JP2004068637A - Exhausting device and method - Google Patents

Exhausting device and method Download PDF

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Publication number
JP2004068637A
JP2004068637A JP2002226075A JP2002226075A JP2004068637A JP 2004068637 A JP2004068637 A JP 2004068637A JP 2002226075 A JP2002226075 A JP 2002226075A JP 2002226075 A JP2002226075 A JP 2002226075A JP 2004068637 A JP2004068637 A JP 2004068637A
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Prior art keywords
vacuum
vacuum pump
exhaust
degree
rotation speed
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Inventor
Masahiro Kumagai
熊谷　正浩
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Seiko Epson Corp
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Seiko Epson Corp
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  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
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Abstract

<P>PROBLEM TO BE SOLVED: To reduce the power consumption of a vacuum pump while inhibiting the lowering of the vacuum in an exhaust pipe. <P>SOLUTION: A rotation control device 3 increases a rotating frequency of the vacuum pump 2 when it receives a start signal S1 of the processing done in a processing device 1, decreases the rotating frequency of the vacuum pump 2 when it receives a termination signal S2 of the processing done in the processing device 1, and further increases the rotating frequency of the vacuum pump 2 when the vacuum in the exhaust pipe 4 becomes less than a predetermined value P1. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は排気装置および排気方法に関し、特に、真空ポンプの駆動方法に適用して好適なものである。
【０００２】
【従来の技術】
従来の排気装置では、真空ポンプの消費電力を節約するために、真空排気の対象となる装置の運転状態と連動させて、真空ポンプの回転数を制御する方法があった。
図３は、従来の排気装置の概略構成を示すブロック図である。
【０００３】
図３において、真空ポンプ１２は、排気管１４を介して真空容器１１と接続され、回転制御装置１３は、真空排気の対象となる装置の運転状態と連動させて、真空ポンプ１２の回転数を制御する。
図４は、従来の排気装置の動作を示すタイミングチャートである。
図４において、回転制御装置１３は、真空ポンプ１２が起動されると、真空ポンプ１２の回転数を定常状態に設定することにより、真空容器１１を排気する。
【０００４】
そして、回転制御装置１３は、真空容器１１内の真空度が要求されなくなると、真空ポンプ１２の回転数をアイドリング状態に設定し（ｔ１１）、真空容器１１内の真空度が再び要求されると、真空ポンプ１２の回転数を定常状態に戻す（ｔ１２）。
【０００５】
【発明が解決しようとする課題】
しかしながら、従来の排気方法では、真空ポンプ１２の回転数をアイドリング状態に設定すると、排気管１４などのリークにより、真空容器１１や排気管１４などの真空度が徐々に低下する。
このため、真空容器１１内を再度排気する際に、その立ち上がりに時間がかかり、半導体装置製造時のスループットが低下したり、真空容器１１から排出される昇華性物質が滞留して、真空ポンプ１２や排気管１４などに付着したりするという問題があった。
【０００６】
そこで、本発明の目的は、排気管内の真空度の低下を抑制しつつ、真空ポンプの消費電力を節約することが可能な排気装置および排気方法を提供することである。
【０００７】
【課題を解決するための手段】
上述した課題を解決するために、請求項１記載の排気装置によれば、排気を行う排気手段と、前記排気手段の吸気側の真空度を計測する真空センサと、前記吸気側の真空度に基づいて前記排気手段の駆動制御を行う駆動制御手段とを備えることを特徴とする。
【０００８】
これにより、排気手段の吸気側の真空度を維持しながら、排気手段の駆動制御を行うことが可能となり、排気管内の真空度の低下を抑制しつつ、排気手段の消費電力を節約することが可能となる。
また、請求項２記載の排気装置によれば、前記駆動制御手段は、前記吸気側の真空度が所定値以下になった場合、前記排気手段の排気力を上昇させることを特徴とする。
【０００９】
