JP2004095466A - Mounting board of electronic component and its manufacturing method, electro-optic device and its manufacturing method as well as electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve reliability in a mounting part of a printed circuit board and a flexible printed board, by having an adhesive element contain conductive particles coated with an insulating film. <P>SOLUTION: Concerning the adhesive element for an electronic component such as an IC chip and a mounting board, a filler, for instance, conductive particles coated with an insulating film with a particle size within a range of 0.1 to 1.0 μm, such as nickel particulates coated with a nickel oxide film is contained in an NCF (Non-Conductive Film), for instance, an adhesive with an epoxy thermosetting resin as the main material. Therefore, the fine particle size can cope with recent needs for a finer-pitched adhesive element for the IC chip and the mounting board. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for mounting an electronic component using a printed circuit board (PCB), a flexible printed circuit board (Flexible Printed Circuit: FPC), and the like.
[0002]
[Background Art]
2. Description of the Related Art In general, an electro-optical device such as a liquid crystal display device or an EL (Electro Luminescence) device forms a panel structure by arranging an electro-optical material such as a liquid crystal or an EL device on a substrate, and further includes a circuit in which an appropriate electronic circuit is mounted. It is formed by connecting a substrate to its panel structure. In addition, chip components such as electrolytic capacitors, IC chips, and the like are often mounted on the circuit board (for example, see Patent Document 1).
[0003]
[Patent Document 1]
It is widely known that there is a mounting method based on SMT (Surface Mount Technology) as a method for mounting an electronic component, particularly a chip component on a circuit board. The mounting method based on the SMT is basically a mounting method using a reflow soldering process. For example, this method is a mounting method including a step of mounting an electronic component on a substrate on which solder is mounted, and then heating the solder to solder the electronic component to the substrate.
[0004]
In recent years, in this mounting method based on SMT, in addition to electronic components mounted by reflow soldering, for example, chip components such as electrolytic capacitors, etc., an IC chip is mounted on a substrate, in other words, COF (Chip on Film). The necessity of a mounting method based on it is increasing. In this mounting method, an adhesive element slightly larger than the outer shape of the IC chip, for example, an ACF (Anisotropic Conductive Film: anisotropic conductive film) or the like is attached to a mounting target position on the substrate, for example, is adhered, and the adhesion is performed. A so-called thermocompression bonding is performed by placing an IC chip on a mounting target position on the substrate from above the element and pressing the IC chip against the substrate while heating the IC chip, thereby mounting the IC chip on the substrate.
[0005]
[Problems to be solved by the invention]
2. Description of the Related Art In recent years, electro-optical devices such as liquid crystal display devices have been mounted on electronic devices such as mobile phones and portable personal computers, and various developments have been promoted particularly to achieve a reduction in thickness and weight. Miniaturization of a mounting board for electronic components is also one of the development items, and it is necessary to reduce the size of an IC chip mounted on the mounting board. In addition, the driving method has been complicated to improve the image quality of the electro-optical device, and accordingly, the design of the IC chip has also been complicated. In the study of the development of the IC chip, it is necessary to narrow the pitch of the gold bumps (electrode wiring) of the IC chip, and so-called fine pitch is being studied.
[0006]
For the above-mentioned fine pitch, the gold bump of the IC chip and the lead (electrode wiring) of the mounting substrate to be connected, that is, the overlapping area of the opposing electrode wiring is reduced. Required.
[0007]
Generally, in a method of mounting an IC chip on a mounting substrate, the above-mentioned ACF is often used as an adhesive element. However, when mounted on a flexible substrate such as an FPC substrate, an NCF (Non Conductive Film) containing no conductive particles is also used. The problems for fine pitching are listed and studied for both ACF and NCF. The above problem will be described below.
[0008]
The ACF is composed of conductive particles coated with an insulating film and an adhesive. The connection method is basically a connection using pressure, and the conductive particles share the electrical connection, and the adhesive shares the function of maintaining the pressed state. A major feature of the ACF is anisotropy in which thermocompression bonding shows conductivity in the vertical direction and insulation in the horizontal direction. In an insulating adhesive film having a thickness of 15 to 70 µm, fine particles of 3 to 10 µmΦ obtained by coating a metal on a plastic are mainly dispersed. As the adhesive, a thermoplastic resin or a thermosetting resin is used, but recently, an epoxy-based thermosetting resin has been widely used with an emphasis on reliability.
