TWM638792U - Production system of anisotropic conductive adhesive with island structure - Google Patents

Abstract

This creation is an island structure anisotropic conductive adhesive production system, which includes: transmission unit, box feeding unit, conductive particle spreading unit, conductive particle removing unit, substrate output unit, adhesive film output device, The first attaching unit, the debonding glue stripping unit and the second attaching unit are used for making anisotropic conductive adhesive with an island structure. In this creation, a plurality of accommodating grooves are provided on the box body to accommodate a plurality of the conductive particles, and through the switch structure, the conductive particles leave the accommodating grooves and fall onto the transfer surface of the transfer substrate, forming a plurality of conductive particles group, to realize the production of anisotropic conductive adhesive with an island structure with conductive particle groups without contacting the box body, which is very suitable for mass production.

Description

Production system of anisotropic conductive adhesive with island structure

This creation is about a production system of anisotropic conductive adhesive with an island structure, especially using a plurality of accommodating grooves arranged in an array on the box body, for a plurality of conductive particles to be accommodated in the accommodating grooves, and at the same time through the switch The structure is opened so that the conductive particles accommodated in the accommodating grooves leave the box and form a plurality of conductive particle groups, realizing the anisotropy of the island structure with conductive particle groups without contacting the box The purpose of conductive adhesive.

With the advancement of the electronic industry and semiconductor technology, many terminal electronic products have not only become more powerful in function, but also constantly pursue light, thin, short, and small appearances to improve practicality.

Take traditional monitors using cathode ray tubes as an example. Not only do they take up too much valuable desk space, they are also quite bulky and consume too much power, especially for large-scale monitors. In recent years, liquid crystal displays (LCDs) manufactured using advanced electronics and semiconductor technologies can greatly reduce weight and reduce overall size, so they have almost completely replaced cathode ray tube displays.

Taking smartphones as an example, they are not only portable, but also have the functions of calling and sending text messages to each other. They can also take pictures and play high-quality videos. It is the universality of everyone holding a mobile phone, and it can be called the most successful consumer electronics product.

The electronic products mentioned above all need to electrically connect different electronic components to the electronic circuits on the circuit board. Traditionally, the process of using solder to achieve the purpose of soldering, even using lead-tin alloy solder with low-temperature melting characteristics and better conductivity, cannot meet the requirements of lightness, thinness, shortness, and smallness, especially for the size that has been greatly reduced. Electronic components of integrated circuits (Integrated Circuit, IC). Although Surface Mount Device (SMD) technology can solve the challenge of size reduction, it requires the use of a high-temperature furnace to accelerate the soldering process, thereby increasing the yield, and there is a potential risk of damage to electronic components.

Therefore, the industry has developed an anisotropic conductive film (Anisotropic Conductive Film, ACF), which is used in the process of chip on glass packaging (Chip on Glass, COG) or chip on film packaging (Chip on Film, COF). To achieve an electrical connection in a specific direction, such as conduction in the vertical direction and non-conduction in the horizontal direction. For example, it can be used to connect the pins of the driver IC (Driver IC) to each pixel of the panel to meet the fine pitch (Fine Pitch) requirements of the display panel.

In short, the anisotropic conductive film is a combination of resin and conductive particles (or conductive powder), which can be used to connect two different substrates and circuits, and the anisotropic conductive film has the upper and lower (Z-axis) electrical conduction characteristics, and the left and right planes (X, Y axes) are insulated, usually under heating and using external pressure treatment in the Z-axis direction, so that the contained separated conductive particles are in contact with each other to achieve electrical conduction in the Z-axis direction And at the same time, the purpose of electrical insulation in the plane direction can avoid short circuit of adjacent pins.

In the conventional technology of making anisotropic conductive film, it is necessary to embed multiple conductive particles in a non-conductive adhesive film, and each conductive particle includes an insulating film and a conductive core, wherein the insulating film covers the core of the conductive core. The outer surface. And when in use, place the electronic components or circuits that need to be connected on the upper and lower sides of the anisotropic conductive film, and then apply the upper and lower external forces to squeeze the anisotropic conductive film, so that the insulating film of the anisotropic conductive film is broken The covered conductive core body is exposed, so that the electronic components or circuits achieve the purpose of electrical conduction by contacting the conductive core body. Since the adjacent conductive particles can be arranged very close together, it can meet the requirement of fine spacing.

