JP2004152687A - Manufacturing device and manufacturing method of conductive particulate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing device of conductive particulate capable of restraining agglomeration of particulates in forming a metal layer on the surface of the particle having magnetism, and suitable for manufacturing the conductive particle with a metal layer with a uniform thickness without flaws or peelings or the like on the surface. <P>SOLUTION: The manufacturing method of the conductive particle, for forming a metal layer on the surface of the particulate having magnetism, is provided with at least a tabulate plate and a magnet arranged at one side of the plate, and a metal layer forming means for forming the metal layer on the surface of the particulate having magnetism. The magnet is arranged on the surface of the plate in free movement in a parallel direction, and the particle having magnetism is absorbed by magnetic attraction of the magnet to a side contrary to the side where the magnet of the plate is arranged and aligned. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an apparatus for producing conductive fine particles and a method for producing conductive fine particles using the apparatus for producing conductive fine particles.
[0002]
[Prior art]
Conventionally, in an electronic circuit board, a method of soldering each electrode on a printed circuit board has been used to connect a chip such as an IC or an LSI. However, this method is inferior in production efficiency. It had low reliability and was not suitable for high density. Therefore, in order to solve such a low connection reliability, a technique such as a ball grid array (BGA) in which a chip is connected to a substrate with a so-called solder ball, in which the solder is made spherical, has been developed. According to this technology, an electronic circuit board having both high productivity and high connection reliability can be configured by melting and connecting the solder balls mounted between the substrate and the chip and between the substrates at a high temperature.
[0003]
However, in recent years, the number of substrates has increased, and distortion and expansion and contraction have occurred due to changes in the external environment of the substrate itself. . In addition, when solder balls are used, the distance between the substrates varies and it is difficult to make the distance constant, and a spacer or the like must be separately provided to keep the distance constant, which is troublesome and expensive. It was.
[0004]
As a means for solving these problems, in order to alleviate the force applied to the connection portion between the substrates, reinforcement is performed by filling a resin or the like between the substrates, and there is a certain effect in improving the connection reliability. As described above, such means is troublesome, and there is a problem in that the cost is increased due to an increase in the number of filling steps.
[0005]
In order to solve such a problem, for example, conductive particles in which copper is used as core fine particles and solder is coated around the core (for example, see Patent Document 1), or conductive particles in which resin is used as core fine particles and solder is plated around the core is used. A method has been proposed in which conductive connection between substrates is performed using conductive particles (for example, see Patent Document 2) to maintain the distance between the substrates and to reduce the force applied to the connection between the substrates.
[0006]
As a method for producing such conductive fine particles having a solder layer, a barrel plating apparatus is generally used when the particle diameter of the core fine particles, which is the object to be plated, is 5000 μm or less.
In this barrel plating apparatus, core fine particles are put into a rotatable polygonal cylindrical barrel immersed in a plating solution, and by contacting the core fine particles with a cathode arranged in the barrel while rotating the barrel, the core fine particles are formed. Electroplating is performed to form a solder layer.
[0007]
However, when the fine particles are plated by the ordinary barrel plating method, the plating is easily performed while the fine particles are aggregated in the plating solution, and the conductive fine particles cannot be obtained as single particles in the plating solution, or even if the fine particles are aggregated. If not, all the fine particles were not plated uniformly, and the thickness of the plating layer was sometimes non-uniform.
[0008]
In addition, when the core fine particles to be plated are relatively light in specific gravity in which a thin conductive layer is formed on the surface of the resin or the resin fine particles, some of the core fine particles float during rotation of the barrel, and the cathode fine particles are suspended. There is also a problem that a bipolar phenomenon occurs due to separation from the substrate and plating may not be performed. The bipolar phenomenon refers to a case where the contact force between the object to be plated and the cathode is weak, or a case where a large number of objects to be plated deviate from a state of being settled as one settled down in the barrel in barrel plating. When a current is applied to the substrate, the floating plating object is polarized, and the coating is dissolved from a positively charged portion.
