JP2004038266A - Card device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable an electronic component in an SD card to be more large. <P>SOLUTION: An SD card device comprises following constitution. A substrate 4 is attached to a plate-like part 3a opposite to a plate-like part 2a formed with an opening 7. A BGA substrate 11 is mounted on the substrate 4. A contact part 6 is formed on the surface of the BGA substrate 11 to be opposite to the opening 7. The contact part 6 and an electronic circuit 12 mounted on the substrate 4 are electrically connected through the BGA substrate 11. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a small card device such as an SD (Secure Digital) card having a built-in electronic circuit.
[0002]
[Prior art]
The SD card is a small card device having an outer dimension of 24 × 32 × 2.1 mm. The SD card is configured by housing an electronic circuit inside a housing having the above outer diameter.
[0003]
FIG. 5 is a diagram showing the structure of a conventional SD card with a housing cut away.
[0004]
The housing 1 is divided into a first cover 2 and a second cover 3. By joining the first cover 2 and the second cover 3 as shown in FIG. 5, the casing 1 having a flat and hollow shape is formed.
[0005]
A substrate 4 is housed inside the housing 1. The electronic circuit 5 is mounted on the board 4 in a range indicated by a broken line in FIG. A contact portion 6 is formed near the end of the substrate 4. The contact section 6 is connected to the electronic circuit 5 via a pattern on the substrate 4.
[0006]
An opening 7 is formed in the first cover 2. The positions of the opening 7 and the contact portion 6 are determined so as to face each other. When the SD card is inserted into a slot of a device (not shown), a contact (not shown) provided in the device is inserted into the opening 7. Then, the contact inserted into the opening 7 comes into contact with the contact portion 6. Thus, the electronic circuit 5 is electrically connected to the device.
[0007]
[Problems to be solved by the invention]
In the card device configured as described above, the distance from the outer surface of the housing to the contact surface is defined in order to stably perform the electrical connection between the card device and the device into which the card device is loaded. .
[0008]
For example, in the case of an SD card, the above interval is defined as 0.8 mm.
[0009]
When the contact portion 6 is realized by forming a pattern made of a conductive material directly on the surface of the substrate 4, the thickness of the contact portion 6 can be neglected, and therefore, as shown in FIG. The substrate 4 is arranged at a position where the distance from the surface of the substrate 4 is 0.8 mm.
[0010]
At this time, if the thickness of the first cover 2 is 0.25 mm, the distance between the inner surface of the first cover 2 and the surface of the substrate 4 is 0.55 mm. Since components constituting the electronic circuit 5 are arranged in a space between the inner surface of the first cover 2 and the surface of the substrate 4, the height of the components is limited to 0.55 mm.
[0011]
As described above, the conventional card device has a problem in that the size of components that can be accommodated is significantly limited.
[0012]
The present invention has been made in view of such circumstances, and an object of the present invention is to provide a card device that can employ components of a larger size.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a flat and hollow housing in which an electronic circuit is accommodated, and a pair of the housings constituting the housing and facing the thickness direction of the housing. In a card device in which a contact inserted from an opening formed in one of the plate-shaped portions is in contact with a contact portion of the electronic circuit, the electronic circuit is connected to an external circuit connected to the contact. The electronic circuit is mounted, a main board attached to the inner surface of the plate-shaped portion facing the plate-shaped portion provided with the opening in the housing, and attached to the main board, It has a thickness such that a distance in the thickness direction between the surface opposite to the surface in contact with the main substrate and the outer surface of the plate-shaped portion provided with the opening has a predetermined value. And a sub-substrate. Place the contact portion, further comprising a conductive member for electrically connecting the said electronic circuit mounted on the main board and the contact portion.
[0014]
By taking such a measure, the main substrate is attached to the inner surface of the plate-shaped portion opposed to the plate-shaped portion provided with the opening in the housing, so that the main substrate is formed between the opposed plate-shaped portions. At the end of the space. Since the contact portion exists from the main substrate via the sub-substrate, the distance from the opening is determined to a predetermined value by the thickness of the sub-substrate regardless of the position of the main substrate. And since the main board is located as far as possible from the plate-shaped part provided with the opening, the maximum space between the board and the plate-shaped part in the area where the sub-board is not attached. Is secured.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of an SD card to which the present invention is applied will be described with reference to the drawings.
