JP5562144B2 - Vacuum pump, operation control device and operation control method thereof - Google Patents

Description

  The present invention relates to a vacuum pump control device, and more particularly, to a vacuum pump for operating and controlling a vacuum pump used for evacuating a chamber of a semiconductor manufacturing device or the like to a vacuum, an operation control device and an operation control method thereof.

  In a semiconductor manufacturing apparatus, a vacuum pump is used to exhaust a gas used in a semiconductor manufacturing process from a chamber and create a vacuum environment in the chamber. As such a vacuum pump, a positive displacement type vacuum pump provided with a roots type or screw type pump rotor is known.

  In general, a positive displacement vacuum pump includes a pair of pump rotors disposed in a casing and a motor for rotationally driving the pump rotor. A minute clearance is formed between the pair of pump rotors and between the pump rotor and the inner surface of the casing, and the pump rotor is configured to rotate without contact with the casing. The pair of pump rotors rotate in opposite directions while being synchronized with each other, whereby the gas in the casing is transferred from the suction side to the discharge side, and the gas is exhausted from a chamber or the like connected to the suction port.

  Some gases used in the semiconductor manufacturing process contain a component that solidifies or liquefies when the temperature of the gas decreases. Usually, the vacuum pump described above generates compression heat in the process of transferring gas, so that the vacuum pump in operation is at a certain high temperature. Therefore, while the vacuum pump is kept at a high temperature, even when the gas containing the above-described components is exhausted using the vacuum pump, the gas components are not solidified or liquefied, and good vacuum exhaust is performed. .

  However, when the operation of the vacuum pump is stopped and the temperature of the vacuum pump is gradually lowered, the components contained in the gas are solidified or liquefied, and are deposited in a gap between the pump rotor and the casing (hereinafter, This solidified and liquefied component is called a product). For this reason, the product hinders the rotation of the pump rotor, and the startup torque of the motor cannot rotate the pump rotor, causing a problem that the restart of the vacuum pump fails. Further, in such a state, not only the vacuum pump cannot be restarted, but there is also a possibility that the motor is heated by applying an excessive load to the motor, causing a problem that the operation of the vacuum pump is hindered. .

  For example, a vacuum pump of Patent Document 1 has been proposed as a solution to the above-described problem that the operation of the vacuum pump is hindered by the accumulation of the product in the vacuum pump. In this vacuum pump, the product is removed by a pump rotor that rotates along a predetermined pattern, and it is possible to start up normally. Moreover, in the vacuum pump of patent document 2, it stops after rotating a pump rotor along a predetermined timing pattern at the time of a driving | operation stop, and a product can be removed and it can be started normally.

JP 2004-138047 A JP 2009-97349 A

  However, in the above-described turbo vacuum pump, the operation of scraping off the product is performed on the pump side alone, and the semiconductor manufacturing process of the semiconductor manufacturing apparatus is not considered. For this reason, the operation of scraping off the product of the vacuum pump may interfere with the semiconductor manufacturing process of the semiconductor manufacturing apparatus. The timing for executing the operation of scraping off the product on the vacuum pump side is desirably adjusted with the semiconductor manufacturing process on the semiconductor manufacturing apparatus side.

  The present invention has been made in view of the above problems, and in accordance with instructions from a semiconductor manufacturing apparatus, products accumulated in the vacuum pump are eliminated, the maintenance period of the vacuum pump is extended, and the life of the vacuum pump is extended. An object of the present invention is to provide an extended vacuum pump, an operation control device thereof, and an operation control method.

A vacuum pump according to an embodiment of the present invention is a vacuum pump that exhausts the inside of a chamber of a semiconductor manufacturing apparatus through an exhaust path provided with an electromagnetic valve whose opening and closing is controlled by a control device of the semiconductor manufacturing apparatus . when receiving the signal output in response to the control of the solenoid valve in the closed from the control device, characterized in that it comprises an operation control unit for controlling the product measures operation. According to this vacuum pump, the products accumulated in the vacuum pump can be eliminated without interfering with the semiconductor manufacturing process of the semiconductor manufacturing apparatus, the maintenance period of the vacuum pump can be extended, and the life of the vacuum pump can be extended. .

Further, in the vacuum pump according to one embodiment of the present invention, the operation control unit detects an operation state of the vacuum pump, determines the product countermeasure operation timing based on the operation state of the vacuum pump, and the product. it may control the product countermeasure operation when receiving a previous issue relaxin before Symbol control device measures the operation time. According to this vacuum pump, products accumulated in the vacuum pump are effectively eliminated without interfering with the semiconductor manufacturing process of the semiconductor manufacturing apparatus, the maintenance period of the vacuum pump is extended, and the life of the vacuum pump is extended. be able to.

  Moreover, the vacuum pump which concerns on one Embodiment of this invention WHEREIN: The said operation control part may perform the driving | operation sequence which repeats driving | operation / stop of the said vacuum pump as said product countermeasure driving | operation. According to this vacuum pump, products accumulated in the vacuum pump are effectively eliminated without interfering with the semiconductor manufacturing process of the semiconductor manufacturing apparatus, the maintenance period of the vacuum pump is extended, and the life of the vacuum pump is extended. be able to.

  In the vacuum pump according to an embodiment of the present invention, the operation control unit may execute a stop sequence of the vacuum pump as the product countermeasure operation. According to this vacuum pump, products accumulated in the vacuum pump are effectively eliminated without interfering with the semiconductor manufacturing process of the semiconductor manufacturing apparatus, the maintenance period of the vacuum pump is extended, and the life of the vacuum pump is extended. be able to.

