JP2004139833A - Connecting structure - Google Patents

Connecting structure Download PDF

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Publication number
JP2004139833A
JP2004139833A JP2002303130A JP2002303130A JP2004139833A JP 2004139833 A JP2004139833 A JP 2004139833A JP 2002303130 A JP2002303130 A JP 2002303130A JP 2002303130 A JP2002303130 A JP 2002303130A JP 2004139833 A JP2004139833 A JP 2004139833A
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Japan
Prior art keywords
connection
adhesive
electronic component
metal thin
connection member
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JP2002303130A
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Japanese (ja)
Inventor
Tomishige Tai
田井　富茂
Chikao Oguchi
小口　慎雄
Mikito Imai
今井　幹人
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Japan Aviation Electronics Industry Ltd
Sony Corp
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Japan Aviation Electronics Industry Ltd
Sony Corp
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Priority to JP2002303130A priority Critical patent/JP2004139833A/en
Publication of JP2004139833A publication Critical patent/JP2004139833A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connecting structure which has a simple connecting process, can use a metallic thin film with weak stiffness as a connecting means, and can repeat connection and removal. <P>SOLUTION: An electronic component 12 is accommodated in a hole 11A of a circuit board 11. A connecting member 13 is integrally configured to two elastically deformable metal thin films 14 and a gel-like adhesive 15 for coating each metal thin film 14. The gel-like adhesive 15 is adhered on surfaces of the circuit board 11 and the electronic component 12, and each of the metal thin films 14 connects a conductor pattern of the circuit board 11 wtih terminals of the electronic component 12. When the connecting member 13 is removed from the circuit board 11 and the electronic component 12, the gel-like adhesive 15 and each of the metal thin films 14 are integrally peeled from the circuit board 11 and the electronic component 12. The connecting member 13 can repeat the connection and the removal. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、接続部材と、電子部品が搭載された接続相手側（回路基板等）とを電気的及び機械的に接続する接続構造に関する。
【０００２】
【従来の技術】
従来の第１の接続構造について図６を参照して説明する。
【０００３】
まず、図６（ａ）に示されるように、チップ・アセンブリ２１は、べァ・チップ２２がＦＰＣ（Ｆｌｅｘｉｂｌｅ　Ｐｒｉｎｔｅｄ　Ｃｉｒｃｕｉｔ）２３の一面にＦＣ（フリップ・チップ）ボンド、ＡＣＦ（異方性導電シート）又はワイヤボンド等によって接続されて構成される。ＦＰＣ２３の他面には、ＳＳＯＰ（Ｓｈｒｉｎｋ　Ｓｍａｌｌ−Ｏｕｔｌｉｎｅ　Ｐａｃｋａｇｅ）２４が、図６（ｂ）と（ｃ）に示されるように接続されている。プリント配線基板２６は、下板２７と、穴２８Ａが設けられた上板２８とから構成される。チップ・アセンブリ２１とプリント配線基板２６とは、ビルドアップされる。
【０００４】
次に、組立方法を図６（ｂ）と（ｃ）を参照して説明する。チップ・アセンブリ２１を表裏反転して、プリント配線基板２６における上板２８の穴２８Ａに搭載する。この後、ＦＰＣ２３を超音波溶接又は熱圧着によって上板２８に固定する。
【０００５】
なお、ＳＳＯＰ２４を図６（ｄ）に示されるＴＳＳＯＰ（Ｔｈｉｎ　Ｓｈｒｉｎｋ　Ｓｍａｌｌ−Ｏｕｔｌｉｎｅ　Ｐａｃｋａｇｅ）２５に替えると、接続構造が薄型に構成される。
【０００６】
従来の第２の接続構造について図７を参照して説明する（例えば、特許文献１参照。）。
【０００７】
電気回路接続用接着シート３１は、基板フィルム３２と接着剤層３３と柔軟性導電層３４とが積層されることにより構成される。
【０００８】
基材３６上には、一対の下部電極３７，３８が形成され、一方の下部電極３７上にボタン電池３９が載置される。一対の下部電極３７，３８の間に、電子部品４０が接続される。
【０００９】
電気回路接続用接着シート３１の接着剤層３３を基板３６の表面に接着すると、柔軟性導電層３４は、ボタン電池３９と他方の下部電極３８とに接触する。したがって、電子部品４０は、駆動される。
【００１０】
【特許文献１】
特開平１０−２４１７６５号公報（第２−４頁、図２）
【００１１】
【発明が解決しようとする課題】
前記従来の第１の接続構造においては、べァ・チップ等とＦＰＣとの接続工程、及び、ＦＰＣとプリント配線基板との接続工程が必要である。また、べァ・チップのＦＰＣへの実装の際、ＦＣボンド、ＡＣＦ又はワイヤボンド等が使用されるから、加熱、荷重又は超音波溶接等が必要とされるので、相当のタクトタイムや高価な接続用装置が入用である。更に、プリント配線基板とＦＰＣとの接続に、熱圧着や超音波溶接が必要とされるので、相当のタクトタイムや高価な接続用装置が入用である。
【００１２】
前記従来の第２の接続構造においては、接続対象物がボタン電池等の剛性が強い物品であり、また、接着剤層を採用しているため、電気回路接続用接着シートを基材に対して繰り返して接着と取外しを行うことができない。
【００１３】
そこで、本発明は前記従来の両技術の欠点を改良し、接続工程が簡易で、剛性が弱い金属薄膜を接続手段とすることができ、しかも、接続と取外しを繰り返すことができる接続構造を提供しようとするものである。
【００１４】
【課題を解決するための手段】
本発明は、前記課題を解決するため、次の手段を採用する。
【００１５】
１．接続部材と電子部品が搭載された接続相手側とを接続する接続構造において、前記接続部材は、基材と、前記基材上に配設された粘着剤と、前記粘着剤上に配設された金属薄膜とから一体に構成され、前記接続相手側は、前記電子部品を収納する収納部と、導体パターンとを有し、前記接続部材と前記接続相手側とを接続する際、前記粘着剤によって、前記金属薄膜と前記導体パターンとを電気的に接続し、前記接続部材と前記接続相手側とを機械的に接続する接続構造。
【００１６】