[0009]
As a method for solving these problems, there is provided a rotatable dome having a cathode on an outer peripheral portion and having a filter portion for allowing a plating solution to pass therethrough and an anode provided inside the dome so as not to contact the cathode. There has been reported a method of plating fine particles using a rotary plating apparatus that repeats energization and stirring by bringing fine particles into contact with a cathode by the effect of centrifugal force due to rotation of the dome (for example, see Patent Document 3). According to this method, it is known that fine particles are less agglomerated than in ordinary barrel plating and plating can be performed uniformly.
[0010]
However, even when a rotary plating apparatus as disclosed in Patent Document 3 is used, agglomeration occurs when the particle diameter of the base material (fine particles to be treated) decreases and the thickness of the plating layer increases. In particular, when the substrate particle diameter was 100 μm or less and the thickness of the plating layer was 1 μm or more, it was almost impossible to plate all the fine particles in a single particle state. This is because in a conventional rotary plating apparatus, the rotation and stop of the dome portion are repeated to prevent aggregation of the base particles, but the particle diameter of the base particles is reduced, so that the effect of crushing the aggregation is reduced. It is thought to be. In addition, it is also considered that the plating proceeds while the base particles are sandwiched between the small gaps in the dome portion due to the small particle diameter of the base particles, which is one of the causes of the aggregation.
[0011]
In order to prevent such agglomeration, a method is known in which dummy particles such as stainless steel and zirconia are added and plating is performed while giving a crushing effect. Collides violently with the base particles, so that the resulting conductive fine particles are subject to peeling or cracking of the plating, resulting in a problem that the surface state is greatly deteriorated.
[0012]
[Patent Document 1]
JP-A-11-74311
[Patent Document 2]
JP-A-5-36306
[Patent Document 3]
JP-A-9-137289
[0013]
[Problems to be solved by the invention]
In view of the above, the present invention can suppress the aggregation of fine particles when forming a metal layer on the surface of magnetic fine particles, and can form a metal having an extremely uniform thickness without flaws or peeling on the surface. It is an object of the present invention to provide an apparatus for producing conductive fine particles suitable for producing conductive fine particles having a layer, and a method for producing conductive fine particles using the apparatus for producing conductive fine particles.
[0014]
Means for Solving the Invention
In order to solve the above problems, the present invention is an apparatus for producing conductive fine particles that forms a metal layer on the surface of fine particles having magnetism, at least one of a flat plate-like body and one of the plate-like bodies. And a metal layer forming means for forming a metal layer on the surface of the fine particles having magnetism, wherein the magnet moves in a direction parallel to the surface of the plate-like body. The magnetic fine particles are adsorbed and arranged by the magnetic force of the magnet on the opposite surface of the plate-shaped body on the side opposite to the side where the magnet is arranged. This is an apparatus for producing conductive fine particles.
Hereinafter, the present invention will be described in detail with reference to the drawings.
[0015]
FIG. 1A is a plan view schematically showing one example of a plate-like body portion of the apparatus for producing conductive fine particles of the present invention, and FIG. 1B is a plan view of the apparatus for producing conductive fine particles shown in FIG. It is sectional drawing of a plate-shaped body part. FIG. 2A is a plan view schematically showing a state in which fine particles are adsorbed and arranged on a plate-like body of the apparatus for producing conductive fine particles shown in FIG. 1, and FIG. FIG. 2 is a cross-sectional view of an apparatus for producing conductive fine particles shown in FIG.
[0016]
In the plate-like body portion 10 of the apparatus for producing conductive fine particles of the present invention shown in FIGS. 1A and 1B, the axial direction of the plate-like body 12 is The rotation shaft 13 is disposed so that the center thereof overlaps with the center of the plate-shaped body 12 in a direction perpendicular to the surface of the rotation shaft 13. A plurality of fixed shafts 14 are attached at equal intervals and extend in a direction parallel to the surface of the plate-shaped body 12, and the magnet 11 is fixed to an end of the fixed shaft 14 on the opposite side of the rotation shaft 13. I have. In the plate portion 10 of the apparatus for producing conductive fine particles of the present invention, the magnet 11 can be moved so as to rotate in a direction parallel to the plane of the plate 12 by rotating the rotating shaft 13. It has become.