Further, to embed a plurality of conductive particles in the non-conductive adhesive film and arrange them in a properly dispersed manner generally uses a transfer printing technique, such as first placing the conductive particles on the configuration disk or the configuration film, and then disposing the disk or the configuration film A plurality of cavities in a specific arrangement to accommodate conductive particles, then attach a non-conductive adhesive film to cover the conductive particles, remove the configuration plate or configuration film, and finally attach another non-conductive adhesive film to cover Conductive particles, and then embed all conductive particles.

However, the disadvantage of the conventional technology is that the adhesive force of the conductive particles in the cavity of the configuration disk or the configuration film is not easy to control, so that when the configuration disk or the configuration film is removed, some conductive particles are still attached to the configuration disk or the film. Configuration on the film, but not transferred to the non-conductive adhesive film, affects the overall electrical connection function of the anisotropic conductive adhesive. In addition, the anisotropic conductive film of the conventional technology only forms electrical connection through a single conductive particle, which further affects the overall electrical connection function of the anisotropic conductive adhesive when the single conductive particle fails, making the quality of the anisotropic conductive adhesive bad.

In view of the above-mentioned shortcomings, creators research ways to improve these shortcomings, and finally this creation occurs.

The main purpose of this creation is to provide a production system for anisotropic conductive adhesive with an island structure, which is provided with a plurality of accommodating grooves on the box body, and the accommodating grooves are arranged in an array, so that adjacent conductive particles Configured in close proximity to meet fine pitch requirements. In addition, a plurality of accommodating grooves are provided on the box body, and the accommodating grooves are used to accommodate a plurality of conductive particles. The box body is opened through the switch structure so that the conductive particles accommodated in the accommodating grooves leave. In the box body, the conductive particles fall on the transfer surface of the transfer substrate, and form a plurality of conductive particle groups to realize an island-shaped structure of anisotropic conductive adhesive, which is very suitable for mass production and solves the problem of conventional technology. When a single conductive particle fails, it will further affect the overall electrical connection function, and achieve the effects of reducing costs and increasing production.

In order to achieve the above purpose and effect, this creation provides a production system of anisotropic conductive adhesive with an island structure, which includes: a transmission unit, including a plurality of rollers, a driver and a transmission belt, and the rollers are connected to The driver is driven by the driver to roll, and the conveyor belt is driven by the rollers to move in a forward direction; a box feeding unit is used to feed a box onto the conveyor belt, on the box A plurality of accommodating tanks are provided, and the accommodating tanks are arranged in an array, a switch structure is provided at the bottom of the box body; a conductive particle spreading unit is used to accommodate a plurality of conductive particles, and on the conveyor belt The box body is driven by the rollers to move from the box body feeding unit to the conductive particle spreading unit, and the conductive particle spreading unit continuously sprays the released part of the conductive particles and spreads them on the box body above, each of the accommodating tanks accommodates a plurality of the conductive particles; a conductive particle removal unit is used to remove the redundant conductive particles that are not accommodated in the accommodating tanks, and the box body is in the transmission Driven by the rollers, the belt moves from the conductive particle spreading unit to the conductive particle removal unit; a substrate output unit, which outputs a transfer substrate to a place parallel to the box body, and the transfer substrate having a transfer surface, the box body is opened through the switch structure so that the conductive particles accommodated in the accommodating grooves leave the box body, and the conductive particles fall onto the transfer surface of the transfer substrate, And form a plurality of conductive particle groups; a film output device, which is used to output a first non-conductive film (Non-Conductive Film, NCF), and the first non-conductive film is moved from the film output unit to Parallel to the transfer substrate; a first attachment unit, which includes at least one first attachment roller, the first attachment roller attaches the first non-conductive adhesive film to the transfer substrate, and the The first non-conductive adhesive film is attached to the conductive particles remaining on the transfer substrate by contact; a debonding peeling unit includes a winder, and the first non-conductive adhesive film is formed by the first The attaching unit moves to the debonding adhesive peeling unit, and is wound by the winder, peels off the transfer substrate and separates from the first non-conductive adhesive film, and the conductive particles are left in the first non-conductive adhesive film. On the adhesive film; a second attaching unit, including at least one second attaching roller, the first non-conductive adhesive film is moved to the attaching unit by the debonding glue peeling unit, and is attached by the at least one first attaching roller. The roller attaches a second non-conductive adhesive film on the first non-conductive adhesive film to cover the conductive particle groups to form an island-shaped anisotropic conductive adhesive, and the conductive particles are covered by the second non-conductive adhesive film. The conductive adhesive film and the first non-conductive adhesive film are sandwiched to form a configuration in which a single layer is distributed.