２．電子部品と前記電子部品が搭載された接続相手側とを接続部材によって接続する接続構造において、前記接続部材は、粘着剤と、前記粘着剤上に配設された金属薄膜とから一体に構成され、前記接続相手側は、前記電子部品と、前記電子部品を収納する収納部と、導体パターンとを有し、前記接続部材と前記接続相手側とを接続する際、前記粘着剤によって、前記金属薄膜と前記導体パターンとを電気的に接続し、前記接続部材と前記接続相手側と前記電子部品とを機械的に接続する接続構造。
【００１７】
３．前記２記載の接続構造において、前記粘着剤によって、前記接続部材と前記接続相手側以外の接続相手側と前記電子部品とを機械的に接続する接続構造。
【００１８】
４．前記粘着剤がゲル状である前記２記載の接続構造。
【００１９】
５．前記粘着剤は、前記接続部材において、基材上に配設されている前記２記載の接続構造。
【００２０】
６．前記金属薄膜が複数設けられている前記１又は２記載の接続構造。
【００２１】
【発明の実施の形態】
本発明の５つの実施の形態例の接続構造について説明する。
【００２２】
まず、第１実施の形態例について図１（ａ）〜（ｇ）を参照して説明する。
【００２３】
図１（ａ）〜（ｅ）は、５種類のチップ・アセンブリをプリント配線基板に搭載する構造例を示す。
【００２４】
（ａ）においては、チップ・アセンブリ２は、接続部材５と、接続部材５の一面に接続されるべァ・チップ３と、接続部材５の他面に接続されるＳＳＯＰ４とから構成される。べァ・チップ３は、プリント配線基板１の凹み又は穴１Ａに収納される。接続部材５の両側は、プリント配線基板１の表面に形成された導体パターン（後述する。）に接続される。
【００２５】
（ｂ）においては、２個のべァ・チップ３が、接続部材５の一面に接続される。
【００２６】
（ｃ）においては、チップ・アセンブリ２は、２層構造に構成され、第１の接続部材５Ａ、第１のべァ・チップ３Ａ、第２の接続部材５Ｂ及び第２のべァ・チップ３Ｂは、サンドイッチ状に積層される。第１の接続部材５Ａの両側と第２の接続部材５Ｂの両側は、それぞれプリント配線基板１の表面に形成された導体パターンに接続される。
【００２７】
（ｄ）においては、チップ・アセンブリ２は、３層構造に構成され、第１の接続部材５Ａ、第１のべァ・チップ３Ａ、第２の接続部材５Ｂ、第２のべァ・チップ３Ｂ、第３の接続部材５Ｃ及び第３のべァ・チップ３Ｃは、サンドイッチ状に積層される。第１の接続部材５Ａの両側と第２の接続部材５Ｂの左側と第３の接続部材５Ｃの右側は、それぞれプリント配線基板１の表面に形成された導体パターンに接続される。
【００２８】
（ｅ）においては、プリント配線基板１の穴１Ａが貫通し、プリント配線基板１の表面側に（ａ）と同様のチップ・アセンブリ２が実装され、裏面側に第２のチップ・アセンブリ２が実装される。第２のチップ・アセンブリ２は、第２の接続部材５Ｂと、第２の接続部材５の一面に接続される第２のべァ・チップ３Ｂとから構成される。
【００２９】
接続部材５のプリント配線基板１への電気的及び機械的接続について（ｆ）と（ｇ）を参照して説明する。（ｂ）における円で囲んだ箇所の拡大断面斜視図は、（ｇ）に示され、接続部材５のプリント配線基板１への接続前の拡大断面斜視図は、（ｆ）に示される。
【００３０】
接続部材５は、基材６と、粘着剤７と、粘着剤７の表面に形成された配線パターン８とが積層されることにより構成される。配線パターン８は、金メッキ層８Ａと、ニッケル箔８Ｂと、金メッキ層８Ｃとが積層されることにより構成され、弾性変形可能な金属薄膜である。配線パターン８は、チップ・アセンブリ２と導通する。
【００３１】
プリント配線基板１の表面には、導体パターン１Ｂが形成される。導体パターン１Ｂは、銅箔１Ｂ１と金メッキ層１Ｂ２とが積層されることにより構成される。
【００３２】
（ｆ）の状態において、接続部材５をプリント配線基板１に対して矢印方向に押圧すると、（ｇ）の状態に至る。この状態では、配線パターン８の金メッキ層８Ｃと導体パターン１Ｂの金メッキ層１Ｂ２とは接触し、粘着剤７の表面はプリント配線基板１の表面に粘着し、また、基材６と粘着剤７の各中央部は導体パターン１Ｂと配線パターン８の各厚さの和に応じて山型形状に湾曲する。このようにして、接続部材５とプリント配線基板１とは、電気的にも機械的にも接続される。
【００３３】
次に、第２実施の形態例について図２を参照して説明する。
【００３４】
回路基板１１の穴１１Ａには、電子部品１２が収納されている。接続部材１３は、弾性変形可能な２つの金属薄膜１４と、各金属薄膜１４を被覆するゲル状粘着剤１５とから一体に構成される。
