron Ltd プローブカードおよび微小構造体の検査装置
JP2009139172A (ja) * 2007-12-05 2009-06-25 Tokyo Electron Ltd 微小構造体の変位量検出装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4387987B2 (ja) * 2004-06-11 2009-12-24 株式会社オクテック 微小構造体の検査装置、微小構造体の検査方法および微小構造体の検査プログラム
KR20070083503A (ko) 2005-03-31 2007-08-24 가부시끼가이샤 오크테크 미소 구조체의 프로브 카드, 미소 구조체의 검사 장치,검사 방법 및 컴퓨터 프로그램
KR101794744B1 (ko) 2013-08-14 2017-12-01 에프이아이 컴파니 하전 입자 비임 시스템용 회로 프로브

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01235139A (ja) * 1988-03-16 1989-09-20 Fujitsu Ltd 電子ビームプローバにおける試料装着方法
JPH0933567A (ja) * 1995-07-21 1997-02-07 Akebono Brake Ind Co Ltd 半導体加速度センサのセンサチップ検査方法及び検査装置
JPH0972939A (ja) * 1995-09-05 1997-03-18 Fujitsu Ten Ltd 基板測定装置
JPH0982771A (ja) * 1995-09-19 1997-03-28 Toshiba Corp 半導体材料の評価方法およびその装置
JPH0989912A (ja) * 1995-09-25 1997-04-04 Olympus Optical Co Ltd テーブル機構
JPH11163066A (ja) * 1997-11-29 1999-06-18 Tokyo Electron Ltd ウエハ試験装置
JP2001004379A (ja) * 1999-06-23 2001-01-12 Denso Corp 慣性センサの感度調整方法
US6232790B1 (en) * 1999-03-08 2001-05-15 Honeywell Inc. Method and apparatus for amplifying electrical test signals from a micromechanical device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0196804B1 (en) * 1985-03-11 1991-01-23 Nippon Telegraph And Telephone Corporation Method and apparatus for testing integrated electronic device
US5600257A (en) * 1995-08-09 1997-02-04 International Business Machines Corporation Semiconductor wafer test and burn-in
US5814733A (en) * 1996-09-12 1998-09-29 Motorola, Inc. Method of characterizing dynamics of a workpiece handling system
US5777484A (en) * 1996-09-30 1998-07-07 Packard Hughes Interconnect Company Device for testing integrated circuit chips during vibration
FR2790833B1 (fr) * 1999-03-08 2001-04-20 St Microelectronics Sa Procede de test statistique de circuits integres
DE10139443A1 (de) * 2001-08-10 2003-03-06 Eads Deutschland Gmbh Verfahren und Vorrichtung zum Trimmen von Sensoren mit schwingenden Strukturen

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01235139A (ja) * 1988-03-16 1989-09-20 Fujitsu Ltd 電子ビームプローバにおける試料装着方法
JPH0933567A (ja) * 1995-07-21 1997-02-07 Akebono Brake Ind Co Ltd 半導体加速度センサのセンサチップ検査方法及び検査装置
JPH0972939A (ja) * 1995-09-05 1997-03-18 Fujitsu Ten Ltd 基板測定装置
JPH0982771A (ja) * 1995-09-19 1997-03-28 Toshiba Corp 半導体材料の評価方法およびその装置
JPH0989912A (ja) * 1995-09-25 1997-04-04 Olympus Optical Co Ltd テーブル機構
JPH11163066A (ja) * 1997-11-29 1999-06-18 Tokyo Electron Ltd ウエハ試験装置
US6232790B1 (en) * 1999-03-08 2001-05-15 Honeywell Inc. Method and apparatus for amplifying electrical test signals from a micromechanical device
JP2001004379A (ja) * 1999-06-23 2001-01-12 Denso Corp 慣性センサの感度調整方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008089350A (ja) * 2006-09-29 2008-04-17 Tokyo Electron Ltd プローブカードおよび微小構造体の検査装置
JP2009139172A (ja) * 2007-12-05 2009-06-25 Tokyo Electron Ltd 微小構造体の変位量検出装置

Also Published As

Publication number Publication date
FR2847384A1 (fr) 2004-05-21
US20040119492A1 (en) 2004-06-24
FR2847384B1 (fr) 2008-08-29

Similar Documents

Publication Publication Date Title
US7584653B2 (en) System for wide frequency dynamic nanomechanical analysis
US8161803B2 (en) Micromachined comb drive for quantitative nanoindentation
CN201212871Y (zh) 薄膜材料动态弯曲疲劳性能测试系统
CN101784862B (zh) 试样的表面形状的测定方法及装置
JP2004320015A (ja) 薄い不透明なプレートを支持し運搬する装置と方法
WO2008053929A1 (en) Apparatus for inspecting fine structure, method for inspecting fine structure and substrate holding apparatus
WO2006106876A1 (ja) 微小構造体のプローブカード、微小構造体の検査装置、検査方法およびコンピュータプログラム
EP2926111B1 (en) Micromachined comb drive for quantitative nanoindentation
CN116699177A (zh) 一种加速度计性能测试装置、方法及系统
US7348788B2 (en) Probing card and inspection apparatus for microstructure
JP2004157121A (ja) 運動感知基板を検査する方法と装置
CN109061232B (zh) 原子力显微镜探针装置
KR20080102082A (ko) 음향방출센서용 위치조정 및 잡음제거장치
US20130055813A1 (en) Accelerometer
WO2007037241A1 (ja) ずり測定方法及びその装置
EP1930732A1 (en) Minute structure inspection device, inspection method, and inspection program
WO2008038781A1 (fr) Carte de sonde et dispositif d'inspection de structure de minute
EP1095254B1 (en) Surface testing equipment and method
Åström et al. Effect of alkylsilane coating on sliding wear of silica–silicon contacts with small amplitude motion
JP2005188951A (ja) 動釣合試験機
Wagner et al. Mechanical reliability of epipoly MEMS structures under shock load
JPS63223539A (ja) 微小領域強度試験装置
JPH11230875A (ja) 微小バネ定数測定装置およびバネ定数の測定方法
JP7741566B2 (ja) 薄板曲げ疲労試験用加振ユニット及び薄板曲げ疲労試験装置
JP2010048597A (ja) 微小構造体の検査装置および微小構造体の検査方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061025

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20061025

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100406

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20100525

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20101005