  In the vacuum pump according to an embodiment of the present invention, the operation control unit may execute a startup sequence of the vacuum pump as the product countermeasure operation. According to this vacuum pump, products accumulated in the vacuum pump are effectively eliminated without interfering with the semiconductor manufacturing process of the semiconductor manufacturing apparatus, the maintenance period of the vacuum pump is extended, and the life of the vacuum pump is extended. be able to.

  In the vacuum pump according to an embodiment of the present invention, the operation control unit may execute a stop sequence and a start sequence of the vacuum pump as the product countermeasure operation. According to the operation control device of this vacuum pump, the product accumulated in the vacuum pump is effectively eliminated without interfering with the semiconductor manufacturing process of the semiconductor manufacturing device, the maintenance period of the vacuum pump is extended, Life can be extended.

An operation control apparatus for a vacuum pump according to an embodiment of the present invention exhausts the inside of a chamber of a semiconductor manufacturing apparatus via an exhaust path provided with an electromagnetic valve whose opening and closing is controlled by the control apparatus of the semiconductor manufacturing apparatus. operation control device for a vacuum pump that controls the operating state of the vacuum pump, when the solenoid valve from the control unit receives a signal outputted in response to control of the closed control product measures the operation of the vacuum pump An operation control unit is provided. According to this vacuum pump operation control device, products accumulated in the vacuum pump are eliminated without interfering with the semiconductor manufacturing process of the semiconductor manufacturing equipment, extending the maintenance period of the vacuum pump and extending the life of the vacuum pump. can do.

A vacuum pump operation control method according to an embodiment of the present invention exhausts a chamber of a semiconductor manufacturing apparatus through an exhaust path provided with an electromagnetic valve whose opening and closing is controlled by the control apparatus of the semiconductor manufacturing apparatus. in operation control method of a vacuum pump to control the operating state of the vacuum pump, when the solenoid valve from the control unit receives a signal outputted in response to control of the closed, the vacuum pump according to product protection operation sequence It is characterized by controlling product countermeasure operation. According to this vacuum pump operation control method, products accumulated in the vacuum pump are eliminated without interfering with the semiconductor manufacturing process of the semiconductor manufacturing equipment, extending the vacuum pump maintenance period and extending the life of the vacuum pump. can do.

A vacuum pump operation control method according to an embodiment of the present invention exhausts a chamber of a semiconductor manufacturing apparatus through an exhaust path provided with an electromagnetic valve whose opening and closing is controlled by the control apparatus of the semiconductor manufacturing apparatus. in operation control method of a vacuum pump to control the operating state of the vacuum pump, the detected operating conditions of the vacuum pump, the operating state of the vacuum pump to determine product measures the operating time of the vacuum pump, from the control device When the signal output according to the control for closing the solenoid valve is received, the product countermeasure operation of the vacuum pump is controlled according to the product countermeasure operation sequence. According to the operation control method of the vacuum pump, the product accumulated in the vacuum pump is effectively eliminated without interfering with the semiconductor manufacturing process of the semiconductor manufacturing apparatus, the maintenance period of the vacuum pump is extended, Life can be extended.

  In the operation control method for a vacuum pump according to an embodiment of the present invention, the product countermeasure operation sequence may repeat operation / stop of the vacuum pump. According to the operation control method of the vacuum pump, the product accumulated in the vacuum pump is effectively eliminated without interfering with the semiconductor manufacturing process of the semiconductor manufacturing apparatus, the maintenance period of the vacuum pump is extended, Life can be extended.

  In the vacuum pump operation control method according to an embodiment of the present invention, the product countermeasure operation sequence may execute a stop sequence of the vacuum pump. According to the operation control method of the vacuum pump, the product accumulated in the vacuum pump is effectively eliminated without interfering with the semiconductor manufacturing process of the semiconductor manufacturing apparatus, the maintenance period of the vacuum pump is extended, Life can be extended.

  In the vacuum pump operation control method according to an embodiment of the present invention, the product countermeasure operation sequence may execute a startup sequence of the vacuum pump. According to the operation control method of the vacuum pump, the product accumulated in the vacuum pump is effectively eliminated without interfering with the semiconductor manufacturing process of the semiconductor manufacturing apparatus, the maintenance period of the vacuum pump is extended, Life can be extended.

  In the vacuum pump operation control method according to an embodiment of the present invention, the product countermeasure operation sequence may execute a stop sequence and a start sequence of the vacuum pump. According to the operation control method of the vacuum pump, the product accumulated in the vacuum pump is effectively eliminated without interfering with the semiconductor manufacturing process of the semiconductor manufacturing apparatus, the maintenance period of the vacuum pump is extended, Life can be extended.

Further, the operation control method for a vacuum pump according to an embodiment of the present invention, before moving to product protection operation of the vacuum pump, it is desirable to close the front SL electric solenoid valve. According to the operation control method of the vacuum pump, it is possible to prevent the semiconductor manufacturing process of the semiconductor manufacturing apparatus from being hindered during the product countermeasure operation of the vacuum pump.

  According to the present invention, in response to an instruction from the semiconductor manufacturing apparatus, a product countermeasure operation is performed to eliminate the product accumulated in the vacuum pump, and deposition is performed in the vacuum pump without interfering with the semiconductor manufacturing process of the semiconductor manufacturing apparatus. Therefore, it is possible to provide a vacuum pump, an operation control device thereof, and an operation control method capable of eliminating the generated product, extending the maintenance period of the vacuum pump, and extending the life of the vacuum pump.