【００３５】
図２に示される状態では、ゲル状粘着剤１５は、回路基板１１の表面と電子部品１２の表面に粘着し、各金属薄膜１４は、回路基板１１の導体パターン（図示せず）と電子部品１２の端子（図示せず）とを接続している。
【００３６】
接続部材１３を回路基板１１と電子部品１２から取外すとき、ゲル状粘着剤１５と各金属薄膜１４は、一体となって回路基板１１と電子部品１２から剥離する。接続部材１３は、接続と取外しを繰り返すことができる。
【００３７】
続いて、第３実施の形態例について図３を参照して説明する。第３乃至第５実施の形態例については、第２実施の形態例と同様な点の説明を省略し、相違する点の説明のみを行う。
【００３８】
接続部材１３は、断面コ字形状の２つの金属薄膜１４と、各金属薄膜１４に充填され、しかも、介在するゲル状粘着剤１５とから上下対称形状に一体に構成される。
【００３９】
ゲル状粘着剤１５の下面は、電子部品１２の上面に粘着し、ゲル状粘着剤１５の上面は、他の回路基板１７の下面に粘着する。
【００４０】
更に、第４実施の形態例について図４を参照して説明する。
【００４１】
接続部材１３は、弾性変形可能な２つの金属薄膜１４と、各金属薄膜１４を被覆するゲル状粘着剤１５と、ゲル状粘着剤１５の上に積層される基材１６とから一体に構成される。基材１６の材質は、ポリイミド又はＰＥＴ（熱可塑性ポリエステル樹脂）等である。
【００４２】
更に、第５実施の形態例について図５を参照して説明する。
【００４３】
回路基板１１の貫通した穴１１Ａには、電子部品１２が収納されている。接続部材１３は、弾性変形可能な折曲した２つの金属薄膜１４と、各金属薄膜１４を被覆するゲル状粘着剤１５と、ゲル状粘着剤１５の上に積層される基材１６とから一体に構成される。基材１６の材質は、アルミニウム板、ステンレス板又はエンボス加工を施されたＰＥＴ等である。
【００４４】
【発明の効果】
以上の説明から明らかなように、本発明によれば、次の効果が奏される。
【００４５】
１．接続部材の金属薄膜と、接続相手側（回路基板等）の導体パターンと、電子部品の端子とを簡易に接続できる接続構造が提供される。
【００４６】
２．接続部材は、金属薄膜と粘着剤とから一体に構成されているので、接続相手側と電子部品に対して接続と取外しを繰り返すことができる。
【図面の簡単な説明】
【図１】本発明の第１実施の形態例の接続構造の諸図であり、（ａ）〜（ｅ）は５種類のチップ・アセンブリがプリント配線基板に搭載された状態の断面図、（ｆ）は接続部材がプリント配線基板に粘着される前の状態の拡大断面斜視図、（ｇ）は（ｂ）における円部の拡大断面斜視図を、それぞれ示す。
【図２】本発明の第２実施の形態例の断面図である。
【図３】本発明の第３実施の形態例の断面図である。
【図４】本発明の第４実施の形態例の断面図である。
【図５】本発明の第５実施の形態例の断面図である。
【図６】従来の第１の接続構造の諸図であり、（ａ）はチップ・アセンブリとプリント配線基板の斜視図、（ｂ）はチップ・アセンブリとプリント配線基板との組立方法を示す斜視図、（ｃ）は拡大断面図、（ｄ）はＴＳＳＯＰの斜視図を、それぞれ示す。
【図７】従来の第２の接続構造の断面図である。
【符号の説明】
１　　プリント配線基板
１Ａ　　凹み、穴導体パターン
１Ｂ　　導体パターン
１Ｂ１　　銅箔
１Ｂ２　　金メッキ層
２　　チップ・アセンブリ
３　　べァ・チップ
３Ａ　　第１のべァ・チップ
３Ｂ　　第２のべァ・チップ
３Ｃ　　第３のべァ・チップ
４　　ＳＳＯＰ
５　　接続部材
５Ａ　　第１の接続部材
５Ｂ　　第２の接続部材
５Ｃ　　第３の接続部材
６　　基材
７　　粘着剤
８　　配線パターン（金属薄膜）
８Ａ　　金メッキ層
８Ｂ　　ニッケル箔
８Ｃ　　金メッキ層
１１　　回路基板
１１Ａ　　穴
１２　　電子部品
１３　　接続部材
１４　　金属薄膜
１５　　ゲル状粘着剤
１６　　基材
１７　　回路基板[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a connection structure for electrically and mechanically connecting a connection member and a connection partner (a circuit board or the like) on which an electronic component is mounted.
