JP2004068056A5 - - Google Patents
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- Publication number
- JP2004068056A5 JP2004068056A5 JP2002226530A JP2002226530A JP2004068056A5 JP 2004068056 A5 JP2004068056 A5 JP 2004068056A5 JP 2002226530 A JP2002226530 A JP 2002226530A JP 2002226530 A JP2002226530 A JP 2002226530A JP 2004068056 A5 JP2004068056 A5 JP 2004068056A5
- Authority
- JP
- Japan
- Prior art keywords
- mol
- acid
- phenolsulfonic
- hypophosphorous
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002253 acid Substances 0.000 description 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- WLXGQMVCYPUOLM-UHFFFAOYSA-N 1-hydroxyethanesulfonic acid Chemical compound CC(O)S(O)(=O)=O WLXGQMVCYPUOLM-UHFFFAOYSA-N 0.000 description 1
- DIZBQMTZXOUFTD-UHFFFAOYSA-N 2-(furan-2-yl)-3h-benzimidazole-5-carboxylic acid Chemical compound N1C2=CC(C(=O)O)=CC=C2N=C1C1=CC=CO1 DIZBQMTZXOUFTD-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- SUMDYPCJJOFFON-UHFFFAOYSA-N beta-hydroxyethanesulfonic acid Natural products OCCS(O)(=O)=O SUMDYPCJJOFFON-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229920002114 octoxynol-9 Polymers 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002226530A JP4016326B2 (ja) | 2002-08-02 | 2002-08-02 | 無電解スズメッキ浴 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002226530A JP4016326B2 (ja) | 2002-08-02 | 2002-08-02 | 無電解スズメッキ浴 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004068056A JP2004068056A (ja) | 2004-03-04 |
| JP2004068056A5 true JP2004068056A5 (https=) | 2005-06-16 |
| JP4016326B2 JP4016326B2 (ja) | 2007-12-05 |
Family
ID=32013842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002226530A Expired - Fee Related JP4016326B2 (ja) | 2002-08-02 | 2002-08-02 | 無電解スズメッキ浴 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4016326B2 (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5830242B2 (ja) * | 2010-12-28 | 2015-12-09 | ローム・アンド・ハース電子材料株式会社 | めっき液中から不純物を除去する方法 |
| JP5715411B2 (ja) * | 2010-12-28 | 2015-05-07 | ローム・アンド・ハース電子材料株式会社 | めっき液中から不純物を除去する方法 |
| EP2476779B1 (en) | 2011-01-13 | 2013-03-20 | Atotech Deutschland GmbH | Immersion tin or tin alloy plating bath with improved removal of cupurous ions |
| JP5937320B2 (ja) * | 2011-09-14 | 2016-06-22 | ローム・アンド・ハース電子材料株式会社 | めっき液中から不純物を除去する方法 |
| CN105899714B (zh) | 2013-12-05 | 2018-09-21 | 霍尼韦尔国际公司 | 具有经调节的pH的甲基磺酸亚锡溶液 |
| PL3166999T3 (pl) | 2014-07-07 | 2023-07-03 | Honeywell International Inc. | Materiał termoprzewodzący ze zmiataczem jonów |
| EP3227399B1 (en) | 2014-12-05 | 2021-07-14 | Honeywell International Inc. | High performance thermal interface materials with low thermal impedance |
| US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
| EP3426746B1 (en) | 2016-03-08 | 2021-07-14 | Honeywell International Inc. | Phase change material |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
| CN110735132A (zh) * | 2019-10-18 | 2020-01-31 | 北京曙光航空电气有限责任公司 | 一种金属表面的镀锡方法 |
| CN115404471B (zh) * | 2022-08-30 | 2023-07-04 | 江西住井新材料有限公司 | 一种无电解镀锡溶液及应用 |
-
2002
- 2002-08-02 JP JP2002226530A patent/JP4016326B2/ja not_active Expired - Fee Related
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