It is a figure which shows schematic structure containing the semiconductor manufacturing apparatus and vacuum pump which use the operation control apparatus which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the structure of the roots type | mold vacuum pump used as a vacuum pump of FIG. It is the II-II sectional view taken on the line of FIG. It is sectional drawing which shows the structure of the screw type vacuum pump used as a vacuum pump of FIG. It is a figure which shows the structural example of the motor drive circuit which drives the motor of the vacuum pump which concerns on the 1st Embodiment of this invention. It is a figure which shows the structural example of the motor drive circuit which drives the motor of the vacuum pump which concerns on the 1st Embodiment of this invention. It is a timing chart which shows the operation | movement outline | summary regarding the product countermeasure driving | running | working performed in the semiconductor manufacturing apparatus and operation control apparatus of FIG. 2 is a flowchart illustrating a specific example of control processing for a vacuum pump executed in a control device in the semiconductor manufacturing apparatus of FIG. 1. It is a flowchart which shows the specific example of the control processing with respect to the product countermeasure driving | running | working performed in the operation control part in the operation control apparatus of FIG. It is a figure which shows the specific example of the stop sequence performed in the product countermeasure driving | operation of FIG. It is a flowchart which shows the specific example of the control processing with respect to the vacuum pump performed in the control apparatus in the semiconductor manufacturing apparatus which concerns on the 2nd Embodiment of this invention. It is a flowchart which shows the specific example of the control processing with respect to the product countermeasure driving | running | working performed in the operation control part in the operation control apparatus which concerns on the 2nd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In this embodiment, an operation control device and operation control method for a positive displacement vacuum pump used for exhausting gas in a chamber of a semiconductor manufacturing apparatus will be described. However, the operation control device and operation according to the present invention are described. The vacuum pump to which the control method is applied is not limited to this. Semiconductor manufacturing apparatuses that are evacuated by a vacuum pump are an etching apparatus, a CVD apparatus, and the like.

(First embodiment)
In the first embodiment of the present invention, configurations of a roots-type vacuum pump and a screw-type vacuum pump are illustrated as a positive displacement vacuum pump using the operation control device according to the present invention.

<Overall configuration>
FIG. 1 is a diagram showing a schematic configuration including a semiconductor manufacturing apparatus using an operation control apparatus according to the present invention and a vacuum pump. In FIG. 1, a semiconductor manufacturing apparatus 100 is an apparatus that performs a semiconductor manufacturing process using the above-described gas, such as an etching apparatus or a CVD apparatus, and the apparatus is not particularly limited. In the semiconductor manufacturing apparatus 100, gas in a chamber (not shown) is exhausted by a vacuum pump 120. An electromagnetic valve 110 is provided in the exhaust path 111 between the semiconductor manufacturing apparatus 100 and the vacuum pump 120. The opening / closing operation of the electromagnetic valve 110 is controlled by an open / close signal S1 output from the control device 105 in the semiconductor manufacturing apparatus 100. The control device 105 in the semiconductor manufacturing apparatus 100 controls various operations related to the semiconductor manufacturing process of its own semiconductor manufacturing apparatus 100, and controls the signal S2 that requests various operating states of the vacuum pump 120 related to this semiconductor manufacturing process. While outputting to the apparatus 140 to control the operating state of the vacuum pump 120, an open / close signal S1 is output to the electromagnetic valve 110 to control the opening / closing operation of the electromagnetic valve 110.

  The motor 130 rotationally drives a rotating shaft (not shown) of the vacuum pump 120 by an operation control signal S4 output from the operation control device 140, and operates such as starting, stopping, rotating speed and rotating direction of the rotating shaft. Execute.

  The operation control device 140 outputs an operation control signal S4 corresponding to various operation signals related to the operation of the vacuum pump 120 output from the control device 105 in the semiconductor manufacturing apparatus 100 to the motor 130 to change the operation state of the vacuum pump 120. An operation control unit 150 for controlling is provided. In the first embodiment according to the present invention, the operation control unit 150 of the operation control device 140 performs the product countermeasure operation according to the product countermeasure operation request signal S2 output from the control device 105 in the semiconductor manufacturing apparatus 100. The operation control signal S4 to be executed is output to the motor 130, and the product countermeasure operation described later is executed by the vacuum pump 120. The operation control unit 150 of the operation control device 140 outputs a product countermeasure state signal S3 to the control device 105 in the semiconductor manufacturing apparatus 100 during the product countermeasure operation of the vacuum pump 120. In addition, the operation control unit 150 of the operation control device 140 inputs an operation state detection signal S5 for detecting the temperature of the vacuum pump 120, the current of the motor 130, the number of revolutions, electric power, etc., and this operation state detection signal S5 and a predetermined value A reference value (for example, a reference value corresponding to each of temperature, current, rotation speed, power, etc.) is compared to control the operation state of the product countermeasure operation in the vacuum pump 120. Furthermore, the operation control unit 150 may include a storage unit (not shown) that stores various operation sequences corresponding to normal operation, product countermeasure operation, and the like of the vacuum pump 120.

<Configuration of vacuum pump>
Next, FIG. 2 and FIG. 3 show a configuration example when a roots type vacuum pump is used as the vacuum pump 120. FIG. 2 is a cross-sectional view showing the configuration of the roots type vacuum pump 120. 3 is a cross-sectional view taken along line II-II in FIG.

  2 and 3, roots rotors 2 and 2 constituting a pair of pump rotors are disposed in a casing 1. Each root rotor 2 is supported by bearings 3 and 3 in the vicinity of both ends. The roots rotors 2 and 2 are rotationally driven by a biaxial brushless DC motor M (corresponding to the motor 130 in FIG. 1). Note that the DC motor rotor may be attached to one of the roots rotor shaft 2. The direct current motor may be an induction motor.