[0009]
When the ACF is used for fine pitching, necessary development items include miniaturization of conductive particles contained in the ACF, improvement of dispersion density, adhesive strength of an adhesive, and the like. In particular, since the conductive particles described above are fine particles having a size of 3 to 10 μmΦ, when the electrode wiring pitch is a fine pitch of 10 μm or less, there is a high possibility that conduction occurs between adjacent electrode wirings. That is, it is difficult for the current size of the conductive particles contained in the ACF to correspond to the fine pitch.
[0010]
In the case of using the NCF, the leads of the mounting substrate which are connected to the gold bumps of the IC chip, that is, the electrode wires facing each other are directly connected. However, according to this method, there is a possibility that there is a slight gap between the opposing electrode wirings. Therefore, the electrical connection between the terminals becomes insufficient, and the reliability of the mounting substrate may be reduced.
[0011]
The present invention has been made in view of the above-described contents, and has high reliability and a mounting board for an electronic component using an adhesive element applicable to fine-pitch wiring, and a mounting board for the electronic component. It is an object to provide an electro-optical device used and an electronic apparatus using the electro-optical device.
[0012]
[Means for Solving the Problems]
In one aspect of the present invention, a first substrate provided with a semiconductor element and a second substrate electrically connected to the first substrate and provided with an electronic component are mounted on an electronic component mounting substrate. And an adhesive element sandwiched between the first substrate and the semiconductor element and electrically connecting the first substrate and the semiconductor element, wherein the adhesive element is electrically insulated. It contains conductive particles and an adhesive coated with a conductive film. The substrate is, for example, a PCB substrate or an FPC substrate. The semiconductor element mounted on the substrate is, for example, a chip component such as an IC chip. By causing the adhesive element to contain conductive particles coated with an electrically insulating film, poor conduction between adjacent terminals can be improved. That is, the film having the electrical insulation property is broken by the pressing force in the connection direction, and the opposing electrode wires are electrically connected via the conductive particles. Further, since the film having electrical insulation is not broken in the lateral direction, the electrical insulation is maintained even when the conductive particles covered with the film having electrical insulation come into contact with each other.
[0013]
In another aspect of the electronic component mounting board, the conductive particles preferably have a diameter in a range of 0.1 to 1.0 μm. By using the size of the conductive particles, it is possible to cope with a fine pitch in which the terminal pitch is, for example, 10 μm or less.
[0014]
In still another aspect of the electronic component mounting board, the conductive particles preferably include nickel fine particles or copper fine particles.
[0015]
In still another mode of the electronic component mounting substrate, the insulating film preferably includes a metal oxide film such as a nickel oxide film or a copper oxide film.
[0016]
In still another aspect of the electronic component mounting board, the adhesive element preferably includes a thermosetting resin. The thermosetting resin is, for example, an epoxy thermosetting resin.
[0017]
In still another aspect of the electronic component mounting substrate, at least the first substrate is preferably a member having translucency or transparency. The member is, for example, a polyimide-based or polycarbonate-based polymer film.
[0018]
According to another aspect of the present invention, an electro-optical device can be configured by the mounting substrate and a panel having an electro-optical material. The panel having the electro-optical material may be, for example, an STN (Super Twisted Nematic) mode, a TFT-LCD (Thin Film Transistor-Liquid Crystal Display), and a TFD-LCD (Thin Film Dynode-Liquid Crystal).
[0019]
Further, an electronic device including the electro-optical device as a display unit can be manufactured.
[0020]
In another aspect of the present invention, the manufacturing process of the electro-optical device includes a step of mounting a semiconductor element on a first substrate via an adhesive element, and a process of mounting the first substrate on a second substrate having an electro-optical material. Electrically connecting to the substrate. Since the adhesive element includes conductive particles and an adhesive coated with a film having electrical insulation, poor conduction between adjacent terminals can be improved. That is, the film having the electrical insulation property is broken by the pressing force in the connection direction, and the opposing electrode wires are electrically connected via the conductive particles. Further, since the film having electrical insulation is not broken in the lateral direction, the electrical insulation is maintained even when the conductive particles covered with the film having electrical insulation come into contact with each other.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
[0022]
The present embodiment relates to an adhesive element between an IC chip and a mounting substrate, and an adhesive mainly composed of a thermosetting adhesive or the like, for example, NCF coated with a filler, for example, nickel coated with a nickel oxide film. It is characterized by containing fine particles and the like.
