JP2004121750A - Electronic endoscope - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To raise static electricity resistance while securing compatibility in a system without impairing the reduction of a diameter in an insertion part. <P>SOLUTION: The VDD (power rouce) and GND (ground) terminals of a solid-state imaging element 10 are connected to a video processor 24 via electric cables 31, 32. Terminals for vertical drive system signals (ϕV1-ϕV4), horizontal drive system signals, and video output signals of the solid-state imaging element 10 are connected to the video processor 24 via the core wires of co-axial wires 33, 34-40. The shield lines of the whole co-axial wires 33, 34-40 are collectively connected to the GND electric cable 32 in the neighborhood of the imaging element 10. The core wires of the co-axial wires 33, 34-36 for the vertical drive system signals are connected to the shield lines via capacitors C1, C2-C4 in an electric connector part 6. The shield lines of the co-axial wires 33, 34-36 for the vertical drive system signals are collectively connected to the electric cable 32 in the electric connector part 6. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic endoscope having an imaging element in a distal end portion of an insertion section.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, when an electronic endoscope is not connected to a processor, it is in an electrically floating state, and there is no portion to be grounded (GND). In addition, the contact pins of the electric connector of the electronic endoscope are often exposed. Therefore, if the electronic endoscope is erroneously touched with the contact pin or the like in a single state, the imaging element of the electronic endoscope may be electrostatically damaged.
[0003]
In response to this, there is an electronic endoscope in which the protection against static electricity is improved by installing a protection circuit in the image sensor (for example, see Patent Document 1).
[0004]
[Patent Document 1]
Japanese Patent Publication No. 6-104102 (pages 2-4, Fig. 1-12)
[0005]
[Problems to be solved by the invention]
However, in a conventional electronic endoscope in which a protection circuit is provided in an image sensor, there is a problem that the image sensor is enlarged by the protection circuit.
[0006]
In addition, a normal protection circuit has a structure in which a surge voltage is released to the GND side. However, in the case of driving with a binary or ternary pulse (High, Middle, Low) including a negative voltage (Low), this protection is performed. In a circuit, when a negative voltage is applied, current flows from the substrate side. Therefore, a negative power supply lower than the Low level has to be newly secured.
[0007]
This means that a change is required on the connected processor side, which causes a problem that system compatibility is lost.
[0008]
Japanese Patent Publication No. 6-104102 discloses a configuration in which a zener diode is provided between a V clock and GND. However, according to this configuration, static electricity applied to the V clock terminal is simply passed to the GND side. . Since the scope alone does not have GND in its original meaning, if this GND capacity is not sufficiently ensured, an unexpectedly large load may be applied to other terminals in the image sensor.
[0009]
The present invention has been made in view of the above circumstances, and provides an electronic endoscope that can improve electrostatic resistance without impairing the reduction in the diameter of the insertion portion and while maintaining system compatibility. The purpose is to provide.
[0010]
[Means for Solving the Problems]
The electronic endoscope according to claim 1, wherein the electronic endoscope includes an image pickup device in a distal end portion of the insertion section, and a signal cable having a plurality of signal lines electrically connected to the image pickup device. And an electronic endoscope in which the signal cable is inserted into a universal cord portion and the signal cable is connected to an external contact portion by an electric connector portion, wherein an image sensor drive pulse including a negative voltage is transmitted among a plurality of signal lines of the signal cable. A signal line is connected to a ground terminal of the image sensor via a capacitor.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First Embodiment)
1 to 3 relate to a first embodiment of the present invention. FIG. 1 is a block diagram illustrating an electrical connection state between a solid-state imaging device and a video processor. FIG. 2 is a plan view illustrating a configuration of an electrical connector unit in FIG. FIG. 3 is an explanatory view showing the entire configuration of the electronic endoscope.
[0012]
(Constitution)
First, the overall configuration of the electronic endoscope 1 will be described with reference to FIG.
As shown in FIG. 3, the electronic endoscope 1 is configured by connecting an insertion section 2, an operation section 3, a universal code section 4, and a scope connector section 5.
[0013]
The solid-state imaging device 10 is arranged inside the distal end of the insertion section 2.
The scope connector section 5 is provided with an electric connector section 6 and a light guide connector section 7.
[0014]
The electrical connector section 6 is formed such that the scope-side connector 22 of the connection cord 21 is detachable. The processor-side connector 23 of the connection cord 21 is connected to the video processor 24.
[0015]
On the other hand, one end of a signal cable 11 is electrically connected to the solid-state imaging device 10. The other end of the signal cable 11 is connected to a terminal in the electric connector section 6 of the scope connector section 5 from the insertion section 2 via the operation section 3 and the universal cord section 4.
[0016]
The electrical connector section 6 is electrically connected to the video processor 24 of the external device via the connection cord 21 by connecting the scope side connector 22.
[0017]
The light guide connector 7 is optically connected to the light source device 25.
The light source device 25 guides the illumination light to the light guide connector unit 7.
Next, an electrical connection state between the solid-state imaging device 10 and the video processor 24 will be described with reference to FIG.
[0018]
As shown in FIG. 1, the signal cable 11 is connected to a vertical drive system signal (φV1 to φV4), a horizontal drive system signal (φH1, φH2, φR), a video output signal (Vout), a power supply (VDD), and a ground (GND). This is a composite cable composed of ten signal lines.
[0019]
The VDD and GND signal lines use electric wires 31, 32, respectively, and the other eight signal lines use coaxial lines 33, 34,.
[0020]
The vertical drive system signals φV1 and φV3 are ternary pulse (High, Middle, and Low) signals including a negative voltage (Low). The vertical drive system signals φV2 and φV4 are binary pulse (Middle, Low) signals including a negative voltage (Low).