これにより、吸気側の真空度を所定値以上に保ちつつ、排気手段の排気力を下降させることが可能となり、排気管などのリークがある場合においても、排気管内の真空度の低下を抑制しつつ、排気手段の消費電力を節約することが可能となる。
また、請求項３記載の排気装置によれば、処理装置の排気を行う真空ポンプと、前記真空ポンプの吸気側の真空度を計測する真空センサと、前記処理装置で行われる処理の開始信号に基づいて、前記真空ポンプの回転数を上昇させ、前記処理装置で行われる処理の終了信号に基づいて、前記真空ポンプの回転数を下降させる第１の回転数制御手段と、前記真空ポンプの回転数が下っている時に、前記吸気側の真空度が所定値以下になった場合、前記真空センサの回転数を上昇させる第２の回転数制御手段とを備えることを特徴とする。
【００１０】
これにより、排気管の真空度を所定値以上に保ちつつ、真空ポンプの回転数を下降させることが可能となり、排気管などのリークがある場合においても、排気管内の真空度の低下を抑制しつつ、真空ポンプの消費電力を節約することが可能となる。
このため、真空ポンプの消費電力を節約する場合においても、その立ち上がり時間を低減して、半導体装置製造時のスループットの劣化を抑制することが可能となるとともに、処理装置から排出される昇華性物質の滞留を抑制して、昇華性物質の付着を低減することが可能となる。
【００１１】
また、請求項４記載の排気方法によれば、処理装置で行われる処理の開始信号に基づいて、前記処理装置内を排気する真空ポンプの回転数を上昇させるステップと、前記処理装置で行われる処理の終了信号に基づいて、前記真空ポンプの回転数を下降させるステップと、前記真空ポンプの回転数が下っている時に、前記真空ポンプの吸気側の真空度が所定値以下になった場合、前記真空センサの回転数を上昇させるステップとを備えることを特徴とする。
【００１２】
これにより、未処理時に真空ポンプの回転数を下降させ、真空ポンプの消費電力を節約する場合においても、排気管内の真空度の低下を抑制することが可能となる。
このため、真空ポンプの立ち上がり時間を低減して、半導体装置製造時のスループットの劣化を抑制することが可能となるとともに、処理装置から排出される昇華性物質の滞留を抑制して、昇華性物質の付着を低減することが可能となる。
【００１３】
【発明の実施の形態】
以下、本発明の実施形態に係る排気装置および排気方法について、図面を参照しながら説明する。
図１は、本発明の一実施形態に係る排気装置の概略構成を示すブロック図である。
【００１４】
図１において、真空ポンプ２は、排気管４を介して処理装置１と接続され、真空ポンプ２の吸気側には、真空センサ５が設けられている。また、回転制御装置３には、処理装置１で行われる処理の開始信号および終了信号が送られるとともに、真空センサ５による真空度の計測結果が送出される。そして、回転制御装置３は、処理装置１の動作状態および真空センサ５による真空度の計測結果に基づいて、真空ポンプ２の回転数を制御する。
【００１５】
なお、処理装置１としては、例えば、ＣＶＤ装置、スパッタ装置、蒸着装置、エッチング装置などを用いることができる。また、真空ポンプ２としては、例えば、ドライポンプやターボポンプなどを用いることができる。
図２は、本発明の一実施形態に係る排気装置の動作を示すタイミングチャートである。
【００１６】
図２（ａ）において、回転制御装置３は、処理装置１で行われる処理の開始信号Ｓ１を受け取ると、図２（ｃ）に示すように、真空ポンプ２の回転数を上昇させる（ｔ１）。この結果、図２（ｂ）に示すように、処理装置１および排気管４内の真空度は上昇する。
次に、図２（ａ）において、回転制御装置３は、処理装置１で行われる処理の終了信号Ｓ２を受け取ると、図２（ｃ）に示すように、真空ポンプ２の回転数を下降させる（ｔ２）。この結果、図２（ｂ）に示すように、処理装置１および排気管４内の真空度は下降する。
【００１７】
ここで、真空ポンプ２の回転数を下降させることにより、真空ポンプ２の消費電力を節約して、省エネルギー化を図ることが可能になる。
そして、排気管４などでのリークにより、排気管４内の真空度が低下し、排気管４内の真空度が所定値Ｐ１以下になると、回転制御装置３は、図２（ｃ）に示すように、真空ポンプ２の回転数を上昇させる（ｔ３）。この結果、図２（ｂ）に示すように、処理装置１および排気管４内の真空度は上昇する。
【００１８】
そして、回転制御装置３は、排気管４内の真空度が上昇し、排気管４内の真空度が所定値Ｐ２以上になると、図２（ｃ）に示すように、真空ポンプ２の回転数を下降させる（ｔ４）。
これにより、処理装置１の未処理時に真空ポンプ２の回転数を下降させ、真空ポンプ２の消費電力を節約する場合においても、排気管４内の真空度を所定値Ｐ１以上に維持することが可能となる。
【００１９】
このため、排気管４などのリークがある場合においても、真空ポンプ２の省エネルギー化を図りつつ、真空ポンプ２の立ち上がり時間を低減して、半導体装置製造時のスループットの劣化を抑制することが可能となるとともに、処理装置１から排出される昇華性物質の滞留を抑制して、昇華性物質の付着を低減することが可能となる。
【００２０】
【発明の効果】
以上説明したように、本発明によれば、吸気側の真空度を計測しながら、排気手段の駆動制御を行うことにより、排気管内の真空度の低下を抑制しつつ、排気手段の消費電力を節約することが可能となる。
【図面の簡単な説明】
【図１】本発明の一実施形態に係る排気装置の概略構成を示すブロック図である。
【図２】本発明の一実施形態に係る排気装置の動作を示すタイミングチャートである。
【図３】従来の排気装置の概略構成を示すブロック図である。
【図４】従来の排気装置の動作を示すタイミングチャートである。
【符号の説明】
１　処理装置、２　真空ポンプ、３　回転制御装置、４　排気管、５　真空センサ[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an exhaust device and an exhaust method, and is particularly suitable for application to a driving method of a vacuum pump.