[0017]
As shown in FIGS. 2A and 2B, in the plate-like body portion 10 of the apparatus for producing conductive fine particles of the present invention, the fine particles 15 having magnetism are the side surfaces of the plate-like body 12 where the magnets 11 are arranged. Are attracted and arranged by the magnetic force of the magnet 11 on the opposite surface of the plate-like body 12 by moving the magnet 11 so as to rotate in a direction parallel to the plane of the plate-like body 12. It can be moved while rotating around the surface of the.
[0018]
Although not shown in FIGS. 1 and 2, the apparatus for producing conductive fine particles of the present invention is further provided with a metal layer forming means for forming a metal layer on the surface of the fine particles 15. By the metal layer forming means, a metal layer can be formed on the surface of the fine particles 15 while rotating and moving the fine particles 15 around the surface of the plate-shaped body 12.
[0019]
The apparatus for producing conductive fine particles of the present invention has a flat plate-like body.
The plate-like body can adsorb and arrange fine particles having magnetism on a surface opposite to the side on which the magnet is disposed by a magnetic force of a magnet disposed on one surface side by a magnetic force of a magnet described later. .
The shape of the plate-like body is not particularly limited as long as it is a flat plate. For example, in addition to a donut shape such as the plate-like body 12 shown in FIGS. Is mentioned.
[0020]
As a material for forming the plate-like body, the magnetic force of a magnet arranged on one surface side of the plate-like body attracts magnetic fine particles on the opposite surface of the plate-like body on the side where the magnet is arranged. There is no particular limitation as long as it can be arranged. For example, when used as a cathode of a plating apparatus, conductive, non-magnetic metal materials such as copper, brass, stainless steel, titanium, and aluminum can be used. When a metal layer forming means other than plating is used, other than the above, for example, plastic such as acrylic resin and epoxy resin, rubber, ceramic and the like can be mentioned.
[0021]
The apparatus for producing conductive fine particles of the present invention has a magnet on one surface side of the plate-like body. The magnet can attract and arrange magnetic fine particles on the opposite side of the surface of the plate-like body facing the magnet by the magnetic force.
[0022]
The magnet is arranged so as to be movable in a direction parallel to the surface of the plate-like body. The direction of movement of the magnet is not limited to the direction of rotation on the surface of the plate as shown in FIGS. 1 and 2 as long as it is parallel to the surface of the plate. For example, as shown in FIG. The magnet 31 may be arranged so that the magnet 31 slides vertically or horizontally, or vertically and horizontally on one surface side of the plate-shaped body 32. FIG. 3 is a cross-sectional view schematically showing another example of the plate-like body portion of the apparatus for producing conductive fine particles of the present invention. In FIG. 3, the magnet 31 moves in the left-right direction of the plate-like body 32. The fine particles 35 also move while rotating in the left-right direction on the surface of the plate-shaped body 32 opposite to the side where the magnets 31 are arranged.
[0023]
FIG. 4 is a cross-sectional view schematically showing still another example of the plate-like body portion of the apparatus for producing conductive fine particles of the present invention.
As shown in FIG. 4, in the plate-shaped body portion 40, a conveyor 43 in which magnets 41 are arranged at predetermined intervals on a belt 44 is arranged on one surface side of the plate-shaped body 42. By driving, the magnet 41 may be continuously moved from one end of the plate-shaped body 42 to the other end. In this case, a particle supply pipe 46 is provided above the vicinity of one end of the plate-like body 42, and the fine particles 45 are supplied from the particle supply pipe 46 to the vicinity of one end of the plate-like body 42 and are conveyed by the conveyor 43. The fine particles 45 can be moved while rotating to near the other end of the plate-like body 42 with the movement of the magnet 41. The fine particles 45 moved to the other end of the plate-like body 42 fall from the other end of the plate-like body 42 and pass through a particle collecting pipe 47 provided below the other end of the plate-like body 42. Can be recovered. In this manner, by rotating and moving the fine particles 45 from one end to the other end on the surface of the plate-like body 42, a process of forming a metal layer on the surface of the fine particles 45 can be continuously performed. .
[0024]
The magnetic force of the magnet is not particularly limited, and is appropriately determined in consideration of the material and thickness of the plate-like body, the weight and quantity of the magnetic fine particles to be adsorbed, and the like. Further, an electromagnet may be used as a magnetic force generation source, and the magnetic force may be adjusted by a current.