[0023]
[Adhesive element]
The adhesive element of the present embodiment is composed of conductive particles coated with an electrically insulating film and an adhesive. For example, the film having electrical insulation is preferably an oxide film such as a nickel oxide film, and the conductive particles are preferably fine metal particles such as fine nickel particles. The adhesive is preferably, for example, an epoxy-based thermosetting resin. Further, as another example, the film having electrical insulation may be a copper oxide film, the conductive particles may be copper fine particles, and the adhesive may be a thermoplastic resin.
[0024]
The nickel oxide film can be obtained, for example, by strongly heating nickel fine particles in air, or by heating in an oxygen atmosphere. Further, it is possible to further promote the oxidation of the nickel fine particles coated with the nickel oxide film produced by the above-mentioned oxidation method in the air to obtain nickel fine particles coated with a stable nickel oxide film.
[0025]
The size of the conductive particles preferably has a diameter in the range of 0.1 to 1.0 μm.
[0026]
For example, a small gap may be generated at a connection portion between a gold bump of an IC chip and a lead of a mounting board to be connected. When an NCF containing no conductive particles is used, a connection failure may occur due to a gap in the electrode wiring. However, the conductive particles can also be provided in the gaps by using an adhesive element containing fine particles and reducing the size of the conductive particles to a diameter of 1 μm or less. In short, the conductive particles enter the gaps between the gold bumps of the IC chip and the connection portions of the leads of the mounting board to be connected, and undergo a thermocompression bonding process, whereby the film having electrical insulation is destroyed, and It can also fulfill its role. Further, since the size of the conductive particles is small, it is possible to cope with the fine pitch described above. For example, since the size of the conductive particles of the ACF has a diameter of 3 to 10 μm, when the terminal pitch is 10 μm or less, conduction occurs between adjacent wiring electrodes that should not be conducted. However, the size of the conductive particles in the present embodiment is about 1/10 of the size of the conductive particles contained in the ACF. Therefore, since the conductive particle size of the present embodiment is 1 μm or less, it can be said that the conductive particle size can be used even at a fine terminal pitch of 10 μm or less. That is, it can be said that the possibility of conduction between adjacent electrode wirings that should not be conducted is low.
[0027]
On the other hand, if the particle size of the conductive particles is too small, it will be difficult to establish electrical continuity at the connection between the gold bumps of the IC chip and the leads of the mounting substrate to be connected. Therefore, the size of the conductive particles is preferably 0.1 μm or more.
[0028]
The mounting by NCF is a bonding method using thermocompression bonding. When a film-like thermosetting resin is heated, the resin softens and then cures to serve as an adhesive. In the process of softening the resin, if the fluidity is high, bubbles are likely to be caught in the adhesive element. If the air bubbles are caught in the adhesive element, moisture in the air bubbles will adversely affect the electrode wiring of the substrate. In short, the presence of moisture and halogen ions contained in the bubbles increases the possibility that an electrolytic corrosion reaction will occur in the electrode wiring of the substrate. For this reason, a connection failure between the terminals occurs, and the reliability of the mounting substrate is reduced. In the present embodiment, the adhesive element contains conductive particles such as nickel fine particles coated with a nickel oxide film, thereby lowering the fluidity of the NCF during mounting and possibly entrapping air bubbles. Has been reduced.
[0029]
Therefore, in the present embodiment, a highly reliable mounting substrate can be provided by using the adhesive element containing fine particles.
[0030]
(Constitution)
FIG. 1 shows an example of a liquid crystal display device on which an FPC board based on the COF method and a PCB board based on the SMT method according to the present invention are mounted. FIG. 2 is a sectional view taken along line AA ′ of the liquid crystal display device 100 shown in FIG.
