CN217641268U - Manufacturing system of anisotropic conductive adhesive - Google Patents

Abstract

The utility model relates to a system for making of anisotropic conducting resin, it contains: the device comprises a transmission unit, a wafer feeding unit, a conductive particle spreading unit, a conductive particle removing unit, a magnetic attraction device, a glue film output device and an attaching unit, and is used for manufacturing continuous anisotropic conductive glue. The utility model discloses a magnetism is inhaled the device and is produced the electrically conductive core body that magnetic force attracts conductive particle for conductive particle leaves and adsorbs on the rendition surface of rendition base plate after the storage tank, realizes rendition conductive particle under the condition of contactless wafer, forms continuous type anisotropic conducting resin, especially adapted bulk production.

Description

Manufacturing system of anisotropic conductive adhesive

Technical Field

The utility model relates to a manufacturing system of continuous type anisotropic conductive adhesive especially utilizes to be provided with a plurality of storage tanks that are array arrangement on the wafer, supplies the conductive particle holding in the storage tank, produces the conductive core body that magnetic force attracts conductive particle through magnetism device simultaneously, the rendition conductive particle under the condition of contactless wafer, therefore reaches the arrangement according to the storage tank and settles conductive particle in order to make continuous type anisotropic conductive adhesive's purpose.

Background

With the progress of the electronic industry and semiconductor technology, many terminal electronic products have been increasingly powerful in function, and are also required to be light, thin, short, and small in appearance, so as to improve the practicability.

Taking a conventional display using a cathode ray tube as an example, not only takes up too much valuable desktop space, but also is relatively heavy and consumes too much power, especially for a large-sized display. In recent years, liquid Crystal Displays (LCDs) manufactured by advanced electronic and semiconductor technologies have been almost completely replaced by cathode ray tube displays because they can be greatly reduced in weight and also reduced in overall size.

Taking a smart phone as an example, the smart phone not only improves portability, has the functions of communication and mutual short message transmission, but also can photograph images and play high-quality films, has strong power saving efficiency, greatly prolongs the cruising ability of a battery, is almost the common degree of one machine of hands at present, and is regarded as the most successful consumer electronic product.

The above-described electronic products all require electrical connection of the various electronic components to the electronic circuitry on the circuit board. Conventionally, even a lead-tin alloy solder with low melting temperature and better conductivity is used for soldering, the process of using solder for soldering cannot satisfy the requirements of being light, thin, short and small, especially for electronic components of Integrated Circuits (ICs) with greatly reduced dimensions. Although Surface Mount Device (SMD) technology can address the size reduction challenges, high temperature furnaces are required to speed up the soldering process, thereby increasing throughput and creating a potential risk of damage to electronic components.

Therefore, anisotropic Conductive Film (ACF) has been developed for use in Chip On Glass (COG) or Chip On Film (COF) processes, wherein the ACF is utilized to achieve electrical connection in a specific direction, such as vertical direction for electrical conduction and horizontal direction for electrical conduction. For example, the pins of the Driver IC (Driver IC) can be connected to each pixel of the panel, so as to meet the requirement of Fine Pitch of the display panel.

In short, the anisotropic conductive film is formed by combining resin and conductive particles (or conductive powder), and can be used to connect two different substrates and circuits, and the anisotropic conductive film has the characteristics of electrical conduction up and down (Z axis), and the left and right planes (X and Y axes) have insulation, so that the separated conductive particles can be contacted with each other under heating and external pressure treatment in the Z axis direction to achieve the purpose of electrical conduction in the Z axis direction and electrical insulation in the plane direction, and the short circuit of adjacent pins can be avoided.

In the prior art of fabricating anisotropic conductive films, a plurality of conductive particles are embedded in a non-conductive adhesive film, and each conductive particle includes an insulating film and a conductive core, wherein the insulating film covers the outer surface of the conductive core. When the conductive film is used, the electronic component or the circuit to be connected is placed on the upper side and the lower side of the anisotropic conductive film, and then the anisotropic conductive film is extruded by applying an upper external force and a lower external force, so that the insulating film of the anisotropic conductive film is broken to expose the coated conductive core body, and the electronic component or the circuit is in contact with the conductive core body to achieve the purpose of electric conduction. Since the adjacent conductive particles can be arranged very close to each other, the fine pitch requirement can be satisfied.