[0025]
The moving speed of the magnet is determined according to the particle diameter of the fine particles, the type and forming conditions of the metal layer formed on the surface of the fine particles, and the speed at which the fine particles can form the metal layer without agglomeration. Select as appropriate.
[0026]
The apparatus for producing conductive fine particles of the present invention has a metal layer forming means for forming a metal layer on the surface of the magnetic fine particles.
In the apparatus for producing conductive fine particles of the present invention, examples of the metal layer forming means include a vapor deposition apparatus, a sputtering apparatus, and an ion plating apparatus.
[0027]
FIG. 5 is a cross-sectional view schematically showing one example of an apparatus for producing conductive fine particles of the present invention when the metal layer forming means is a vapor deposition apparatus.
When the metal layer forming means is a vapor deposition apparatus as shown in FIG. 5, the apparatus 50 for producing conductive fine particles of the present invention includes the plate-shaped body portion 10 shown in FIGS. The evaporating source 51 including the evaporating substance 52 is disposed so as to adsorb the fine particles of the plate-shaped body of the plate-shaped body portion 10 and face the arranged surface. In addition, the plate-like body part 10 may be the plate-like body part 30 or the plate-like body 40 shown in FIG. 3 or FIG.
An apparatus 50 for producing conductive fine particles shown in FIG. 5 has a structure similar to that of a known vapor deposition apparatus (vacuum vapor deposition apparatus) except that the apparatus uses the plate-shaped body portion 10.
[0028]
FIG. 6 is a perspective view schematically showing an example of the apparatus for producing conductive fine particles of the present invention when the metal layer forming means is a sputtering apparatus.
As shown in FIG. 6, when the metal layer forming means is a sputtering device, the apparatus 60 for producing conductive fine particles of the present invention uses the plate-like fine particles of the plate-like body portion 10 shown in FIGS. A plurality of cathodes 61 are arranged so as to face the surfaces arranged by suction. In addition, the plate-like body part 10 may be the plate-like body part 30 or the plate-like body 40 shown in FIG. 3 or FIG.
The apparatus 60 for producing conductive fine particles shown in FIG. 6 has a structure similar to that of a known sputtering apparatus except that the apparatus uses the plate-shaped body portion 10.
[0029]
FIG. 7 is a cross-sectional view schematically showing an example of the apparatus for producing conductive fine particles of the present invention when the metal layer forming means is an ion plating apparatus.
When the metal layer forming means is an ion plating apparatus as shown in FIG. 7, the apparatus 70 for producing conductive fine particles of the present invention includes a plate-like body 10 shown in FIGS. Is disposed on the side of the plate-shaped body portion 10 where the magnet is disposed, and the cathode 72 connected to the wiring 77 penetrating the inside of the insulating glass tube 73 is provided, and the plate-shaped fine particles are adsorbed and arranged. The evaporating filament 71 connected to the wiring 78 penetrating the inside of the insulating glass tube 730 is disposed so as to face the surface. The wiring 77 connected to the cathode 72 is connected to a high-voltage power supply 75 outside the container 76, and the wiring 78 connected to the evaporating filament 71 is connected to a low-voltage power supply 74 for the filament outside the container 76. . The plate portion 10 may be the plate 30 or the plate 40 shown in FIG. 3 or FIG.
An apparatus 70 for producing conductive fine particles shown in FIG. 7 has a structure similar to that of a known ion plating apparatus except that the apparatus uses the plate-like body portion 10.
[0030]
Further, an example of the metal layer forming means is an electroplating apparatus.
In the apparatus for producing conductive fine particles of the present invention, when the metal layer forming means is an electroplating apparatus, the plate-like body serves as a cathode.
[0031]
When the metal layer forming means is an electroplating apparatus, the apparatus for producing conductive fine particles of the present invention has a structure in which a cathode part in a known electroplating apparatus is replaced with a plate-shaped body part having the structure shown in FIGS. One.
[0032]
FIG. 8 is a cross-sectional view schematically showing an example of the apparatus for producing conductive fine particles of the present invention when the metal layer forming means is an electroplating apparatus.
