JP2004095296A - Electrode structure of field emission type electron source and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrode structure of a field emission type electron source that can be manufactured at a low cost. <P>SOLUTION: The electrode structure of the field emission type electron source is constructed of a belt-shape cathode electrode 111 having a field emission type electron emitting material and a belt-shape control electrode 112 for controlling electron emission from the cathode electrode 111 that are arranged adjacent to each other on a transparent glass substrate 113 at prescribed intervals. The cathode electrode 111 and the control electrode 112 are formed, after a positive type photograph paste containing carbon nanotubes is printed on a belt-shape cathode wiring layer 114 and a belt-shape control electrode wiring layer 115 formed on the transparent glass substrate 113, by exposing it through the transparent substrate 113 using these wiring layers as a mask, and developing and trimming, and then firing. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electrode structure of a field emission electron source and a method of manufacturing the same.
[0002]
[Prior art]
2. Description of the Related Art As an electron source of a fluorescent display device such as a field emission display (FED) or a fluorescent display tube, a field emission electron source using a field emission type electron emission material such as a carbon nanotube has attracted attention. FIG. 6 shows an electrode structure of a conventional field emission electron source.
This field emission type electron source is composed of a cathode electrode 601 and a control electrode 602 which are arranged substantially parallel and opposed to each other. The cathode electrode 601 is a conductor substrate 612 on which a field emission type electron emission material 611 such as a carbon nanotube is attached. The control electrode 602 is a thin metal plate having a lattice area 621 having a line width of 0.03 mm and a pitch of 0.4 mm formed at the center, for example. The lattice area 621 includes a large number of lattices 622 and lattice windows 623. ing. In such an electrode structure, when a high voltage is applied so that the control electrode 602 has a positive potential with respect to the cathode electrode 601, field electron emission occurs and electrons are extracted from the cathode electrode 601. Most of the electrons extracted from the cathode electrode 601 are emitted to the outside through the lattice window 623 of the control electrode 602.
[0003]
[Problems to be solved by the invention]
In the electrode structure of the conventional field emission type electron source shown in FIG. 6, it is necessary to fabricate the control electrode 602 by processing a metal member and assemble it so as to face the cathode electrode 601. For this reason, member costs, processing costs, and assembly costs are incurred, and it has been difficult to manufacture them at low cost.
The present invention has been made to solve the above-described problem, and has as its object to provide an electrode structure of a field emission type electron source that can be manufactured at low cost and a method of manufacturing the same.
[0004]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, an electrode structure of a field emission type electron source according to the present invention includes a cathode electrode having a field emission type electron emission material and a control electrode for controlling electron emission from the cathode electrode. Each of the cathode electrode and the control electrode has a plurality of band portions formed in a band shape, and the band portion of the cathode electrode and the band portion of the control electrode are arranged adjacent to each other at a predetermined interval on the same substrate. It is characterized by having. In this case, a field emission type electron source is formed by the cathode electrode and the control electrode which are arranged adjacent to each other at a predetermined interval on the same substrate.
[0005]
The cathode electrode and the control electrode need only have these strips adjacent to each other on the same substrate, regardless of whether or not they are formed directly on the substrate surface. In the configuration example, a cathode electrode and a control electrode are formed on each wiring formed in a strip shape on a substrate. In this case, both the height of the cathode electrode and the height of the control electrode are increased by the wiring, but since these wirings are formed in the same wiring layer, both the cathode electrode and the control electrode are formed on the same height wiring. Is done. Even in such a case, there is no difference in that the cathode electrode and the control electrode are arranged adjacent to each other at a predetermined interval on the same substrate.
[0006]
In another configuration example of this electrode structure, a cathode electrode and a control electrode are formed on respective wirings formed in a strip shape on a substrate via a resistance layer. In this case, the current flowing through the cathode electrode and the control electrode is limited by the resistance layer, and an abnormal current caused by an arc discharge or a hot spot triggered by an abnormal discharge caused by electric field concentration is suppressed. Further, in another configuration example of the electrode structure, the cathode electrode and the control electrode are made of the same constituent material. In this case, the cathode electrode and the control electrode include, for example, carbon nanotubes, which are field emission type electron emission materials.