Further, the conductive particles are embedded in the non-conductive adhesive film and arranged in a proper dispersion manner, generally by using a transfer printing technique, such as first placing the conductive particles on a configuration disk or a configuration film, wherein the configuration disk or the configuration film has a plurality of cavities with a specific arrangement manner for accommodating the conductive particles, then attaching the non-conductive adhesive film to cover the conductive particles, removing the configuration disk or the configuration film, and finally attaching another non-conductive adhesive film to cover the conductive particles, thereby embedding all the conductive particles.

However, the conventional techniques have a drawback in that the adhesion force of the cavities of the configuration disk or the configuration film to the conductive particles is not easily controlled, so that when the configuration disk or the configuration film is removed, some conductive particles still adhere to the configuration disk or the configuration film without transferring to the non-conductive adhesive film, thereby affecting the overall electrical connection function of the anisotropic conductive adhesive. In addition, the configuration disk or the configuration film of the prior art generally transfers the conductive particles in a contact manner, which causes residual adhesive to be easily left on the configuration disk or the configuration film, so that the quality of the anisotropic conductive adhesive is poor, and the configuration disk or the configuration film must be frequently replaced or cleaned, which increases the cost and is very inconvenient.

In view of the above disadvantages, the inventor aims at the disadvantages to study and improve the disadvantages, and finally, the invention is produced.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a system for manufacturing anisotropic conductive adhesive, which is provided with a plurality of receiving grooves on the wafer, and the receiving grooves are arranged in several arrays, so that the adjacent conductive particles are configured to be very close to each other, thereby satisfying the requirement of fine spacing. In addition, through the electrically conductive core body that magnetism device production magnetic force attracted conductive particle for conductive particle leaves the transfer-printing surface that adsorbs the transfer-printing base plate behind the storage tank, realizes the transfer-printing conductive particle under the condition of contactless wafer, forms the anisotropic conducting resin of continuous type, and especially adapted bulk production uses and solves above-mentioned prior art all problems.

To achieve the above objects and effects, the present invention provides a system for manufacturing anisotropic conductive adhesive, which comprises: the transmission unit comprises a plurality of rollers, a driver and a transmission belt, wherein the rollers are linked to the driver and roll under the driving of the driver, and the transmission belt is driven by the rollers to move towards an advancing direction; a wafer feed-in unit for feeding a wafer into the transmission belt, wherein the wafer is provided with a plurality of accommodating grooves which are arranged in an array; the conductive particle spreading unit is used for accommodating a plurality of conductive particles, the wafer on the transmission belt is driven by the roller wheel to move from the wafer feed-in unit to the conductive particle spreading unit, the conductive particle spreading unit continuously sprays and releases partial conductive particles to be spread on the wafer, and each accommodating groove at most accommodates one single conductive particle; the conductive particle removing unit is used for removing the redundant conductive particles which are not contained in the containing groove, and the wafer is driven by the roller on the transmission belt and moves to the conductive particle removing unit from the conductive particle spreading unit; the magnetic attraction device comprises at least one substrate output unit, the wafer is driven by the roller on the transmission belt to move to the magnetic attraction device through the conductive particle removing unit, the substrate output unit outputs a transfer substrate, the wafer and the transfer substrate are arranged in parallel, and the magnetic attraction device attracts the conductive core body of the conductive particles through generating a magnetic force, so that the conductive particles are adsorbed on a transfer surface of the transfer substrate after leaving the accommodating groove; a Film output device for outputting a first Non-Conductive Film (NCF), wherein the first Non-Conductive Film is driven by the roller on the conveyor belt and moved by the Film output unit to the magnetic attraction device parallel to the transfer substrate, the magnetic attraction device releases the magnetic force, the Conductive particles are separated from the transfer substrate, and the Conductive particles remain on a pair of attaching surfaces of the first Non-Conductive Film; and the attaching unit comprises at least one first attaching roller, the first non-conductive adhesive film is driven by the roller on the transmission belt to move to the attaching unit through the magnetic attraction device, a second non-conductive adhesive film is attached to the first non-conductive adhesive film through the at least one first attaching roller so as to cover the conductive particles to form a continuous anisotropic conductive adhesive, and the conductive particles are clamped by the second non-conductive adhesive film and the first non-conductive adhesive film to form a configuration mode of single-layer distribution.