As shown in FIG. 8, when the metal layer forming means is an electroplating apparatus, the apparatus 80 for producing conductive fine particles of the present invention functions as a cathode on the inner wall of a plating tank 87 containing a plating solution 88. A plate 82 is disposed, and an anode 86 is disposed at a position facing the plate 82 inside the plating tank 87, and the anode 86 is disposed outside the wall surface of the plating tank 87 on which the plate 82 is disposed. A magnet 81 movable in a direction parallel to the wall surface is provided. Fine particles 85 having magnetism are adsorbed and arranged by the magnetic force of the magnet 81 on the surface of the plate body 82 on the plating solution 88 side.
That is, the plate-like body portion composed of the magnet 81 and the plate-like body 82 in the apparatus 80 for producing conductive fine particles has substantially the same structure as the plate-like body portion 10 shown in FIGS. The plate-like body 82 is not arranged so as to face directly like the magnet 11 and the plate-like body 12 of the plate-like body portion 10, but is arranged so as to face through the wall of the plating tank 87. I have. Note that the magnet 81 and the plate-shaped body 82 may be arranged to face each other via the bottom of the plating tank 87. Further, the magnet 81 may be submerged in the plating solution without passing through the wall of the plating tank 87.
Further, the plate-like body portion composed of the magnet 81 and the plate-like body 82 in the apparatus 80 for producing conductive fine particles may have substantially the same structure as the plate-like body portion having the structure shown in FIGS.
[0033]
FIG. 9 is a cross-sectional view schematically showing another example of the apparatus for producing conductive fine particles of the present invention when the metal layer forming means is an electroplating apparatus.
When the metal layer forming means is an electroplating apparatus as shown in FIG. 9, the apparatus 90 for producing conductive fine particles of the present invention has a structure shown in FIG. 4 near the bottom of a plating tank 97 containing a plating solution 98. Are disposed, and the anode 96 is disposed above the plate-shaped body of the plate-shaped body portion 40. According to the manufacturing apparatus 90 for the conductive fine particles having the above structure, the electroplating process for forming a metal layer on the surface of the fine particles can be continuously performed.
[0034]
In the apparatus for producing conductive fine particles of the present invention, the magnetic fine particles adsorbed and arranged on the surface of the plate-like body are not particularly limited, and, for example, a metal underlayer is formed on the surface of the base particles. And fine metal particles having magnetism.
[0035]
The material constituting the base particles is not particularly limited, and includes, for example, polystyrene, polystyrene copolymer, polyacrylate, polyacrylate copolymer, phenol resin, silicone resin, polyamide resin, polyester resin, and polystyrene. Examples thereof include resin materials such as vinyl chloride, and metal materials such as copper.
[0036]
The material constituting the metal underlayer is not particularly limited, and examples thereof include nickel, iron, and cobalt. The metal base layer can be formed by plating the surface of the base particles by an electroless plating method or the like.
[0037]
The material constituting the magnetic fine particles having magnetism is not particularly limited, and examples thereof include metals such as iron, nickel, and cobalt, and alloys thereof.
The magnetic fine particles may be those obtained by coating the surface of the magnetic fine metal particles with a resin or a non-magnetic metal.
[0038]
The particle size of the magnetic fine particles is not particularly limited, but preferably has a lower limit of 1 μm and an upper limit of 1000 μm. When it is less than 1 μm, when forming a metal layer on the surface of the magnetic fine particles using the apparatus for producing conductive fine particles of the present invention, it is difficult to treat all magnetic fine particles as single particles. In some cases, aggregation may occur. If it exceeds 1,000 μm, the metal layer formed on the surface of the magnetic fine particles using the apparatus for producing conductive fine particles of the present invention may be cracked and easily peeled off from the magnetic fine particles. Further, the number of magnetic fine particles that can be arranged per unit surface area of the plate-like body becomes extremely small, which is uneconomical. The particle diameter of the magnetic fine particles has a lower limit of preferably 5 μm and an upper limit of 500 μm, more preferably a lower limit of 10 μm and an upper limit of 300 μm, most preferably a lower limit of 10 μm and an upper limit of 100 μm. preferable.