Preferably, according to the production system of the island-shaped anisotropic conductive adhesive of the present creation, the transfer surface of the transfer substrate has adhesiveness, and the adhesiveness of the facing surface of the first non-conductive adhesive film greater than the viscosity of the transfer surface.

Preferably, according to the production system of the island-shaped anisotropic conductive adhesive of the present invention, the transfer surface includes a medium-adhesive film, the medium-adhesive film itself is sticky, and the medium-adhesive film has The viscosity is between 40% and 80% of the viscosity of the first non-conductive adhesive film, and the medium-adhesive film is attached to the facing surface of the first non-conductive adhesive film in the attaching step , the facing surface covers and contacts the conductive particles, and then the conductive adhesive film is peeled off to separate from the medium viscous film, and the conductive particles will remain on the facing surface of the conductive adhesive film.

Preferably, according to the production system of anisotropic conductive adhesive with an island structure in the present invention, wherein the conductive particle groups include 2 to 30 conductive particles.

Preferably, according to the production system of the island-shaped anisotropic conductive adhesive of the present invention, the transfer substrate is made of non-metallic materials selected from polycarbonate, polyethylene terephthalate One of diester, polymethyl methacrylate, polyimide, and polyethylene naphthalate.

Preferably, according to the production system of the island-shaped anisotropic conductive adhesive of the present invention, the particle removal device includes a brush or a blowing device, and the brush removes excess conductive particles in a scraping manner. particles, and the air blowing device blows off excess conductive particles by means of air blowing.

Preferably, according to the manufacturing system of island-shaped anisotropic conductive adhesive of the present invention, the accommodating grooves have a width ranging from 1.1 times to 1.9 times the diameter of the conductive particles.

Preferably, according to the manufacturing system of island-shaped anisotropic conductive adhesive of the present invention, the accommodating grooves have a depth ranging from 2 times to 30 times the diameter of the conductive particles.

Preferably, according to the manufacturing system of island-shaped anisotropic conductive adhesive of the present invention, the driver includes at least one electric motor.

Preferably, according to the production system of the island-shaped anisotropic conductive adhesive of the present creation, the second non-conductive adhesive film and the first non-conductive adhesive film are made of the same material, and the material is selected One of polyurethane (Polyurethane, PU) and epoxy resin.

To sum up, the production system of the island-shaped anisotropic conductive adhesive provided by this creation is provided with a plurality of storage tanks on the box body, and these storage tanks are used to accommodate a plurality of conductive particles. The switch structure is opened so that the conductive particles accommodated in the accommodating grooves leave the box body, and the conductive particles fall on the transfer surface of the transfer substrate to form a plurality of conductive particle groups, realizing an island Shaped structure anisotropic conductive adhesive is very suitable for mass production, and at the same time solves the problem of further affecting the overall electrical connection function in the conventional technology when a single conductive particle fails, and achieves the effects of reducing costs and increasing production.

In order to make people familiar with this technique understand the purpose, characteristics and effects of this creation, the creation is described in detail as follows by the following specific examples and in conjunction with the attached drawings.

The inventive concept will now be explained more fully hereinafter with reference to the accompanying drawings in which exemplary embodiments of the inventive concept are shown. The advantages and features of the inventive concept as well as the method for its realization will be apparent below by referring to the exemplary embodiments described in more detail with reference to the accompanying drawings. It should be noted, however, that the inventive concept is not limited to the following exemplary embodiments, but can be implemented in various forms. Therefore, the exemplary embodiments are provided only to disclose the inventive concept and to enable those skilled in the art to understand the category of the inventive concept. In the drawings, the exemplary embodiments of the inventive concepts are not limited to the particular examples provided herein and are exaggerated for clarity.