[0007]
A method of manufacturing an electrode structure of a field emission type electron source according to the present invention is directed to a method of manufacturing a field emission type electron source including a cathode electrode having a field emission type electron emission material and a control electrode for controlling electron emission from the cathode electrode. A method of manufacturing an electrode structure, comprising a metal film on a transparent substrate, a cathode wiring having a plurality of strips and a control electrode wiring having a plurality of strips, wherein the strip of the cathode wiring and the strip of the control electrode wiring are formed. Forming a cathode type photo paste containing the electron-emitting material on at least a band portion of the cathode wiring and a band portion of the control electrode wiring; Exposing the positive-type photo paste protruding from the cathode wiring and the control electrode wiring through the transparent substrate using the mask and the control electrode wiring as a mask; and Developing the type photo paste, a step of trimming the positive photo paste protruding from the cathode lines and the control electrode wiring, characterized by having a step of firing the positive photo paste after trimming. If the wiring of the cathode electrode and the wiring of the control electrode are formed of a metal film having the same thickness, the paste can be printed thereon with high accuracy. In addition, since exposure is performed using the wiring as a mask, the exposure and trimming steps can be performed without forming a separate mask.
[0008]
Further, another manufacturing method of the electrode structure of the field emission type electron source according to the present invention is a method of forming a cathode wiring having a plurality of strips and a control electrode wiring having a plurality of strips on a transparent substrate by a metal film. Forming a strip portion of the control electrode wiring and a strip portion of the control electrode wiring so as to be adjacent to each other at a predetermined interval; and a positive type including a resistive material on at least the strip portion of the cathode wiring and the strip portion of the control electrode wiring. A step of printing a photo paste, a step of printing a positive photo paste containing an electron emission material on the cathode wiring and the control electrode wiring on which the positive type photo paste containing the resistive material is printed, and a step of printing the cathode wiring and the control electrode wiring Positive type including resistive material protruding from the cathode wiring and control electrode wiring over the transparent substrate by using as a mask and positive type including electron emitting material Exposing the photo paste to light, developing the positive photo paste after exposure, trimming the positive photo paste protruding from the cathode wiring and control electrode wiring, and baking the positive photo paste after trimming. And
In these manufacturing methods described above, one configuration example of the electron-emitting material includes a carbon nanotube.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[Embodiment 1]
FIG. 1 is a partial cross-sectional view of a fluorescent display device using the electrode structure of the field emission electron source according to the first embodiment. In FIG. 1, the fluorescent display device includes a cathode substrate 110 having a field emission type electron source on one surface and an anode substrate 120 having a light emitting portion on one surface. Numeral 120 is arranged so that the field emission type electron source and the light emitting unit face each other.
[0010]
The cathode substrate 110 has a transparent glass substrate 113, a cathode electrode 111 having a field emission type electron emission material disposed thereon, and is also disposed on the glass substrate 113, and controls electron emission from the cathode electrode 111. And a control electrode 112. In this case, the cathode electrode 111 and the control electrode 112 are formed with the same thickness on the cathode wiring 114 and the control electrode wiring 115 formed on one surface of the transparent glass substrate 113 with a thickness. I have.
[0011]
FIG. 2 is a plan view showing the planar shape of the electrode structure of the field emission electron source according to the first embodiment. 2, a comb-shaped cathode wiring 114 in plan view and a control electrode wiring 115 in comb-shaped plan view are arranged on a transparent glass substrate 113 so that the comb teeth engage with each other. The strips 114a forming the comb teeth and the strips 115a forming the comb teeth of the control electrode wiring 115 are adjacent to each other at a predetermined interval. At least the strip portions 114a and 115a of the cathode wiring 114 and the control electrode wiring 115 form electrode patterns of the cathode electrode 111 and the control electrode 112, respectively.