Preferably, according to the utility model discloses a system for making anisotropic conducting resin, wherein, this rendition surface of this rendition base plate has the stickness, and this stickness of this pair of surface of this non-conductive glued membrane of this first is greater than the stickness on this rendition surface.

Preferably, according to the utility model discloses a system for making anisotropic conducting resin, wherein, this glued membrane output device further contains: a second attaching unit including at least one second attaching roller that attaches the first nonconductive film to the transfer substrate, the first nonconductive film being attached to the conductive particles left on the transfer substrate by contact; and the de-adhesive stripping unit comprises a winder, the first non-conductive adhesive film is driven by the roller on the conveying belt to move from the second attaching unit to the de-adhesive stripping unit, the transfer printing substrate is wound and stripped by the winder to be separated from the first non-conductive adhesive film, and the conductive particles are left on the first non-conductive adhesive film.

Preferably, according to the utility model discloses a system for making anisotropic conducting resin, wherein, this rendition surface contains a moderate stickness membrane, and this moderate stickness membrane itself has the stickness, and the stickness of this moderate stickness membrane is between 40% to 80% of the stickness of this first non-conductive glued membrane, and this moderate stickness membrane is attached to each other with this facing surface of this first non-conductive glued membrane in this attached step, should cover and contact facing surface conducting particle peels off this conductive glue membrane and separates with this moderate stickness membrane after that, and this conducting particle can remain this facing surface of this conductive glue membrane.

Preferably, according to the present invention, the transfer substrate is made of a non-metallic material selected from one of polycarbonate, polyethylene terephthalate, polymethyl methacrylate, polyimide, and polyethylene naphthalate.

Preferably, according to the present invention, the transfer substrate is made of a metal material selected from one of nickel, copper, aluminum, and zinc.

Preferably, according to the present invention, the containing groove has a width between 1.1 times and 1.9 times of the diameter of the conductive particles.

Preferably, according to the present invention, the containing groove has a depth between 0.5 times and 1.1 times of the diameter of the conductive particles.

Preferably, the system for manufacturing anisotropic conductive adhesive according to the present invention, wherein the driver includes at least one electric motor.

Preferably, according to the present invention, the second film and the first film are made of the same material selected from Polyurethane (PU) and epoxy.

To enable those skilled in the art to understand the objects, features and effects of the present invention, the present invention will be described in detail below with reference to the following specific embodiments and accompanying drawings.

Drawings

Fig. 1 is a system diagram of a system for manufacturing anisotropic conductive adhesive according to the present invention;

fig. 2A-2B are schematic system diagrams illustrating a system for manufacturing anisotropic conductive adhesive according to the present invention;

fig. 3 is a schematic view of a wafer of a system for manufacturing anisotropic conductive paste according to the present invention;

fig. 4 is a further schematic view of a wafer of the system for manufacturing anisotropic conductive film according to the present invention;

fig. 5 is a system diagram of a system for manufacturing anisotropic conductive adhesive according to another embodiment of the present invention;

fig. 6A-6B are schematic system diagrams illustrating a system for manufacturing anisotropic conductive film according to another embodiment of the present invention.

