1380528 六、發明說明： 【發明所屬之技術領域】 [0001]本創作關於一種電連接器，尤指一種用於電性連接晶片 模組至印刷電路板之電連接器。 [先前技術3 [0002]與本創作相關之電連接器，用以電性連接晶片模組至印 刷電路板，其包括安置於印刷電路板上之絕緣本體、容 攻於絕緣本體中之複數導電端子、圍設於絕緣本體周侧 且爲塑膠材質製成之固持框。將絕緣本體置於印刷電路 •板上以實現導電端子與印刷電路板之間之電性連接，再 將晶片模組置於絕緣本體上端以實現晶片模組與導電端 子之電性連接’從而實現晶片模組與印刷電路板之間之 電性導通。 _3]惟，此種結構之電連接器至少存在以下缺點：首先隨 著導電端子數量之增加，圍設於絕緣本體週邊之固持框 需要承受更大之作用力，而固持框係由塑膠材質製成， 其強度相龍弱’故m持框會因強度残*發生損壞或 者斷裂；此外，隨著電連接器向更小型化發展之趨勢， 電連接器之厚度要求越來越薄，而塑膠材f之固持框剛 度亦無法滿足電連接盗厚度方面之需求。 [0004] 黎於此，實有必要提供-種改進之電連接器，以克服上 述電連接器之缺陷。 【發明内容】 一種電連接器，尤指一 電連接器。 [0005]本創作要解決之技術問題係提供 種具有較佳強度和剛度固持框之 〇9514092产單編號 A〇1〇l 第3頁/共12頁 1013133302-0 1380528 101年04月10日梭正替换頁 [0006] 爲此.，本創作提供了一種用以電性連接晶片模組至印刷 電路板之電連接器，其包括：絕緣本體、容設於絕緣本 體中之複數導電端子，以及圍設於絕緣本體周側之固持 ' 框，其中，固持框由金屬材質製成，而且固持框之表面 覆有絕緣層。 [0007] 相對於與本創作相關之技術，本創作電連接器具有以下 優點：該電連接器之固持框由金屬材質製成，從而固持 框之強度和剛度得以加強，能夠滿足導電端子數量增加 之需求；另外，固持框之表面覆有絕緣層，從而可以維 持固持框良好之絕緣性能，而且可以避免影響周邊之元 件。 【實施方式】 [0008] 請參閱第一圖至第三圖所示，一種電連接器1，用以電性 連接晶片模組（未圖示）至印刷電路板（未圖示），其 包括安置於印刷電路板上之絕緣本體2、容置於絕緣本體 2中之複數導電端子（未圖示）、圍設於絕緣本體2周側 之固持框3，以及將固持框3固持於印刷電路板之固持裝 置4。 [0009] 絕緣本體2大致呈矩形板狀構造，其設有用以承接晶片模 組之連接面21及安裝於印刷電路板上之安裝面22。貫穿 連接面21至安裝面22設置有複數個端子收容槽（未圖示 )，該端子收容槽内收容有複數個導電端子（未圖示） 。導電端子設有上連接部（未圖示）和下接觸部（未圖 不）分別與晶片模組和印刷電路板電性連接。 [0010] 固持框3大致爲中空之框體，其設有圍設於絕緣本體2周 1013133302-0 0951409#單编號AGm 第4頁/共頁 1380528 101年04月10日修正替换頁 側之主體部31和自主體部31背向絕緣本體2延伸之卡扣部 32。主體部31由金屬材質製成且主體部31由彼此相連的 四個側邊共同圍成，其表面覆有絕緣層310以維持固持框 3良好之絕緣性，從而可以避免影響周圍其他之元件。卡 扣部32位於相鄰兩主體部31之拐角處，且該電連接器1至 少設有呈對角設置之兩個卡扣部32。卡扣部32上設有收 容孔320。主體部31上還設有複數通孔311。固持框3與 絕緣層31 0之整體高度小於絕緣本體2之高度。 [00113 固持裝置4大致呈圓柱體狀，其與固持框3上卡扣部32之 收容孔320係干涉配合，從而將固持框3連接於印刷電路 板上。 [0012] 將絕緣本體2組設於印刷電路板上，再通過固持裝置4置 於收容孔320中以將固持框3固持於印刷電路板上，此時 ，導電端子與印刷電路板係電性連接，接著將晶片模組 放置於絕緣本體2之連接面21上以實現晶片模組與導電端 子之電性導通，進而實現晶片模組與印刷電路板之電性 連接。絕緣本體2之四周完全收容於固持框3内，由於固 持框3主體部31由金屬材質構成，故固持框3具有較佳之 剛度和強度，能夠滿足導電端子數量增加和電連接器1厚 度變薄之需要。另外，由於固持框3主體部31表面上設有 絕緣層310，由此可維持固持框3良好之絕緣性，從而可 以避免影響周圍其他之元件。固持框之上下表面均覆有 對稱分佈之絕緣層，絕緣層係均勻分佈於金屬材質上。 絕緣層之厚度與金屬材質之厚度大致相同。 [0013] 此外，本創作中絕緣層310覆在固持框3主體部31上，其 1013133302-0 09514092产單編號Α〇101 第5頁/共12頁 1380528 101年04月10日核正替换頁 與主體部31—體成型，其也可爲脫離主體部31而單獨存 在之獨立元件。 [0014] 綜上所述，本創作符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本創作之較佳實施例，本創 作之範圍並不以上述實施例為限，舉凡熟習本案技藝之 人士援依本創作之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 【圖式簡單說明】 [0015] 第一圖係本創作電連接器之立體分解圖。 [0016] 第二圖係本創作電連接器之立體組合圖。 [0017] 第三圖係本創作電連接器中固持框上任意一段之截面示 意圖® 【主要元件符號說明】 [0018] 電連接器：1 [0019] 絕緣本體：2 [0020] 連接面：21 [0021] 安裝面：22 [0022] 固持框：3 [0023] 主體部：31 [0024] 絕緣層：310 [0025] 通孔：311 [0026] 卡扣部：3 2 1013133302-0 。9514。92产單编號A0101 第6頁/共12頁 1380528 101年04月10日修正替換頁 [0027]收容孔：3 2 0 [0028] 固持裝置：4 09514092#單編號 A〇101 第7頁/共12頁 1013133302-01380528 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to an electrical connector, and more particularly to an electrical connector for electrically connecting a wafer module to a printed circuit board. [Previous Art 3 [0002] The electrical connector related to the present invention is used for electrically connecting a chip module to a printed circuit board, which comprises an insulating body disposed on the printed circuit board and a plurality of conductive materials that are accommodated in the insulating body. The terminal is disposed on a peripheral side of the insulating body and is a holding frame made of a plastic material. The insulating body is placed on the printed circuit board to realize electrical connection between the conductive terminal and the printed circuit board, and then the chip module is placed on the upper end of the insulating body to realize electrical connection between the chip module and the conductive terminal. Electrical conduction between the chip module and the printed circuit board. _3] However, the electrical connector of this structure has at least the following disadvantages: first, as the number of conductive terminals