[0002]
[Prior art]
A conventional first connection structure will be described with reference to FIG.
[0003]
First, as shown in FIG. 6A, the chip assembly 21 includes a base chip 22 on one side of an FPC (Flexible Printed Circuit) 23, an FC (flip chip) bond, and an ACF (anisotropic conductive sheet). ) Or connected by a wire bond or the like. An SSOP (Shrink Small-Outline Package) 24 is connected to the other surface of the FPC 23 as shown in FIGS. 6B and 6C. The printed wiring board 26 includes a lower plate 27 and an upper plate 28 provided with a hole 28A. The chip assembly 21 and the printed wiring board 26 are built up.
[0004]
Next, an assembling method will be described with reference to FIGS. The chip assembly 21 is turned upside down and mounted in the hole 28A of the upper plate 28 of the printed wiring board 26. Thereafter, the FPC 23 is fixed to the upper plate 28 by ultrasonic welding or thermocompression bonding.
[0005]
Note that when the SSOP 24 is replaced with a TSSOP (Thin Short Small-Outline Package) 25 shown in FIG. 6D, the connection structure is configured to be thin.
[0006]
A conventional second connection structure will be described with reference to FIG. 7 (for example, see Patent Document 1).
[0007]
The electric circuit connection adhesive sheet 31 is formed by laminating a substrate film 32, an adhesive layer 33, and a flexible conductive layer 34.
[0008]
A pair of lower electrodes 37 and 38 are formed on the base material 36, and a button battery 39 is mounted on one of the lower electrodes 37. An electronic component 40 is connected between the pair of lower electrodes 37 and 38.
[0009]
When the adhesive layer 33 of the electric circuit connection adhesive sheet 31 is adhered to the surface of the substrate 36, the flexible conductive layer 34 comes into contact with the button battery 39 and the other lower electrode 38. Therefore, the electronic component 40 is driven.
[0010]
[Patent Document 1]
JP-A-10-241765 (pages 2-4, FIG. 2)
[0011]
[Problems to be solved by the invention]
The first connection structure of the related art requires a step of connecting a base chip or the like to an FPC and a step of connecting an FPC to a printed wiring board. Further, when mounting the base chip on the FPC, since FC bond, ACF, wire bond, or the like is used, heating, load, ultrasonic welding, or the like is required. The connecting device is necessary. Further, since thermocompression bonding and ultrasonic welding are required for connection between the printed wiring board and the FPC, a considerable tact time and an expensive connection device are required.
[0012]
In the second connection structure of the related art, the connection object is a highly rigid article such as a button battery, and the adhesive layer is employed. Cannot be repeatedly bonded and removed.
[0013]
Therefore, the present invention improves the drawbacks of both of the above conventional techniques, and provides a connection structure that is simple in connection process, can use a metal thin film having low rigidity as a connection means, and can repeat connection and disconnection. What you are trying to do.
[0014]
[Means for Solving the Problems]
The present invention employs the following means in order to solve the above problems.
[0015]
1. In a connection structure for connecting a connection member and a connection partner side on which an electronic component is mounted, the connection member is provided on a base material, an adhesive provided on the base material, and provided on the adhesive. The connection partner side has a storage part for storing the electronic component, and a conductor pattern, and when connecting the connection member and the connection partner side, the adhesive is used. A connection structure that electrically connects the metal thin film and the conductor pattern, and mechanically connects the connection member and the connection partner.