[0021]
The horizontal drive system signals (φH1, φH2, φR) are binary pulse (High, Middle) signals that do not include a negative voltage.
[0022]
The VDD and GND terminals of the solid-state imaging device 10 are connected to the VDD and GND terminals of the video processor 24 via electric wires 31 and 32, respectively.
[0023]
Terminals for the vertical drive system signals (φV1 to φV4), the horizontal drive system signals (φH1, φH2, φR), and the video output signal (Vout) of the solid-state imaging device 10 pass through the cores of the coaxial lines 33, 34,. The video processor 24 is connected to terminals for vertical drive system signals (φV1 to φV4), horizontal drive system signals (φH1, φH2, φR), and video output signals (Vout).
[0024]
In the vicinity of the solid-state imaging device 10, the outer conductors (shield wires) of all the coaxial wires 33, 34,..., 40 are collectively connected to a GND wire 32.
[0025]
In the electrical connector section 6, the inner conductors (core wires) of the coaxial lines 33, 34... 36 of the vertical drive system signals (φV1 to φV4) and the shield lines are connected via capacitors C1, C2.
[0026]
The shield wires of the coaxial lines 33, 34,... 36 of the vertical drive system signals are collectively connected to the GND wire 32 in the electrical connector section 6.
[0027]
Next, the configuration of the electrical connector section 6 will be described in detail with reference to FIG.
A board 42 is provided inside the connector case 41 of the electrical connector section 6. The substrate 42 is provided with contact pins 51, 52... 56, 63, 64... 66, which are male pins, and coaxial contacts 57, 58.
[0028]
The contact pins 51, 52... 56, 63, 64... 66 are used for VDD, GND, a core wire of a vertical drive system signal, and a shield wire. That is, the contact pins 51, 52 are respectively connected to the electric wires 31, 32, the contact pins 53, 54,... 56 are respectively connected to the core wires of the coaxial wires 33, 34,. 36 are connected to the shield wires of the coaxial wires 33, 34,.
[0029]
The internal contacts of the coaxial contacts 57, 58... 60 are female pins and are connected to the respective core wires of the coaxial wires 37, 38.
[0030]
The external contacts of the coaxial contacts 57, 58... 60 are provided in an insulated state on the outer periphery of the internal contacts, and are connected to the respective shield wires of the coaxial wires 37, 38. The internal contacts of the coaxial contacts 57, 58... 60 are structured so as not to be directly touched from the outside.
[0031]
The contact pins 63, 64,... 66 of the shield line of the vertical drive system signal and the contact pin 52 of GND are provided at the same potential in the GND section 43 on the substrate 42. It is desirable that the GND section 43 has an area as large as possible.
[0032]
The contact pins 53, 54... 56 of the core lines of the vertical drive system signals and the GND section 43 are connected via chip-type capacitors C1, C2. Thereby, the connection of the electrical connector section 6 shown in FIG. 1 is realized.
[0033]
According to such a structure, the electronic endoscope 1 has the image pickup device 10 in the distal end portion of the insertion section 2 and a plurality of signal lines (electric wires 31 and 32, coaxial lines) electrically connected to the image pickup device 10. The signal cable 11 having the wires 33, 34,... 40) is inserted into the operation section 3 and the universal cord section 4, and the signal cable 11 is connected to the external contact section by the electric connector section 6.
[0034]
The electronic endoscope 1 connects signal lines (core lines of coaxial lines 33, 34... 36) for transmitting an image pickup device drive pulse including a negative voltage among a plurality of signal lines of the signal cable 11 to capacitors C1, C2. Is connected to a ground terminal of the image pickup device 10 via the.
[0035]
The video processor 24 is an external device. The connection code 21 is a connection code for an external device. The scope side connector 22 is a connector for a connection cord of an external device.
[0036]
(Action)
Here, the terminal of the horizontal drive system signal of the solid-state imaging device has a lower electrostatic resistance than the conventional one. For this reason, in the first embodiment, as shown in FIG. 2, coaxial contacts 57, 58,... In addition, a new type of ultra-compact solid-state imaging device generally has lower static electricity resistance than a conventional solid-state imaging device. As the electrostatic resistance of the entire solid-state imaging device has decreased, the electrostatic resistance of the terminals of the vertical drive system signals has become relatively weaker than the terminals of the horizontal drive system signals as a single unit. For this reason, it is desirable that the terminals of the vertical drive system signals also make coaxial contacts in the electrical connector section. However, in order to ensure the compatibility of the video processor 24 or the connection cord 21, the contact pins 63, 64,... 66 of the vertical drive system signal cannot be changed to coaxial contacts.
[0037]
For this reason, in the first embodiment, the core portions of the coaxial lines 33, 34... 36 of the vertical drive system signals are connected to the shield lines of the coaxial lines 33, 34. Since the shielded wires of the coaxial lines 33, 34... 36 are connected together to the GND electric wire 32, even if a large static electricity is applied to the core portions of the coaxial lines 33, 34. Since static electricity falls to GND, no large load is applied to this terminal. Even when static electricity flows to the GND side, the capacitor C1, C2 ... C4 greatly reduces the voltage, so no sharp voltage is applied to GND. The other terminals in the solid-state imaging device 10 are not destroyed.
[0038]
(effect)
As described above, according to the first embodiment, since it is not necessary to provide a protection circuit at a terminal of the solid-state imaging device 10 having a weak electrostatic resistance, a reduction in the diameter of the insertion portion is not impaired, and Since the electrical connector section 6 having the same pin arrangement as that of the conventional electronic endoscope can be used, the electrostatic resistance can be improved while maintaining the compatibility of the system, and the diameter of the insertion section 2 of the electronic endoscope 1 can be reduced. And improve reliability.