The terminology used herein is for describing particular embodiments only and is not intended to limit the present invention. As used herein, the terms "a", "an" and "the" in the singular are intended to include the plural forms as well, unless the context clearly dictates otherwise. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present.

Similarly, it will be understood that when an element such as a layer, region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may be present. In contrast, the term "directly" means that there are no intervening elements. It should be further understood that when the words "comprising" and "comprising" are used herein, it indicates the existence of stated features, integers, steps, operations, elements, and/or components, but does not exclude one or more other features. , integers, steps, operations, elements, components, and/or the presence or addition of groups thereof.

Furthermore, exemplary embodiments in the detailed description will be explained with cross-sectional views that are idealized exemplary views of the inventive concept. Accordingly, the shapes of the exemplary figures may be modified according to manufacturing techniques and/or allowable errors. Thus, example embodiments of the inventive concept are not limited to the particular shapes shown in the example figures, but may include other shapes that may result from manufacturing processes. Regions illustrated in the drawings have general characteristics and are used to illustrate specific shapes of elements. Accordingly, this should not be viewed as limiting the scope of this creative concept.

It should also be understood that although the terms “first”, “second”, “third” etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish various elements. Thus, a first element in some embodiments could be termed a second element in other embodiments without departing from the teachings of the present invention. Exemplary embodiments of aspects of the inventive concept illustrated and illustrated herein include their complementary counterparts. Throughout this specification, the same reference number or the same designator designates the same element.

Additionally, exemplary embodiments are described herein with reference to cross-sectional and/or plan views, which are idealized exemplary illustrations. Accordingly, deviations from the illustrated shapes as a result, for example, of manufacturing techniques and/or tolerances are to be expected. Thus, example embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. Thus, the regions shown in the figures are schematic and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.

Please refer to Fig. 1 to Fig. 2B, Fig. 1 is a system schematic diagram of the production system of the anisotropic conductive adhesive according to the present invention; Fig. 2A-2B is a detailed system diagram of the production system of the anisotropic conductive adhesive according to the present invention . As shown in Figures 1 to 2B, the production system 100 of the anisotropic conductive adhesive according to the present invention includes: a transmission unit 10, a box feeding unit 20, a conductive particle spreading unit 30, a conductive particle removing unit 40, a substrate The output unit 50, the adhesive film output device 60, the first attaching unit 70, the debonding adhesive peeling unit 80 and the second attaching unit 90 are used to make continuous island-shaped structure anisotropic conductive adhesive, which can facilitate a large amount of production and quality control.

Specifically, as shown in FIGS. 2A-2B , the transmission device 10 includes a plurality of rollers 11 and a driver 12, wherein the rollers 11 are connected to the driver 12, such as via a chain, a gear set or a transmission rod, and the rollers 11 are connected to the driver 12. The driver 12 is driven to roll downwards, and the conveyor belt 13 is driven by the rollers 11 to move in a preset advancing direction D. As shown in FIG. For example, the driver 12 may include at least one electric motor.

In addition, the box body feeding unit 20 is used to feed a box body 21 onto the conveyor belt 13 and move toward the advancing direction D, and the box body 21 is provided with a receiving groove 211 . It should be further explained that, in some embodiments, the accommodating grooves 211 are specially configured to be separated without contacting each other, and preferably, the accommodating grooves 211 are distributed in an array. In addition, each accommodating groove 211 can be in the shape of a dot and has a specific area. It should be noted that, in the array distribution, the lateral spacing between two adjacent accommodation grooves 211 in the horizontal direction may be the same as or different from the vertical distance between the two adjacent accommodation grooves 211 in the vertical direction. The spacing, that is, the horizontal spacing and the vertical spacing can be designed separately according to actual needs.