[0016]
2. In a connection structure for connecting an electronic component and a connection partner on which the electronic component is mounted by a connection member, the connection member is integrally formed of an adhesive and a metal thin film provided on the adhesive. The connection partner has the electronic component, a storage part that stores the electronic component, and a conductor pattern, and when connecting the connection member and the connection partner, the adhesive forms the metal. A connection structure for electrically connecting a thin film and the conductor pattern, and for mechanically connecting the connection member, the connection partner, and the electronic component.
[0017]
3. 3. The connection structure according to claim 2, wherein the adhesive is used to mechanically connect the electronic component to the connection member other than the connection member and the connection partner.
[0018]
4. 3. The connection structure according to the above item 2, wherein the adhesive is in a gel form.
[0019]
5. 3. The connection structure according to the item 2, wherein the adhesive is provided on a base material in the connection member.
[0020]
6. 3. The connection structure according to 1 or 2, wherein a plurality of the metal thin films are provided.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
The connection structure of the fifth embodiment of the present invention will be described.
[0022]
First, a first embodiment will be described with reference to FIGS.
[0023]
FIGS. 1A to 1E show an example of a structure in which five types of chip assemblies are mounted on a printed wiring board.
[0024]
1A, the chip assembly 2 includes a connection member 5, a bay chip 3 connected to one surface of the connection member 5, and an SSOP 4 connected to the other surface of the connection member 5. The bay chip 3 is housed in the recess or hole 1A of the printed wiring board 1. Both sides of the connection member 5 are connected to conductor patterns (described later) formed on the surface of the printed wiring board 1.
[0025]
In (b), two bay chips 3 are connected to one surface of the connection member 5.
[0026]
In (c), the chip assembly 2 has a two-layer structure, and includes a first connection member 5A, a first bay chip 3A, a second connection member 5B, and a second bay chip 3B. Are stacked in a sandwich shape. Both sides of the first connection member 5A and both sides of the second connection member 5B are respectively connected to conductor patterns formed on the surface of the printed wiring board 1.
[0027]
In (d), the chip assembly 2 has a three-layer structure, and includes a first connecting member 5A, a first bay chip 3A, a second connecting member 5B, and a second bay chip 3B. , The third connection member 5C and the third bay chip 3C are stacked in a sandwich shape. Both sides of the first connection member 5A, the left side of the second connection member 5B, and the right side of the third connection member 5C are connected to conductor patterns formed on the surface of the printed wiring board 1, respectively.
[0028]
In (e), the hole 1A of the printed wiring board 1 penetrates, the same chip assembly 2 as in (a) is mounted on the front side of the printed wiring board 1, and the second chip assembly 2 is mounted on the back side. Implemented. The second chip assembly 2 includes a second connection member 5B and a second bay chip 3B connected to one surface of the second connection member 5.
[0029]
The electrical and mechanical connection of the connection member 5 to the printed wiring board 1 will be described with reference to (f) and (g). An enlarged cross-sectional perspective view of a portion surrounded by a circle in (b) is shown in (g), and an enlarged cross-sectional perspective view before connecting the connection member 5 to the printed wiring board 1 is shown in (f).
[0030]
The connection member 5 is configured by laminating a base material 6, an adhesive 7, and a wiring pattern 8 formed on the surface of the adhesive 7. The wiring pattern 8 is formed by laminating a gold plating layer 8A, a nickel foil 8B, and a gold plating layer 8C, and is an elastically deformable metal thin film. The wiring pattern 8 conducts with the chip assembly 2.
[0031]
The conductor pattern 1B is formed on the surface of the printed wiring board 1. The conductor pattern 1B is formed by laminating a copper foil 1B1 and a gold plating layer 1B2.