[0039]
(Second embodiment)
4 and 5 relate to a second embodiment of the present invention. FIG. 4 is an explanatory view showing the entire configuration of the electronic endoscope, and FIG. 5 shows a state after a scope-side connector is connected to an electric connector. FIG.
[0040]
In the description of the second embodiment with reference to FIGS. 4 and 5, the same components as those of the first embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals, and description thereof will be omitted. I have.
[0041]
(Constitution)
First, a state before the scope-side connector 22 is connected to the electric connector unit 106 of the electronic endoscope 101 will be described with reference to FIG.
[0042]
The first substrate 112 is fixed to the connector case 111.
First contact pins 113 are fixed to the first substrate 112 with solder or the like. Second contact pins 115 are fixed to the second substrate 114.
As shown in FIG. 5, the second contact pin 115 includes an male pin portion 116, a fixing portion 117, a female pin portion 118 and a contact spring 119.
[0043]
The scope side connector 22 is provided with a contact 81 which is a female pin.
The male pin 116 is connected to the contact 81 of the scope connector 22.
The fixing section 117 is fixed to the second substrate 114.
The female pin 118 is connected to the first contact pin 113. The contact spring 119 is provided on the female pin 118, and presses and fixes the first contact pin 113.
[0044]
In a state where the electrical connector section 106 and the scope-side connector 22 are not connected, the second contact pin 115 and the first contact pin 113 are not in contact with each other so that the first board 112 and the second board 114 are not in contact with each other. Is provided with a spring 120.
[0045]
(Action)
When connecting the scope-side connector 22 to the electrical connector section 106 shown in FIG. 4, the contact 81 is first connected to the male pin section 116, and when pressed in this state, the second board 114 approaches the first board 112. Then, the first contact pin 113 is connected to the female pin 118 and the contact spring 119.
[0046]
(effect)
As described above, according to the second embodiment, the terminal (the first contact pin 113) of the electrical connector unit 106 connected to the solid-state imaging device 10 is not exposed to the outside, so that one of the electronic endoscopes 101 is not exposed. The static electricity resistance as a single unit is improved.
[0047]
(Third embodiment)
6 and 7 relate to a third embodiment of the present invention. FIG. 6 is a cross-sectional view showing a state before a scope-side connector is connected to an electric connector. FIG. It is sectional drawing which shows the state which connected.
[0048]
In the description of the third embodiment with reference to FIGS. 6 and 7, the same components as those in the first embodiment shown in FIGS. I have.
[0049]
(Constitution)
As shown in FIGS. 6 and 7, contact pins 53, 54, and 63 are fixed to a board 212 fixed to the connector case 211 with solder or the like.
[0050]
A first contact pin 231 is fixed to one of the guide holes 213 provided in the substrate 212, and a second contact pin 232 is provided to the other of the guide holes 213.
[0051]
The second contact pin 232 includes a male pin 233 connected to the contact 81, a contact 234 connected to the first contact pin 231, and a guide cylinder 235. The guide cylinder 235 is an insulating member for guiding the movement of the first contact pin 231.
[0052]
The first contact pin 231, the male pin 233, and the contact 234 are conductive members.
[0053]
When the electric connector 206 and the scope-side connector 22 shown in FIG. 6 are not connected, the first contact pin 231 and the contact portion 234 do not come into contact with each other. A spring 236 is provided between the holes 213.
[0054]
(Action)
When the scope connector 22 is connected to the electrical connector unit 206 shown in FIG. 7 from the state before the scope connector 22 is connected to the electrical connector unit 206 shown in FIG. 6, first, the contact 81 is connected to the male pin unit 233. When pushed in this state, the contact portion 234 is connected to the first contact pin 231.
[0055]
(effect)
As described above, according to the third embodiment, since the terminal (first contact pin 231) of the electrical connector unit 206 connected to the solid-state imaging device 10 (see FIG. 1) is not exposed to the outside, the electronic The endurance of the endoscope 201 as a single unit is improved.
[0056]
(Fourth embodiment)
8 and 9 relate to a fourth embodiment of the present invention. FIG. 8 is a cross-sectional view showing a state before the scope connector is connected to the electrical connector. FIG. 9 is a view showing the scope connector connected to the electrical connector. It is sectional drawing which shows the state which connected.
[0057]
In the description of the fourth embodiment with reference to FIGS. 8 and 9, the same components as those in the first embodiment shown in FIGS. I have.
[0058]
(Constitution)
First, as shown in FIGS. 8 and 9, a board 262 is fixed to a connector case 261 of the electrical connector section 256.
[0059]
The contact pins 53, 54, 55, 63 are fixed to the board 262 by solder or the like.
[0060]
The protection board 263 is provided with a pin hole 264 through which the contact pins 53, 54, 55, 63 are inserted.
[0061]
Further, a guide hole 265 is provided in the protection substrate 263. A fixing pin 266 and a spring 267 are provided in the guide hole 265.
[0062]
A guide hole 268 is provided in the connector case 261. A release pin 269 is provided in the guide hole 268.
[0063]
A spring 270 is provided between the board 262 and the protection board 263 so that the tips of the contact pins 53, 54, 55, 63 do not protrude from the protection board 263 when the electrical connector section 256 and the scope-side connector 22 are not connected. Have been.
[0064]
At the position shown in FIG. 8, the fixing pin 266 pushes the release pin 269 in a state of being inserted into the guide hole 268, and the distal end of the release pin 269 projects outside. At this time, since the position of the protection board 263 is locked, the state where the contact pins 53, 54, 55, 63 are stored inside the protection board 263 is kept.
