JP2004080061A - Component mounting facility - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve high-speed mounting operations of components by suppressing the increase in size of a facility in a component mounting facility. <P>SOLUTION: The component mounting facility is provided with a board positioning part 24, a pair of component feeding tables 12 installed fixedly on both sides of the board positioning part 24, a first mounting head 31, and a second mounting head 31. In the first mounting head 31 and the second mounting head 31, a component mounting device has a constitution in which at least four component suction nozzles 33 are arranged radially against a rotary body to the rotary body 32 rotating around the horizontal axis. The other component mounting device is provided with a board positioning part having the same constitution as that of the component mounting device, a pair of component feeding tables, a first mounting head, and a second mounting head. These two monuting heads are arranged side by side on the straight line so that the respective board positioning parts 24 are connected. <P>COPYRIGHT: (C)2004,JPO

Description

The present invention relates to a component mounting facility for automatically mounting various components such as electronic components on a printed circuit board or the like.

Generally, in an electronic component mounting apparatus, a large number of component supply means are mounted in parallel on a component supply table, and at the time of component mounting, the component supply table is moved in the parallel direction of the component supply means, and the components are mounted in accordance with the order of components to be mounted. The component supply means is sequentially positioned at a predetermined component supply position, and the components of the component supply means are sucked and taken out by the mounting head portion, and are transferred to the circuit board positioned at the circuit board positioning section to mount the components. Is configured.

(4) A conventional component mounting apparatus of this type will be described with reference to FIG. 5 showing a perspective view and FIG. 6 showing a schematic plan view. In FIG. 5, a board positioning section 4 for positioning the circuit board P supplied from the board supply means 2 at a mounting position is provided at a front portion of the apparatus main body 1. In this board positioning section 4, The circuit board P on which the required components are mounted is discharged by the substrate discharging means 3. On the other hand, a component supply unit 7 is provided at the rear of the apparatus main body 1. Between the component supply unit 7 and the board positioning unit 4, as shown in FIG. A part 8 is provided.

The component supply section 7 is provided with two component supply tables 10 and 11 that are independently movable on the guide rail 9 in the left-right direction. Each of the component supply tables 10 and 11 includes a large number of components. The supply means 12 is mounted in parallel along the moving direction of the supply tables 10 and 11. As the component supply means 12, for example, one generally referred to as a part cassette is shown, and will be briefly described below. That is, electronic components of the same type are housed at equal intervals in a carrier tape and wound on a reel 13 in a state covered with a cover tape, and the carrier tape is unwound from the reel 13 and has a pitch equal to the housing interval of the components. And the cover tape is wound up, so that the frontmost electronic component is positioned at the component supply position A of the mounting head unit 8 facing the component suction head 14.

As shown in FIG. 6, the mounting head unit 8 includes a plurality of component suction heads 14 arranged at equal angular intervals on the same circumference of a rotary table (not shown) rotatably provided around a vertical axis. It is provided. Each of the component suction heads 14 is configured to suck a component by vacuum evacuation means, and is sequentially stopped at a component supply position A and a component mounting position B by intermittent rotation of the rotary table, so that the component supply means Receiving the component from the component 12 and mounting the component on the circuit board P are performed in parallel. Further, while one of the component supply tables 10 is supplying components, the other component supply table 11, which has been retracted to the standby position, performs replacement of the component supply means 12 and replenishment of components, so that the component mounting apparatus is not stopped. Preparations are made to operate.

In recent years, the types of circuit boards P to be produced and the types of components to be mounted on the circuit boards P tend to increase. On the other hand, it is conceivable to increase the number of component supply units 12 mounted on the component supply tables 10 and 11, but in this case, each of the component supply tables 10 and 11 increases with the increase in the number of component supply units 12. Therefore, the entire length of the component supply unit 7 becomes very long, the space utilization efficiency is deteriorated, and the productivity per floor area is reduced.

An even more important problem is that the component supply tables 10 and 11 are configured to be pitch-fed in accordance with the removal of components by the mounting head unit 8, so that the following inconveniences occur. That is, when the weight of the supply tables 10 and 11 increases as the length increases, not only a large driving force is required to move the component supply tables 10 and 11, but also Since the inertia force is increased, the vibration when feeding the supply tables 10 and 11 at the pitch is significantly increased. Therefore, it is not possible to increase the speed of component supply, that is, the mounting operation of components.