[0031]
In the liquid crystal panel 102, transparent electrode films 2a and 2b are respectively formed on the surfaces of a first substrate 1a and a second substrate 1b, which are insulating substrates made of glass, plastic, or the like, and liquid crystal molecules are aligned in a certain direction. An alignment film that is not provided is further provided. The first substrate 1a and the second substrate 1b are adhered to each other with a sealing material so that the above-mentioned transparent electrodes 2a and 2b face each other while maintaining a constant interval by a spacer (not shown). The liquid crystal layer 4 is sandwiched between the first substrate 1a and the second substrate 1b by filling the liquid crystal material in the gap between the first substrate 1a and the second substrate 1b. Further, polarizing plates 3a and 3b are provided outside the first substrate 1a and the second substrate 1b, respectively, and thereby, a liquid crystal panel 102 is formed. When a voltage is applied to the opposing transparent electrode films 2a, 2b, the arrangement of the liquid crystal molecules sandwiched therebetween changes, and the backlight unit (not shown) is displayed together with the directions of the absorption axes of the polarizing plates 3a, 3b. The transmission and non-transmission of light from the device are controlled, and a desired display can be obtained.
[0032]
The electrode terminal portion of the liquid crystal panel 102 has a thermocompression bonding portion 105 for connecting to the FPC board 103. The ACF 5a uses an adhesive containing conductive particles. The adhesive is sandwiched between the transparent conductive film 2b, which is a wiring terminal of the liquid crystal panel 102, and the wiring terminal 11a of the FPC board 103. And heat and pressurize, and thermocompression bonding. Thereby, the conductive particles in the ACF 5a electrically connect the respective electrodes. The IC chip component 6 is arranged on the above-mentioned FPC board 103 by thermocompression bonding using the adhesive element 13 containing fine particles. On the FPC board 103, the leads 7 electrically connected to the bumps 6a of the IC chip component 6 are formed.
[0033]
Further, the ACF 5b is sandwiched between the wiring terminals 11b of the FPC board 103 and the wiring terminals 12 of the PCB board 104, and is heated and pressed in the area of the thermocompression bonding section 106. Thus, the conductive particles in the ACF 5b electrically connect the electrode terminals on each substrate. Chip components 8, which are electronic components, are arranged on the PCB substrate 104 by soldering 9. The terminals 10 to be soldered to the terminals of the chip component 8 are formed on the PCB substrate 104.
[0034]
(Cross-section structure of connection part according to the present embodiment)
FIG. 3 is a sectional view taken along line BB ′ of the liquid crystal display device 100 shown in FIG.
[0035]
The IC chip component 6 is mounted on the FPC board 103 by thermocompression bonding using the adhesive element 13 containing fine particles. On the FPC board 103, the leads 7 that are conductively connected to the bumps 6a of the IC chip component 6 are formed. At the time of mounting, a slight gap may be generated between the bump 6a and the lead 7. When a normal NCF that does not contain conductive particles is used, a connection failure between the wiring electrodes occurs even with a small gap as described above. However, when the adhesive element 13 containing fine particles is used, the contained conductive particles 14 have a diameter size in the range of 0.1 to 1.0 μm, and thus are disposed in the above-described gap. In short, the conductive particles 14a enter the gaps between the bumps 6a of the IC chip component 6 and the connection portions of the leads 7 and undergo a thermocompression bonding process, whereby the insulating film is broken and the conductive film 14 is electrically connected in the vertical direction. , The bump 6a and the lead 7 can be electrically connected.
[0036]
Regarding the content of the conductive particles used in the present embodiment, regardless of the particle size, the larger the content, the less likely the connection failure to occur.
[0037]
Furthermore, by using the adhesive element 13 containing fine particles according to the present embodiment, the generation rate of bubbles contained in the adhesive element after mounting is reduced. Even if it occurs, it can be said that the bubble size is small.
[0038]
From the above, when the connection reliability between the terminals is confirmed by using the adhesive element 13 containing fine particles, the defect occurrence rate is reduced. Therefore, this embodiment can provide a good mounting adhesive element.
[0039]
(Example of manufacturing method)
FIG. 4 shows a manufacturing flowchart of the liquid crystal display device 100 shown in FIG. 1 according to the present embodiment.