[0065]
(Action)
When the scope connector 22 is connected to the electrical connector 256 shown in FIG. 9 from the state before the scope connector 22 is connected to the electrical connector 256 shown in FIG. 8, first, the scope connector is connected to the electrical connector 256. When the connector 22 is pressed, the connector case 82 of the scope-side connector 22 pushes down the release pin 269, and then the release pin 269 pushes down the fixing pin 266, so that the protection board 263 becomes free. By pushing the scope-side connector 22 as it is, the contact 81 is connected to the corresponding contact pins 53, 54, 55, 63.
[0066]
(effect)
As described above, according to the fourth embodiment, the terminals (contact pins 53, 54, 55, 63) of the electrical connector unit 256 connected to the solid-state imaging device 10 (see FIG. 1) are not exposed to the outside. Therefore, the resistance to static electricity as one unit of the electronic endoscope is improved.
[0067]
(Fifth embodiment)
10 and 11 relate to a fifth embodiment of the present invention. FIG. 10 is a front view showing a configuration of an electric connector, and FIG. 11 is a sectional view of the electric connector.
[0068]
(Constitution)
As shown in FIGS. 10 and 11, in the electrical connector section 306 of the fifth embodiment, terminals having weak electrostatic resistance (for example, φV1 and φV2) are replaced with short pins 353 and 354, and terminals having strong electrostatic resistance ( For example, VDD and the like) and GND are long pins 351 and 352.
[0069]
Further, the electric connector section 306 is provided with coaxial contacts 357 and 358.
(Action)
In the fifth embodiment, a plurality of long pins 351, 352, 353 and coaxial contacts 357, 358 surround short pins 353, 354, or an outer wall of a connector case 311 and long pins 351, 352, 353, coaxial contacts. By forming the pins 357 and 358 so as to surround the short pins 353 and 354, the possibility of contact with the short pins 353 and 354 can be reduced.
[0070]
(effect)
As described above, according to the fifth embodiment, the possibility of contact is reduced by using terminals with weak static electricity resistance (for example, φV1, φV2, etc.) as the short pins 353, 354. The static electricity resistance as one unit of the endoscope is improved.
[0071]
By the way, in a conventional electronic endoscope, when a flare occurs in an image sensor, the image quality is greatly reduced. The following embodiment relates to flare prevention of an image sensor.
[0072]
(Sixth embodiment)
12 and 13 relate to a sixth embodiment of the present invention. FIG. 12 is a cross-sectional view showing an image sensor and its peripheral portion, and FIG. 13 is a front view of the image sensor and its peripheral portion.
[0073]
(Constitution)
As shown in FIGS. 12 and 13, a rectangular image area 411 is provided on one surface of the solid-state imaging device 410. A terminal row 412 is provided at one end of one surface of the solid-state imaging device 410. A first chamfer 413 and a second chamfer 414 are provided on the back surface of the solid-state imaging device 410.
[0074]
A rectangular cover glass 415 is attached to one surface of the solid-state imaging device 410 so as to completely cover the image area 411 except for the terminal row 412.
[0075]
An inner lead 417 is provided at one end of the flexible substrate 416. The flexible board 416 has an electronic component 418 mounted on one surface, and a cable land to which the signal cable 11 is connected is provided on the other surface.
[0076]
The inner lead 417 is connected and fixed to a terminal row 412 of the solid-state imaging device 410 via a bump 419. The flexible substrate 416 is bent at the inner lead 417 along the first chamfered portion 413. The sealing portion 420 for sealing around the inner leads 417 and the bumps 419 is covered with an adhesive to improve electrical resistance and mechanical resistance.
[0077]
An optical member 421 is fixed to the surface of the cover glass 415 with a UV adhesive. A flat portion 422 is provided on a part of the optical member 421, and the flat portion 422 is disposed on the sealing portion 420 side of the cover glass 415, and is bonded at a position where the flat portion 422 does not protrude from the sealing portion 420. I have.
[0078]
(Action)
In the sixth embodiment, when the cover glass 415 and the optical member 421 are bonded, the adhesives 431 and 432 usually protrude as shown in the figure. If the adhesive is left here, it causes image flare, so it is necessary to remove the adhesive. If the optical member 421 has a circular shape without the flat portion 422 as indicated by a dotted line, the adhesive 432 will protrude into a very sandwiched portion between the optical member 421 and the sealing portion 420. Removal becomes very difficult.
[0079]
With the configuration of the sixth embodiment, the adhesive 432 can be easily removed via the flat portion 422.
[0080]
After removing the adhesives 431 and 432, the optical member 421 is attached to the lens frame 424 with the flare cut mask 423 arranged on the front side.
[0081]
(effect)
As described above, according to the sixth embodiment, the adhesive 431 and 432 can be easily removed at the time of bonding the cover glass 415 and the optical member 421, so that image flare can be easily prevented.
[0082]
In addition, by providing the first chamfered portion 413 and the second chamfered portion 414 in FIG. 11, the solid-state imaging device 410 and the flexible substrate 416 can be used in common for direct-view observation as shown in FIGS. , Oblique observation, and rear oblique observation electronic endoscope.
[0083]
FIG. 14 is a side view showing an image sensor according to a first modification of the sixth embodiment and its peripheral portion.
[0084]
In the description of the first modified example using FIG. 14, the same components as those in the sixth embodiment shown in FIGS. 12 and 13 are denoted by the same reference numerals, and description thereof is omitted.
[0085]
As illustrated in FIG. 14, the optical member 441 to be attached to the cover glass 415 has a chamfered portion 442 at a corner on the sealing portion 420 side on the rear surface.
[0086]
According to the first modification, the adhesive 432 can be easily removed via the chamfered portion 442, so that the same effect as that of the sixth embodiment shown in FIGS. 12 and 13 can be obtained.