[0012]
The cathode electrode 111 is formed on at least the strip portion 114a of the cathode wiring 114 in the same plane shape as the cathode wiring 114, and the control electrode 112 is formed on at least the strip portion 115a of the control electrode wiring 115 in the same plane shape as the control electrode wiring 115. Have been. That is, the cathode electrode 111 and the control electrode 112 have strips arranged in parallel on the same plane so as to be adjacent to each other at a predetermined interval, and these strips constitute a field emission type electron source. are doing.
[0013]
Here, for the transparent glass substrate 113, for example, soda lime glass is used.
The cathode wiring 114 and the control electrode wiring 115 are formed in a comb shape from a metal film such as an aluminum thin film (thickness: 1 μm) formed on a transparent glass substrate 113. A gap of about 20 μm in horizontal distance is provided between the strips corresponding to the 115 comb teeth. The cathode electrode 111 is made of a field emission type electron emission material such as a carbon nanotube fixed with a binder. In the present embodiment, control electrode 112 is formed of carbon nanotubes fixed with a binder, similarly to cathode electrode 111, but other conductive materials may be used.
[0014]
The light-emitting portion of the anode substrate 120 includes a phosphor layer 122 arranged in a pattern to be displayed on a transparent glass substrate 121 and a metal back film 123 serving as an anode electrode formed on the phosphor layer 122. ing. In this case, for the glass substrate 121, for example, soda lime glass is used. For the phosphor layer 122, a phosphor generally used in a cathode ray tube is used. The metal back film 123 is formed of an aluminum thin film having a thickness of about 0.1 μm formed on the surface of the phosphor layer 122 by using a well-known vapor deposition method.
[0015]
Next, a method of manufacturing the electrode structure of the field emission electron source according to this embodiment will be described with reference to FIG. First, as shown in FIG. 3A, a metal thin film of aluminum or the like formed on a transparent glass substrate 301 is patterned by a known photolithography method to form a predetermined pattern of a cathode wiring 302 and a control electrode wiring 303. I do. In the present embodiment, the cathode wiring 302 and the control electrode wiring 303 are each formed in a comb shape in a plan view, and are arranged so as to engage with each other.
[0016]
The strips forming the comb teeth of the cathode wiring 302 constitute the electrode pattern of the cathode electrode, and the strips forming the comb teeth of the control electrode wiring 303 constitute the electrode pattern of the control electrode. They are adjacent to each other at a predetermined interval.
The cathode wiring 302 and the control electrode wiring 303 are formed by patterning the same metal thin film formed on the transparent glass substrate 301 so that the respective upper surfaces have the same height.
[0017]
After the formation of the cathode wiring 302 and the control electrode wiring 303, as shown in FIG. 3B, a positive type photo-electrode containing a field emission type electron emission material is formed on the cathode wiring 302 and the control electrode wiring 303 by a screen printing method. The paste 304 is printed in a predetermined pattern corresponding to the electrodes to the same thickness. In the present embodiment, a positive photo paste containing carbon nanotubes is simultaneously printed on the cathode wiring 302 and the control electrode wiring 303 to a thickness of about 20 to 100 μm. In this case, the constituent materials of the cathode electrode 111 and the control electrode 112 are the same.
[0018]
Here, the positive photo paste containing carbon nanotubes is a photo paste including carbon nanotubes, silver particles (metal particles) having a particle size of about 1 μm, glass particles having a particle size of about 1 μm, and a positive photosensitive resin. The part has the property of being removed by development processing. The positive photosensitive resin can be removed, for example, by heating to about 300 to 400 ° C. in the air, and the glass particles melt at about 300 to 400 ° C.