[0040]
As shown in FIG. 4, in an FPC board manufacturing process Pa by the COF method, in a process Pa <b> 1, an adhesion process is performed, and the fine particle-containing adhesive element 13 is mounted on the FPC board 103. The adhesive element 13 containing fine particles is the adhesive element according to the above-described embodiment. In the adhesive element 13 containing fine particles of the present embodiment, as the conductive particles 14, for example, nickel fine particles coated with a nickel oxide film are preferable, and as the adhesive, for example, an epoxy-based thermosetting resin is preferable. The conductive particles 14 may be copper fine particles coated with a copper oxide film, and the adhesive may be a thermoplastic resin. Since the above-described adhesive element 13 containing fine particles contains the conductive particles 14 having a size of 0.1 to 1.0 μm in diameter, it can also cope with a fine pitch. Further, the adhesive element 13 containing fine particles has a property of reducing the fluidity and making it difficult to entrap bubbles. The conductive particles 14 of the present embodiment also correspond to a fine pitch, and can reduce the content of bubbles by lowering the fluidity of the adhesive element 13 containing fine particles.
[0041]
After attaching the fine particle-containing adhesive element 13 to the FPC board 103, the mounting process of the IC chip component 6 is performed in step Pa2. Specifically, the IC chip component 6 is set via the fine particle-containing adhesive element 13 so that each output of the IC chip component 6, that is, the bump 6a corresponds to the lead 7 provided on the FPC board 103. .
[0042]
Next, in step Pa3, the IC chip component 6 is pressed against the FPC board 103 by the heated head. As a result, the IC chip component 6 is pressed and heated, and the whole of the IC chip component 6 is adhered to the FPC board 103 by the adhesive element 13 containing fine particles, and the bumps 6a of the IC chip component 6 correspond to the positions. Electrically connected to the conductive leads 7 by conductive particles. Through the above steps, the FPC board 103 by the COF method is manufactured.
[0043]
Next, a bonding step Pb of the FPC board 103 and the liquid crystal panel 102 is performed. The wiring terminal portion of the liquid crystal panel 102 has a thermocompression bonding portion 105 for thermocompression bonding the FPC board 103. Therefore, in this step Pb1, the ACF 5a is mounted between the liquid crystal panel 102 and the wiring terminals of the FPC board 103. Next, in step Pb2, the heated head is pressed against the thermocompression bonding section 105. Thus, the thermocompression bonding section 105 is pressurized and heated, and the FPC board 103 and the liquid crystal panel 102 are joined by the ACF 5a. Thus, the conductive particles in the ACF 5a electrically connect the respective electrodes.
[0044]
In the PCB substrate manufacturing process Pc using the SMT method, solder printing is performed in a process Pc1. Next, in step Pc2, mounting processing of the chip component 8 is performed, and the chip component 8 such as an electrolytic capacitor is mounted on the PCB board 104, for example. Next, in step Pc3, a reflow process is performed. This is a process in which the PCB substrate 104 on which the chip components 8 are mounted is transported into a reflow furnace, and hot air is supplied to the side of the PCB substrate 104 on which the chip components 8 are mounted in the reflow furnace. Thereby, the solder 9 is melted and the plurality of chip components 8 are collectively soldered to the plurality of terminals 10.
[0045]
Next, in a process Pd, a bonding process of the FPC board 103 bonded to the liquid crystal panel 102 and the PCB substrate 104 is performed. In step Pd1, the ACF 5b is mounted between the electrodes of the FPC board 103 and the PCB board 104. Next, in the process Pd2, the heated head is pressed against the thermocompression bonding region 106. Thus, the thermocompression bonding section 106 is pressurized and heated, and the FPC board 103 and the PCB board 104 are joined by the ACF 5b. In short, the conductive particles in the ACF 5b electrically connect the respective wiring terminals. Next, in step Pd3, an inspection is performed on the connectivity between the wiring terminals.
[0046]
By using the adhesive element 13 containing fine particles according to the present embodiment, the generation rate of bubbles due to being caught in the adhesive element during mounting is reduced. Also, if bubbles are generated, their size is small. The size of the conductive particles contained in the adhesive element containing fine particles has a diameter in the range of 0.1 to 1.0 μm, so that a fine pitch can be obtained.
[0047]
Therefore, the present embodiment can provide a mounting substrate of a liquid crystal display device that can achieve a highly reliable and fine pitch by using the above-described adhesive element 13b containing fine particles.