[0087]
FIG. 15 is a side view showing an image sensor and its peripheral portion according to a second modification of the sixth embodiment.
[0088]
In the description of the second modification example using FIG. 15, the same components as those in the sixth embodiment shown in FIGS. 12 and 13 are denoted by the same reference numerals, and description thereof is omitted.
[0089]
As shown in FIG. 15, the optical member 451 to be attached to the cover glass 415 has a notch 452 at a corner on the rear surface side of the sealing portion 420.
[0090]
According to the second modification, the adhesive 432 can be easily removed through the cutout portion 452, so that the same effect as in the sixth embodiment can be obtained.
[0091]
(Seventh embodiment)
16 and 17 relate to a seventh embodiment of the present invention. FIG. 16 is a cross-sectional view showing an image sensor and its peripheral portion, and FIG. 17 is a front view of the image sensor.
[0092]
(Constitution)
As shown in FIGS. 16 and 17, a first cutout 513 and a second cutout 514 are provided on the back surface of the solid-state imaging device 510.
[0093]
The flexible substrate 416 is bent at the inner lead 417 so as to contact the front and rear edges of the first cutout 513. The viewing direction of the solid-state imaging device 510 is inclined at an acute angle with respect to the horizontal front direction of the plate surface of the flexible substrate 416.
[0094]
A rectangular cover glass 515 is attached to one surface of the solid-state imaging device 510 so as to completely cover the image area 411 except for the terminal row 412.
[0095]
A circular optical member 521 is fixed to the surface of the cover glass 515 with a UV adhesive.
[0096]
Here, by providing a cutout portion 541 at a corner portion of the cover glass 515 facing the terminal row 412, the optical member 521 on the sealing portion 420 side on the surface where the circular optical member 521 and the cover glass 515 are attached. Does not protrude from the cover glass 515.
[0097]
(Action)
When the cover glass 515 and the optical member 521 are attached to each other, the adhesive 532 is exposed to a wide portion from the sealing portion 420 side of the optical member 521, so that the adhesive 532 can be easily removed.
[0098]
(effect)
As described above, according to the seventh embodiment, the adhesive 431 and 532 can be easily removed when the cover glass 515 and the optical member 521 are bonded, so that image flare can be easily prevented.
[0099]
In addition, since the solid-state imaging device 510 is provided with the first cutout portion 513 and the second cutout portion 514 in FIG. 16, the solid-state imaging device 510 and the flexible substrate 416 are shared, for direct-view observation and oblique observation. And an electronic endoscope for oblique observation from behind.
[0100]
The effect of providing the first notch 513 and the second notch 514 will be described in more detail with reference to FIGS.
[0101]
FIG. 18 is an explanatory view showing an image pickup device and its peripheral portion in the case where the solid-state image pickup device shown in FIG. 16 is applied to an electronic endoscope for oblique observation from the rear, and FIG. FIG. 20 is an explanatory diagram showing the distal end of an insertion portion when applied to an electronic endoscope for use. FIG. 20 is an explanatory diagram showing the distal end of an insertion portion when the solid-state imaging device shown in FIG. 16 is applied to an electronic endoscope for oblique observation. FIG. 21 is an explanatory diagram showing the distal end of the insertion section when the solid-state imaging device shown in FIG. 18 is applied to an electronic endoscope for oblique observation from behind.
[0102]
As shown in FIG. 18, the flexible substrate 416 is bent at the inner lead 417 so as to contact the front and rear edges of the second notch 514. The viewing direction of the solid-state imaging device 510 forms an obtuse angle with respect to the horizontal front direction of the plate surface of the flexible substrate 416, and faces rearward.
[0103]
As shown in FIG. 19, a flexible substrate 416 and a solid-state image sensor 510 arranged as shown in FIG. 16 are used at the distal end of the insertion section 602 of the electronic endoscope 601 for direct observation.
[0104]
The distal end main body 603 of the insertion section 602 is made of metal, and has a mounting hole 605 so that the imaging unit 604 can be mounted. The mounting hole 605 is formed along the insertion direction of the insertion portion 602.
[0105]
The imaging unit 604 is obtained by attaching optical members 521, 612, and 613 to a cylindrical lens frame 611. The optical axis directions of the optical members 521, 612, and 613 attached to the lens frame 611 correspond to the viewing direction of the solid-state imaging device 510.
[0106]
With such a structure, the viewing direction of the solid-state imaging device 510 matches the insertion direction of the insertion section 602. That is, the flexible substrate 416 and the solid-state imaging device 510 having the arrangement shown in FIG. 16 can be applied to the electronic endoscope 601 for direct observation.
[0107]
As shown in FIG. 20, a flexible substrate 416 and a solid-state imaging device 510 having the arrangement shown in FIG. 16 are used at the distal end of the insertion portion 632 of the electronic endoscope 631 for oblique observation.
[0108]
The distal end main body 633 of the insertion portion 632 is made of metal, and has a mounting hole 635 so that the imaging unit 604 can be mounted. The mounting hole 635 is formed to be inclined by an acute angle θ1 with respect to the insertion direction of the insertion portion 632.
[0109]
With such a structure, the viewing direction of the solid-state imaging device 510 is inclined by an acute angle θ1 with respect to the insertion direction of the insertion section 632. That is, the flexible substrate 416 and the solid-state imaging device 510 having the arrangement shown in FIG. 16 can be applied to the electronic endoscope 631 for oblique observation.
[0110]
As shown in FIG. 21, an imaging unit 654 including a flexible substrate 416 and a solid-state imaging device 510 arranged as shown in FIG. 18 is used at the distal end of the insertion portion 652 of the electronic endoscope 651 for oblique rear observation. .