[0019]
The printing for the two electrode wirings may be performed separately. In this case, the positive photo paste printed on the control electrode wiring 303 is not limited to the positive photo paste containing carbon nanotubes. Due to the trade-off between the cost of carbon nanotubes and the reduction in the number of printing steps, a positive photopaste containing another conductive material such as a refractory metal or carbon is used instead of a positive photopaste containing carbon nanotubes. You may do so.
[0020]
After printing the positive type photo paste 304 containing the field emission type electron emission material, as shown in FIG. 3C, the cathode wiring 302 is controlled from the back surface (the surface on which no wiring is formed) of the transparent glass substrate 301. Exposure light 305 is irradiated through the glass substrate 301 using the electrode wiring 303 as a mask, and the positive photo paste 304 including the field emission type electron emitting material which is protruded from the cathode wiring 302 and the control electrode wiring 303 is exposed. After the exposure, the positive type photo paste 304 containing the field emission type electron emission material is developed, and as shown in FIG. 3D, the positive type photo paste containing the field emission type electron emission material protruding from the cathode wiring 302 and the control electrode wiring 303. The mold photo paste 304 is trimmed.
[0021]
After the trimming, as shown in FIG. 3E, the glass substrate 301 is placed in a heating furnace or the like, and heat 306 is applied thereto, and the positive photo paste 304 containing the field emission type electron emission material is fired at a predetermined firing temperature. The positive photosensitive resin is burned off by heating during firing, and the glass particles are melted to serve as a binder, and the carbon nanotubes are fixed to the wiring. The silver particles are interposed between the wiring and the carbon nanotubes or between the carbon nanotubes, and make these conductive. The firing temperature is set to about 400 to 700 ° C., which is a temperature range in which the glass particles contained in the positive-type photo paste 304 including the field emission type electron emission material are melted and the carbon nanotubes do not become carbon dioxide gas by heating. Is desirable. Thus, the electrode structure of the field emission electron source according to the first embodiment is formed.
[0022]
Next, an operation of the fluorescent display device using the electrode structure of the field emission electron source according to the first embodiment will be described with reference to FIG. This fluorescent display device forms a strong electric field near the cathode electrode 111 by applying a high voltage between the cathode electrode 111 and the control electrode 112 so that the control electrode 112 has a positive potential with respect to the cathode electrode 111. Then, field electron emission occurs from the field emission type electron emission material of the cathode electrode 111, and electrons are extracted from the cathode electrode 111. The electrons extracted from the cathode electrode 111 are deflected and accelerated by an electric field generated by applying a higher voltage to the metal back film 123 than the cathode electrode 111 and the control electrode 112, and reach the metal back film 123. The electrons that reach the metal back film 123 pass through the metal back film 123 and collide with the phosphor layer 122, causing the phosphor layer 122 to emit light.
[0023]
In the electrode structure of the field emission type electron source according to this embodiment, since the control electrode can be formed by printing, a grid-like metal member functioning as the control electrode as in the related art is not required. As a result, manufacturing costs such as member costs, processing costs, and assembly costs can be reduced, so that an inexpensive field emission electron source can be provided. Further, since the thickness of the control electrode is substantially the same as the thickness of the cathode electrode, the distance between the cathode electrode and the control electrode and the anode electrode can be reduced, and the thickness of the fluorescent display device can be reduced. Further, since the cathode electrode and the control electrode are arranged adjacent to each other on the same substrate, the distance between the cathode electrode and the control electrode due to the deformation of the metal member is different from the case where the control electrode of the metal member is arranged above the cathode electrode. Since no change occurs, the distance between the cathode electrode and the control electrode can be made high precision, and the variation in the electric field applied to the field emission type electron emission material can be reduced. For this reason, a stable field emission type electron source with a small variation in the amount of emitted electrons can be obtained.
[0024]
Further, according to the manufacturing method of the electrode structure described in this embodiment, since the wiring including the electrode pattern is formed by the photolithography method, a precise electrode pattern can be formed, and the electrode pattern is formed on the electrode pattern using the mask as a mask. Since the portion protruding from the electrode pattern of the printed positive electrode or the positive-type photo paste serving as the control electrode is exposed and trimmed, a cathode electrode or a control electrode with high dimensional accuracy can be formed.