[0002]
[Prior art]
In a conventional evacuation apparatus, there is a method of controlling the number of revolutions of a vacuum pump in conjunction with an operation state of an apparatus to be evacuated in order to save power consumption of the vacuum pump.
FIG. 3 is a block diagram showing a schematic configuration of a conventional exhaust device.
[0003]
In FIG. 3, the vacuum pump 12 is connected to the vacuum vessel 11 via an exhaust pipe 14, and the rotation control device 13 controls the rotation speed of the vacuum pump 12 in conjunction with the operation state of the device to be evacuated. Control.
FIG. 4 is a timing chart showing the operation of the conventional exhaust device.
In FIG. 4, when the vacuum pump 12 is started, the rotation control device 13 exhausts the vacuum vessel 11 by setting the rotation speed of the vacuum pump 12 to a steady state.
[0004]
When the degree of vacuum in the vacuum vessel 11 is no longer required, the rotation control device 13 sets the rotation speed of the vacuum pump 12 to the idling state (t11), and when the degree of vacuum in the vacuum vessel 11 is required again. Then, the rotation speed of the vacuum pump 12 is returned to the steady state (t12).
[0005]
[Problems to be solved by the invention]
However, in the conventional evacuation method, when the rotation speed of the vacuum pump 12 is set to the idling state, the degree of vacuum of the vacuum vessel 11 and the evacuation pipe 14 gradually decreases due to the leakage of the evacuation pipe 14 and the like.
For this reason, when the inside of the vacuum vessel 11 is evacuated again, it takes time to rise, and the throughput at the time of manufacturing the semiconductor device decreases, or the sublimable substance discharged from the vacuum vessel 11 stays and the vacuum pump 12 And it adheres to the exhaust pipe 14 and the like.
[0006]
Accordingly, an object of the present invention is to provide an exhaust device and an exhaust method capable of saving the power consumption of a vacuum pump while suppressing a decrease in the degree of vacuum in an exhaust pipe.
[0007]
[Means for Solving the Problems]
In order to solve the above-described problem, according to the exhaust device of claim 1, an exhaust unit that exhausts, a vacuum sensor that measures a vacuum degree on an intake side of the exhaust unit, and a vacuum degree on the intake side. And a drive control means for performing drive control of the exhaust means based on the control information.
[0008]
This makes it possible to control the drive of the exhaust unit while maintaining the degree of vacuum on the intake side of the exhaust unit, and to reduce the power consumption of the exhaust unit while suppressing a decrease in the degree of vacuum in the exhaust pipe. It becomes possible.
According to a second aspect of the present invention, the drive control means increases the exhaust force of the exhaust means when the degree of vacuum on the intake side becomes equal to or less than a predetermined value.
[0009]
This makes it possible to lower the exhaust power of the exhaust means while maintaining the degree of vacuum on the intake side at a predetermined value or more, and to suppress a decrease in the degree of vacuum in the exhaust pipe even when there is a leak in the exhaust pipe. In addition, the power consumption of the exhaust means can be reduced.
According to the exhaust device of the third aspect, a vacuum pump that exhausts the processing device, a vacuum sensor that measures the degree of vacuum on the suction side of the vacuum pump, and a start signal of a process performed by the processing device. A first rotation speed control means for increasing the rotation speed of the vacuum pump based on the rotation speed of the vacuum pump, and decreasing the rotation speed of the vacuum pump based on an end signal of the processing performed in the processing device; A second rotation speed control unit configured to increase the rotation speed of the vacuum sensor when the degree of vacuum on the suction side becomes lower than a predetermined value when the number is decreasing.