Please refer to Fig. 3 and Fig. 4, Fig. 3 is a box schematic diagram of the production system of the anisotropic conductive adhesive according to the present invention; Fig. 4 is another box body of the production system of the anisotropic conductive adhesive according to the present invention schematic diagram. Specifically, as shown in FIG. 3 and FIG. 4 , a switch structure 212 is provided at the bottom of the box body 21, and the switch structure 212 communicates with the accommodating grooves 211, so that when the switch structure 212 is opened, the accommodating groove 211 The accommodated conductive particles P leave the accommodation grooves 211 . More specifically, in some embodiments, the switch structure 212 communicates with the bottoms of the storage tanks 211, and when the switch structure 212 is opened, the conductive particles P contained in the storage tanks 211 are transmitted through gravity. Leave the receiving grooves 211 . Please refer to FIG. 3 and FIG. 4, in some embodiments, the accommodating groove 211 of the box body 21 has a width W, and the width W is between 1.1 times and 1.9 times the diameter of the conductive particle P. Preferably, The width W is between 1.3 times and 1.8 times the diameter of the conductive particle P. In some embodiments, the accommodating groove 211 of the box body 21 has a depth h, and the depth h is between 2 times and 30 times the diameter of the conductive particle P. Preferably, the depth h is between 2 times and 30 times the diameter of the conductive particle P. Between 3 times and 10 times. In some embodiments, there is a predetermined distance L between the accommodating grooves 211 of the box body 21, and the predetermined distance L is between 1 time and 5 times the diameter of the conductive particle P. Preferably, the predetermined distance L is between 2 times and 3 times the diameter of the conductive particle P. In this way, the box body 21 of the present invention can accommodate a plurality of conductive particles P by adjusting the size of the storage tank, and ensure that each storage tank can accommodate the same number of conductive particles P, and the excess conductive Particles P are removed in the subsequent conductive particle removal unit 40, enhancing the anisotropic conductivity of the present invention The quality of the continuous anisotropic conductive adhesive produced by the adhesive production system is easy to implement and is very suitable for mass production.

Specifically, as shown in Figures 2A-2B, the conductive particle spreading unit 30 is used to accommodate a plurality of conductive particles P, and the box body 21 on the conveyor belt 13 is driven by the roller 11 and fed into the unit by the box body 20 moves to the conductive particle sprinkling unit 30, and the conductive particle sprinkling unit 30 continuously sprays the released part of the conductive particles P to spread on the box body 21, especially, each containing groove 211 accommodates a plurality of conductive particles P .

Each equal-conducting particle P has an outer diameter, and includes an insulating film and a conductive core body (not shown in the figure), wherein the insulating film covers the outer surface of the conductive core body, and the insulating film is configured to be squeezed by an external force. Cracking, so as to expose the coated conductive core body for contact to achieve anisotropic conductive function.

For example, the conductive particle sprinkling unit 30 may include a particle accommodating cavity 31 and a particle sprinkling opening 32, and the particle accommodating cavity 31 accommodates a plurality of conductive particles P, and the particle sprinkling opening 32 sprays the released portion The conductive particles P are sprinkled on the box body 21 .

Specifically, the box body 21 on the conveyor belt 13 is driven by the rollers 11 to move from the conductive particle spreading unit 30 to the conductive particle removal unit 40, and the conductive particle removal unit 40 removes the box body 21 that is not accommodated in the Excess conductive particles P in the accommodating groove 211 of the box body 21 .

For example, as shown in FIGS. 2A-2B , the conductive particle removal unit 40 may include an air blowing device 41 and an air suction device 42, and the excess conductive particles P are blown away from the box body 21 by the air blowing device 41 by blowing air. , and then the excess conductive particles P blown away by the blowing device 41 are collected by the suction device 42 by suction. In addition, the redundant conductive particles P collected by the suction device 42 can be recycled to the conductive particle spreading unit 30 for spreading.

Another example of the conductive particle removal unit 40 may include a brush (not shown) or an air blowing device 41, wherein the brush is to remove excess conductive particles P by scraping off, and the air blowing device 41 is used to remove excess conductive particles P. The redundant conductive particles P are blown off by air blowing.