  In FIG. 2, a motor rotor 5 </ b> A is fixed to the shaft end 2 a of the roots rotor 2. One motor stator 6 is disposed on the outer peripheral side of the motor rotor 5 </ b> A via a resin can 7. The motor stator 6 is accommodated in a motor frame 9. A motor driver 10 is fixed to the motor frame 9. In FIG. 2, the configuration of one of the two root rotors 2 and 2 is shown, but the other root rotor 2 also has the same configuration. A minute gap is formed between the pair of root rotors 2 and 2 and the inner surface of the casing 1, and the root rotors 2 and 2 rotate in a non-contact manner while maintaining a slight clearance C.

  In the roots-type vacuum pump 120 configured as described above, the motor M is driven to rotate the pair of roots rotors 2, 2, whereby the gas sucked from the intake ports (not shown) is exhausted to the exhaust side according to the roots rotors 2, 2. It is transferred and exhausted from an exhaust port (not shown).

  In FIG. 2, the motor M and the casing 1 of the Roots type vacuum pump 120 are connected to the operation control device 140 via wirings L1 and L2. The wiring L1 is a wiring for detecting the current, rotation speed, electric power and the like of the motor M, and the wiring L2 is a wiring for detecting the temperature of the casing 1 and the like.

  Next, FIG. 4 shows a configuration example when a screw type vacuum pump is used as the vacuum pump 120. FIG. 4 is a cross-sectional view showing the configuration of the screw type vacuum pump 120.

  In FIG. 4, the screw type vacuum pump 120 includes a motor unit 20 and a pump unit 21. The motor unit 20 is a DC brushless motor, and the pump unit 21 is a vacuum for transferring gas by synchronously inverting a pair of screw rotors. It is a pump and is a volumetric transfer type twin screw pump.

  In FIG. 4, two rotary shafts 31 a and 31 b are arranged in parallel inside the pump casing 30, and the rotary shafts 31 a and 31 b are supported by bearings 33. A right-handed screw rotor 32a is fixed to the rotating shaft 31a, and a left-handed screw rotor 32b is fixed to the rotating shaft 31b. A fluid flow path 36 is formed between the screw rotors 32 a and 32 b and the inner surface of the casing 30, and an intake port 21 a is provided at the upstream end of the fluid flow path 36. The screw rotors 32a and 32b reverse each other in a non-contact manner while maintaining a slight clearance C, and transfer the gas sucked from the intake port 21a to the exhaust port 21b. In addition, as a screw rotor 32a, 32b, you may use a pair of screw rotor which has an axial cross-sectional shape which contacts only on a pitch line.

  A pair of magnet rotors 34 and 34 having the same configuration are arranged at the shaft ends on the intake side of the rotary shafts 31a and 31b, respectively, and reversely drive the rotary shafts 31a and 31b as brushless DC motors. The synchronization inversion of 31b is secured.

  In FIG. 4, the motor unit 20 and the casing 30 of the screw type vacuum pump 120 are connected to the operation control device 140 via wires L1 and L2. The wiring L1 is a wiring for detecting the current, rotation speed, power, and the like of the motor unit 20, and the wiring L2 is a wiring for detecting the temperature of the casing 30 and the like.

  1 is connected to the intake port of the Roots type vacuum pump 120 shown in FIG. 2 or the intake port of the screw type vacuum pump 120 shown in FIG. 4 via the exhaust path 111 and the electromagnetic valve 110. By continuously transferring the gas from the suction side to the exhaust side, the gas in the chamber (not shown) of the semiconductor manufacturing apparatus 100 connected to the suction port is evacuated.

  In the first embodiment according to the present invention, the example using the above-described roots-type vacuum pump and screw-type vacuum pump is shown as the vacuum pump 120. However, the present invention is not limited to these vacuum pumps. The operation control apparatus of the present invention can be used for other types of dry vacuum pumps, rotary pumps, and the like.

<Configuration of motor drive circuit>
Next, a configuration example of the motor drive circuit controlled by the operation control device 140 of FIG. 1 will be described with reference to FIGS. 5 and 6.

  First, a description will be given with reference to a configuration example of the motor drive circuit shown in FIG. In FIG. 5, the motor drive circuit 200 includes a three-phase power source 201, an electric leakage breaker (ELB) 202, an electromagnetic contactor 203, and a thermal protector 204. The three-phase power source 201 is connected to an electromagnetic contactor 203 via an earth leakage breaker (ELB) 202, and the electromagnetic contactor 203 is connected to the motor 130 via a thermal protector 204. The electromagnetic contactor 203 has an operation control for controlling the rotation and stop operation of the pump rotor 211 (one of the root rotors 2 in FIG. 2 or one of the screw rotors 32a and 32b in FIG. 4). A device 140 is connected. Note that a circuit breaker (CB) may be used instead of the earth leakage breaker (ELB) 202.

  An operation stop switch (not shown) of the vacuum pump 120 is connected to the operation control device 140. When this operation stop switch is operated during operation, a stop command is issued from the operation control device 140 to the electromagnetic contactor 203. It is supposed to be sent. The magnetic contactor 203 operates in response to the stop command, and cuts off the three-phase power supplied from the three-phase power source 201 to the motor 130. As a result, the motor 130 stops and the vacuum pump 120 stops. Note that the thermal protector 204 operates when the motor 130 is overloaded, and stops the operation of the vacuum pump 120 by cutting off the three-phase power supplied from the three-phase power source 201 to the motor 130. ing. Thereby, overload and overheating of the motor 130 are prevented.