Thereby, the interval between the cathode electrode and the control electrode can be made constant, so that it is possible to prevent the electric field from concentrating on a part of the cathode electrode due to the protruding amount of the electrode constituting material and the like, and thereby causing uneven electron emission. Further, since the wiring is used as a mask, the trouble of separately forming a mask in the electrode forming process can be omitted, and the efficiency of the manufacturing process can be improved. In addition, since the width of the cathode electrode and the control electrode can be reduced and the substrate is transparent, it is possible to see the light emission of the light emitting portion from the cathode substrate side, which was not possible with the conventional field emission electron source, which is not possible in the past It has the potential to lead to applications.
[0025]
[Embodiment 2]
FIG. 4 is a partial cross-sectional view of a fluorescent display device using the electrode structure of the field emission electron source according to the second embodiment. In FIG. 4, this fluorescent display device is different from the fluorescent display device using the electrode structure of the field emission electron source according to the first embodiment shown in FIG. Is connected to the cathode wiring 114 and the control electrode wiring 115 via the. In FIG. 4, the same symbols as those in FIG. 1 indicate the same parts. Here, the resistance layer 116 is a resistance material formed so as to have a predetermined resistance value. In the present embodiment, a sintered body mainly containing carbon is used.
[0026]
Next, a method of manufacturing the electrode structure of the field emission electron source according to this embodiment will be described with reference to FIG. First, as shown in FIG. 5A, a metal thin film such as aluminum formed on a transparent glass substrate 501 is patterned by a well-known photolithography method to form a predetermined pattern of a cathode wiring 502 and a control electrode wiring 503. I do. In the present embodiment, the cathode wiring 502 and the control electrode wiring 503 are each formed in a comb shape in a plan view, and are arranged so that the comb teeth are engaged with each other.
[0027]
The strips constituting the comb teeth of the cathode wiring 502 constitute the electrode pattern of the cathode electrode, and the strips constituting the comb teeth of the control electrode wiring 503 constitute the electrode pattern of the control electrode. They are adjacent to each other at a predetermined interval.
The cathode wiring 502 and the control electrode wiring 503 are formed by patterning the same metal thin film formed on a transparent glass substrate 501 so that the respective upper surfaces have the same height.
[0028]
After the formation of the cathode wiring 502 and the control electrode wiring 503, as shown in FIG. 5B, a positive type photo paste 504 containing a resistive material is placed on the cathode wiring 502 and the control electrode wiring 503 by the screen printing method. And a predetermined pattern corresponding to the control electrode are printed at the same time. Here, the positive type photo paste 504 including a resistance material is a photo paste including a resistance material, glass particles having a particle size of about 1 μm, and a positive type photosensitive resin, and has a property that an exposed portion is removed by a development process. . The positive photosensitive resin can be removed, for example, by heating to about 300 to 400 ° C. in the air, and the glass particles melt at about 300 to 400 ° C. In this embodiment mode, carbon is used as a resistance material of the positive photo paste 504 including a resistance material. Note that the resistance material is not limited to carbon, and for example, another resistance material including a metal may be used.
[0029]
After printing the positive-type photo paste 504 containing the resistance material, as shown in FIG. 5C, the cathode wiring 502 and the control electrode wiring 503 on which the positive-type photo paste 504 containing the resistance material is printed by a screen printing method. A positive type photo paste 505 containing a field emission type electron emission material is printed on the upper surface in a predetermined pattern corresponding to the electrodes to the same thickness. In the present embodiment, a positive photo paste containing carbon nanotubes is simultaneously printed on the cathode wiring 502 and the control electrode wiring 503 to a thickness of about 20 to 100 μm. In this case, the constituent materials of the cathode electrode 111 and the control electrode 112 are the same.