Specifically, as shown in FIGS. 2A-2B , the substrate output unit 50 outputs a transfer substrate 51 to a place parallel to the box body 21, so that the box body 21 and the transfer substrate 51 are arranged in parallel, and the box body 21 passes through the switch structure 212. Opening allows the conductive particles P accommodated in the accommodating grooves 211 to leave the box body 21 , and the conductive particles P fall on the transfer surface 511 of the transfer substrate 51 to form a plurality of conductive particle groups PG.

Specifically, in some embodiments, the transfer substrate 51 is made of a non-metallic material selected from polycarbonate, polyethylene terephthalate, polymethyl methacrylate, polyamide Amine, and one of polyethylene naphthalate, the above non-metallic materials have a stable chemical properties, good elasticity, and extensibility, so that the substrate output unit 50 can be set in the form of a tape or a reel to be continuously pulled out to feed the transfer substrate 51 for subsequent processing, and has wide applicability. However, this invention does not limited to this.

Specifically, as shown in Figures 2A-2B, the adhesive film output device 60 is used to output a first non-conductive adhesive film NCF1, the first non-conductive adhesive film NCF1 has a first abutment surface 61, and the first non-conductive adhesive film NCF1 The adhesive film NCF1 is moved to a place parallel to the transfer substrate 51 by the adhesive film output unit 60 .

Specifically, in this embodiment, since the transfer surface 511 of the transfer substrate 51 is viscous, when the box body 21 is opened through the switch structure 212, the conductive materials contained in the accommodating grooves 211 Particles P leave the box body 21, these conductive particles P fall on the transfer surface 511 of the transfer substrate 51, and after forming a plurality of conductive particle groups PG, the conductive particle groups PG will be fixed on the transfer surface 511 to reduce Risk of conductive particles P falling. Specifically, the transfer surface 511 may include a medium-adhesive film (not shown), the medium-adhesive film itself has viscosity, and the viscosity of the medium-adhesive film is the original viscosity of the first non-conductive adhesive film NCF1. 40% to 80% of the adhesiveness, that is, the adhesiveness of the bonding surface 61 of the first non-conductive adhesive film NCF1 is greater than the adhesiveness of the transfer surface 511.

Specifically, as shown in FIGS. 2A-2B , the first attaching unit 70 includes a first attaching roller 71, and the first attaching roller 71 attaches the first non-conductive adhesive film NCF1 to the transfer substrate 51, and The first non-conductive adhesive film NCF1 is attached to the conductive particle groups PG remaining on the transfer substrate 51 by contact, so that the facing surface 61 of the first non-conductive adhesive film NCF1 has the conductive particle groups PG. .

Specifically, as shown in FIGS. 2A-2B , the debonding adhesive peeling unit 80 includes a winder 81, and the first non-conductive adhesive film NCF1 is moved from the first attaching unit 70 to the debonding adhesive peeling unit 80, The transfer substrate 51 is wound and peeled off by the winder 81 to be separated from the first non-conductive adhesive film NCF1, and the conductive particle groups PG are left on the first non-conductive adhesive film NCF1.

Specifically, in actual operation, the facing surface 61 of the first non-conductive adhesive film NCF1 is first attached to the transfer surface 511, and the conductive particle group PG is covered, and then the first non-conductive adhesive film NCF1 is peeled off. and separated from the transfer surface 511 . It is obvious that since the adhesion force of the transfer surface 511 to the conductive particle group PG is 40% to 80% of that of the first non-conductive adhesive film NCF1, the particles that are simultaneously adhered by the first non-conductive adhesive film NCF1 and the transfer surface 511 The conductive particle group PG, when the transfer substrate 51 and the first non-conductive adhesive film NCF1 are peeled off from each other, the conductive particle group PG will stay on the facing surface 61 of the first non-conductive adhesive film NCF1, and will not stay on the transfer surface 511.

Specifically, as shown in FIGS. 2A-2B , the second attaching unit 90 includes a second attaching roller 91, and the first non-conductive adhesive film NCF1 including the conductive particle group PG is moved to the second attaching unit 80 by the debonding adhesive peeling unit 80. The attaching unit 90, and the second non-conductive adhesive film NCF2 is attached to the first non-conductive adhesive film NCF1 by the second attaching roller 91 to cover the conductive particles P to form an island-shaped anisotropic conductive adhesive, and The conductive particle group PG is sandwiched by the second non-conductive adhesive film NCF2 and the first non-conductive adhesive film NCF1 to form a single layer distribution.