  Next, a description will be given with reference to a configuration example of the motor drive circuit shown in FIG. In the motor drive circuit 220 shown in FIG. 6, the same components as those shown in FIG. In FIG. 6, the motor drive circuit 220 includes a three-phase power source 201, an earth leakage breaker (ELB) 202, and a frequency converter 221. The three-phase power source 201 is connected to the frequency converter 221 via the earth leakage breaker (ELB) 202, and the frequency converter 221 is connected to the motor 130. The frequency converter 221 includes a rectifier 222, a power transistor unit 223 that generates a current waveform that rotates the motor 130, and a frequency conversion control unit 224 that controls the frequency converter 221. Further, the frequency converter 221 has an operation control for controlling the rotation and stop operation of the pump rotor 211 (one of the root rotors 2 in FIG. 2 or one of the screw rotors 32a and 32b in FIG. 4). A device 140 is connected.

  In the first embodiment according to the present invention, the configuration examples shown in FIGS. 5 and 6 are shown as the configuration of the motor drive circuit. However, the configuration is not limited to these circuit configurations, and other circuit configurations are used. It may be used.

<Operation example of semiconductor manufacturing apparatus and operation control apparatus>
Next, operations related to the above-described product countermeasure operation executed in the semiconductor manufacturing apparatus 100 and the operation control apparatus 140 shown in FIG. 1 will be described with reference to FIGS.

  First, an operation outline including a product countermeasure operation executed in the semiconductor manufacturing apparatus 100 and the operation control apparatus 140 will be described with reference to a timing chart shown in FIG.

  In FIG. 7, “operating state of the semiconductor manufacturing apparatus” indicates the operating state of the semiconductor manufacturing apparatus 100 of FIG. 1, and “during process with exhaust” indicates a semiconductor manufacturing process with vacuum exhaust of the gas in the chamber by the vacuum pump 120. “In process without evacuation” indicates a semiconductor manufacturing process that does not involve evacuation of the gas in the chamber by the vacuum pump 120. In FIG. 7, “electromagnetic valve state” indicates the open / closed state of the electromagnetic valve 110 in FIG. 1, and “vacuum pump in operation / stopped” indicates that the vacuum pump 120 in FIG. The idling operation for operating the vacuum pump 120 may be included. In FIG. 7, the “product countermeasure command” indicates whether or not the above-described product countermeasure operation request signal S <b> 2 output from the control device 105 in the semiconductor manufacturing apparatus 100 of FIG. 1 to the operation control device 140 is output. The “product countermeasure state” indicates the above-described product countermeasure state signal S3 output from the operation control device 140 to the control device 105 in the semiconductor manufacturing apparatus 100 in accordance with the operation state being executed in the vacuum pump 120 of FIG. Indicates the presence or absence of

  In the timing chart shown in FIG. 7, an example in which each operation in the semiconductor manufacturing apparatus 100, the electromagnetic valve 110, the vacuum pump 120, and the operation control apparatus 140 in FIG. 1 changes in the order of the periods T 1 → T 2 → T 3 shown in the figure. Is shown. First, in the period T1, the semiconductor manufacturing apparatus 100 is in a process with exhaust, and the electromagnetic valve 110 is in an open state. At this time, the normal operation command signal S2 is output from the control device 105 in the semiconductor manufacturing apparatus 100 to the operation control device 140, and the operation control device 140 controls the vacuum pump 120 to be in the normal operation state. Yes. Then, a normal pump operation signal S3 indicating that the vacuum pump 120 is in normal operation is output from the operation control device 140 to the control device 105 in the semiconductor manufacturing apparatus 100.

  Next, when the process with exhaust ends and the semiconductor manufacturing apparatus 100 transitions to a process without exhaust (transition from the period T1 to the period T2), the semiconductor manufacturing apparatus 100 closes the electromagnetic valve 110. At this time, the product countermeasure command signal S <b> 2 is output from the control device 105 in the semiconductor manufacturing apparatus 100 to the operation control device 140. The operation control device 140 controls the vacuum pump 120 to shift from the normal operation state to the product countermeasure operation state. Then, a product countermeasure state signal S3 indicating that the vacuum pump 120 is in a product countermeasure operation is output from the operation control device 140 to the control device 105 in the semiconductor manufacturing apparatus 100.

  Next, when the operation control device 140 confirms that the product countermeasure operation of the vacuum pump 120 is completed, the operation control device 140 controls the vacuum pump 120 to shift from the product countermeasure operation state to the normal operation state, and the product countermeasure state signal S3. Is stopped, and a pump normal operation (product countermeasure end) signal S3 is output to the control device 105 in the semiconductor manufacturing apparatus 100. When the control device 105 in the semiconductor manufacturing apparatus 100 confirms the input of the normal pump operation (product countermeasure end) signal S3, the control device 105 opens the electromagnetic valve 110 and shifts to a process involving exhaust (from the period T2 to the period T3). To).

  As described above, in the operation control apparatus 140 according to the first embodiment of the present invention, the vacuum pump 120 is generated according to the product countermeasure command signal S2 output from the semiconductor manufacturing apparatus 100 during the process without exhaust. Operation control for shifting to the physical measure operation state is performed.

  Next, a specific example of control processing for the vacuum pump 120 executed in the control device 105 in the semiconductor manufacturing apparatus 100 in the outline operation described with reference to FIG. 7 will be described with reference to the flowchart shown in FIG. .

