JP2004091734A5 - - Google Patents
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- Publication number
- JP2004091734A5 JP2004091734A5 JP2002257934A JP2002257934A JP2004091734A5 JP 2004091734 A5 JP2004091734 A5 JP 2004091734A5 JP 2002257934 A JP2002257934 A JP 2002257934A JP 2002257934 A JP2002257934 A JP 2002257934A JP 2004091734 A5 JP2004091734 A5 JP 2004091734A5
- Authority
- JP
- Japan
- Prior art keywords
- aromatic
- residue
- diamine residue
- phenolic
- general formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002257934A JP4174274B2 (ja) | 2002-09-03 | 2002-09-03 | ポリアミドイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002257934A JP4174274B2 (ja) | 2002-09-03 | 2002-09-03 | ポリアミドイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004091734A JP2004091734A (ja) | 2004-03-25 |
| JP2004091734A5 true JP2004091734A5 (https=) | 2006-08-31 |
| JP4174274B2 JP4174274B2 (ja) | 2008-10-29 |
Family
ID=32062727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002257934A Expired - Fee Related JP4174274B2 (ja) | 2002-09-03 | 2002-09-03 | ポリアミドイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4174274B2 (https=) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4084597B2 (ja) * | 2002-05-07 | 2008-04-30 | 群栄化学工業株式会社 | アミノ基含有フェノール誘導体 |
| JP4609645B2 (ja) * | 2005-03-07 | 2011-01-12 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂成形材料接着用プライマー組成物及び半導体装置 |
| JP4704082B2 (ja) * | 2005-03-22 | 2011-06-15 | 住友電工プリントサーキット株式会社 | 接着剤組成物およびそれを用いたフレキシブル印刷配線板 |
| US8080319B2 (en) | 2005-10-21 | 2011-12-20 | Kippon Kayaku Kabushiki Kaisha | Thermosetting resin composition and use thereof |
| JP2007211182A (ja) * | 2006-02-10 | 2007-08-23 | Kyocera Chemical Corp | 樹脂組成物、プリプレグ、積層板、金属張積層板およびプリント配線板 |
| EP2070961A4 (en) * | 2006-10-04 | 2012-08-29 | Hitachi Chemical Co Ltd | POLYAMIDEIMIDE RESIN, ADHESIVE AGENT, FLEXIBLE SUBSTRATE MATERIAL, FLEXIBLE LAMINATE, AND FLEXIBLE CONNECTION TABLE FOR PRINTER |
| JP2008227398A (ja) * | 2007-03-15 | 2008-09-25 | Sanken Electric Co Ltd | 半導体装置の製法 |
| JP5470704B2 (ja) * | 2007-04-11 | 2014-04-16 | 日立化成株式会社 | ポリアミド樹脂及び樹脂組成物 |
| TW200923034A (en) | 2007-09-20 | 2009-06-01 | Nippon Kayaku Kk | Primer resin for semiconductor device and semiconductor device |
| JP5245526B2 (ja) * | 2008-05-09 | 2013-07-24 | 日立化成株式会社 | 絶縁樹脂組成物、及び支持体付絶縁フィルム |
| JP2010037489A (ja) * | 2008-08-07 | 2010-02-18 | Hitachi Chem Co Ltd | 接着フィルム及び樹脂付き金属箔 |
| JP5509460B2 (ja) * | 2008-09-22 | 2014-06-04 | 住鉱潤滑剤株式会社 | 耐擦傷性に優れた高硬度被膜形成用塗料組成物 |
| JP6467784B2 (ja) * | 2014-05-07 | 2019-02-13 | 凸版印刷株式会社 | 転写フィルムおよび加飾成形品 |
| JP6724620B2 (ja) * | 2016-07-19 | 2020-07-15 | Jsr株式会社 | 接着剤、積層体、積層体の製造方法および電子部品 |
| EP3491047B1 (en) | 2016-07-28 | 2021-09-15 | 3M Innovative Properties Company | Segmented silicone polyamide block copolymers and articles containing the same |
| US10640614B2 (en) | 2016-07-28 | 2020-05-05 | 3M Innovative Properties Company | Segmented silicone polyamide block copolymers and articles containing the same |
| CN116200035A (zh) * | 2022-12-27 | 2023-06-02 | 镇江东艺机械有限公司 | 一种用于阀体密封的pai复合材料及其制备方法 |
-
2002
- 2002-09-03 JP JP2002257934A patent/JP4174274B2/ja not_active Expired - Fee Related
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