JP2004037940A - Method for aligning photomask, exposing device and method for manufacturing printed wiring board - Google Patents

Method for aligning photomask, exposing device and method for manufacturing printed wiring board Download PDF

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JP2004037940A
JP2004037940A JP2002196378A JP2002196378A JP2004037940A JP 2004037940 A JP2004037940 A JP 2004037940A JP 2002196378 A JP2002196378 A JP 2002196378A JP 2002196378 A JP2002196378 A JP 2002196378A JP 2004037940 A JP2004037940 A JP 2004037940A
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Prior art keywords
photomask
pin
female
male pin
male
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JP2002196378A
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JP4306194B2 (en
Inventor
Tsunaichi Takizawa
瀧沢 綱一
Shigeru Yamato
大和 茂
Yoshifumi Shimokawabe
下河邉 義史
Koji Ishikawa
石川 浩二
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for aligning photomasks capable of inexpensively aligning two upper and lower photomasks with a high degree of accuracy. <P>SOLUTION: Two or more holes are pierced in each of the two photomasks, tapered pins machined to an outside diameter equal to the hole diameter are inserted in the holes in one of the photomasks, female pins each having an internal tapered pocket are inserted in the holes in the other, and the male pins are fitted in the female pins. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は、フォトマスクの位置合せ方法とフォトマスクの露光装置とプリント配線板の製造方法に関する。
【0002】
【従来の技術】
従来、プリント配線板のパターン形成は、ドライフィルムをラミネートした銅張り積層板に、ストレートタイプのオスメスピンにてフォトマスクを取付け、このピンにて位置合せを行った焼枠にて銅張り積層板とフォトマスクを真空密着させた後、紫外線を照射し、ドライフィルムにフォトマスクと同一形状のパターン形成を行っていた。しかし、焼枠面積が大きくなると、それに伴い焼枠部材の反り等の変形量が増大するため、ストレートタイプのピンを使用する場合は、オスメスピンのクリアランスを大きくしないとオスメスピンの抜き差しが困難になる傾向があった。そのため、例えば、オスピンの直径に比べてメスピンの空洞直径を0.1mm程度大きくする必要があった。したがって、ストレートタイプのピンの使用だけでは、上下2枚のフォトマスクの位置合せを高精度に行うことが困難であった。
【0003】
そこで、ストレートタイプのピンの使用に加えて、上下2枚のフォトマスク各々に2箇所以上の位置合せ用のマークを設け、CCDカメラにて上下2枚のフォトマスクのずれを計測し、サーボモータとボールネジを用いて焼枠をX、Y、θ方向に移動させ上下2枚のフォトマスク間の位置ずれを最小限に抑える露光装置を用いて、層間位置精度の高いプリント配線板が製造されていた。
【0004】
【発明が解決しようとする課題】
しかし、CCDカメラを利用し焼枠を駆動させる上記の露光装置では、焼枠1枚当たり1枚のフォトマスクしか位置合わせすることができず、多面のパターン形成をするような大型基板の回路形成をすることはできなかった。また、多面パターンを形成できるような装置は高価であった(特開2000−066418)。
【0005】
本発明は、安価にて、複数セットのフォトマスクを高精度に位置合せをする方法と、この方法を用いた露光装置と、この装置を用いたプリント配線板の製造方法とを提供することを目的とする。
