JP2004082482A5 - - Google Patents

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Publication number
JP2004082482A5
JP2004082482A5 JP2002245694A JP2002245694A JP2004082482A5 JP 2004082482 A5 JP2004082482 A5 JP 2004082482A5 JP 2002245694 A JP2002245694 A JP 2002245694A JP 2002245694 A JP2002245694 A JP 2002245694A JP 2004082482 A5 JP2004082482 A5 JP 2004082482A5
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JP
Japan
Prior art keywords
mold
thermoplastic resin
slidable
cavity
mold piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002245694A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004082482A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002245694A priority Critical patent/JP2004082482A/ja
Priority claimed from JP2002245694A external-priority patent/JP2004082482A/ja
Publication of JP2004082482A publication Critical patent/JP2004082482A/ja
Publication of JP2004082482A5 publication Critical patent/JP2004082482A5/ja
Pending legal-status Critical Current

Links

JP2002245694A 2002-08-26 2002-08-26 射出成形用金型、射出成形方法及び光学素子 Pending JP2004082482A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002245694A JP2004082482A (ja) 2002-08-26 2002-08-26 射出成形用金型、射出成形方法及び光学素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002245694A JP2004082482A (ja) 2002-08-26 2002-08-26 射出成形用金型、射出成形方法及び光学素子

Publications (2)

Publication Number Publication Date
JP2004082482A JP2004082482A (ja) 2004-03-18
JP2004082482A5 true JP2004082482A5 (cg-RX-API-DMAC7.html) 2005-09-08

Family

ID=32053809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002245694A Pending JP2004082482A (ja) 2002-08-26 2002-08-26 射出成形用金型、射出成形方法及び光学素子

Country Status (1)

Country Link
JP (1) JP2004082482A (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4057385B2 (ja) * 2002-09-27 2008-03-05 株式会社リコー プラスチック成形品の成形方法および射出成形用金型
JP4979627B2 (ja) 2008-03-31 2012-07-18 株式会社ホンダロック 樹脂成形方法および樹脂成形用金型装置
US20200001510A1 (en) * 2016-06-08 2020-01-02 Mitsubishi Electric Corporation Injection compression molding mold and injection compression molding method

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