[0039]
The material constituting the metal layer formed on the surface of the magnetic fine particles by the apparatus for producing conductive fine particles of the present invention is not particularly limited. For example, gold, silver, copper, platinum, zinc, iron, lead, Examples include metals such as tin, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, germanium, cadmium, and silicon, and alloys, nitrides, oxides, and carbides thereof.
The metal layer made of the above-mentioned material may be formed as a single layer of one kind of material on the surface of the magnetic fine particles, or may be formed as two or more layers of two or more kinds of materials.
[0040]
The lower limit of the thickness of the metal layer formed on the surface of the magnetic fine particles is preferably 0.02 μm, and the upper limit thereof is preferably 100 μm. When the thickness is less than 0.02 μm, conductive fine particles having desired conductivity may not be obtained. When the thickness exceeds 100 μm, connection between a semiconductor chip, an electronic component, or the like and a substrate is performed using the obtained conductive fine particles. If it does, the effect of relaxing the strain stress caused by the difference between the two coefficients of linear expansion may not be obtained. The lower limit of the thickness of the metal layer is more preferably 0.1 μm, and the upper limit is more preferably 50 μm, and the lower limit is more preferably 1 μm and the upper limit is 30 μm.
[0041]
The apparatus for producing conductive fine particles according to the present invention is configured such that the magnetic force of a magnet arranged on one surface side of the plate-like body so as to be movable in a direction parallel to the surface of the plate-like body, The magnetic fine particles are adsorbed on the surface opposite to the side where the magnet is arranged, and the magnetic fine particles can be adsorbed and arranged, so that the magnetic fine particles are rotated on the surface of the plate-like body in accordance with the movement of the magnet, It can be moved, and the rotation and movement of the magnetic fine particles can be suitably controlled.
Therefore, when a metal layer is formed on the surface of magnetic fine particles using the apparatus for producing conductive fine particles of the present invention, even if the magnetic fine particles have a very small particle size of 100 μm or less, During the formation of the metal layer, the magnetic fine particles hardly agglomerate, and the conductive fine particles having the metal layer with a uniform thickness formed on the surface thereof can be obtained in a single particle state. Of course, the obtained conductive fine particles hardly cause peeling or cracking of the metal layer.
A method for producing conductive fine particles using the apparatus for producing conductive fine particles of the present invention is also one of the present invention.
[0042]
The method for producing conductive fine particles of the present invention is a method for producing conductive fine particles using the apparatus for producing conductive fine particles of the present invention, wherein the magnetic force of a magnet arranged on one surface side of the plate-like body is used to produce the conductive fine particles. Step 1 of adsorbing and arranging magnetic fine particles on the opposite side of the plate-like body on which the magnet is arranged, and moving the magnet in a direction parallel to the surface of the plate-like body to obtain the magnetic property A step of forming a metal layer on the surface of the magnetic fine particles by a metal layer forming means while rotating and moving the fine particles having the above on the surface of the plate-like body.
[0043]
In step 1 of the method for producing conductive fine particles of the present invention, the magnets of the plate-like body are arranged by the magnetic force of the magnets disposed on one side of the plate-like body of the apparatus for producing conductive fine particles of the present invention. The magnetic fine particles are adsorbed and arranged on the surface opposite to the side on which the magnetic particles are applied.
[0044]
In this step 1, in order to prevent the magnetic fine particles from aggregating on the surface of the plate-like body, the magnetic fine particles are made of the plate-like body like the fine particles 15 shown in FIG. It is preferable to make a single layer adsorb and arrange on the surface.
The method of adsorbing the magnetic fine particles in a single layer on the surface of the plate-like body is not particularly limited, and, for example, after spraying the magnetic fine particles on the surface of the plate-like body, An arbitrary method such as a method of shaking the plate-like body to shake off the superposed fine particles having magnetism may be mentioned. In step 2 described below, the magnet is moved in a direction parallel to the surface of the plate-like body. By rotating the fine particles having the magnetism on the surface of the plate-like body, the overlapping fine particles having the magnetism are dropped, and the fine particles having the magnetism are formed into a single layer on the surface of the plate-like body. It can also be adsorbed and arranged. In addition, even if they overlap, by controlling the magnetic force, the rotation and movement speed of the magnet, and the formation speed of the metal layer, the fine particles having individual magnetism can be rotated and moved while replacing their respective locations, resulting in agglomeration. The metal layer can be formed without performing.