[0111]
The distal end main body 653 of the insertion portion 652 is made of metal, and has a mounting hole 655 so that the imaging unit 654 can be mounted. The mounting hole 655 is formed to be inclined backward by an acute angle θ2 with respect to a direction orthogonal to the insertion direction of the insertion portion 652.
[0112]
With such a structure, the viewing direction of the solid-state imaging device 510 is inclined by an obtuse angle (90 ° + θ2) with respect to the insertion direction of the insertion portion 652. That is, the flexible substrate 416 and the solid-state imaging device 510 having the arrangement shown in FIG. 18 can be applied to the electronic endoscope 651 for oblique observation from the rear.
[0113]
In particular, the arrangement of the flexible substrate 416 and the solid-state imaging device 410 shown in FIG. 12 is suitable for an electronic endoscope for direct viewing observation as shown in FIG. 19, and the arrangement of the flexible substrate 416 and the solid-state imaging device shown in FIG. The arrangement of the element 510 is suitable for an electronic endoscope for oblique observation as shown in FIG. 20, and the arrangement of the flexible substrate 416 and the solid-state imaging element 510 in the arrangement shown in FIG. Suitable for electronic endoscopes.
[0114]
(Eighth embodiment)
FIGS. 22 to 24 relate to an eighth embodiment of the present invention, FIG. 22 is a front view showing a distal end face of an insertion portion of an electronic endoscope, FIG. 23 is a sectional view showing a light guide fiber bundle, and FIGS. FIG. 23 is a sectional view taken along line AA of FIG. 22.
[0115]
(Constitution)
As shown in FIG. 22, a distal end cover 703 is attached to the distal end of the insertion section 702 of the electronic endoscope 701.
[0116]
An objective lens 711, an air / water supply nozzle 712, a forceps channel hole 713, first and second illumination lenses 714, 715, and a sub water supply channel hole 716 are provided on a distal end surface 704 of the distal end cover 703.
[0117]
In the conventional illumination means of an electronic endoscope, when the number of light guide fiber bundles for an illumination lens is large, a core metal is provided at a central portion thereof to improve light distribution. In the present embodiment, a sub water supply channel is provided in this cored bar portion.
[0118]
As shown in FIG. 23, the sub-water supply channel 717 has a pipe 719 provided at the center from the illumination lens 715 to the tip of the light guide fiber bundle 718, and a tube 720 fixed to the rear end.
[0119]
The distal end of the sub water supply channel 717 is a sub water supply channel hole 716. The light guide fiber bundle 718 and the tube 720 are separated in an insertion tube (not shown) of the electronic endoscope 701.
[0120]
As shown in FIG. 24, a drain portion 721 is provided on the distal end surface 704 of the distal end cover 703 between the objective lens 711 and the forceps channel hole 713. The drainer 721 may be inclined as shown in the drawing, or the center axis of the forceps channel hole 713 may be inclined toward the objective lens 711.
[0121]
(Action)
In the insertion section 702 of the electronic endoscope 701, water is supplied by an air supply / water supply nozzle 712 and a sub water supply channel 716 provided inside the illumination lens 715. The water supply from the air supply / water supply nozzle 712 is lateral water supply on the objective lens 711 side. Water is supplied by the sub water supply channel 716 to the front of the insertion section 702.
[0122]
Water droplets and the like remaining on the surface of the objective lens 711 are easily flowed in the direction of the forceps channel hole 713 by the drainage portion 721, and the drainage can be easily performed by applying suction.
[0123]
(effect)
As described above, according to the eighth embodiment, since the auxiliary water supply channel 717 is provided inside the illumination lens 715 and the light guide fiber bundle 718, the distal end diameter of the insertion portion 702 can be increased by this configuration. No water supply function can be added without lowering the light distribution. In addition, the drain unit 721 can easily drain the water droplets and the like remaining on the surface of the objective lens 711.
[0124]
(Ninth embodiment)
25 and 26 relate to a ninth embodiment of the present invention. FIG. 25 is a front view showing a distal end surface of an insertion portion of the electronic endoscope, and FIG. 26 is a cross-sectional view of the insertion portion of the electronic endoscope. is there.
[0125]
(Constitution)
As shown in FIG. 25, a distal end cover 803 is provided at the distal end of the insertion section 802 of the electronic endoscope 801.
[0126]
The distal end surface 804 of the distal end cover 803 is provided with an objective lens 811, a water supply port 812, a water intake port 813, a forceps channel hole 814, and first and second illumination lenses 815 and 816.
[0127]
As shown in FIG. 25, the distal end main body 820 is provided with an imaging unit 821 provided with the objective lens 811 at the distal end, and a water supply channel 822 and a water absorption channel 823 communicating with a water supply port 812 and a water intake port 813, respectively. I have.
[0128]
The water supply channel 822 and the water absorption channel 823 provided in the distal end main body 820 are formed so as to go toward the center of the objective lens 811 toward the distal end.
[0129]
The front end cover 803 is provided with a water supply port 812 and a water supply port 813 in accordance with the water supply channel 822 and the water absorption channel 823.
[0130]
The diameter of the water supply port 812 and the water absorption port 813 at the distal end surface is formed smaller than the diameter of the water supply channel 822 and the water absorption channel 823 at the distal end surface of the distal end main body 820, and is closer to the center of the objective lens 811. Position.
[0131]
(Action)
By applying suction from the direction of the water absorption channel 823 in synchronization with the timing of performing air supply or water supply from the direction of the water supply channel 822, air supply and water supply are performed on the surface of the objective lens 811 and the surface of the objective lens 811 can be cleaned.
[0132]
(effect)
As described above, according to the ninth embodiment, the objective lens 811 can be washed without providing a nozzle in front of the distal end surface of the objective lens 811. The visual field range can be set, and the distal end diameter of the insertion section 802 can be reduced.
