JP2004140178A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2004140178A5 JP2004140178A5 JP2002303346A JP2002303346A JP2004140178A5 JP 2004140178 A5 JP2004140178 A5 JP 2004140178A5 JP 2002303346 A JP2002303346 A JP 2002303346A JP 2002303346 A JP2002303346 A JP 2002303346A JP 2004140178 A5 JP2004140178 A5 JP 2004140178A5
- Authority
- JP
- Japan
- Prior art keywords
- chemical mechanical
- grooves
- mechanical polishing
- interval
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims 18
- 239000000126 substance Substances 0.000 claims 11
- 238000004519 manufacturing process Methods 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- 238000000059 patterning Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002303346A JP2004140178A (ja) | 2002-10-17 | 2002-10-17 | 化学的機械研磨装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002303346A JP2004140178A (ja) | 2002-10-17 | 2002-10-17 | 化学的機械研磨装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004140178A JP2004140178A (ja) | 2004-05-13 |
| JP2004140178A5 true JP2004140178A5 (https=) | 2005-07-14 |
Family
ID=32451163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002303346A Pending JP2004140178A (ja) | 2002-10-17 | 2002-10-17 | 化学的機械研磨装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004140178A (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004167605A (ja) * | 2002-11-15 | 2004-06-17 | Rodel Nitta Co | 研磨パッドおよび研磨装置 |
| KR100568258B1 (ko) | 2004-07-01 | 2006-04-07 | 삼성전자주식회사 | 화학적 기계적 연마용 연마 패드 및 이를 이용하는 화학적기계적 연마 장치 |
| TW200801253A (en) * | 2006-04-14 | 2008-01-01 | Roki Techno Co Ltd | Polishing pad for device wafer |
| JP5186738B2 (ja) | 2006-07-10 | 2013-04-24 | 富士通セミコンダクター株式会社 | 研磨パッドの製造方法及び被研磨体の研磨方法 |
| SG11201608134YA (en) | 2014-04-03 | 2016-10-28 | 3M Innovative Properties Co | Polishing pads and systems and methods of making and using the same |
| JP6985587B2 (ja) * | 2017-03-30 | 2021-12-22 | 富士紡ホールディングス株式会社 | 研磨パッド |
| CN109514444B (zh) * | 2018-12-25 | 2024-06-21 | 中机半导体材料(深圳)有限公司 | 一种具有避免划痕功能的抛光皮 |
| CN110385632B (zh) * | 2019-07-19 | 2025-05-16 | 南开大学 | 磁吸式抛光夹具和抛光装置 |
| CN113524022B (zh) * | 2021-09-17 | 2022-01-07 | 湖北鼎汇微电子材料有限公司 | 一种抛光垫及半导体器件的制造方法 |
| JP7770849B2 (ja) * | 2021-10-06 | 2025-11-17 | グローバルウェーハズ・ジャパン株式会社 | 研磨パッド、研磨装置、および研磨方法 |
| CN116276633B (zh) * | 2023-02-13 | 2025-09-16 | 上海芯谦集成电路有限公司 | 一种具有透气孔的抛光垫 |
| WO2026070884A1 (ja) * | 2024-09-30 | 2026-04-02 | 富士紡ホールディングス株式会社 | 研磨パッド |
-
2002
- 2002-10-17 JP JP2002303346A patent/JP2004140178A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2004140178A5 (https=) | ||
| WO2004059751A3 (en) | Methods of forming semiconductor mesa structures including self-aligned contact layers and related devices | |
| JP2001345294A5 (https=) | ||
| JP2007515775A5 (https=) | ||
| JP2002313757A5 (https=) | ||
| TW200501216A (en) | Organic semiconductor device and method of manufacture of same | |
| TW200512875A (en) | Semiconductor apparatus utilizing multi-level interconnection to prevent peeling-off of low-k layer | |
| JP2007529894A5 (https=) | ||
| ATE432145T1 (de) | Leitender polierkörper zum elektrochemisch- mechanischen polieren | |
| TW200733350A (en) | Efuse and methods of manufacturing the same | |
| EP1681713A4 (en) | SURFACE PROTECTION FILM AND SEMICONDUCTOR WAFER LAPPING METHOD | |
| JP2008525987A5 (https=) | ||
| JP2006332585A5 (https=) | ||
| JP2003147538A5 (https=) | ||
| TW200603231A (en) | Substrate heating apparatus and manufacturing method for the same | |
| FR2842943B1 (fr) | Procede de fabrication de film polymere conducteur anisotrope sur tranche de semi-conducteur | |
| EP1517364A4 (en) | SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF | |
| JP2010527509A5 (https=) | ||
| JP2004158663A5 (https=) | ||
| WO2004084267A3 (en) | System, method and apparatus for improved local dual-damascene planarization | |
| TW200705568A (en) | Method of forming an interlayer dielectric | |
| WO2006117765A3 (en) | Method for analyzing an integrated circuit, apparatus and integrated circuit | |
| EP1580806A3 (en) | Semiconductor wafer, method of manufacturing the same, and method of manufacturing a semiconductor device | |
| TW200507130A (en) | Tape carrier type semiconductor device and method of producing the same | |
| MX2007003615A (es) | Circuito integrado y metodo de fabricacion. |