[0045]
In step 2 of the method for producing conductive fine particles of the present invention, the magnet is moved in a direction parallel to the surface of the plate, so that the magnetic fine particles are rotated and moved on the surface of the plate. Let it.
The direction in which the magnetic fine particles are rotated and moved on the surface of the plate-like body is determined by the structure of the plate-like body portion in the apparatus for producing conductive fine particles of the present invention. That is, when the plate-like body portion has a structure like the plate-like body portion 10 shown in FIGS. 1 and 2, the magnetic fine particles rotate while rotating around the surface of the plate-like body. When the plate-like body portion moves and has a structure like the plate-like body portion 30 shown in FIG. 3, the fine particles having magnetism move vertically or horizontally, or vertically on the surface of the plate-like body. When the plate-like portion has a structure like the plate-like portion 40 shown in FIG. 4 while moving in the left-right direction while rotating, the fine particles having magnetism will have one end on the surface of the plate-like body. To move to the other end while rotating.
[0046]
In the method for producing conductive fine particles of the present invention, a metal layer is formed on the surface of the magnetic fine particles by the metal layer forming means while rotating and moving the magnetic fine particles on the surface of the plate.
Examples of the metal layer forming means include a vapor deposition device, a sputtering device, an ion plating device, or an electroplating device, as described in the device for producing conductive fine particles of the present invention.
[0047]
In the method for producing conductive fine particles of the present invention, when the metal layer forming means is a vapor deposition device, a sputtering device or an ion plating device, a method for forming a metal layer on the surface of the magnetic fine particles includes a vapor deposition method. , Sputtering method or ion plating method.
As the vapor deposition method, sputtering method or ion plating method, a known vapor deposition method, sputtering method or ion plating method is used, in addition to using the apparatus for producing the conductive fine particles of the present invention having the structure shown in FIGS. No.
[0048]
When the metal layer forming means is an electroplating apparatus, examples of a method for forming a metal layer on the surface of the magnetic fine particles include an electroplating method.
As the above-mentioned electroplating method, a structure in which a cathode portion of a known electroplating apparatus is replaced with a plate-like body portion shown in FIGS. 1 to 4 or a conductive fine particle of the present invention having a structure shown in FIG. Other than using the manufacturing apparatus, a known electroplating method may be used.
[0049]
The method for producing conductive fine particles of the present invention is performed using the apparatus for producing conductive fine particles of the present invention. Therefore, the rotation and movement of each of the magnetic fine particles on the surface of the plate-like body during the formation of the metal layer can be controlled by the movement of the magnet, and the particle diameter of the magnetic fine particles is as very small as 100 μm or less. Even when the fine particles having magnetism are hardly agglomerated during the formation of the metal layer, the conductive fine particles having a uniform thickness of the metal layer formed on the surface thereof are in a single particle state. Can be obtained at Of course, the obtained conductive fine particles hardly cause peeling or cracking of the metal layer.
[0050]
【Example】
Using the apparatus for producing conductive fine particles of the present invention, when a metal layer was formed on the surface of magnetic fine particles by the method for producing conductive fine particles of the present invention, the magnetic fine particles did not aggregate, The conductive fine particles on which the metal layer having a uniform thickness was formed could be manufactured in a single particle state.
[0051]
【The invention's effect】
Since the present invention has the above configuration, when forming a metal layer on the surface of the magnetic fine particles, the aggregation of the magnetic fine particles can be suppressed, and the surface is extremely uniform without scratches or peeling off. It is possible to provide an apparatus for producing conductive fine particles suitable for producing conductive fine particles having a metal layer having a large thickness, and a method for producing conductive fine particles using the apparatus for producing conductive fine particles.
[Brief description of the drawings]
FIG. 1 (a) is a plan view schematically showing an example of a plate-like body portion of an apparatus for producing conductive fine particles of the present invention, and FIG. 1 (b) is a plan view of the production of conductive fine particles shown in FIG. It is sectional drawing of the plate-shaped body part of an apparatus.