[0030]
The positive type photo paste 505 including the field emission type electron emitting material is the same as the positive type photo paste 304 including the field emission type electron emitting material described in Embodiment 1, and thus the description is omitted. The two electrode wirings may be separately printed, and the positive photo paste printed on the control electrode wiring 503 is not limited to the positive photo paste containing carbon nanotubes. Due to the trade-off between the cost of carbon nanotubes and the reduction in the number of printing steps, a positive photopaste containing another conductive material such as a refractory metal or carbon is used instead of a positive photopaste containing carbon nanotubes. You may do so.
[0031]
After printing the positive type photo paste 505 containing the field emission type electron emission material, as shown in FIG. 5D, the cathode wiring 502 is controlled from the back surface (the surface on which no wiring is formed) of the transparent glass substrate 501. Exposure light 506 is irradiated through the glass substrate 501 using the electrode wiring 503 as a mask, and a positive type photo paste 504 including a resistive material protruding from the cathode wiring 502 and the control electrode wiring 503 and a positive type including a field emission type electron emitting material. The photo paste 505 is exposed.
[0032]
After the exposure, a developing process is performed, and as shown in FIG. 5E, a positive photo paste 504 including a resistance material protruding from the cathode wiring 502 and the control electrode wiring 503 and a positive photo paste including a field emission type electron emitting material. 505 is trimmed.
After the trimming, as shown in FIG. 5 (f), the glass substrate 501 is placed in a heating furnace or the like, and heat 507 is applied thereto, and a positive photo paste 504 containing a resistance material and a positive photo paste containing a field emission type electron emission material are used. 505 is fired at a predetermined firing temperature.
[0033]
The positive-type photo paste 504 including a resistance material and the positive-type photo paste 505 including a field emission type electron emission material include glass particles having a particle diameter of about 1 μm that function as a binder, and the glass particles are melted by heating during firing. Then, the resistance layer is fixed on the wiring, and the carbon nanotube is fixed on the resistance layer. The firing temperature is such that the glass particles contained in the positive photo paste 504 containing the resistive material and the positive photo paste 505 containing the field emission type electron emitting material are melted, and the carbon nanotubes are not converted into carbon dioxide gas by heating. It is desirable that the temperature be in the range of about 400 to 700 ° C. Thus, the electrode structure of the field emission electron source according to the second embodiment is formed.
[0034]
According to this embodiment, since the current flowing through the cathode electrode and the control electrode is limited by the resistance layer, it is possible to suppress an abnormal current caused by an arc discharge or a hot spot caused by an abnormal discharge caused by electric field concentration. Thereby, it is possible to suppress deterioration of the field emission type electron emission material and abnormal increase in the amount of electron emission like a spot. Therefore, in addition to the same effect as in the first embodiment, the effect of stabilizing the electron emission can be obtained. can get.
[0035]
Further, according to the manufacturing method of the electrode structure described in this embodiment, since the positive type photo paste containing the resistance material is used for forming the resistance layer, the cathode pattern and the positive type photo paste serving as the control electrode are used together with the electrode pattern. The protruding portion can be exposed and trimmed. This makes it possible to stabilize electron emission without deteriorating the dimensional accuracy of the cathode electrode and the control electrode. Further, since the resistive layer is formed by printing, stabilization of electron emission can be achieved at low cost. In the first and second embodiments, an example has been described in which carbon nanotubes are used as the field emission type electron emission material of the cathode electrode. However, field emission type electron emission materials other than carbon nanotubes may be used.