Wherein the reference numerals are as follows:

100 manufacturing system of anisotropic conductive adhesive

10 transmission unit

11: roller

12 drive

13 conveyor belt

20 wafer feed-in unit

21: wafer

211 accommodating groove

30 conductive particle spreading unit

31 accommodating chamber

32 particle spreading port

40 conductive particle removing unit

41 blowing device

42 suction device

50 magnetic attraction device

51 substrate output unit

511 transfer printing substrate

512 transfer surface

60 adhesive film output device

61 facing surfaces

70 first attaching unit

71 first attaching roller

80 second attaching unit

81 second attaching roller

90-debonding adhesive peeling unit

91 winding device

ACF (anisotropic conductive film) -continuous anisotropic conductive adhesive

D forward direction

F is magnetic force

h is depth

NCF1 first non-conductive adhesive film

NCF2 second non-conductive adhesive film

P conductive particles

W is the width

Detailed Description

The inventive concept will now be explained more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the inventive concept are shown. Advantages and features of the present inventive concept, and methods of accomplishing the same, will become apparent from the following more detailed description of exemplary embodiments, as illustrated in the accompanying drawings. It should be noted, however, that the inventive concept is not limited to the following exemplary embodiments, but may be embodied in various forms. Accordingly, the exemplary embodiments are provided solely to disclose and enable those skilled in the art to understand the broad inventive concepts. In the drawings, exemplary embodiments of the inventive concept are not limited to the specific examples provided herein and are exaggerated for clarity.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present.

Similarly, it will be understood that when an element (e.g., a layer, region or substrate) is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, the term "directly" means that there are no intervening components present. It will be further understood that the terms "comprises" and/or "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

Furthermore, exemplary embodiments in the detailed description will be set forth by way of cross-sectional views of idealized exemplary diagrams that are the concepts of the present invention. Accordingly, the shape of the exemplary diagrams may be modified according to manufacturing techniques and/or allowable errors. Accordingly, exemplary embodiments of the present inventive concept are not limited to the specific shapes shown in the exemplary drawings, but may include other shapes that may be produced according to a manufacturing process. The regions illustrated in the figures have the general character, and are intended to illustrate the particular shape of a component. Therefore, this should not be considered as limiting the scope of the inventive concept.

It should also be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, a first component in some embodiments may be referred to as a second component in other embodiments without departing from the teachings of the present invention. Exemplary embodiments of implementations of the inventive concepts illustrated and described herein include their complementary counterparts. Throughout this specification, the same reference numerals or the same indicators denote the same components.

Further, exemplary embodiments are described herein with reference to cross-sectional and/or plan views, which are idealized exemplary illustrations. Accordingly, departures from the illustrated shapes are contemplated as may result, for example, from manufacturing techniques and/or tolerances. Thus, example embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. Thus, the regions illustrated in the figures are schematic and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of exemplary embodiments.

Referring to fig. 1 to 2B, fig. 1 is a system diagram of a system for manufacturing anisotropic conductive adhesive according to the present invention; fig. 2A-2B are schematic diagrams illustrating a detailed system of a system for manufacturing anisotropic conductive adhesive according to the present invention. As shown in fig. 1 to fig. 2B, the system 100 for manufacturing anisotropic conductive adhesive according to the present invention includes: the transfer unit 10, the wafer feeding unit 20, the conductive particle spreading unit 30, the conductive particle removing unit 40, the magnetic attracting device 50, the adhesive film output device 60, and the first attaching unit 70 are used to manufacture a continuous anisotropic conductive film ACF, which is convenient for mass production and can control quality.

Specifically, as shown in fig. 2A-2B, the conveying device 10 includes a plurality of rollers 11 and a driver 12, wherein the rollers 11 are linked to the driver 12, such as via a chain, a gear set or a transmission rod, the rollers 11 are driven by the driver 12 to roll, the transmission belt 13 is driven by the rollers 11 to move in a predetermined advancing direction D, and the transmission belt 13 sequentially enters the wafer feeding unit 20, the conductive particle spreading unit 30, the conductive particle removing unit 40, the magnetic attracting device 50, the adhesive film output device 60 and the first attaching unit 70. For example, the drive 12 may include at least one electric motor.

