JP2004140178A - 化学的機械研磨装置 - Google Patents

化学的機械研磨装置 Download PDF

Info

Publication number
JP2004140178A
JP2004140178A JP2002303346A JP2002303346A JP2004140178A JP 2004140178 A JP2004140178 A JP 2004140178A JP 2002303346 A JP2002303346 A JP 2002303346A JP 2002303346 A JP2002303346 A JP 2002303346A JP 2004140178 A JP2004140178 A JP 2004140178A
Authority
JP
Japan
Prior art keywords
polishing
wafer
polishing pad
grooves
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002303346A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004140178A5 (https=
Inventor
Hidefumi Ito
伊藤　秀文
Norikazu Suzuki
鈴木　教和
Toshimasa Miura
三浦　敏雅
Toshihiko Abe
安部　寿彦
Fumiyuki Kanai
金井　史幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2002303346A priority Critical patent/JP2004140178A/ja
Publication of JP2004140178A publication Critical patent/JP2004140178A/ja
Publication of JP2004140178A5 publication Critical patent/JP2004140178A5/ja
Pending legal-status Critical Current

Links

Images

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2002303346A 2002-10-17 2002-10-17 化学的機械研磨装置 Pending JP2004140178A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002303346A JP2004140178A (ja) 2002-10-17 2002-10-17 化学的機械研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002303346A JP2004140178A (ja) 2002-10-17 2002-10-17 化学的機械研磨装置

Publications (2)

Publication Number Publication Date
JP2004140178A true JP2004140178A (ja) 2004-05-13
JP2004140178A5 JP2004140178A5 (https=) 2005-07-14

Family

ID=32451163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002303346A Pending JP2004140178A (ja) 2002-10-17 2002-10-17 化学的機械研磨装置

Country Status (1)

Country Link
JP (1) JP2004140178A (https=)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004167605A (ja) * 2002-11-15 2004-06-17 Rodel Nitta Co 研磨パッドおよび研磨装置
KR100568258B1 (ko) 2004-07-01 2006-04-07 삼성전자주식회사 화학적 기계적 연마용 연마 패드 및 이를 이용하는 화학적기계적 연마 장치
JPWO2007119845A1 (ja) * 2006-04-14 2009-08-27 株式会社ロキテクノ デバイスウエハ用の研磨パッド
US8011999B2 (en) 2006-07-10 2011-09-06 Fujitsu Semiconductor Limited Polishing pad, method for manufacturing the polishing pad
US10071461B2 (en) 2014-04-03 2018-09-11 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
JP2018167371A (ja) * 2017-03-30 2018-11-01 富士紡ホールディングス株式会社 研磨パッド
CN109514444A (zh) * 2018-12-25 2019-03-26 郑州中研高科实业有限公司 一种具有避免划痕功能的抛光皮
CN110385632A (zh) * 2019-07-19 2019-10-29 南开大学 磁吸式抛光夹具和抛光装置
CN113524022A (zh) * 2021-09-17 2021-10-22 湖北鼎汇微电子材料有限公司 一种抛光垫及半导体器件的制造方法
JP2023055477A (ja) * 2021-10-06 2023-04-18 グローバルウェーハズ・ジャパン株式会社 研磨パッド、研磨装置、および研磨方法
CN116276633A (zh) * 2023-02-13 2023-06-23 上海芯谦集成电路有限公司 一种具有透气孔的抛光垫
WO2026070884A1 (ja) * 2024-09-30 2026-04-02 富士紡ホールディングス株式会社 研磨パッド

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004167605A (ja) * 2002-11-15 2004-06-17 Rodel Nitta Co 研磨パッドおよび研磨装置
KR100568258B1 (ko) 2004-07-01 2006-04-07 삼성전자주식회사 화학적 기계적 연마용 연마 패드 및 이를 이용하는 화학적기계적 연마 장치
JPWO2007119845A1 (ja) * 2006-04-14 2009-08-27 株式会社ロキテクノ デバイスウエハ用の研磨パッド
US8011999B2 (en) 2006-07-10 2011-09-06 Fujitsu Semiconductor Limited Polishing pad, method for manufacturing the polishing pad
US10252396B2 (en) 2014-04-03 2019-04-09 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
US10071461B2 (en) 2014-04-03 2018-09-11 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
JP2018167371A (ja) * 2017-03-30 2018-11-01 富士紡ホールディングス株式会社 研磨パッド
CN109514444A (zh) * 2018-12-25 2019-03-26 郑州中研高科实业有限公司 一种具有避免划痕功能的抛光皮
CN110385632A (zh) * 2019-07-19 2019-10-29 南开大学 磁吸式抛光夹具和抛光装置
CN113524022A (zh) * 2021-09-17 2021-10-22 湖北鼎汇微电子材料有限公司 一种抛光垫及半导体器件的制造方法
CN113524022B (zh) * 2021-09-17 2022-01-07 湖北鼎汇微电子材料有限公司 一种抛光垫及半导体器件的制造方法
JP2023055477A (ja) * 2021-10-06 2023-04-18 グローバルウェーハズ・ジャパン株式会社 研磨パッド、研磨装置、および研磨方法
JP7770849B2 (ja) 2021-10-06 2025-11-17 グローバルウェーハズ・ジャパン株式会社 研磨パッド、研磨装置、および研磨方法
CN116276633A (zh) * 2023-02-13 2023-06-23 上海芯谦集成电路有限公司 一种具有透气孔的抛光垫
WO2026070884A1 (ja) * 2024-09-30 2026-04-02 富士紡ホールディングス株式会社 研磨パッド

Similar Documents

Publication Publication Date Title
US6193587B1 (en) Apparatus and method for cleansing a polishing pad
KR100566787B1 (ko) 반도체의연마방법및장치
EP0874390B1 (en) Polishing method
US6010395A (en) Chemical-mechanical polishing apparatus
US8485863B2 (en) Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
US20040009742A1 (en) Polishing pad conditioning disks for chemical mechanical polisher
JP3770752B2 (ja) 半導体装置の製造方法及び加工装置
JPH11156711A (ja) 研磨装置
JPH11868A (ja) 研磨布表面のドレス治具及びその製造方法
US6341997B1 (en) Method for recycling a polishing pad conditioning disk
US6386963B1 (en) Conditioning disk for conditioning a polishing pad
US6394886B1 (en) Conformal disk holder for CMP pad conditioner
JP2004140178A (ja) 化学的機械研磨装置
KR20110084877A (ko) 텍스쳐 처리된 플래튼
US6302770B1 (en) In-situ pad conditioning for CMP polisher
JP2004167605A (ja) 研磨パッドおよび研磨装置
US6478977B1 (en) Polishing method and apparatus
KR19980070998A (ko) 연마 장치, 연마 부재 및 연마 방법
US6300248B1 (en) On-chip pad conditioning for chemical mechanical polishing
US20020194790A1 (en) Method for fabricating diamond conditioning disc and disc fabricated
US20020187731A1 (en) In-situ pad and wafer cleaning during chemical mechanical polishing
JPH10256201A (ja) 半導体の製造方法
KR100910509B1 (ko) 반도체 소자의 제조를 위한 ｃｍｐ 장치
JP2004122291A (ja) 基板研磨方法
US6783441B2 (en) Apparatus and method for transferring a torque from a rotating hub frame to a one-piece hub shaft

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20041116

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20041116

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070529

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070605

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20071009