[0036]
【The invention's effect】
As described above, the electrode structure of the field emission type electron source according to the present invention includes a cathode electrode having a field emission type electron emission material, and a control electrode for controlling electron emission from the cathode electrode. The control electrode and the control electrode each have a plurality of band portions formed in a band shape, and the band portion of the cathode electrode and the band portion of the control electrode are arranged adjacent to each other at a predetermined interval on the same substrate. As described above, since a grid-like metal member functioning as a control electrode is not required, manufacturing costs such as member costs, processing costs, and assembly costs can be reduced, and an inexpensive field emission electron source can be provided. . Further, the control electrode can be formed by printing together with the cathode electrode, which is excellent in mass productivity. If the electrode structure of the field emission type electron source is applied to an electron source such as an FED or a fluorescent display tube, the thickness can be reduced.
[0037]
Further, in the electrode structure of the field emission type electron source according to the present invention, since the cathode electrode and the control electrode are formed on the respective wirings formed in a strip shape on the substrate via the resistance layer, the resistance layer is used. The current flowing through the cathode electrode and control electrode is limited, and abnormal current due to arc discharge or hot spots triggered by abnormal discharge due to electric field concentration is suppressed. This has the effect of suppressing an abnormal increase in the amount of emission, and stabilizes electron emission. In addition, since the cathode electrode and the control electrode are made of the same constituent material, the control electrode and the cathode electrode can be manufactured in the same manufacturing process, and a more inexpensive field emission electron source can be provided.
[0038]
The method for manufacturing an electrode structure of a field emission type electron source according to the present invention comprises a metal film on a transparent substrate, a cathode wiring having a plurality of strips, and a control electrode wiring having a plurality of strips. Forming a strip of control electrode wiring so as to be adjacent to each other at a predetermined interval; and a positive-type photo paste containing the electron-emitting material on at least the strip of cathode wiring and the strip of control electrode wiring. Printing, the step of exposing the positive photo paste protruding from the cathode wiring and the control electrode wiring over the transparent substrate using the cathode wiring and the control electrode wiring as a mask, and Developing and trimming the positive-type photo paste protruding from the cathode wiring and the control electrode wiring; and forming the positive-type photo paste after trimming. Since a step of firing the door, a printing method can be formed with high dimensional accuracy cathode electrode and a control electrode with. For this reason, the manufacturing cost can be reduced, mass production is possible, and an inexpensive field emission electron source can be provided.
[0039]
Further, another manufacturing method of the electrode structure of the field emission type electron source according to the present invention is a method of forming a cathode wiring having a plurality of strips and a control electrode wiring having a plurality of strips on a transparent substrate by a metal film. Forming a strip portion of the control electrode wiring and a strip portion of the control electrode wiring so as to be adjacent to each other at a predetermined interval; and a positive type including a resistive material on at least the strip portion of the cathode wiring and the strip portion of the control electrode wiring. A step of printing a photo paste, a step of printing a positive photo paste containing an electron emission material on the cathode wiring and the control electrode wiring on which the positive type photo paste containing the resistive material is printed, and a step of printing the cathode wiring and the control electrode wiring Positive type including resistive material protruding from the cathode wiring and control electrode wiring over the transparent substrate by using as a mask and positive type including electron emitting material Exposing the photo paste to light, developing the positive photo paste after exposure, trimming the positive photo paste protruding from the cathode wiring and control electrode wiring, and firing the positive photo paste after trimming. A resistance layer can be provided between the cathode electrode or the control electrode and each wiring layer without deteriorating the dimensional accuracy of the cathode electrode or the control electrode, and the electron emission is stabilized. It is possible to provide a low-cost electron source.
[Brief description of the drawings]
FIG. 1 is a partial cross-sectional view of a fluorescent display device using an electrode structure of a field emission electron source according to a first embodiment.
FIG. 2 is a plan view showing a planar shape of an electrode structure of the field emission electron source according to the first exemplary embodiment;
FIG. 3 is an explanatory view showing a manufacturing process of the electrode structure of the field emission electron source according to the first exemplary embodiment;
FIG. 4 is a partial cross-sectional view of a fluorescent display device using the electrode structure of the field emission electron source according to the second embodiment.
FIG. 5 is an explanatory view showing a manufacturing process of the electrode structure of the field emission electron source according to the second embodiment.