  In FIG. 8, the control device 105 confirms whether its own semiconductor manufacturing process is in a process involving an exhaust process (step S101). When the semiconductor manufacturing process is not in the process with the exhaust process, that is, in the process without the exhaust process (step S101: NO), the control device 105 outputs the close signal S1 to the electromagnetic valve 110. The electromagnetic valve 110 is closed (step S102), and then a product countermeasure command signal S2 is output to the operation control device 140 (step S103). The control operation performed on the operation control device 140 side by the output of the product countermeasure command signal S2 will be supplemented in the description of FIG. 9 described later.

  Next, the control device 105 confirms whether or not preparation for the next semiconductor manufacturing process is being started (step S104). If preparation for the next semiconductor manufacturing process is being started (step S104: YES), product countermeasures are performed. Command stop signal S2 is output to operation control device 140 (Step S105). When the preparation for the next semiconductor manufacturing process is not in progress (step S104: NO), the control device 105 proceeds to step S106 and confirms whether or not the product countermeasure state signal S3 is received from the operation control device 140. . When the product countermeasure state signal S3 is received from the operation control device 140 (step S106: YES), the process returns to step S104.

  If the product countermeasure state signal S3 is not received from the operation control device 140 (step S106: NO), the control device 105 proceeds to step S107 and receives the pump process possible state signal S3 from the operation control device 140. Make sure that When the pump process possible state signal S3 is received from the operation control device 140 (step S107: YES), the control device 105 outputs an open signal to the electromagnetic valve 10 to open the electromagnetic valve 110 (step S108). Return to step S101.

  Next, in the outline operation described with reference to FIG. 7 described above, a specific example of the control process for the product countermeasure operation of the vacuum pump 120 executed in the operation control unit 150 in the operation control device 140 is shown in the flowchart of FIG. Will be described with reference to FIG.

  In FIG. 9, the operation control unit 150 confirms whether or not the product countermeasure command signal S2 is received from the control device 105 in the semiconductor manufacturing apparatus 100 (step S201). When the product countermeasure command signal S2 is received from the control device 105 (step S201: YES), the operation control unit 150 follows the operation sequence of the product countermeasure operation stored in the storage unit (not shown) and the like. The stop sequence is executed (step S202), and then the startup sequence of the vacuum pump 120 is executed (step S203).

  Here, a specific example of the stop sequence of the vacuum pump 120 will be described with reference to FIG. FIG. 10 is a diagram illustrating an example of a stop control pattern executed in the operation control unit 150.

  It is assumed that a stop control pattern (a timing pattern for stopping the vacuum pump 120) as shown in FIG. 10 is stored in the storage unit (not shown) of the operation control unit 150. When the operation control unit 150 receives the product countermeasure command signal S2 and starts the stop sequence, the operation control unit 150 uses a timer (not shown) built in the operation control unit 150 to vacuum according to the stop control pattern shown in FIG. Pump stop control pattern in which the pump 120 is turned on and off, that is, the vacuum pump 120 is turned off until the time t1 elapses from the pump stop start, and the vacuum pump 120 is turned on until the time t2 elapses after the time t1 elapses. Execute. Thereby, the rotation and stop of the pump rotor of the vacuum pump 120 (the root rotors 2 and 2 in FIG. 2 or the screw rotors 32a and 32b in FIG. 4) are repeatedly executed. In this case, for example, the timer pattern is set so that the pump rotor is driven in the order of stop and forward rotation. When the pair of pump rotors rotate in the forward direction, one of the pair of pump rotors rotates in a certain direction (for example, clockwise), and the other rotates in the opposite direction (for example, counterclockwise).

  As described above, after the pump rotor is stopped by the stop sequence of the vacuum pump 120, the pump rotor (the root rotor 2, 2, or FIG. 4 of FIG. The force of the pump rotor can be applied to the product that precipitates with the temperature drop of the vacuum pump 120 between the screw rotors 32a and 32b) and the casing (the casing 1 in FIG. 2 or the casing 30 in FIG. 4). it can. As a result, it is possible to prevent biting of the product due to shrinkage and to remove the product, so that the vacuum pump 120 can be started up smoothly.

  Next, a specific example of the startup sequence of the vacuum pump 120 will be described.

  It is assumed that an activation control pattern (timing pattern for activation control of the vacuum pump 120) is stored in a storage unit (not shown) of the operation control unit 150. When the stop sequence ends, the operation control unit 150 uses a timer (not shown) built in the operation control unit 150 to perform forward rotation, stop, and normal rotation in the order of the pump rotor (the root rotor 2, FIG. 2). 2 or the screw rotors 32a and 32b) of FIG. 4 are controlled to be driven. When the pair of pump rotors rotate in the forward direction, one of the pair of pump rotors rotates in a certain direction (for example, clockwise), and the other rotates in the opposite direction (for example, counterclockwise).

  As described above, after the pump rotor is rotated by the startup sequence of the vacuum pump 120, the pump rotor is temporarily stopped, and then the pump rotor is rotated again, whereby the pump rotor (the root rotor 2, 2 in FIG. 2 or the screw in FIG. The force of the pump rotor can be applied to the product accumulated between the rotors 32a and 32b) and the casing (the casing 1 in FIG. 2 or the casing 30 in FIG. 4). As a result, for example, the solidified product can be made brittle, and the vacuum pump 120 can be started.