In addition, the production system of the invention may further include a collection unit (not shown in the figure), which is arranged after the first attachment unit 70 to collect the continuous anisotropic conductive adhesive ACF, for example, it can be continuously formed by winding. It is wound on a roller, which is convenient for subsequent application, processing and handling.

For example, the above-mentioned second non-conductive film NCF2 and the first non-conductive film NCF1 can be made of the same material, for example, the material used includes polyurethane (Polyurethane, PU) or epoxy resin. In addition, the thickness of the first non-conductive adhesive film NCF1 may be 20-300 μm, and the thickness of the second non-conductive adhesive film NCF2 may be 20-300 μm.

In this way, the box body 21 is provided with a plurality of accommodating grooves 211 , and the accommodating grooves are arranged in an array, so that adjacent conductive particles are arranged very close to meet the requirement of fine spacing. In addition, by adjusting the depth h of the accommodating groove 211, the quantity of conductive particles P accommodated in the accommodating groove is adjusted. Leaving the box body 21, the conductive particles P fall on the transfer surface 511 of the transfer substrate 51, and form a plurality of conductive particle groups PG to realize an island-shaped anisotropic conductive adhesive, which is very suitable for mass production. At the same time, it solves the problem that when a single conductive particle fails in the conventional technology, the problem that the overall electrical connection function is further affected, and achieves the effects of reducing costs and increasing production.

It can be understood that those with ordinary knowledge in the technical field to which this creation belongs can make various changes and adjustments based on the above examples, which will not be listed here.

The above is to illustrate the implementation of the invention by means of specific specific examples. Those with ordinary knowledge in the technical field can easily understand other advantages and effects of the invention from the content disclosed in this specification.

The above is only a preferred embodiment of this creation, and is not intended to limit the scope of this creation; all other equivalent changes or modifications that do not deviate from the spirit disclosed by this creation should be included in the scope of the following patents Inside.

100: Production system of anisotropic conductive adhesive 10:Transmission unit 11:Roller 12: drive 13: Conveyor belt 20: Box feed-in unit 21: box body 211: storage tank 30: Conductive particle spreading unit 31: Accommodating cavity 32: Particle spreading mouth 40: Conductive particle removal unit 41: blowing device 42: suction device 50: Substrate output unit 51: Transfer substrate 511: transfer surface 60: film output device 61: Face-to-face 70: The first attachment unit 71: The first attached roller 80: Debonding adhesive stripping unit 81: winder 90: the second attachment unit 91: The second attached roller D: forward direction h: depth NCF1: The first non-conductive adhesive film NCF2: The second non-conductive film P: conductive particles PG: Conductive Particle Swarm W: width

Fig. 1 is a system schematic diagram of the production system of the anisotropic conductive adhesive according to the invention; 2A-2B are detailed system schematic diagrams of the production system of the anisotropic conductive adhesive according to the invention; Fig. 3 is a box schematic diagram of the production system of the anisotropic conductive adhesive according to the invention; Fig. 4 is another schematic diagram of the box body of the production system of the anisotropic conductive adhesive according to the present invention.

100: Production system of anisotropic conductive adhesive with island structure

10:Transmission unit

20: Box feed-in unit

30: Conductive particle spreading unit

40: Conductive particle removal unit

50: Substrate output device

60: film output device

70: The first attachment unit

80: Debonding adhesive stripping unit

90: the second attachment unit

Claims (10)