In addition, the wafer feeding unit 20 feeds a wafer 21 onto the conveyor 13 and moves in the forward direction D, and the wafer 21 is provided with a receiving groove 211. It should be further noted that, in some embodiments, the receiving grooves 211 are particularly configured to be separated without contacting each other, and preferably, the receiving grooves 211 are distributed in an array manner. In addition, each receiving groove 211 may be a circular dot and has a specific area. It should be noted that, in the group type distribution, the lateral distance between two adjacent receiving grooves 211 in the horizontal direction may be the same as or different from the vertical distance between two adjacent receiving grooves 211 in the vertical direction, that is, the lateral distance and the vertical distance may be designed according to actual requirements.

Referring to fig. 3 and 4, fig. 3 is a schematic view of a wafer of a system for manufacturing anisotropic conductive adhesive according to the present invention; fig. 4 is another schematic view of a wafer of a system for manufacturing anisotropic conductive film according to the present invention. As shown in fig. 3 and 4, in some embodiments, the receiving groove 211 of the wafer 21 has a width W between 1.1 times and 1.9 times of the diameter of the conductive particle P, and preferably, the width W is between 1.3 times and 1.8 times of the diameter of the conductive particle P. In some embodiments, the receiving cavity 211 of the wafer 21 has a depth h between 0.5 and 1.1 times the diameter of the conductive particles P, and preferably between 0.5 and 1.1 times the diameter of the conductive particles P. In some embodiments, the receiving cavities 211 of the wafer 21 have a predetermined distance L therebetween, and the predetermined distance L is between 1 and 5 times the diameter of the conductive particles P, and preferably between 2 and 3 times the diameter of the conductive particles P. Therefore, the utility model discloses a wafer 21 prevents the unnecessary conductive particle P of the repeated holding of storage tank through the size of adjustment storage tank to guarantee that unnecessary conductive particle P is removed in subsequent conductive particle removes unit 40, promote the utility model discloses a quality of the anisotropic conductive adhesive of the continuous type of anisotropic conductive adhesive manufacturing system output, and easy to carry out, especially adapted bulk production.

Specifically, as shown in fig. 2A-2B, the conductive particle spreading unit 30 is used to accommodate a plurality of conductive particles P, the wafer 21 on the conveyor 13 is driven by the roller 11 to move from the wafer feeding unit 20 to the conductive particle spreading unit 30, and the conductive particle spreading unit 30 continuously sprays the released portion of the conductive particles P to spread on the wafer 21, and particularly, each accommodating groove 211 accommodates only one conductive particle P at most.

Each of the conductive particles P has an outer diameter and includes an insulating film and a conductive core (not shown), wherein the insulating film covers an outer surface of the conductive core, and the insulating film is configured to be broken by an external force so as to expose the covered conductive core for contact to achieve an anisotropic conductive function.

For example, the conductive particle spreading unit 30 may include a particle accommodating chamber 31 and a particle spreading opening 32, and a plurality of conductive particles P are accommodated in the particle accommodating chamber 31 and spread on the wafer 21 by spraying a released portion of the conductive particles P through the particle spreading opening 32.

Specifically, the wafer 21 on the conveyor belt 13 is driven by the roller 11 to move from the conductive particle spreading unit 30 to the conductive particle removing unit 40, and the conductive particle removing unit 40 removes the excess conductive particles P not accommodated in the accommodating groove 211 of the wafer 21.

For example, as shown in fig. 2A-2B, the conductive particle removing unit 40 may include an air blowing device 41 and a suction device 42, and the excess conductive particles P are blown off from the wafer 21 by the air blowing device 41, and the excess conductive particles P blown off by the air blowing device 41 are collected by the suction device 42 by suction. In addition, the excessive conductive particles P collected by the gettering device 42 may be recovered to the conductive particle spreading unit 30 for spreading.

Another example of the conductive particle removing unit 40 may include a brush (not shown) for removing the excessive conductive particles P by scraping or an air blowing device 41 for blowing the excessive conductive particles P by blowing air.