[0010]
This makes it possible to reduce the number of rotations of the vacuum pump while maintaining the degree of vacuum of the exhaust pipe at a predetermined value or more, and to suppress a decrease in the degree of vacuum in the exhaust pipe even when there is a leak from the exhaust pipe. In addition, the power consumption of the vacuum pump can be reduced.
Therefore, even when the power consumption of the vacuum pump is reduced, the rise time of the vacuum pump can be reduced to suppress the deterioration of the throughput at the time of manufacturing the semiconductor device, and the sublimable substance discharged from the processing apparatus can be suppressed. Can be suppressed, and the adhesion of the sublimable substance can be reduced.
[0011]
According to the exhaust method of the fourth aspect, a step of increasing the rotation speed of a vacuum pump for exhausting the inside of the processing apparatus based on a start signal of the processing performed in the processing apparatus is performed by the processing apparatus. A step of lowering the rotation speed of the vacuum pump based on a processing end signal, and, when the rotation speed of the vacuum pump is falling, when the degree of vacuum on the suction side of the vacuum pump has become a predetermined value or less, Increasing the rotation speed of the vacuum sensor.
[0012]
This makes it possible to suppress a decrease in the degree of vacuum in the exhaust pipe even when the number of revolutions of the vacuum pump is reduced during non-treatment and power consumption of the vacuum pump is saved.
For this reason, it is possible to reduce the rise time of the vacuum pump, to suppress the deterioration of the throughput during the manufacture of the semiconductor device, and to suppress the stagnation of the sublimable substance discharged from the processing apparatus, and Can be reduced.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an exhaust device and an exhaust method according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a block diagram illustrating a schematic configuration of an exhaust device according to an embodiment of the present invention.
[0014]
In FIG. 1, a vacuum pump 2 is connected to a processing apparatus 1 via an exhaust pipe 4, and a vacuum sensor 5 is provided on the suction side of the vacuum pump 2. Further, a start signal and an end signal of the processing performed by the processing device 1 are sent to the rotation control device 3, and a measurement result of the degree of vacuum by the vacuum sensor 5 is sent out. The rotation control device 3 controls the rotation speed of the vacuum pump 2 based on the operation state of the processing device 1 and the measurement result of the degree of vacuum by the vacuum sensor 5.
[0015]
In addition, as the processing apparatus 1, for example, a CVD apparatus, a sputtering apparatus, a vapor deposition apparatus, an etching apparatus, or the like can be used. As the vacuum pump 2, for example, a dry pump, a turbo pump, or the like can be used.
FIG. 2 is a timing chart showing the operation of the exhaust device according to one embodiment of the present invention.
[0016]
2A, when the rotation control device 3 receives the start signal S1 of the processing performed in the processing device 1, as shown in FIG. 2C, the rotation control device 3 increases the rotation speed of the vacuum pump 2 (t1). . As a result, as shown in FIG. 2B, the degree of vacuum in the processing apparatus 1 and the exhaust pipe 4 increases.
Next, in FIG. 2A, when the rotation control device 3 receives the end signal S2 of the processing performed in the processing device 1, as shown in FIG. 2C, the rotation speed of the vacuum pump 2 is reduced. (T2). As a result, as shown in FIG. 2B, the degree of vacuum in the processing apparatus 1 and the exhaust pipe 4 decreases.
[0017]
Here, by reducing the rotation speed of the vacuum pump 2, it is possible to save power consumption of the vacuum pump 2 and to save energy.
Then, when the degree of vacuum in the exhaust pipe 4 decreases due to a leak in the exhaust pipe 4 or the like and the degree of vacuum in the exhaust pipe 4 becomes equal to or less than a predetermined value P1, the rotation control device 3 shows in FIG. Thus, the rotation speed of the vacuum pump 2 is increased (t3). As a result, as shown in FIG. 2B, the degree of vacuum in the processing apparatus 1 and the exhaust pipe 4 increases.
[0018]
Then, when the degree of vacuum in the exhaust pipe 4 increases and the degree of vacuum in the exhaust pipe 4 becomes equal to or more than a predetermined value P2, the rotation control device 3 rotates the vacuum pump 2 as shown in FIG. Is lowered (t4).
Thus, even when the rotation speed of the vacuum pump 2 is reduced when the processing apparatus 1 is not being processed and power consumption of the vacuum pump 2 is to be saved, the degree of vacuum in the exhaust pipe 4 can be maintained at a predetermined value P1 or more. It becomes possible.
[0019]
For this reason, even in the case where there is a leak from the exhaust pipe 4 or the like, it is possible to reduce the rise time of the vacuum pump 2 and to suppress the deterioration of the throughput at the time of manufacturing the semiconductor device while saving the energy of the vacuum pump 2. At the same time, it is possible to suppress the stagnation of the sublimable substance discharged from the processing apparatus 1 and reduce the adhesion of the sublimable substance.