[0048]
[Manufacturing method of liquid crystal display device]
Next, an example of a method of manufacturing the liquid crystal display device 100 shown in FIGS. 1 and 2 will be described with reference to FIG.
[0049]
First, in step A1 of FIG. 5, a first electrode that is a transparent electrode 2a is formed on a large-sized first substrate 1a that is an insulating substrate made of glass, plastic, or the like. Specifically, terminals and the like (not shown) are formed by a known pattern forming method using ITO as a material, for example, a photolithography method.
[0050]
Next, in step A2, an alignment film made of a polyimide resin or the like (not shown) is formed on the transparent electrode film 2a, and in step A3, a rubbing treatment or the like is performed.
[0051]
On the other hand, in step B1, the transparent electrode film 2b is formed on the large-sized second substrate 1b by the same method. Further, in step B2, an alignment film (not shown) is formed on the transparent electrode film 2b, and in step B3, a rubbing process or the like is performed.
[0052]
Further, in step A4, a sealing material is formed on the first substrate using, for example, epoxy resin or the like on the substrate 1a, and in step A5, the spacers are dispersed.
[0053]
After the first substrate 1a and the second substrate 1b thus formed are manufactured, in a step C1, the first substrate 1a and the second substrate 1b are overlapped with each other with a sealing material interposed therebetween, and further pressed. That is, both substrates are bonded to each other by pressing under heating. By this bonding, a large-sized structure (that is, a mother substrate) including a plurality of liquid crystal cells 101 in FIG. 1 is formed.
[0054]
After the mother substrate is manufactured as described above, the first break step is performed in step C2. As a result, a plurality of medium-sized panel structures including a plurality of liquid crystal panel portions in which a liquid crystal injection port (not shown) is exposed to the outside, that is, a plurality of so-called strip-shaped medium-sized panel structures are cut out.
[0055]
Then, in step C3, the liquid crystal is injected into the inside of the liquid crystal panel portion through a liquid crystal injection port (not shown), and after the injection is completed, the liquid crystal injection port is sealed with a resin to form the liquid crystal layer 4.
[0056]
Further, in step C4, a second break step is performed on the medium-sized panel structure. Specifically, the substrate 1a and the substrate 1b constituting the medium-sized panel structure are cut, whereby the liquid crystal cells 101 in FIG. 1 are separated one by one.
[0057]
Thereafter, in step C5, the FPC board 103 is mounted on the surface of the thermocompression bonding portion 105 on the electrode terminal of the liquid crystal cell 101 via the ACF 5a. Further, a PCB substrate 104 is mounted on the surface of the thermocompression bonding portion 106 of the FPC substrate 103 connected to the liquid crystal cell 101 via the ACF 5b.
[0058]
Next, in steps C6 and C7, a retardation plate, a polarizing plate, and the like are provided on the outside of the first substrate 1a and the second substrate 1b of the liquid crystal cell 101 on which the FPC substrate 103 and the PCB substrate 104 are mounted, as necessary. Then, the liquid crystal display device 100 shown in FIGS. 1 and 2 is completed.
[0059]
[Electronics]
FIG. 6 is a schematic configuration diagram illustrating the overall configuration of the present embodiment. The electronic device shown here includes the above-described liquid crystal display device 100 and control means 110 for controlling the same. Here, the liquid crystal display device 100 is conceptually divided into a panel structure 100A and a drive circuit 100B including a semiconductor IC or the like. Further, the control unit 110 includes a display information output source 111, a display information processing circuit 112, a power supply circuit 113, and a timing generator 114.
[0060]
The display information output source 111 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning circuit for synchronizing and outputting a digital image signal. And is configured to supply display information to the display information processing circuit 112 in the form of an image signal in a predetermined format based on various clock signals generated by the timing generator 114.
[0061]
The display information processing circuit 112 includes well-known various circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit. Is supplied to the drive circuit 100B together with the clock signal CLK. The driving circuit 100B includes a scanning line driving circuit, a data line driving circuit, and an inspection circuit. The power supply circuit 113 supplies a predetermined voltage to each of the above-described components.
[0062]
Next, a specific example of an electronic device to which the liquid crystal display device according to the present invention can be applied will be described with reference to FIG.
