JP2004152861A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2004152861A5 JP2004152861A5 JP2002314303A JP2002314303A JP2004152861A5 JP 2004152861 A5 JP2004152861 A5 JP 2004152861A5 JP 2002314303 A JP2002314303 A JP 2002314303A JP 2002314303 A JP2002314303 A JP 2002314303A JP 2004152861 A5 JP2004152861 A5 JP 2004152861A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- snubber
- circuit
- capacitor
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 10
- 239000003990 capacitor Substances 0.000 claims 3
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002314303A JP2004152861A (ja) | 2002-10-29 | 2002-10-29 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002314303A JP2004152861A (ja) | 2002-10-29 | 2002-10-29 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004152861A JP2004152861A (ja) | 2004-05-27 |
| JP2004152861A5 true JP2004152861A5 (enExample) | 2005-08-04 |
Family
ID=32458647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002314303A Pending JP2004152861A (ja) | 2002-10-29 | 2002-10-29 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004152861A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5999677B2 (ja) | 2011-09-20 | 2016-09-28 | ローム株式会社 | 電子回路 |
| DE212020000086U1 (de) | 2019-04-24 | 2020-08-12 | Rohm Co., Ltd. | Halbleiterbauteil |
| CN113748509B (zh) * | 2019-04-24 | 2024-04-30 | 罗姆股份有限公司 | 半导体装置 |
-
2002
- 2002-10-29 JP JP2002314303A patent/JP2004152861A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2004336041A5 (enExample) | ||
| TW200625709A (en) | Vertical interconnect for organic electronic devices | |
| TW200501345A (en) | Stacked-type semiconductor device | |
| EP1724829A3 (en) | Semiconductor device | |
| JP2004165559A5 (enExample) | ||
| TW200509270A (en) | Semiconductor package having semiconductor constructing body and method of manufacturing the same | |
| JP2004523128A5 (enExample) | ||
| JP2003124383A5 (enExample) | ||
| JP2010530644A5 (enExample) | ||
| JP2003526946A5 (enExample) | ||
| TW200503016A (en) | Laminated ceramic capacitor, mounted structure of laminated ceramic capacitor, and capacitor module | |
| TW200725917A (en) | Semiconductor capacitor device | |
| JP2004179232A5 (enExample) | ||
| JP2004534452A5 (enExample) | ||
| US11387226B2 (en) | Chip power supply system, chip, PCB, and computer device | |
| US6477032B2 (en) | Low inductance chip with center via contact | |
| TWI273867B (en) | Keysheet module | |
| JP2003324183A5 (enExample) | ||
| ATE431614T1 (de) | Stapelkondensator mit durch ein leitfähiges polymer getrennten aluminiumelektroden | |
| JP2007110870A5 (enExample) | ||
| JP2004152861A5 (enExample) | ||
| TW200620585A (en) | Semiconductor package structure and method for fabricating the same | |
| TW200511548A (en) | Ball grid array package for high speed devices | |
| CN103310990B (zh) | 固态电解电容基板模块及包括其的电路板 | |
| JP2005101128A5 (enExample) |