increases, the holding frame surrounding the periphery of the insulating body needs to bear a greater force, and the holding frame is made of plastic material. Cheng, its strength is weak, so the frame will be damaged or broken due to the strength of the residual * In addition, as the electrical connector is becoming more compact, the thickness of the electrical connector is required to be thinner and thinner. The rigidity of the holding frame of the material f cannot meet the requirements of the thickness of the electrical connection. [0004] Here, it is necessary to provide an improved electrical connector to overcome the drawbacks of the above electrical connector. SUMMARY OF THE INVENTION An electrical connector, especially an electrical connector. [0005] The technical problem to be solved by this creation is to provide a kind of holding frame with better strength and rigidity. 〇9514092 Production order number A〇1〇l Page 3/12 pages 1013133302-0 1380528 101 April 10 Positive replacement page [0006] To this end, the present invention provides an electrical connector for electrically connecting a chip module to a printed circuit board, comprising: an insulative housing, a plurality of conductive terminals received in the insulative housing, and a holding frame surrounding the insulating body, wherein the holding frame is made of a metal material, and the surface of the holding frame is covered with an insulating layer. [0007] Compared with the technology related to the present creation, the present invention has the following advantages: the fixing frame of the electrical connector is made of a metal material, so that the strength and rigidity of the holding frame are enhanced, and the number of conductive terminals can be increased. In addition, the surface of the holding frame is covered with an insulating layer, so that the insulating structure of the holding frame can be maintained, and the surrounding components can be avoided. [Embodiment] [0008] Referring to the first to third figures, an electrical connector 1 is used to electrically connect a chip module (not shown) to a printed circuit board (not shown), including An insulating body 2 disposed on the printed circuit board, a plurality of conductive terminals (not shown) housed in the insulating body 2, a holding frame 3 surrounding the insulating body 2, and a holding frame 3 held on the printed circuit Plate holding device 4. The insulative housing 2 has a substantially rectangular plate-like configuration, and is provided with a connecting surface 21 for receiving the wafer module and a mounting surface 22 mounted on the printed circuit board. A plurality of terminal receiving grooves (not shown) are provided through the connecting surface 21 to the mounting surface 22, and a plurality of conductive terminals (not shown) are accommodated in the terminal receiving grooves. The conductive terminals are provided with an upper connection portion (not shown) and a lower contact portion (not shown) electrically connected to the wafer module and the printed circuit board, respectively. [0010] The holding frame 3 is substantially a hollow frame, and is provided around the insulating body 2, 1013133302-0 0951409# single number AGm, page 4, total page 1380528, April 10, 10, revised replacement page side The main body portion 31 and the buckle portion 32 extending from the main body portion 31 toward the insulative housing 2 are formed. The main body portion 31 is made of a metal material and the main body portion 31 is surrounded by four side edges which are connected to each other, and the surface thereof is covered with an insulating layer 310 to maintain good insulation of the holding frame 3, so that it is possible