[0133]
[Appendix]
According to the above-described embodiment of the present invention as described in detail above, the following configuration can be obtained.
[0134]
(Additional Item 1) An image pickup device is provided in the distal end portion of the insertion portion, and a signal cable having a plurality of signal lines electrically connected to the image pickup device is inserted into the operation portion and the universal cord portion, and the signal cable is electrically connected. In the electronic endoscope connected to the external contact part by the connector part,
An electronic endoscope, wherein a signal line for transmitting an image sensor drive pulse including a negative voltage among a plurality of signal lines of the signal cable is connected to a ground terminal of the image sensor via a capacitor.
[0135]
(Additional Item 2) An image sensor is provided in the distal end portion of the insertion portion, and a signal cable having a plurality of signal lines electrically connected to the image sensor is inserted into the operation portion and the universal cord portion, and the signal cable is electrically connected. In the electronic endoscope connected to the external contact part by the connector part,
The electric connector portion is detachable with a connector of a connection cord of an external device,
The external contact portion,
A first contact pin arranged inside the electrical connector portion and connected to the signal cable;
It is arranged outside the electrical connector portion, and is configured by an outer second contact pin connected to the connector of the connection cord,
In a state where the connector of the connection cord is not connected to the electric connector of the electronic endoscope, the first contact pin and the second contact pin are separated from each other, and the connection is made to the electric connector of the electronic endoscope. An electronic endoscope wherein the first contact pin and the second contact pin are connected when the cord connector is connected.
[0136]
(Additional Item 3) An image sensor is provided in the distal end portion of the insertion portion, and a signal cable having a plurality of signal lines electrically connected to the image sensor is inserted into the operation portion and the universal cord portion, and the signal cable is electrically connected. In the electronic endoscope connected to the external contact part by the connector part,
The electric connector portion is detachable with a connector of a connection cord of an external device,
The electrical connector portion is provided with a protective substrate and a spring for urging the protective substrate outward,
The protection board is provided with a pin hole into which a contact pin of an external contact portion can be inserted,
In a state where the connector of the connection cord is not connected to the electric connector section of the electronic endoscope, the contact pin of the external contact section is hidden in the pin hole of the protection board, and the electric connector section of the electronic endoscope is provided with the contact pin. An electronic endoscope wherein a contact pin of an external contact portion protrudes from a pin hole of the protection board when the connector of the connection cord is connected.
[0137]
(Supplementary Note 4) An image sensor is provided in the distal end portion of the insertion portion, and a signal cable having a plurality of signal lines electrically connected to the image sensor is inserted into the operation portion and the universal cord portion, and the signal cable is electrically connected. In the electronic endoscope connected to the external contact part by the connector part,
An electronic endoscope, wherein a terminal having a weak electrostatic resistance of the external contact portion is a short pin, and a terminal having a strong electrostatic resistance of the external contact portion is a long pin.
[0138]
(Additional Item 5) An image pickup device, a flexible substrate on which the image pickup device is mounted, a cover glass adhered and fixed to the image pickup surface of the image pickup device, and an adhesive fixation on the front side of the cover glass are provided in the distal end portion of the insertion section. An electronic device having an optical member and having a signal cable having a plurality of signal lines electrically connected to the flexible substrate inserted through the operating portion and the universal cord portion, and connecting the signal cable to an external contact portion with an electrical connector portion. In an endoscope,
A first chamfer and a second chamfer are provided on the back surface of the image sensor,
An electronic endoscope, wherein the flexible substrate is connected and fixed to the image sensor along one of a first chamfered portion and a second chamfered portion of the image sensor.
[0139]
(Additional Item 6) An image pickup device, a flexible substrate on which the image pickup device is mounted, a cover glass adhered and fixed to the image pickup surface of the image pickup device, and an adhesive fixation on the front side of the cover glass are provided in the distal end portion of the insertion portion. An electronic device having an optical member and having a signal cable having a plurality of signal lines electrically connected to the flexible substrate inserted through the operating portion and the universal cord portion, and connecting the signal cable to an external contact portion with an electrical connector portion. In an endoscope,
A first notch and a second notch are provided on the back surface of the image sensor,
The electronic endoscope, wherein the flexible substrate is in contact with one of the first notch and the second notch of the image pickup device to connect and fix the image pickup device.
[0140]
(Additional Item 7) An image pickup device, a flexible substrate on which the image pickup device is mounted, a cover glass adhered and fixed to the image pickup surface of the image pickup device, and an adhesive fixation on the front side of the cover glass are provided in the distal end portion of the insertion portion. An electronic device having an optical member and having a signal cable having a plurality of signal lines electrically connected to the flexible substrate inserted through the operating portion and the universal cord portion, and connecting the signal cable to an external contact portion with an electrical connector portion. In an endoscope,
The optical member has a chamfer or a notch formed at a part of the rear corner, and the adhesive between the optical member and the cover glass is easily removed through the chamfer or the notch. An electronic endoscope characterized in that it is made possible.
[0141]
(Supplementary Item 8) An image pickup device, a flexible substrate on which the image pickup device is mounted, a cover glass adhered and fixed to the image pickup surface of the image pickup device, and an adhesive fixation on the front side of the cover glass are provided in the distal end portion of the insertion section. An electronic device having an optical member and having a signal cable having a plurality of signal lines electrically connected to the flexible substrate inserted through the operating portion and the universal cord portion, and connecting the signal cable to an external contact portion with an electrical connector portion. In an endoscope,
An electronic endoscope, wherein the cover glass has a notch formed in a part of a rear corner.