[0032]
When the connection member 5 is pressed against the printed wiring board 1 in the direction of the arrow in the state of (f), the state of (g) is reached. In this state, the gold plating layer 8C of the wiring pattern 8 comes into contact with the gold plating layer 1B2 of the conductor pattern 1B, the surface of the adhesive 7 adheres to the surface of the printed wiring board 1, and the base material 6 and the adhesive 7 Each central portion is curved in a mountain shape according to the sum of the thicknesses of the conductor pattern 1B and the wiring pattern 8. In this manner, the connection member 5 and the printed wiring board 1 are electrically and mechanically connected.
[0033]
Next, a second embodiment will be described with reference to FIG.
[0034]
The electronic component 12 is housed in the hole 11 </ b> A of the circuit board 11. The connection member 13 is integrally formed of two elastically deformable metal thin films 14 and a gel adhesive 15 that covers each metal thin film 14.
[0035]
In the state shown in FIG. 2, the gel-like adhesive 15 adheres to the surface of the circuit board 11 and the surface of the electronic component 12, and each metal thin film 14 is formed of a conductive pattern (not shown) on the circuit board 11 and the electronic component. 12 terminals (not shown).
[0036]
When the connecting member 13 is removed from the circuit board 11 and the electronic component 12, the gel adhesive 15 and each metal thin film 14 are peeled off from the circuit board 11 and the electronic component 12 integrally. The connection member 13 can repeat connection and detachment.
[0037]
Next, a third embodiment will be described with reference to FIG. Regarding the third to fifth embodiments, the description of the same points as the second embodiment will be omitted, and only the different points will be described.
[0038]
The connecting member 13 is integrally formed in a vertically symmetrical shape with two metal thin films 14 having a U-shaped cross section and a gel adhesive 15 which is filled in the metal thin films 14 and intervenes.
[0039]
The lower surface of the gel adhesive 15 adheres to the upper surface of the electronic component 12, and the upper surface of the gel adhesive 15 adheres to the lower surface of another circuit board 17.
[0040]
Further, a fourth embodiment will be described with reference to FIG.
[0041]
The connection member 13 is integrally formed of two elastically deformable metal thin films 14, a gel adhesive 15 covering each metal thin film 14, and a base material 16 laminated on the gel adhesive 15. You. The material of the base material 16 is polyimide or PET (thermoplastic polyester resin) or the like.
[0042]
Further, a fifth embodiment will be described with reference to FIG.
[0043]
The electronic component 12 is housed in the through hole 11A of the circuit board 11. The connecting member 13 is integrally formed of two bent metal thin films 14 capable of elastic deformation, a gel adhesive 15 covering each metal thin film 14, and a base material 16 laminated on the gel adhesive 15. Is configured. The material of the base material 16 is an aluminum plate, a stainless steel plate, embossed PET, or the like.
[0044]
【The invention's effect】
As is clear from the above description, the present invention has the following effects.
[0045]
1. Provided is a connection structure capable of easily connecting a metal thin film of a connection member, a conductor pattern on a connection partner (a circuit board or the like), and a terminal of an electronic component.
[0046]
2. Since the connection member is integrally formed of the metal thin film and the adhesive, the connection and removal of the connection partner and the electronic component can be repeated.
[Brief description of the drawings]
FIGS. 1A to 1E are cross-sectional views of a connection structure according to a first embodiment of the present invention, in which five types of chip assemblies are mounted on a printed wiring board; f) is an enlarged cross-sectional perspective view of the state before the connection member is adhered to the printed wiring board, and (g) is an enlarged cross-sectional perspective view of the circular portion in (b).
FIG. 2 is a sectional view of a second embodiment of the present invention.
FIG. 3 is a sectional view of a third embodiment of the present invention.
FIG. 4 is a sectional view of a fourth embodiment of the present invention.
FIG. 5 is a sectional view of a fifth embodiment of the present invention.
FIGS. 6A and 6B are views of a first conventional connection structure, wherein FIG. 6A is a perspective view of a chip assembly and a printed wiring board, and FIG. 6B is a perspective view showing a method of assembling the chip assembly and the printed wiring board; (C) is an enlarged sectional view, and (d) is a perspective view of TSSOP.