Therefore, the present invention provides a component mounting equipment capable of achieving a high-speed component mounting operation without increasing the size of the entire equipment even when the type of substrate or the number of components to be mounted on the substrate increases. The purpose is to provide.

In order to achieve the above object, the component mounting equipment of the present invention transports a board, and a board positioning section for positioning the board, and a number of component supply means are mounted in parallel in the board transport direction and mounted so that the board positioning is performed. A pair of component supply tables fixedly installed on both sides of the unit, and a first mounting head unit of an XY movement type for sucking a component of one component supply table and mounting the component on a positioned substrate And a second mounting head of an XY movement type for mounting the component on the positioned substrate after sucking the component of the other component supply table, and the first mounting head and the second mounting. The head unit includes a component mounting apparatus having a configuration in which at least four component suction nozzles are radially disposed with respect to the rotary body on a rotary body that rotates about a horizontal axis. The board positioning unit having the above configuration, another component mounting apparatus including a pair of component supply tables, a first mounting head unit, and a second mounting head unit are connected in a straight line by connecting the respective board positioning units. It is characterized by being juxtaposed.

With this, the component supply table is fixedly installed, so that the component supply table is independent of vibration regardless of the number of mounted component supply means, and the mounting head is driven by a plurality of component suction nozzles disposed on the rotating body. The robot type is a robot type that sequentially picks up a plurality of components from the component supply table and then sequentially mounts each component at a predetermined location on the board, so even if the number of components mounted on the board increases, the rotary type The component mounting operation can be remarkably speeded up as compared with a conventional device in which the component supply table is pitch-fed to the mounting head.

(4) Since components can be mounted on the board positioned by the single board positioning section by the first and second mounting heads, the component mounting operation can be further speeded up.

As described above, according to the present invention, it is possible to suppress an increase in the size of the component mounting equipment, and to remarkably speed up the component mounting operation.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

FIG. 1 is a schematic plan view schematically showing a component mounting facility (component mounting line) according to one embodiment of the present invention. In the figure, a board transfer path 21 from a board supply means 22 for supplying a board on which components are mounted to a board discharge means 23 for discharging the board is provided in the left-right direction. Two component mounting apparatuses 27A to 27D are provided. Since all of these component mounting apparatuses 27A to 27D have basically the same configuration, FIG. 2 showing a perspective view of the component mounting apparatus 27D and a plan view of the operation mechanism portion are shown using the component mounting apparatus 27D as an example. This will be described below with reference to FIG.

2, in the component mounting apparatus 27D, a pair of right and left inverted U-shaped support frames 29 are juxtaposed along the transfer path 21 so as to penetrate the board transfer path 21. Between them, two operation frames 30 are arranged in parallel with each other and bridged therebetween, and are individually movably supported in a direction orthogonal to the transport path 21. A mounting head section 31 is attached to each operation frame 30 so as to be movable along the operation frame 30. The mounting head section 31 is attached to a rotating body 32 that is rotatable about a horizontal axis by four components. The nozzles 33 are arranged at equal intervals (90 ° intervals), and the rotating body 32 rotates at the same pitch as the interval between the component suction nozzles 33, so that each of the component suction nozzles 33 is selectively directed downward sequentially. Then, the component 34 is sucked from the component supply table 28A, or the component 34 is mounted on the circuit board 37 of the board positioning unit 24.

部品 The component supply table 28A is fixedly installed at a predetermined position between the two support frames 29 after being moved by the casters 40 and inserted from both front and rear sides. The component supply table 28A is provided with the component supply means 12 composed of a packer set having the above-mentioned reels 13. In addition to this, as shown in FIG. A component supply table 28B on which a stick-shaped component supply means 38 sent to the takeout position is mounted, a component supply table 28C on which bulk components 39 are mounted, and a tray-shaped component supply table 28D are installed in each of the component mounting units 27A to 27D. You. Note that a mounting arm portion 59 in the form of a rotating arm for taking out these components is provided for the tray-shaped component supply table 28D.