FIG. 2A is a plan view schematically showing a state in which fine particles are adsorbed and arranged on a plate-like body of the apparatus for producing conductive fine particles shown in FIG. 1, and FIG. FIG. 2 is a cross-sectional view of an apparatus for producing conductive fine particles shown in FIG.
FIG. 3 is a cross-sectional view schematically showing another example of the plate-like body portion of the apparatus for producing conductive fine particles of the present invention.
FIG. 4 is a cross-sectional view schematically showing still another example of the plate-like body portion of the apparatus for producing conductive fine particles of the present invention.
FIG. 5 is a cross-sectional view schematically showing one example of an apparatus for producing conductive fine particles of the present invention when the metal layer forming means is an evaporation apparatus.
FIG. 6 is a perspective view schematically showing one example of an apparatus for producing conductive fine particles of the present invention when the metal layer forming means is a sputtering apparatus.
FIG. 7 is a cross-sectional view schematically showing an example of the apparatus for producing conductive fine particles of the present invention when the metal layer forming means is an ion plating apparatus.
FIG. 8 is a cross-sectional view schematically showing one example of an apparatus for producing conductive fine particles of the present invention when the metal layer forming means is an electroplating apparatus.
FIG. 9 is a cross-sectional view schematically showing another example of the apparatus for producing conductive fine particles of the present invention when the metal layer forming means is an electroplating apparatus.
[Explanation of symbols]
10, 30, 40 plate-like body part
11, 31, 41, 81 magnet
12, 32, 44, 82 plate-like body
13 Rotation axis
14 Fixed axis
15, 35, 45, 85 Fine particles
43 Conveyor
44 belt
46 Particle supply pipe
47 Particle discharge pipe
50 Evaporation equipment
51 evaporation source
52 evaporating substances
53 containers
60 sputtering equipment
61 Cathode
70 Ion plating equipment
71 Evaporation filament
72 cathode
73,730 Insulated glass tube
74 Low voltage power supply for filament
75 High voltage power supply
76 containers
77, 78 wiring
80, 90 Electroplating equipment
86, 96 anode
87, 97 Plating tank
88, 98 Plating solution

Claims (7)

An apparatus for producing conductive fine particles that forms a metal layer on the surface of magnetic fine particles,
At least, a flat plate-shaped body, a magnet disposed on one surface side of the plate-shaped body, and a metal layer forming means for forming a metal layer on the surface of the magnetic fine particles,
The magnet is arranged so as to be movable in a direction parallel to the plane of the plate-like body, and the fine particles having magnetism are arranged on a surface of the plate-like body opposite to the side where the magnet is arranged. An apparatus for producing conductive fine particles, which is attracted and arranged by the magnetic force of the magnet. The apparatus for producing conductive fine particles according to claim 1, wherein the metal layer forming means is a vapor deposition apparatus, a sputtering apparatus, or an ion plating apparatus. 2. The apparatus according to claim 1, wherein the metal layer forming means is an electroplating apparatus, and the plate is a cathode. A method for producing conductive fine particles using the apparatus for producing conductive fine particles according to claim 1, 2, or 3,
A step 1 of adsorbing and arranging magnetic fine particles on a surface of the plate-shaped body opposite to the side where the magnets are disposed by a magnetic force of a magnet disposed on one surface side of the plate-shaped body;
By moving the magnet in a direction parallel to the surface of the plate, the magnetic fine particles are rotated and moved on the surface of the plate while the surface of the magnetic fine particles is formed by the metal layer forming means. And a step 2 of forming a metal layer on the substrate. 5. The method for producing conductive fine particles according to claim 4, wherein a metal layer is formed on the surfaces of the magnetic fine particles by a vapor deposition method, a sputtering method, or an ion plating method. The method for producing conductive fine particles according to claim 4, wherein a metal layer is formed on the surface of the magnetic fine particles by an electroplating method. 7. The method for producing conductive fine particles according to claim 3, wherein the fine particles having magnetism have a particle diameter of 1 to 1000 [mu] m.

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