FIG. 6 is a sectional view showing an electrode structure of a conventional field emission electron source.
[Explanation of symbols]
110: cathode substrate, 111, 601: cathode electrode, 112, 602: control electrode, 113, 121, 301, 501: glass substrate, 114, 302, 502: cathode wiring, 114a, 115a: band, 115, 303, 503: Control electrode wiring, 116: Resistive layer, 120: Anode substrate, 122: Phosphor layer, 123: Metal back film, 304, 505: Positive photo paste containing field emission type electron emitting material, 305, 506: Exposure Light, 306, 507, heat, 504, a positive type photo paste containing a resistive material, 611, a field emission type electron emitting material, 612, a conductor substrate, 621, a lattice region, 622, a lattice, 623, a lattice window.

Claims (7)

In a field emission type electron source electrode structure including a cathode electrode having a field emission type electron emission material and a control electrode for controlling electron emission from the cathode electrode,
The cathode electrode and the control electrode each have a plurality of strips formed in a strip shape,
The electrode structure of a field emission type electron source, wherein the strip portion of the cathode electrode and the strip portion of the control electrode are arranged adjacent to each other at a predetermined interval on the same substrate. In claim 1,
The electrode structure of a field emission type electron source, wherein the cathode electrode and the control electrode are formed on respective wirings formed in a strip shape on a substrate. In claim 1,
The electrode structure of a field emission type electron source, wherein the cathode electrode and the control electrode are formed on respective wirings formed in a band shape on a substrate via a resistance layer. In any one of claims 1 to 3,
The electrode structure of a field emission type electron source, wherein the cathode electrode and the control electrode are made of the same constituent material. A method for manufacturing an electrode structure of a field emission type electron source comprising a cathode electrode having a field emission type electron emission material and a control electrode for controlling electron emission from the cathode electrode,
A metal film is formed on a transparent substrate, and a cathode wiring having a plurality of strips and a control electrode wiring having a plurality of strips are adjacent to each other at a predetermined interval between the strip of the cathode wiring and the strip of the control electrode wiring. Forming to fit,
A step of printing a positive-type photo paste containing the electron-emitting material on at least the strip of the cathode wiring and the strip of the control electrode wiring,
Exposing the positive type photo paste protruding from the cathode wiring and the control electrode wiring over the transparent substrate using the cathode wiring and the control electrode wiring as a mask,
Developing the positive type photo paste after the exposure, trimming the positive type photo paste protruding from the cathode wiring and the control electrode wiring,
Baking the positive photo paste after the trimming. The method for manufacturing an electrode structure of a field emission type electron source. A method for manufacturing an electrode structure of a field emission type electron source comprising a cathode electrode having a field emission type electron emission material and a control electrode for controlling electron emission from the cathode electrode,
A metal film is formed on a transparent substrate, and a cathode wiring having a plurality of strips and a control electrode wiring having a plurality of strips are adjacent to each other at a predetermined interval between the strip of the cathode wiring and the strip of the control electrode wiring. Forming to fit,
A step of printing a positive type photo paste containing a resistive material on at least the strip portion of the cathode wiring and the strip portion of the control electrode wiring,
Printing a positive photo paste containing the electron emitting material on the cathode wiring and the control electrode wiring on which the positive photo paste containing the resistance material is printed,
Using the cathode wiring and the control electrode wiring as a mask, a positive type photo paste containing the resistance material and the positive type photo paste containing the electron emission material protruding from the cathode wiring and the control electrode wiring over the transparent substrate. Exposing;
Developing the positive type photo paste after the exposure, trimming the positive type photo paste protruding from the cathode wiring and the control electrode wiring,
Baking the positive photo paste after the trimming. The method for manufacturing an electrode structure of a field emission type electron source. In claim 5 or claim 6,
The method for manufacturing an electrode structure, wherein the electron emission material includes a carbon nanotube.

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