In FIG. 3, a head positioning mechanism 41 for moving the mounting head 31 in a direction along the substrate transfer path 21 is housed inside the operation frame 30. The head positioning mechanism 41 is connected between a pair of support plates 42 fixed to both ends of the operation frame 30 and rotatably supported by a ball screw 43. And a moving body 49 having a nut 48 screwed with the ball screw 43 fixed therein and moved by the rotation of the ball screw 43. The mounting head unit 31 is fixed to a moving body 49 via a head holder 50, and the head holder 50 incorporates an existing head vertical movement mechanism unit 51 that moves the mounting head unit 31 up and down.

ヘ ッ ド A head transfer mechanism 52 for moving the head positioning mechanism 41 in the direction orthogonal to the substrate transfer path 21 via the operation frame 30 is housed in each of the support frames 29. The head transfer mechanism 52 is provided between a pair of support plates 53 fixed to both ends of the support frame 29 and rotatably supported by a ball screw 54. Between a stepping motor 56 that is driven to rotate, a moving body 57 that is screwed to the ball screw 54 and fixed to one end of each operation frame 30, and moves the operation frame 30 by the rotation of the ball screw 54, and the support plate 53. The guide shaft 58 is fixed by being bridged, and slidably supports the other end of the operation frame 30 through the other end.

Next, the operation of the component mounting equipment will be described with reference to the flowchart of FIG. In each of the component mounting apparatuses 27A to 27D, when one of the mounting heads 31 is picking up the component 34 from the component supply tables 28A to 28D, the other mounting head 31 mounts the component 34 on the circuit board 37 at the timing. Although both are controlled, the mounting heads 31 perform the same operation only by shifting the operation timing, so the operation of one mounting head 31 will now be described.

First, the mounting head unit 31 is moved to the position just above the component 34 to be sucked in the component supply tables 28A to 28D and positioned (step S1). That is, when the step motor 47 of the head positioning mechanism 41 rotates by a required angle in a required direction, the moving body 49 is moved in the direction along the substrate transport path 21 by the ball screw 43 that rotates integrally with the step motor 47. Then, the mounting head unit 31 is moved to a predetermined component take-out position in the component supply tables 28A to 28D. Here, the other component supply tables 28A to 28C except for the tray-shaped component supply table 28D face the mounting head unit 31 because the component removal positions are located in a straight line along the substrate transport path 21. The mounting head unit 31 is positioned at that position and does not move until there is no part such as a parts cassette or a stick.

When the mounting head section 31 is positioned, the head vertical movement mechanism section 51 operates to lower the mounting head section 31, the component suction nozzle 33 sucks the component 34, and then the mounting is performed by the head vertical movement mechanism section 51. The head 31 is slightly raised (step S2). Subsequently, the rotating body 32 of the mounting head unit 31 is rotated by one pitch, and the next component suction nozzle 33 is opposed to the component removal position (step S3). Here, the mounting head unit 31 determines whether or not the suction of a predetermined number (four in this example) of the components 34 has been completed (step S4). If not, the same operation as described above is performed. Is repeated to suck a predetermined number of components 34.

When the suction of the predetermined number of components 34 is completed, the step motor 56 of the head transfer mechanism 52 and the step motor 47 of the head positioning mechanism 41 are simultaneously driven, and the mounting head 31 is rotated by the rotation of the ball screw 54. It is moved onto the board positioning section 24 via the operation frame 30 and is positioned just above a predetermined component mounting position on the circuit board 37 by the head positioning mechanism section 41 (step S5 #). Next, the component held by the component suction nozzle 33 driven by the head vertical movement mechanism 51 is mounted on the circuit board 37 (step S6). After the mounting head unit 31 is slightly lifted by the head vertical movement mechanism unit 51, the mounting head unit 31 is moved to the true position of the next component mounting position on the circuit board 37 by the operation of the head positioning mechanism unit 41 and the head transfer mechanism unit 52. The rotating body 32 is rotated by one pitch while being moved upward and positioned, and the next component to be mounted is opposed to the component mounting position (step S7).

Here, it is determined whether or not the mounting of all the components 34 held by the mounting head unit 31 has been completed (step S8). If not, the same operation as described above is repeated. All the components 34 are mounted at predetermined positions on the circuit board 37.

