JP2004054077A5 - - Google Patents

Download PDF

Info

Publication number
JP2004054077A5
JP2004054077A5 JP2002213494A JP2002213494A JP2004054077A5 JP 2004054077 A5 JP2004054077 A5 JP 2004054077A5 JP 2002213494 A JP2002213494 A JP 2002213494A JP 2002213494 A JP2002213494 A JP 2002213494A JP 2004054077 A5 JP2004054077 A5 JP 2004054077A5
Authority
JP
Japan
Prior art keywords
adherend
contact
peeling claw
adherend according
adhesive component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002213494A
Other languages
English (en)
Japanese (ja)
Other versions
JP4145590B2 (ja
JP2004054077A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002213494A priority Critical patent/JP4145590B2/ja
Priority claimed from JP2002213494A external-priority patent/JP4145590B2/ja
Publication of JP2004054077A publication Critical patent/JP2004054077A/ja
Publication of JP2004054077A5 publication Critical patent/JP2004054077A5/ja
Application granted granted Critical
Publication of JP4145590B2 publication Critical patent/JP4145590B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002213494A 2002-07-23 2002-07-23 粘着部品の被着体 Expired - Fee Related JP4145590B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002213494A JP4145590B2 (ja) 2002-07-23 2002-07-23 粘着部品の被着体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002213494A JP4145590B2 (ja) 2002-07-23 2002-07-23 粘着部品の被着体

Publications (3)

Publication Number Publication Date
JP2004054077A JP2004054077A (ja) 2004-02-19
JP2004054077A5 true JP2004054077A5 (enExample) 2005-09-02
JP4145590B2 JP4145590B2 (ja) 2008-09-03

Family

ID=31936074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002213494A Expired - Fee Related JP4145590B2 (ja) 2002-07-23 2002-07-23 粘着部品の被着体

Country Status (1)

Country Link
JP (1) JP4145590B2 (enExample)

Similar Documents

Publication Publication Date Title
MY129795A (en) Heat-peelable pressure-sensitive adhesive sheet
TWI264121B (en) A display device, a method of manufacturing a semiconductor device, and a method of manufacturing a display device
EP1097977A3 (en) Heat-peelable pressure-sensitive adhesive sheet
EP1245851A3 (en) Vibration damping shim structure
WO2008093873A1 (ja) ＺｎＯ系半導体素子
EP1591504A4 (en) ADHESIVE STRIP TO ADHAPE WAFERS
ATE534713T1 (de) Durch streckung ablösbares klebeband mit differentiellen klebeeigenschaften
JPWO2003025079A1 (ja) 新易貼付性粘着シート及びその製造方法
WO2006026665A3 (en) Increasing adhesion in an imprinting procedure
CA2509912A1 (en) Junction substrate and method of bonding substrates together
JP2004054077A5 (enExample)
JP2009117594A (ja) 薄膜熱拡散シート
CN212084555U (zh) 显示面板和显示装置
TW200605305A (en) Semiconductor device and method for manufacturing same
JP5857202B2 (ja) 熱伝導シート
JP2006181349A (ja) 付け爪粘着用シート
TW200721411A (en) Solder layer, heat-dissipating substrate using the same and manufacturing method thereof
JP4451704B2 (ja) 穴明きラベルの製造方法
CN206014754U (zh) 粘合片
JP2003191369A5 (enExample)
JP3132967U (ja) 剥離防止粘着養生テープ
JP2010195845A (ja) 粘着シート
CN217628199U (zh) 一种耐高温晶圆芯片保护膜
CN208279546U (zh) 一种双面胶带
JPS6344990Y2 (enExample)