[0020]
【The invention's effect】
As described above, according to the present invention, by controlling the driving of the exhaust unit while measuring the degree of vacuum on the intake side, the power consumption of the exhaust unit can be reduced while suppressing the decrease in the degree of vacuum in the exhaust pipe. It is possible to save money.
[Brief description of the drawings]
FIG. 1 is a block diagram illustrating a schematic configuration of an exhaust device according to an embodiment of the present invention.
FIG. 2 is a timing chart showing an operation of the exhaust device according to one embodiment of the present invention.
FIG. 3 is a block diagram showing a schematic configuration of a conventional exhaust device.
FIG. 4 is a timing chart showing the operation of a conventional exhaust device.
[Explanation of symbols]
1 processing device, 2 vacuum pump, 3 rotation control device, 4 exhaust pipe, 5 vacuum sensor

Claims (4)

排気を行う排気手段と、
前記排気手段の吸気側の真空度を計測する真空センサと、
前記吸気側の真空度に基づいて前記排気手段の駆動制御を行う駆動制御手段とを備えることを特徴とする排気装置。Exhaust means for exhausting,
A vacuum sensor for measuring the degree of vacuum on the intake side of the exhaust means,
An exhaust device comprising: a drive control unit that performs drive control of the exhaust unit based on the degree of vacuum on the intake side. 前記駆動制御手段は、前記吸気側の真空度が所定値以下になった場合、前記排気手段の排気力を上昇させることを特徴とする請求項１記載の排気装置。2. The exhaust device according to claim 1, wherein the drive control unit increases the exhaust force of the exhaust unit when the degree of vacuum on the intake side becomes equal to or less than a predetermined value. 処理装置の排気を行う真空ポンプと、
前記真空ポンプの吸気側の真空度を計測する真空センサと、
前記処理装置で行われる処理の開始信号に基づいて、前記真空ポンプの回転数を上昇させ、前記処理装置で行われる処理の終了信号に基づいて、前記真空ポンプの回転数を下降させる第１の回転数制御手段と、
前記真空ポンプの回転数が下っている時に、前記吸気側の真空度が所定値以下になった場合、前記真空センサの回転数を上昇させる第２の回転数制御手段とを備えることを特徴とする排気装置。A vacuum pump for exhausting the processing device;
A vacuum sensor that measures the degree of vacuum on the suction side of the vacuum pump,
A first step of increasing the number of revolutions of the vacuum pump based on a start signal of the processing performed by the processing apparatus and decreasing the number of rotations of the vacuum pump based on an end signal of the processing performed by the processing apparatus; Rotation speed control means,
When the number of rotations of the vacuum pump is falling, the vacuum rate on the suction side becomes equal to or less than a predetermined value, and a second number of rotations control means for increasing the number of rotations of the vacuum sensor is provided. Exhaust system. 処理装置で行われる処理の開始信号に基づいて、前記処理装置内を排気する真空ポンプの回転数を上昇させるステップと、
前記処理装置で行われる処理の終了信号に基づいて、前記真空ポンプの回転数を下降させるステップと、
前記真空ポンプの回転数が下っている時に、前記真空ポンプの吸気側の真空度が所定値以下になった場合、前記真空センサの回転数を上昇させるステップとを備えることを特徴とする排気方法。Based on a start signal of processing performed in the processing device, increasing the rotation speed of a vacuum pump that exhausts the processing device,
A step of lowering the rotation speed of the vacuum pump based on an end signal of the processing performed in the processing device;
A step of increasing the number of revolutions of the vacuum sensor when the degree of vacuum on the suction side of the vacuum pump becomes lower than or equal to a predetermined value while the number of revolutions of the vacuum pump is decreasing. .
JP2002226075A 2002-08-02 2002-08-02 Exhausting device and method Withdrawn JP2004068637A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006342688A (en) * 2005-06-07 2006-12-21 Ebara Corp Evacuation system
JP2017179974A (en) * 2016-03-31 2017-10-05 株式会社モリタホールディングス Work vehicle

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006342688A (en) * 2005-06-07 2006-12-21 Ebara Corp Evacuation system
KR101243891B1 (en) * 2005-06-07 2013-03-20 가부시키가이샤 에바라 세이사꾸쇼 Vacuum exhaust system
JP2017179974A (en) * 2016-03-31 2017-10-05 株式会社モリタホールディングス Work vehicle

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