[0142]
(Additional Item 9) An objective lens and an illumination lens are provided on the distal end surface of the distal end cover of the insertion portion, and an image pickup device for the objective lens and a light guide fiber bundle for the illumination lens are provided in the distal end portion of the insertion portion. In the provided electronic endoscope,
An electronic endoscope, wherein a water supply channel is provided at a central portion of the illumination lens and the light guide fiber bundle.
[0143]
(Additional Item 10) An objective lens, an air supply / water supply nozzle, and a forceps channel hole are provided on the distal end surface of the distal end cover of the insertion portion, and the imaging element for the objective lens and the forceps channel are provided in the distal end portion of the insertion portion. In an electronic endoscope provided with a forceps channel communicating with the hole and an air / water channel communicating with the air / water nozzle,
An electronic endoscope, wherein a water drain portion is provided between the objective lens and a forceps channel hole on a distal end surface of the distal end cover.
[0144]
(Additional Item 11) In an electronic endoscope in which an objective lens is provided on a distal end surface of a distal end cover of an insertion portion, and an imaging element for the objective lens is provided in a distal end portion of the insertion portion, the distal end of the electronic endoscope may be provided inside the distal end portion. A water supply channel and a water absorption channel which are provided so as to be directed toward the center of the objective lens as they go, and wherein a water supply port of the water supply channel and a water supply port of the water absorption channel are provided at the distal end cover. Endoscope.
[0145]
【The invention's effect】
As described above, according to the electronic endoscope of the present invention, the resistance to static electricity can be improved without impairing the reduction in the diameter of the insertion portion and in a state where the compatibility of the system is secured. The diameter of the insertion portion of the endoscope can be reduced, and the reliability can be improved.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram illustrating an electrical connection state between a solid-state imaging device and a video processor according to a first embodiment of the present invention.
FIG. 2 is a plan view showing the configuration of the electrical connector according to the first embodiment of the present invention.
FIG. 3 is an explanatory diagram showing the overall configuration of the electronic endoscope according to the first embodiment of the present invention.
FIG. 4 is an explanatory diagram showing an overall configuration of an electronic endoscope according to a second embodiment of the present invention.
FIG. 5 is a cross-sectional view showing a state where a scope-side connector is connected to an electric connector according to a second embodiment of the present invention.
FIG. 6 is a sectional view showing a state before a scope-side connector is connected to an electric connector according to a third embodiment of the present invention.
FIG. 7 is a sectional view showing a state where a scope-side connector is connected to an electric connector according to a third embodiment of the present invention.
FIG. 8 is a sectional view showing a state before a scope-side connector is connected to an electric connector according to a fourth embodiment of the present invention.
FIG. 9 is a sectional view showing a state where a scope-side connector is connected to an electric connector according to a fourth embodiment of the present invention.
FIG. 10 is an exemplary front view showing the configuration of an electrical connector according to a fifth embodiment of the present invention;
FIG. 11 is a sectional view of an electrical connector according to a fifth embodiment of the present invention.
FIG. 12 is a cross-sectional view illustrating an image sensor according to a sixth embodiment of the present invention and a peripheral portion thereof.
FIG. 13 is a front view showing an image sensor according to a sixth embodiment of the present invention and a peripheral portion thereof.
FIG. 14 is a side view showing an image sensor according to a first modification of the sixth embodiment and its peripheral portion.
FIG. 15 is a side view showing an image sensor according to a second modification of the sixth embodiment and its peripheral portion.
FIG. 16 is a sectional view showing an image sensor according to a seventh embodiment of the present invention and a peripheral portion thereof.
FIG. 17 is an exemplary front view showing an image sensor according to a seventh embodiment of the present invention and peripheral components thereof;
FIG. 18 is an explanatory diagram showing an image pickup device and its peripheral portion when a solid-state image pickup device according to a seventh embodiment of the present invention is applied to an electronic endoscope for oblique rear observation.
FIG. 19 is an explanatory diagram showing a distal end of an insertion portion when the solid-state imaging device shown in FIG. 16 is applied to an electronic endoscope for direct observation.
FIG. 20 is an explanatory diagram showing a distal end of an insertion portion when the solid-state imaging device shown in FIG. 16 is applied to an electronic endoscope for oblique observation.
FIG. 21 is an explanatory diagram showing a distal end of an insertion section when the solid-state imaging device shown in FIG. 18 is applied to an electronic endoscope for oblique rear observation.
FIG. 22 is an exemplary front view showing the distal end face of the insertion section of the electronic endoscope according to the eighth embodiment of the present invention;
FIG. 23 is a sectional view showing a light guide fiber bundle according to an eighth embodiment of the present invention.
FIG. 24 is a sectional view taken along line AA of FIG. 22;
FIG. 25 is an exemplary front view showing the distal end face of the insertion section of the electronic endoscope according to the ninth embodiment of the present invention;
FIG. 26 is a sectional view of an insertion portion of an electronic endoscope according to a ninth embodiment of the present invention.
[Explanation of symbols]
1. Electronic endoscope
2 ... insertion part
3 ... operation unit
4… Universal cord part
5 Scope connector
6 Electric connector
7 Light guide connector
10 ... Solid-state imaging device
11 ... signal cable
21 ... connection code
22 Scope connector
24 Video processor
31, 32 ... electric wire
33, 34 ... 40 ... coaxial line
C1, C2 ... C4 ... capacitors

Claims (1)

An image sensor is provided in the distal end portion of the insertion portion, and a signal cable having a plurality of signal lines electrically connected to the image sensor is inserted through the operation portion and the universal cord portion, and the signal cable is connected to an external contact by an electrical connector portion. In the electronic endoscope connected to the section,
An electronic endoscope, wherein a signal line for transmitting an image sensor drive pulse including a negative voltage among a plurality of signal lines of the signal cable is connected to a ground terminal of the image sensor via a capacitor.

Images