[0016]
(1st Embodiment)
FIG. 1 is a diagram showing a structure of an SD card according to a first embodiment of the present invention with a housing cut away. In FIG. 1, the same parts as those in FIG. 5 are denoted by the same reference numerals.
[0017]
As shown in FIG. 1, the SD card according to the first embodiment includes a housing 1, a board 4, a contact section 6, a BGA (Ball Grid Array) board 11, and an electronic circuit 12.
[0018]
The housing 1 is divided into a first cover 2 and a second cover 3. By joining the first cover 2 and the second cover 3 as shown in FIG. 1, the casing 1 having a flat and hollow shape is formed. The vertical direction in FIG. 1 is the thickness direction of the housing 1.
[0019]
The first cover 2 and the second cover 3 have plate portions 2a and 3a that face each other in the thickness direction of the housing 1 when the housing 1 is formed. An opening 7 is formed near the end of the plate portion 2a.
[0020]
A substrate 4 is housed inside the housing 1. The substrate 4 is directly fixed to the inner surface of the plate portion 3a. A BGA board 11 is mounted near the end of the board 4. The BGA substrate 11 is sufficiently smaller than the substrate 4. Therefore, most of the substrate 4 is not covered by the BGA substrate 11. Using such an area, the electronic circuit 12 is mounted on the substrate 4 in a range indicated by a broken line in FIG.
[0021]
A contact portion 6 is formed on the surface of the BGA substrate 11 opposite to the surface in contact with the substrate 4. The positions of the contact portion 6 and the opening 7 are determined so as to face each other. The contact section 6 is electrically connected to an electronic circuit 12 mounted on the board 4 via a BGA board 11.
[0022]
The thickness of the BGA substrate 11 is determined so that the distance between the surface on which the contact portion 6 is formed and the outer surface of the plate-shaped portion 2a is a specified value. The specified value is a value determined for the distance from the outer surface of the housing to the contact surface.
[0023]
That is, if the overall thickness is A, the prescribed value is B, the thickness of the plate-like portions 2a and 3a is C, and the thickness of the substrate 4 is D, the thickness E of the BGA substrate 11 is a value determined by the following equation. .
[0024]
E = A-B-C-D
Specifically, in the SD card, the overall thickness is set to 2.1 mm and the specified value is set to 0.8 mm. Therefore, if the thickness of the plate-shaped portion 3a is 0.25 mm and the thickness of the substrate 4 is 0.4 mm, the BGA substrate 11 is determined to be 0.65 mm by the following equation.
[0025]
2.1-0.8-0.25-0.4 = 0.65 mm
Thus, according to such a structure, while the contact portion 6 is arranged at a prescribed position, a value obtained by the following equation is secured as the interval F between the substrate 4 and the plate-shaped portion 2a.
[0026]
F = A-2C-D
In the case of the above specific example, a distance F between the substrate 4 and the plate-like portion 2a of 1.2 mm is secured by the following equation.
[0027]
2.1−0.25 × 2−0.4 = 1.2
As a result, the height limit of the components used for the electronic circuit 12 is 1.2 mm, and it is possible to use components larger than before.
[0028]
Further, according to the present embodiment, since the substrate 4 is directly fixed to the inner surface of the plate portion 3a, the substrate 4 also functions as a reinforcing material for the housing 1. As a result, the strength of the housing 1 can be increased.
[0029]
Further, since the substrate 4 and the BGA substrate 11 are merely stacked on the plate-shaped portion 3a, the manufacturing is easy and the positioning of the contact portion 6 can be easily performed.
[0030]
(Second embodiment)
FIG. 2 is a diagram showing the structure of an SD card according to a second embodiment of the present invention, with its housing cut away. In FIG. 2, the same parts as those in FIGS. 1 and 5 are denoted by the same reference numerals.
[0031]
As shown in FIG. 2, in the second embodiment, a sub-substrate 21 is provided instead of the BGA substrate 11 in the first embodiment. The size and thickness of sub-substrate 21 are determined similarly to BGA substrate 11.
[0032]
The contact portion 6 is formed on the surface of the sub-substrate 21. The pattern 22 is formed on the surface of the sub-substrate 21 so as to extend from the contact portion 6. A conductive crank-shaped member 24 is disposed between the pattern 22 and the pattern 23 formed on the substrate 4 and connected to the electronic circuit 12. The crank-shaped member 24 electrically connects between the pattern 22 and the pattern 23 and thus between the contact portion 6 and the electronic circuit 12.