to avoid affecting other surrounding components. The latching portion 32 is located at a corner of the adjacent two main body portions 31, and the electrical connector 1 is provided with at least two latching portions 32 disposed diagonally. The catching portion 32 is provided with a receiving hole 320. A plurality of through holes 311 are also formed in the main body portion 31. The overall height of the holding frame 3 and the insulating layer 31 0 is smaller than the height of the insulating body 2. [00113] The holding device 4 is substantially cylindrical and interferes with the receiving hole 320 of the latching portion 32 of the holding frame 3 to connect the holding frame 3 to the printed circuit board. [0012] The insulative housing 2 is assembled on the printed circuit board, and then placed in the receiving hole 320 through the holding device 4 to hold the holding frame 3 on the printed circuit board. At this time, the conductive terminal and the printed circuit board are electrically connected. After the connection, the chip module is placed on the connection surface 21 of the insulative housing 2 to electrically connect the chip module and the conductive terminal, thereby electrically connecting the chip module and the printed circuit board. The periphery of the insulative housing 2 is completely received in the holding frame 3. Since the main body portion 31 of the holding frame 3 is made of a metal material, the holding frame 3 has better rigidity and strength, and the number of the conductive terminals is increased and the thickness of the electrical connector 1 is thinned. Need. Further, since the insulating layer 310 is provided on the surface of the main body portion 31 of the holding frame 3, it is possible to maintain good insulation of the holding frame 3, thereby avoiding the influence of other surrounding components. The upper surface of the holding frame is covered with a symmetrically distributed insulating layer, and the insulating layer is evenly distributed on the metal material. The thickness of the insulating layer is approximately the same as the thickness of the metal material. [0013] In addition, in the present creation, the insulating layer 310 is covered on the main body portion 31 of the holding frame 3, and its number is 1013133302-0 09514092. The number is Α〇101, the fifth page, the total 12 pages, the 1380528, the 10th of April, the nuclear replacement page. It is formed integrally with the main body portion 31, and may be a separate element that exists separately from the main body portion 31. [0014] In summary, the creation meets the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those who are familiar with the skill of the present invention are equivalent to the equivalent modifications or changes made by the spirit of the present creation. It should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS [0015] The first figure is an exploded perspective view of the present electrical connector. [0016] The second figure is a three-dimensional combination diagram of the present electrical connector. [0017] The third figure is a schematic cross-sectional view of any section on the holding frame of the present invention. [Main component symbol description] [0018] Electrical connector: 1 [0019] Insulating body: 2 [0020] Connection surface: 21 [0021] Mounting surface: 22 [0022] Holding frame: 3 [0023] Main body portion: 31 [0024] Insulating layer: 310 [0025] Through hole: 311 [0026] Buckle portion: 3 2 1013133302-0. 9514.92 Production Order No. A0101 Page 6/Total 12 Page 1380528 101 April 10 Revision Replacement Page [0027] Reception hole: 3 2 0 [0028] Holding device: 4 09514092#单号A〇101第7 Page / Total 12 pages 1013133302-0