A production system of anisotropic conductive adhesive with an island structure, which includes: A transmission unit comprising a plurality of rollers, a driver and a transmission belt, the rollers are connected to the driver and rolled under the drive of the driver, and the transmission belt is driven by the rollers to move in a forward direction; A box body feed-in unit, used to feed a box body onto the conveyor belt, the box body is provided with a plurality of accommodating slots, and the accommodating slots are arranged in an array, and the bottom of the box body is provided with a switch structure ; A conductive particle spreading unit is used to accommodate a plurality of conductive particles, and the box body on the conveyor belt is driven by the rollers to move from the box body feeding unit to the conductive particle spreading unit, And the conductive particle spraying unit continuously sprays the released part of the conductive particles on the box body, and each of the accommodating grooves accommodates a plurality of the conductive particles; A conductive particle removal unit is used to remove the redundant conductive particles not accommodated in the holding tank, and the box is moved by the conductive particle spreading unit on the conveyor belt driven by the rollers to the conductive particle removal unit; A substrate output unit, the substrate output unit outputs a transfer substrate to a place parallel to the box body, the transfer substrate has a transfer surface, and the box body is opened through the switch structure so as to be accommodated in the accommodating grooves The conductive particles leave the box, the conductive particles fall on the transfer surface of the transfer substrate, and form a plurality of conductive particle groups; An adhesive film output device, which is used to output a first non-conductive adhesive film (Non-Conductive Film, NCF), and the first non-conductive adhesive film is moved from the adhesive film output unit to a place parallel to the transfer substrate ; A first attaching unit, which comprises at least one first attaching roller, the first attaching roller attaches the first non-conductive adhesive film to the transfer substrate, and the first non-conductive adhesive film is contacting and attaching to the conductive particles remaining on the transfer substrate; A debonding adhesive peeling unit, including a winder, the first non-conductive adhesive film is moved from the first attaching unit to the debonding adhesive peeling unit, and the transfer substrate is wound and peeled off by the winder while being separated from the first non-conductive adhesive film, the conductive particles are left on the first non-conductive adhesive film; A second attaching unit, including at least one second attaching roller, the first non-conductive adhesive film is moved to the attaching unit by the debonding glue peeling unit, and a first attaching roller is used by the at least one first attaching roller. Two non-conductive adhesive films are attached to the first non-conductive adhesive film to cover the conductive particle groups to form an island-shaped anisotropic conductive adhesive, and the conductive particles are covered by the second non-conductive adhesive film and A configuration in which the first non-conductive adhesive film is sandwiched to form a single-layer distribution. The manufacturing system of island-shaped anisotropic conductive adhesive according to claim 1, wherein the transfer surface of the transfer substrate has viscosity, and the viscosity of the pair of pasting surfaces of the first non-conductive adhesive film greater than the viscosity of the transfer surface. The production system of the island-shaped anisotropic conductive adhesive as described in claim 2, wherein the transfer surface includes a medium-adhesive film, the medium-adhesive film itself is sticky, and the adhesive of the medium-adhesive film The viscosity is between 40% and 80% of the viscosity of the first non-conductive adhesive film, and the medium-adhesive film is attached to the facing surface of the first non-conductive adhesive film in the attaching step, The facing surface covers and touches the conductive particles, and then the conductive adhesive film is peeled off to separate from the medium viscous film, and the conductive particles will remain on the facing surface of the conductive adhesive film. The manufacturing system of anisotropic conductive adhesive with an island structure according to claim 1, wherein the conductive particle groups include 2 to 30 conductive particles. The production system of anisotropic conductive adhesive with an island structure as described in Claim 1, wherein the transfer substrate is made of non-metallic material, and the non-metallic material is selected from polycarbonate, polyethylene terephthalate One of ester, polymethyl methacrylate, polyimide, and polyethylene naphthalate. The manufacturing system of island-shaped anisotropic conductive adhesive as described in Claim 1, wherein the particle removal device includes a brush or an air blowing device, and the brush removes excess conductive particles by a scraping method , and the air blowing device blows off the redundant conductive particles by means of air blowing. The manufacturing system of island-shaped anisotropic conductive adhesive according to claim 1, wherein the accommodating grooves have a width ranging from 1.1 times to 1.9 times the diameter of the conductive particles. The manufacturing system of island-shaped anisotropic conductive adhesive according to claim 1, wherein the accommodating grooves have a depth ranging from 2 times to 30 times the diameter of the conductive particles. The manufacturing system of island-shaped anisotropic conductive adhesive according to claim 1, wherein the driver includes at least one electric motor. The manufacturing system of island-shaped anisotropic conductive adhesive as described in Claim 1, wherein the second non-conductive adhesive film and the first non-conductive adhesive film are made of the same material, and the material is selected from One of polyurethane (Polyurethane, PU) and epoxy resin.

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