Specifically, as shown in fig. 2A-2B, the magnetic attraction device 50 may include a substrate output unit 51, the wafer 21 is driven by the roller 11 on the conveyor belt 13 to move from the conductive particle removing unit 40 to the magnetic attraction device 50, and the substrate output unit 51 outputs a transfer substrate 511 parallel to the wafer 21, such that the wafer 21 and the transfer substrate 511 are arranged in parallel, and the magnetic attraction device attracts the conductive core of the conductive particle P by generating a magnetic force F, such that the conductive particle P leaves the accommodating groove 211 and then is attracted to the transfer surface 512 of the transfer substrate 511.

Specifically, the magnetic attracting means 50 may be a means having an electromagnet, wherein the electromagnet is a means that can generate the magnetic force F by an electric current, so as to control the generation of the magnetic force F by the electric current. It should be further noted that the magnitude of the magnetic force F generated by the magnetic attraction device 50 is related to the transfer substrate 511, and it is understood that when the transfer substrate 511 is made of a non-metal material, since the metal material is a non-magnetic conductive material, the magnetic attraction device 50 must generate a strong magnetic force F to attract the conductive core of the conductive particles P, and the magnetic force F may be between gauss and gauss. On the contrary, when the transfer substrate 511 is made of a metal material, since the magnetic permeability of the metal material is better, the magnetic attraction device 50 can generate a weaker magnetic force F to attract the conductive core of the conductive particles P, the magnetic force F can be between 5000 gauss and 3 ten thousand gauss, and preferably, the magnetic force F can be between 1 ten thousand gauss and 2 ten thousand gauss, but the present invention is not limited thereto.

Specifically, in some embodiments, the transfer substrate 511 is made of a non-metal material selected from one of polycarbonate, polyethylene terephthalate, polymethyl methacrylate, polyimide, and polyethylene naphthalate, which has stable chemical properties, good elasticity, and ductility, so that the substrate output unit 51 can be disposed in a tape or reel manner to be continuously drawn out to feed the transfer substrate 511 for subsequent processing, and thus has wide applicability. Specifically, in some embodiments, the transfer substrate 511 is made of a metal material selected from one of nickel, copper, aluminum, and zinc, and the metal material has high magnetic permeability, and under the action of an external magnetic field, the magnetic induction intensity inside the metal material is greatly enhanced, so that the magnetic force F generated by the magnetic attraction device 50 can be effectively conducted to the conductive particles P, stably attract the conductive core of the conductive particles P, and prevent the conductive particles P from falling off, thereby further ensuring the quality of the continuous anisotropic conductive adhesive, which is not limited thereto.

Specifically, as shown in fig. 2A-2B, the film output device 60 is used for outputting a first non-conductive film NCF1, and the first non-conductive film NCF1 is moved from the film output unit 60 to the magnetic attraction device 50 and parallel to the transfer substrate 511 by being driven by the roller 11 on the conveyor belt 13, and further, the magnetic attraction device 50 releases the magnetic force F, the conductive particles P are separated from the transfer substrate 511, and the conductive particles P remain on the attaching surface 61 of the first non-conductive film NCF 1.

Specifically, as shown in fig. 2A-2B, the first attaching unit 70 includes a first attaching roller 71, and the first nonconductive film NCF1 is driven by a roller 11 on the conveyor belt 13 to move from the magnetic attraction device 50 to the first attaching unit 70, and the first attaching roller 71 attaches the second nonconductive film NCF2 to the first nonconductive film NCF1 to cover the conductive particles P to form the continuous anisotropic conductive film ACF, and the conductive particles P are sandwiched by the second nonconductive film NCF2 and the first nonconductive film NCF1 to form a single-layer distribution configuration.

In addition, the manufacturing system of the present invention may further include a collecting unit (not shown) disposed behind the first attaching unit 70 for collecting the continuous anisotropic conductive film ACF, for example, the continuous anisotropic conductive film ACF can be continuously wound on the roller by using a winding method, thereby facilitating subsequent application, processing, and treatment.

For example, the second non-conductive adhesive film NCF2 and the first non-conductive adhesive film NCF1 may be made of the same material, such as Polyurethane (PU) or epoxy resin. Further, the thickness of the first non-conductive adhesive film NCF1 may be 20 to 300 μm, and the thickness of the second non-conductive adhesive film NCF2 may be 20 to 300 μm.