[0033]
Thus, even with such a structure, the same effect as that of the first embodiment can be achieved.
[0034]
(Third embodiment)
FIG. 3 is a diagram showing a structure of an SD card according to a third embodiment of the present invention with a housing cut away. In FIG. 3, the same parts as those in FIGS. 1, 2 and 5 are denoted by the same reference numerals.
[0035]
As shown in FIG. 3, in the third embodiment, the pattern 22 and the pattern 23 are connected by a conductive wire 31 instead of the crank-shaped member 24 in the second embodiment.
[0036]
Thus, even with such a structure, the same effect as that of the first embodiment can be achieved.
[0037]
(Fourth embodiment)
FIG. 4 is a diagram showing a structure of an SD card according to a fourth embodiment of the present invention with a housing cut away. In FIG. 4, the same parts as those in FIGS. 1 and 5 are denoted by the same reference numerals.
[0038]
As shown in FIG. 4, in the fourth embodiment, a through-hole substrate 41 is provided instead of the BGA substrate 11 in the first embodiment. The size and thickness of the through-hole board 41 are determined similarly to the BGA board 11.
[0039]
The through hole substrate 41 is provided with a through hole 41a penetrating along the thickness direction.
[0040]
The contact portion 6 and the pattern 42 formed on the substrate 4 and connected to the electronic circuit 12 are electrically connected by a wire 43 inserted into the through hole 41a.
[0041]
Thus, even with such a structure, the same effect as that of the first embodiment can be achieved.
[0042]
Note that the present invention is not limited to the above embodiments. For example, the present invention can be applied to a card device other than an SD card. Therefore, the dimensions of each part shown in each of the above embodiments are also examples and can be changed.
[0043]
In addition, various modifications can be made without departing from the spirit of the present invention.
[0044]
【The invention's effect】
According to the present invention, the main substrate is attached to the inner surface of the plate-shaped portion facing the plate-shaped portion provided with the opening in the housing, and the contact portion is arranged via the sub-substrate from the main substrate. The distance between the contact portion and the plate portion provided with the opening is determined to a predetermined value of the opening by the thickness of the sub-substrate, and the main substrate is located as far as possible from the plate portion provided with the opening. Therefore, in a region where the sub-board is not attached, a maximum space is secured between the board and the plate-shaped portion. As a result, a card device capable of employing components of a larger size is obtained.
[Brief description of the drawings]
FIG. 1 is an exemplary view showing a structure of an SD card according to a first embodiment of the present invention with a housing cut away.
FIG. 2 is a diagram showing a structure of an SD card according to a second embodiment of the present invention, with a housing cut away.
FIG. 3 is a view showing a structure of an SD card according to a third embodiment of the present invention, with a housing cut away.
FIG. 4 is an exemplary view showing a structure of an SD card according to a fourth embodiment of the present invention with a housing cut away.
FIG. 5 is a diagram showing a structure of a conventional SD card with a housing cut away.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Housing | casing 2 ... 1st cover 3 ... 2nd cover 2a, 3a ... Plate-shaped part 4 ... Substrate 6 ... Contact part 7 ... Opening 11 ... BGA board 12 ... Electronic circuit 21 ... Sub-substrates 22, 23 ... Pattern 24 ... Crank-shaped member 31 wire 41 through-hole board 41a through hole 42 pattern 43 wire

Claims (1)

An electronic circuit is housed inside a flat and hollow housing, which constitutes the housing and is inserted through an opening formed in one of a pair of plate-shaped portions opposed in a thickness direction of the housing. The electronic device is connected to an external circuit to which the contact is connected by a contact that is made to contact a contact portion of the electronic circuit.
A main board on which the electronic circuit is mounted, and which is attached to an inner surface of a plate-shaped portion facing the plate-shaped portion provided with the opening in the housing;
Attached on the main substrate, smaller than the main substrate, and the surface in the thickness direction of the surface opposite to the surface in contact with the main substrate and the outer surface of the plate-shaped portion provided with the opening A sub-substrate having a thickness at which the interval is a predetermined value,
The contact portion is arranged on the sub-substrate,
A card device further comprising a conductor that electrically connects the electronic circuit mounted on the main board and the contact portion.

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