  When the stop sequence in step S202 and the start sequence in step S203 are completed, the operation control unit 150 confirms whether or not the product countermeasure stop command signal S2 is received from the control device 105 of the semiconductor manufacturing apparatus 100 (step S204). When the product countermeasure stop command signal S2 has not been received (step S204: NO), the operation control unit 150 proceeds to step S205 and determines the continuation of the product countermeasure operation. When it is determined that the product countermeasure operation is continued (step S205: YES), the operation control unit 150 returns to step S202, and when it is determined that the product countermeasure operation is not continued (step S205: NO), the vacuum pump The product countermeasure operation at 120 is stopped and the process proceeds to step S206. Note that the determination criterion for the continuation of the product countermeasure operation is, for example, whether the product countermeasure operation is performed a preprogrammed number of times, or the product countermeasure stop command signal S2 is received from the control device 105 of the semiconductor manufacturing apparatus 100. It may be received or not.

  In step S204, when the product countermeasure stop command signal S2 is received (step S204: YES), the operation control unit 150 stops the product countermeasure operation of the vacuum pump 120 and proceeds to step S206. In step S <b> 206, the operation control unit 150 determines whether the vacuum pump 120 is in a pump process enabled state (normal operation enabled state). When it is determined that the pump process is possible (normal operation is possible) (step S206: YES), the operation control unit 150 proceeds to step S207 and sends the pump process feasible state signal S3 to the control device 105 of the semiconductor manufacturing apparatus 100. To finish the control process for the product countermeasure operation. The criteria for determining the pump process possible state may be, for example, that the rotational speed of the vacuum pump 120 has increased to the rated rotational speed.

  As described above, in the operation control device 140 according to the first embodiment of the present invention, the product countermeasure operation (stop sequence, start sequence, etc.) of the vacuum pump 120 in accordance with the product countermeasure command from the semiconductor manufacturing apparatus 100. Was made to run. Further, the semiconductor manufacturing apparatus 100 is configured to close the electromagnetic valve 10 disposed between the vacuum pump 120 and the vacuum pump 120 during the product countermeasure operation. Therefore, during the semiconductor manufacturing process that does not involve the exhaust process in the semiconductor manufacturing apparatus, when the product is accumulated in the vacuum pump 120, or regularly, even during the operation period, the casing of the vacuum pump 120 and the pump rotor It is possible to perform an operation of discharging the product deposited during the period of time, and it is possible to reduce the unnecessary operation of the vacuum pump 120 during the semiconductor manufacturing process and to extend the overhaul period of the vacuum pump 120. become. Further, since the solenoid valve 110 is closed during the product countermeasure operation of the vacuum pump 120, it is possible to prevent the product countermeasure operation from interfering with the semiconductor manufacturing process of the semiconductor manufacturing apparatus 100. Furthermore, the operation control apparatus 140 according to the first embodiment outputs its own pump process possible state (normal operation possible state) signal S3 to the control apparatus 105 in the semiconductor manufacturing apparatus 100, and controls in the semiconductor manufacturing apparatus 100. Since the device 105 opens the electromagnetic valve 110 after confirming the reception of the pump process possible state signal S3, it is possible to reliably prevent the electromagnetic valve 110 from being opened before the end of the product countermeasure operation. The reliability of 120 can be improved. Further, when starting the preparation for the next process, the control device 105 in the semiconductor manufacturing apparatus 100 immediately outputs the product countermeasure stop command signal S2 to the operation control device 140, so that the above-described pump process possible state (normally) (Operation ready state) After confirming the reception of the signal S3, an operation to move to the next process (operation to open the electromagnetic valve 110) is executed, so that the reliability of the semiconductor manufacturing process can be improved.

  In the first embodiment, as the product countermeasure operation of the vacuum pump 120, the stop sequence and the start sequence for repeating the stop and operation of the vacuum pump 120 have been described. However, the operation is limited to these operation sequences. Instead, for example, an idling operation sequence in which the rotation speed of the vacuum pump 120 is reduced to a low rotation may be executed. In this idling operation sequence, for example, after receiving the product countermeasure command signal S2 from the semiconductor manufacturing apparatus 100, the rotational speed of the vacuum pump 120 is gradually decreased to shift to a desired idling state, and the idling operation is continued for a predetermined period. Thereafter, an operation sequence such as gradually increasing to a normal rotation speed may be executed. By executing such an idling operation sequence, the vacuum pump 120 can be immediately returned to the normal operation state when the semiconductor manufacturing apparatus 100 shifts to a process involving exhaust.

(Second Embodiment)
In the operation control apparatus according to the second embodiment of the present invention, the temperature of the casing of the vacuum pump, the current of the motor, the number of revolutions, the electric power, etc. are detected and the maintenance conditions of the vacuum pump are determined, and then the first embodiment described above. Each of the control processes shown in FIG. 9 and FIG. In addition, since each structure of the operation control apparatus which concerns on 2nd Embodiment, a semiconductor manufacturing apparatus, and a vacuum pump is the same as the structure demonstrated in the said 1st Embodiment, the illustration and structure description are abbreviate | omitted. Therefore, in the second embodiment, a specific example of control processing for the vacuum pump 120 executed in the control device 105 of the semiconductor manufacturing apparatus 100 and the vacuum pump 120 executed in the operation control unit 150 in the operation control device 140. A specific example of the control process for the product countermeasure operation will be described with reference to the flowcharts shown in FIGS. 11 and 12.
To do.

  FIG. 11 is a flowchart showing a specific example of control processing for the vacuum pump 120 executed in the control device 105 of the semiconductor manufacturing apparatus 100 according to the second embodiment. In FIG. 11, the same steps as those in the flowchart shown in FIG. 8 described above are denoted by the same step numbers, and the description of the operation is omitted.

  In FIG. 11, the control device 105 of the semiconductor manufacturing apparatus 100 confirms whether or not the maintenance signal S3 is received from the operation control device 140 (step S301). When the maintenance signal S3 is received from the operation control device 140 (step S301: YES), the control device 105 executes the processing after step S101.