【0006】
【課題を解決するための手段】
本発明のフォトマスクの位置合せ方法は、上下2枚のフォトマスクに各々2箇所以上の穴をあけ、1枚目のフォトマスクにあけられた穴にはその穴径と同一の外径を一部に有する先細のオスピンを挿入し、二枚目のフォトマスクにあけられた穴にはその穴径と同一の外径を有し内部に先細の空洞を有するメスピンを挿入し、メスピンとオスピンとを嵌め合わせることを特徴とする。
【0007】
オスピンまたはメスピンを嵌め合わせる際に、オスピン又はメスピンを加重してもよい。
【0008】
さらに、本発明のプリント配線板の露光装置は、先細のオスピン、内部に先細の空洞を有し前記オスピンと嵌合するメスピン、前記メスピンを収納するための複数のカプセルが形成された上フォトマスクを取り付けるための焼き枠(以下、上枠とする。)及び下フォトマスクを取り付けるための焼き枠(以下、下枠とする。)を備えることを特徴とする。
さらに、本発明のフォトマスクの露光方法は、上枠及び下枠にフォトマスクをそれぞれ取付け、光硬化性膜が両面に形成された基材を、上枠と下枠とに挟んで固定し、その上下から露光光線を照射する方法であって、前記フォトマスクの取付けの際に先細のオスピン及び先細の空洞を有するメスピンを用い、前記挟んで固定する際に上記のフォトマスクの前記オスピンとメスピンを嵌め合わせることにより位置合せすることを特徴とする。
【0009】
さらに、本発明のプリント配線板の製造方法は、このようなプリント配線板用露光装置を用いてもよい。
さらに、先細のオスピン及び内部が先細のメスピンを用いる本発明のフォトマスクの位置合わせ方法を、他の装置、例えば、実装装置(熱圧着装置)、積層装置に応用してもよい。
【0010】
【発明の実施の形態】
(フォトマスク位置合せ方法)
本願発明による上下2枚のフォトマスクを位置合せする方法は、各フォトマスクに2箇所以上の穴をあけ、1枚目のフォトマスクにあけられた穴には、その穴径と同一の外形を一部に有する先細のオスピンを挿入し、二枚目のフォトマスクにあけられた穴にはその穴径と同一外径を有し内部に先細の空洞を有するメスピンを挿入し、メスピンとオスピンとを嵌め合わせることを特徴とする。
本発明のフォトマスク位置合せ方法を、図面を参照しながら以下に説明する。図1の(A)に上フォトマスク10、(B)に下フォトマスク20の一具体例を示す。これらのフォトマスクは、中央にパターン11,21を有し、また、ピン挿入穴、すなわち、メスピン挿入穴12又はオスピン挿入穴22を有する。これらの穴の径は、挿入するオスピンの一径と同一およびメスピンの外径と同一径とする。ここで、同一もしくは同一径とは、ほぼ同一径を意味し、正確に位置合わせできる程度に、穴径はピン径と比べて僅かに大きい場合を含む。
フォトマスク1枚あたりの穴数は少なくとも2箇所以上であればよいが、信頼性を高くするためには、3箇所以上設けるのが好ましい。また、穴位置は上下フォトマスクに描画されたパターン以外の箇所であれば問題ないが、フォトマスクの隅に配置するのが好ましい。
図2の(A)には本願発明に用いるオスピン30、(B)にはメスピン40の一例を示す。
図2の(A)に示されるオスピン30は、オスピン挿入穴22(図1)に挿入するためのフォトマスク取付け部31を有し、その上部にフォトマスクが上方向に抜けるのを防止するための座32を有し、さらにその上部には円錐状のオスピン部33を有する。オスピン30は、座32を備えることが好ましいがなくてもよい。また、図示しないが、フォトマスク取付け部31の下に、オスピン30を下枠に固定するための手段を有していてもよい。本発明で用いるオスピンは、先細のオスピンであるが、「先細のオスピン」とは、底面から離れるに従って断面積が小さくなるオスピン部を有するオスピンをいう。この様なオスピン部として、例えば、円錐、円錐台、多角錐、半球、球の一部、及び円錐及び多角錐の先端を丸めたものが挙げられる。オスピン部は、好ましくは、図2に示すような円錐形状である。オスピン部が円錐形状である場合は、円錐の中心軸を含む平面で円錐を切断した場合に、円錐の底面中心点及び頂点を結ぶ直線と、円錐の底面円周上の点及び頂点を結ぶ直線とにより形成される角度は、求められる位置合わせ精度と積層板の大きさとを考慮してあらかじめ最適値を実験により決定することとするが、好ましくは10〜60°、より好ましくは10〜45°、更に好ましくは10〜30°である。また、オスピン底面の外径についても、同様に最適値を決定することとするが、好ましくは3〜50mm、より好ましくは5〜30mm、更に好ましくは5〜20mmである。
図2(B)に示されるメスピン40は、フォトマスクの挿入穴に挿入するための円柱状部44と、その下に、フォトマスクが下方向に抜けるのを防止するための座41を有し、メスピン内部には先細の空洞であるメスピン部43を有する。本発明で用いるメスピンは、内部に先細の空洞であるメスピン部43を有するメスピンであり、「先細の空洞」とは、空洞の入り口から空洞の奥に入るに従って空洞の断面積が小さくなる空洞であって、上記のオスピンと密着する形状をいう。メスピン部の形状は、好ましくは円錐形状である。