Next, it is determined whether or not mounting of all the components 34 shared by the component mounting devices 27A to 27D to the circuit board 37 positioned by the board positioning unit 24 has been completed (step S9), and the process is terminated. If not, the mounting head unit 31 is moved onto the component supply tables 28A to 28D again, and the components 34 are sucked from the component supply tables 28A to 28D and the components 34 are attached to the circuit board 37 as described above. Is repeated until the mounting of all the components 34 on the circuit board 37 is completed. When the mounting of all the components 34 on the circuit board 37 is completed, the circuit boards 37 positioned on the board transfer path 21 are transferred at a predetermined pitch, and the board positioning units in the component mounting apparatuses 27A to 27D in the next process are transferred. 24 (step S10), and the same operation as described above is repeated.

In the component mounting equipment, different components can be mounted on the component supply tables 28A to 28D of a plurality of (four in this example) component mounting devices 27A to 27D arranged side by side along the board transfer path 21. When the types and the number of components 34 to be mounted on the circuit board 37 increase, these components are divided into the groups classified by type and mounted on each of the component supply tables 28A to 28D. 28A to 28D only mount components 34 of a group only, so that the size is not increased, and component supply tables 28A to 28D in each of the component mounting devices 27A to 27D are installed in a direction orthogonal to the board transfer path 21. Therefore, the size of the entire equipment does not increase so as to protrude largely in the direction of the substrate transfer path 21.

Also, since the mounting head unit 31 of each of the component mounting apparatuses 27A to 27D only operates, and the component supply tables 28A to 28D are fixedly installed, the component supply tables 28A to 28D are fixed regardless of the number of component supply units 12, 38 mounted. Become unrelated to vibration. Further, the mounting head unit 31 picks up a plurality of components 34 from the component supply tables 28A to 28D at once, and then sequentially mounts the components 34 at predetermined positions on the circuit board 37. Further, each of the component mounting apparatuses 27A to 27D is provided with a pair of mounting heads 31 so that when one of the components mounts the component 34, the other controls the component 34 held by the suction to be held on the circuit board 37. I have. As a result, even when the types and the number of the components 34 mounted on the circuit board 37 are increased, the component mounting is performed in comparison with the configuration in which the component supply table is pitch-fed to the rotary mounting head unit as in the conventional device. Operation can be remarkably accelerated.

On the other hand, when the number of types of the circuit boards 37 increases, a part of the component supply tables 28A to 28D installed in the respective component mounting apparatuses 27A to 27D is replaced with a component supply table on which a required component 34 is mounted. This can be dealt with simply by changing to the tables 28A to 28D. It is needless to say that the component mounting apparatuses 27A to 27D can be used alone.

FIG. 1 is a schematic plan view schematically showing a component mounting facility according to one embodiment of the present invention. The perspective view of one embodiment of the component mounting device of the present invention which is a part of the above equipment. FIG. 2 is a plan view of an operation mechanism of the device. Flow chart of the above device. FIG. 9 is a perspective view of a conventional component mounting apparatus. FIG. 2 is a schematic plan view of the same device.

Explanation of reference numerals

12, 38 component supply means 21 substrate transport means 22 substrate supply means 23 substrate discharge means 24 substrate positioning unit 27A to 27D component mounting device 28A to 28D component supply table 31, 59 mounting head unit 33 component suction nozzle 34 component 37 substrate 41 head Positioning mechanism 51 Head vertical movement mechanism 52 Head transfer mechanism

Claims (1)

A board positioning section for transporting the board and positioning the board, and a pair of component feeders which are mounted so that a number of component supply means are arranged in parallel in the board transfer direction and are fixedly installed on both sides of the board positioning section After sucking the table, the component of one component supply table, the first mounting head of the XY movement type for mounting the component on the positioned substrate, and the component of the other component supply table, A second mounting head of an XY movement type for mounting a component on a positioned substrate, wherein the first mounting head and the second mounting head are each provided with at least four rotating bodies rotating about a horizontal axis. A component mounting apparatus having a configuration in which the component suction nozzles are radially arranged with respect to the rotating body,
A board positioning unit having the same configuration as the component mounting apparatus, another component mounting apparatus including a pair of component supply tables, a first mounting head unit, and a second mounting head unit;
Component mounting equipment characterized by being arranged in a straight line so as to connect the board positioning parts.

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