  FIG. 12 is a flowchart showing a specific example of the control process for the product countermeasure operation of the vacuum pump 120 executed in the operation control unit 150 in the operation control apparatus 140 according to the second embodiment. In FIG. 12, the same steps as those in the flowchart shown in FIG. 9 described above are denoted by the same step numbers, and the description of the operation is omitted.

  In FIG. 12, the operation control unit 150 in the operation control device 140 includes the temperature of the casing of the vacuum pump 120 (the casing 1 in FIG. 2 or the casing 30 in FIG. 4), the motor (the motor M in FIG. 2 or the figure). 4, the current, rotation speed, power, etc. of the motor unit 20) are detected, and these detected values are compared with the reference values of the maintenance conditions stored in advance in the operation control unit 150. It is determined whether or not there is (step S401). When it is determined that the vacuum pump 120 is in the maintenance period, the maintenance signal S3 is output to the control device 105 of the semiconductor manufacturing apparatus 100 (step S401: YES), and the operation control unit 150 executes the processes after step S201.

  As described above, in the operation control apparatus 140 according to the second embodiment of the present invention, the product countermeasure operation is executed after the maintenance time of the vacuum pump is determined, and therefore the product countermeasure operation of the vacuum pump is performed. Can be performed more efficiently, and the overhaul period of the vacuum pump can be further extended. The determination of the maintenance time of the vacuum pump 120 is not limited to the detected values such as the casing temperature, the motor current, the rotation speed, and the electric power described above. For example, a sensor for detecting the accumulation state of the product may be provided in the casing of the vacuum pump 120, and the maintenance time may be determined based on the detection signal of this sensor. Alternatively, a vibration mode that changes with time depending on the operating state of the vacuum pump 120 may be detected and used as a criterion for determining the maintenance time.

DESCRIPTION OF SYMBOLS 100 ... Semiconductor manufacturing apparatus, 110 ... Solenoid valve, 120 ... Vacuum pump, 130 ... Motor, 140 ... Operation control apparatus, 150 ... Operation control part.

Claims (14)

In a vacuum pump for exhausting the inside of a chamber of a semiconductor manufacturing apparatus through an exhaust path provided with an electromagnetic valve whose opening and closing is controlled by a control device of the semiconductor manufacturing apparatus
When receiving the signal output in response to the control of the solenoid valve in the closed from the control device, wherein the vacuum pump comprises a driving control unit for controlling the product measures operation. The operation control unit is configured to detect the operating state of the vacuum pump, the by the operating state of the vacuum pump to determine the product countermeasure operation timing, No. before relaxin before Symbol control device to the product measures the operating timing The vacuum pump according to claim 1, wherein the product countermeasure operation is controlled when the signal is received.   The vacuum pump according to claim 1, wherein the operation control unit executes an operation sequence that repeats operation / stop of the vacuum pump as the product countermeasure operation.   The vacuum pump according to claim 1, wherein the operation control unit executes a stop sequence of the vacuum pump as the product countermeasure operation.   The vacuum pump according to claim 1, wherein the operation control unit executes a startup sequence of the vacuum pump as the product countermeasure operation.   The vacuum pump according to claim 1, wherein the operation control unit executes a stop sequence and a start sequence of the vacuum pump as the product countermeasure operation. In a vacuum pump operation control apparatus for controlling an operation state of a vacuum pump that exhausts the inside of a chamber of a semiconductor manufacturing apparatus through an exhaust path provided with an electromagnetic valve whose opening and closing is controlled by the control apparatus of the semiconductor manufacturing apparatus .
If the solenoid valve from the control unit receives a signal outputted in response to control of the closed, operation control of the vacuum pump, characterized in that it comprises an operation control unit for controlling the product measures the operation of the vacuum pump apparatus. In a vacuum pump operation control method for controlling an operating state of a vacuum pump that exhausts the inside of a chamber of a semiconductor manufacturing apparatus through an exhaust path provided with an electromagnetic valve whose opening and closing is controlled by a control device of the semiconductor manufacturing apparatus .
When receiving the signal output in response to the control of the solenoid valve in the closed from the control device, the operation of the vacuum pump and controlling the product measures the operation of the vacuum pump according to product protection operation sequence Control method. In a vacuum pump operation control method for controlling an operating state of a vacuum pump that exhausts the inside of a chamber of a semiconductor manufacturing apparatus through an exhaust path provided with an electromagnetic valve whose opening and closing is controlled by a control device of the semiconductor manufacturing apparatus .
Detecting the operating state of the vacuum pump;
Determine the product countermeasure operation timing of the vacuum pump according to the operating state of the vacuum pump,
A product control operation of the vacuum pump is controlled according to a product countermeasure operation sequence when a signal output in response to a control for closing the solenoid valve is received from the control device. Operation control method.   10. The operation control method for a vacuum pump according to claim 8, wherein the product countermeasure operation sequence repeats operation / stop of the vacuum pump.   10. The operation control method for a vacuum pump according to claim 8, wherein the product countermeasure operation sequence executes a stop sequence of the vacuum pump.   The vacuum pump operation control method according to claim 8 or 9, wherein the product countermeasure operation sequence executes a startup sequence of the vacuum pump.   The operation control method for a vacuum pump according to claim 8 or 9, wherein the product countermeasure operation sequence executes a stop sequence and a start sequence of the vacuum pump. Wherein before moving to product protection operation of the vacuum pump, the operation control method for a vacuum pump according to any one of claims 8 to 13, characterized in that closing the front SL electric solenoid valve.