Other examples of anisotropic conductive adhesive manufacturing systems 100 are provided below to make possible variations more clear to those skilled in the art to which the present invention pertains. Components designated by the same reference numerals as in the above-described embodiment are substantially the same as those described above with reference to fig. 1 and 2A-2B. The components, features, and advantages that are the same as those of the conventional anisotropic conductive adhesive manufacturing system 100 will not be described in detail.

Referring to fig. 5 to 6B, fig. 5 is a schematic processing flow chart illustrating a method for manufacturing an anisotropic conductive adhesive according to another embodiment of the present invention; fig. 6A-6B are schematic system diagrams illustrating a method for manufacturing anisotropic conductive adhesive according to another embodiment of the present invention. As shown in fig. 5 to 6B, a method for manufacturing anisotropic conductive adhesive according to another embodiment of the present invention includes: a transmission unit 10, a wafer feeding unit 20, a conductive particle spreading unit 30, a conductive particle removing unit 40, a magnetic attraction device 50, a glue film output device 60, a first attaching unit 70, a second attaching unit 80, and a debonding unit 90.

Specifically, in the embodiment, since the transfer surface 512 of the transfer substrate 511 has viscosity, the conductive particles P will be fixed on the transfer surface 512 after the magnetic attraction device 50 releases the magnetic force F, so as to reduce the risk of falling of the conductive particles P. Specifically, the transfer surface 512 may include a medium-adhesive film (not shown), which has an adhesive property, and the adhesive property of the medium-adhesive film is between 40% and 80% of the original adhesive property of the first non-conductive adhesive film NCF1, that is, the adhesive property of the attaching surface 61 of the first non-conductive adhesive film NCF1 is greater than the adhesive property of the transfer surface 512.

Specifically, as shown in fig. 5 to 6B, the second attaching unit 80 includes a second attaching roller 81, the second attaching roller 81 attaches the first non-conductive adhesive film NCF1 to the transfer substrate 511, and the first non-conductive adhesive film NCF1 is attached to the conductive particles P remaining on the transfer substrate 511 by contact.

Specifically, as shown in fig. 5 to 6B, the debonding unit 90 includes a winder 91, and the first non-conductive adhesive film NCF1 is moved from the second attaching unit 80 to the debonding unit 90 by the roller 11 on the conveyor belt 13, and is wound and peeled from the first non-conductive adhesive film NCF1 by the winder 91, and the conductive particles P remain on the first non-conductive adhesive film NCF 1.

Specifically, in actual practice, the opposite surface 61 of the first nonconductive adhesive film NCF1 is first attached to the transfer surface 512 to cover and contact the conductive particles P, and then the first nonconductive adhesive film NCF1 is peeled off and separated from the transfer surface 512. It is apparent that, since the adhesion force of the transfer surface 512 to the conductive particles P is 40% to 80% of the first nonconductive adhesive film NCF1, the conductive particles P adhered by the first nonconductive adhesive film NCF1 and the transfer surface 512 at the same time remain on the adhesion surface 61 of the first nonconductive adhesive film NCF1 and do not remain on the transfer surface 512 when the transfer substrate 511 and the first nonconductive adhesive film NCF1 are peeled from each other.

It is understood that various changes and modifications can be made by those skilled in the art based on the above examples, and they are not listed here.

The foregoing description of the embodiments of the present invention has been provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; it is intended that all such equivalent changes and modifications be included within the scope of the present invention as defined by the appended claims.