FIG. 7 is a sectional view of a conventional second connection structure.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 printed wiring board 1A dent, hole conductor pattern 1B conductor pattern 1B1 copper foil 1B2 gold plated layer 2 chip assembly 3 bay chip 3A first bay chip 3B second bay chip 3C third bay・ Chip 4 SSOP
Reference Signs List 5 connecting member 5A first connecting member 5B second connecting member 5C third connecting member 6 base material 7 adhesive 8 wiring pattern (metal thin film)
8A Gold plating layer 8B Nickel foil 8C Gold plating layer 11 Circuit board 11A Hole 12 Electronic component 13 Connection member 14 Metal thin film 15 Gel adhesive 16 Base 17 Circuit board

Claims (6)

接続部材と電子部品が搭載された接続相手側とを接続する接続構造において、
前記接続部材は、基材と、前記基材上に配設された粘着剤と、前記粘着剤上に配設された金属薄膜とから一体に構成され、
前記接続相手側は、前記電子部品を収納する収納部と、導体パターンとを有し、
前記接続部材と前記接続相手側とを接続する際、前記粘着剤によって、前記金属薄膜と前記導体パターンとを電気的に接続し、前記接続部材と前記接続相手側とを機械的に接続することを特徴とする接続構造。In a connection structure for connecting a connection member and a connection partner on which an electronic component is mounted,
The connection member is integrally formed of a base material, an adhesive provided on the base material, and a metal thin film provided on the adhesive.
The connection partner side has a storage portion for storing the electronic component, and a conductor pattern,
When the connection member and the connection partner are connected, the metal thin film and the conductor pattern are electrically connected by the adhesive, and the connection member and the connection partner are mechanically connected. The connection structure characterized by the above. 電子部品と前記電子部品が搭載された接続相手側とを接続部材によって接続する接続構造において、
前記接続部材は、粘着剤と、前記粘着剤上に配設された金属薄膜とから一体に構成され、
前記接続相手側は、前記電子部品と、前記電子部品を収納する収納部と、導体パターンとを有し、
前記接続部材と前記接続相手側とを接続する際、前記粘着剤によって、前記金属薄膜と前記導体パターンとを電気的に接続し、前記接続部材と前記接続相手側と前記電子部品とを機械的に接続することを特徴とする接続構造。In a connection structure for connecting an electronic component and a connection partner on which the electronic component is mounted by a connection member,
The connection member is integrally formed of an adhesive and a metal thin film disposed on the adhesive,
The connection partner side has the electronic component, a storage portion that stores the electronic component, and a conductor pattern,
When connecting the connection member and the connection partner, the adhesive electrically connects the metal thin film and the conductor pattern, and mechanically connects the connection member, the connection partner, and the electronic component. A connection structure characterized in that the connection structure is connected. 請求項２記載の接続構造において、前記粘着剤によって、前記接続部材と前記接続相手側以外の接続相手側と前記電子部品とを機械的に接続することを特徴とする接続構造。The connection structure according to claim 2, wherein the electronic component is mechanically connected to the connection member and a connection partner other than the connection partner by the adhesive. 前記粘着剤がゲル状であることを特徴とする請求項２記載の接続構造。The connection structure according to claim 2, wherein the adhesive is in a gel form. 前記粘着剤は、前記接続部材において、基材上に配設されていることを特徴とする請求項２記載の接続構造。The connection structure according to claim 2, wherein the adhesive is provided on the base material in the connection member. 前記金属薄膜が複数設けられていることを特徴とする請求項１又は２記載の接続構造。The connection structure according to claim 1, wherein a plurality of the metal thin films are provided.
JP2002303130A 2002-10-17 2002-10-17 Connecting structure Withdrawn JP2004139833A (en)

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