[0063]
First, an example in which the liquid crystal display device according to the present invention is applied to a display unit of a portable personal computer (so-called notebook computer) will be described. FIG. 7A is a perspective view showing the configuration of the personal computer. As shown in the figure, the personal computer 210 includes a main body 212 provided with a keyboard 211 and a display 213 to which the liquid crystal display device according to the present invention is applied.
[0064]
Subsequently, an example in which the liquid crystal display device according to the present invention is applied to a display unit of a mobile phone will be described. FIG. 7B is a perspective view showing the configuration of the mobile phone. As shown in the figure, the mobile phone 220 includes a plurality of operation buttons 221, an earpiece 222, a mouthpiece 223, and a display unit 224 to which the liquid crystal display device according to the invention is applied.
[0065]
Electronic devices to which the liquid crystal display panel according to the present invention can be applied include, in addition to the personal computer shown in FIG. 7A and the mobile phone shown in FIG. -A video tape recorder, a car navigation device, a pager, an electronic organizer, a calculator, a word processor, a workstation, a videophone, a POS terminal, a digital still camera, etc., of a monitor direct-view type.
[0066]
[Modification]
Further, the electro-optical device of the present invention is not limited to a passive matrix type liquid crystal display panel, but also includes an active matrix type liquid crystal display panel (for example, a liquid crystal display panel having a TFT (thin film transistor) or TFD (thin film diode) as a switching element). ) Can be similarly applied. The present invention is applicable not only to a liquid crystal display panel but also to various electro-optical devices such as an electroluminescence device, an organic electroluminescence device, a plasma display device, an electrophoretic display device, and a field emission display (field emission display device). The same can be applied.
[Brief description of the drawings]
FIG. 1 is a plan view illustrating a liquid crystal display device using a mounting substrate according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of a liquid crystal display device using a mounting substrate according to an embodiment of the present invention.
FIG. 3 is an enlarged view showing a connection part including an adhesive element according to an embodiment of the present invention.
FIG. 4 is a flowchart illustrating a method of manufacturing a mounting board according to an embodiment of the present invention.
FIG. 5 is a flowchart showing a method of manufacturing the liquid crystal display device shown in FIGS. 1 and 2.
FIG. 6 illustrates a configuration of an electronic device using a liquid crystal display device to which the present invention is applied.
FIG. 7 illustrates an example of an electronic apparatus including a liquid crystal display device to which the present invention is applied.
[Explanation of symbols]
1a first substrate 1b second substrate 2a, 2b transparent electrode film 3, 3a, 3b polarizing plate 4 liquid crystal layer 5a, 5b ACF
Reference Signs List 6 IC chip component 6a Bump 7 Lead 8 Chip component 9 Solder 10 Terminal 11a, 11b, 12 Wiring terminal 13 Adhesive element containing fine particles 14, 14a Conductive particle 100 Liquid crystal display device 101 Liquid crystal cell 102 Liquid crystal panel 103 Flexible print (FPC) substrate 104 Printed Circuit (PCB) Board

Claims (9)

A first substrate provided with a semiconductor element;
A second substrate electrically connected to the first substrate and provided with electronic components;
An adhesive element sandwiched between the first substrate and the semiconductor element, and electrically connecting the first substrate and the semiconductor element;
A mounting board for an electronic component, wherein the adhesive element includes conductive particles and an adhesive coated with a film having electrical insulation. The mounting board according to claim 1, wherein the conductive particles have a diameter in a range of 0.1 to 1.0 μm. The electronic component mounting board according to claim 1, wherein the conductive particles include nickel fine particles or copper fine particles. The electronic component mounting board according to claim 1, wherein the film having electrical insulation properties includes a nickel oxide film or a copper oxide film. The mounting board according to claim 1, wherein the adhesive element includes a thermosetting resin. The electronic component mounting board according to claim 1, wherein at least the first board is a member having translucency or transparency. A mounting board according to any one of claims 1 to 6,
A panel having an electro-optical material,
An electro-optical device comprising: An electronic apparatus comprising the electro-optical device according to claim 7 as a display unit. Mounting a semiconductor element on the first substrate via an adhesive element;
Electrically connecting the first substrate to a second substrate having an electro-optic material;
The method for manufacturing an electro-optical device, wherein the adhesive element includes conductive particles coated with a film having electrical insulation and an adhesive.

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