Claims (10)

1. A system for manufacturing anisotropic conductive adhesive, comprising:

the conveying unit comprises a plurality of rollers, a driver and a conveying belt, wherein the rollers are linked to the driver and roll under the driving of the driver, and the conveying belt is driven by the rollers to move in the forward direction;

the wafer feeding unit is used for feeding wafers onto the transmission belt, a plurality of accommodating grooves are formed in the wafers, and the accommodating grooves are arranged in an array manner;

the conductive particle spreading unit is used for accommodating a plurality of conductive particles, the wafer on the conveying belt is driven by the roller wheel to move from the wafer feeding unit to the conductive particle spreading unit, the conductive particle spreading unit continuously sprays and releases part of the conductive particles to be spread on the wafer, and each accommodating groove accommodates at most one single conductive particle;

the conductive particle removing unit is used for removing the redundant conductive particles which are not accommodated in the accommodating groove, and the wafer is driven by the roller on the transmission belt and moves to the conductive particle removing unit from the conductive particle spreading unit;

the magnetic attraction device comprises at least one substrate output unit, the wafer is driven by the roller on the conveying belt to move to the magnetic attraction device through the conductive particle removing unit, the substrate output unit outputs the transfer printing substrate, the wafer and the transfer printing substrate are arranged in parallel, and the magnetic attraction device attracts the conductive core body of the conductive particles through magnetic force, so that the conductive particles are adsorbed on the transfer printing surface of the transfer printing substrate after leaving the accommodating groove;

the adhesive film output device is used for outputting a first non-conductive adhesive film, the first non-conductive adhesive film is driven by the roller on the conveying belt to move to the magnetic attraction device by the adhesive film output unit and is parallel to the transfer printing substrate, the magnetic attraction device releases the magnetic force, the conductive particles are separated from the transfer printing substrate, and the conductive particles are left on a pair of attaching surfaces of the first non-conductive adhesive film; and

the first attaching unit comprises at least one first attaching roller, the first non-conductive adhesive film is on the transmission belt and driven by the roller to move to the attaching unit through the magnetic attraction device, the second non-conductive adhesive film is attached to the non-conductive adhesive film through the at least one first attaching roller to cover the conductive particles to form continuous anisotropic conductive adhesive, and the conductive particles are clamped by the second non-conductive adhesive film and the first non-conductive adhesive film to form a configuration mode of single-layer distribution.

2. The system for manufacturing anisotropic conductive film according to claim 1, wherein the transfer surface of the transfer substrate has an adhesive property, and the adhesive property of the attaching surface of the first non-conductive adhesive film is greater than the adhesive property of the transfer surface.

3. The system of claim 2, wherein the adhesive film output device further comprises:

a second attaching unit including at least one second attaching roller that attaches the first nonconductive adhesive film to the transfer substrate, and the first nonconductive adhesive film is attached to the conductive particles left on the transfer substrate by contact; and

the de-adhesive stripping unit comprises a winder, the first non-conductive adhesive film is driven by the roller on the conveying belt to move to the de-adhesive stripping unit from the second attaching unit, the transfer printing substrate is wound and stripped by the winder to be separated from the first non-conductive adhesive film, and the conductive particles are left on the first non-conductive adhesive film.

4. The system for manufacturing anisotropic conductive adhesive according to claim 2, wherein the transfer surface comprises a medium adhesive film, the medium adhesive film has an adhesive property, the adhesive property of the medium adhesive film is 40% to 80% of the adhesive property of the first non-conductive adhesive film, the medium adhesive film is attached to the attaching surface of the first non-conductive adhesive film in the attaching step, the attaching surface covers the conductive particles and contacts the conductive particles, and then the conductive adhesive film is peeled off and separated from the medium adhesive film, and the conductive particles are left on the attaching surface of the conductive adhesive film.

5. The system of claim 1, wherein the transfer substrate is made of a non-metallic material selected from one of polycarbonate, polyethylene terephthalate, polymethyl methacrylate, polyimide, and polyethylene naphthalate.

6. The system of claim 1, wherein the transfer substrate is made of a metal material selected from one of nickel, copper, aluminum, and zinc.

7. The system of claim 1, wherein the receiving cavity has a width between 1.1 and 1.5 times a diameter of the conductive particles.

8. The system of claim 1, wherein the receiving cavity has a depth between 1.1 and 1.5 times a diameter of the conductive particles.

9. The system of claim 1, wherein the driver comprises at least one electric motor.

10. The system of claim 1, wherein the second film and the first film are made of the same material, and the material is selected from one of polyurethane and epoxy.

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