図3に、上下フォトマスクの位置合せの一具体例を示す。まず、上フォトマスク10にメスピン40を挿入し、下フォトマスク20にオスピン30を挿入する。次に、上フォトマスク10に挿入されたメスピン40を、下フォトマスク20に挿入されたオスピン30と嵌合させることによって、フォトマスク同士の位置合せを高精度に行うことができる。
この時、下フォトマスクに挿入した全てのオスピンの頭頂の位置が、メスピンの底部外形の形状を下フォトマスク表面上にフォトマスク上部から平行投影してできる円内にあれば、位置合せ時の加重によって、オスピンの頭頂部はメスピンの空洞内の側面を伝ってメスピンの頭頂部に到達する、いわゆる、セルフアラインメント機能が生じる。そのため、従来この後の工程で行っていたCCDカメラを使った正確な位置合せを要することなく高精度な位置合せが可能となる。
【0011】
オスピン30とメスピン40とを嵌合するために、オスピン30又はメスピン40を加重してもよい。加重は、例えば、バネやエアシリンダによりピンを上方または下方から押しつけることによって行ってもよい。
【0012】
(プリント配線板用露光装置)
図4の(A)及び(B)に、本発明のプリント配線板用露光装置の一例を示す。この装置は、上下からの露光光線を、基材の両面に形成された光硬化性膜に、フォトマスクを介して照射する露光装置である。図4には、露光装置に上フォトマスク10及び下フォトマスク20が装着された例が示される。この露光装置は、メスピン40,メスピンを格納するカプセル70、カプセル70が取り付けられた上枠50、メスピン40と嵌合するオスピン30及び下枠60を備える。カプセル70は、メスピンを上方向から押圧するためのスプリング100、スプリングの圧力をメスピンに伝達するためスプリングとメスピンとの間に位置するバネ座金90、メスピンをカプセル内部に固定・安定するためのメスピン固定用円盤110、メスピン固定用円盤をネジによりカプセル内に取り付けるためのメスピン固定用円盤取付穴120を備える。このような装置として、一般に市販されているプリント配線板の露光装置を利用してもよい。露光光線としては、例えば、紫外線を用い、発光源としては、例えば、水銀灯を用いることができる。
図5の(A)及び(B)に本発明の上枠50及び下枠60を示す。上枠50に、メスピンを格納するカプセル70が複数個取り付けられている。上枠に取り付けられるカプセルの数及び位置は、フォトマスクに空けられたピン挿入穴の数、位置及び形状、位置合わせしたいフォトマスクの数、及びパターン形成したい積層板の数を考慮して決定する。下枠60は、上枠50と真空密着するように下枠の周囲に沿って土手ゴム61を備えていてもよく、さらに、下枠4隅の土手ゴムの内側に真空密着のための吸引口を備えていてもよい。
本発明のフォトマスク位置合せ方法と本発明の露光装置を用いることで層間位置精度の高いプリント配線板を製造することができる。
【0013】
(プリント配線板の製造方法)
本発明のプリント配線板の製造方法に用いる基材のうち、その両面に銅箔を貼り合わせた両面銅張り積層板としては、市販のものを使用することができる。市販の銅張り積層板として、例えば、MCL−E−67(日立化成工業株式会社製、商品名)、MCL−E−679(日立化成工業株式会社製、商品名)が挙げられる。
その表面に形成する光硬化性膜としては、エポキシ樹脂等の熱硬化性樹脂と光硬化剤、硬化促進剤、必要な場合には顔料や流動性調整剤、粘度調整剤などを、希釈剤に混合・分散して、ワニスとしたものを、直接基材の表面に塗布・乾燥し、形成することもできる。また、そのワニスを、キャリアフィルムに塗布・乾燥し半硬化状のドライフィルムを基材にラミネートして、光硬化性膜として用いてもよい。
このようなワニス状のエッチング用レジスト材としては、市販のものを利用してもよい。市販のワニス状のエッチング用レジスト材として、例えば、オプトER N−350(日本ペイント株式会社製、商品名)が挙げられる。また、ドライフィルム状のエッチング用レジスト材は市販のものを利用してもよい。市販のドライフィルム状のエッチング用レジスト材として、例えば、フォテックH−930(日立化成工業株式会社製、商品名)が挙げられる。
エッチングレジストを形成した後、エッチングレジストの硬化していない箇所のエッチングを除去するには、エッチング液を用いる。エッチング液として、例えば、塩化第二鉄溶液、塩化第二銅溶液などが挙げられる。これらのエッチング液をスプレー噴霧して、エッチングレジストの硬化していない箇所を腐食除去し、プリント配線板とすることができる。
【0014】
【実施例】
上フォトマスク10および下フォトマスク20として、図1に示す形状のうち、715mmピッチにて内径φ8.00mmの穴をフォトマスクの幅中心に各2穴ずつピン挿入穴12及び22を穴明けしたフォトマスクを準備した。
フォトマスクの位置合せに用いるピンとして、図2に示す様な、外径φ8.00mm、厚さ0.2mmのフォトマスク取付け部31を有し、外径φ12mm、厚さ0.2mmのフォトマスクの抜けを防止する座32を有し、さらにその上に、低部外径φ6.00mm、高さ6.00mmの先細のオスピン部33を有するオスピンを準備した。また、メスピン40として、外径φ12mm、厚さ0.2mmの、フォトマスクの抜けを防止するための座41を有し、その上に外径φ8.00mm、高さ8mmの円柱状部44を有し、メスピン40の内側は低部外径φ6.00mm、高さ6.00mmの先細の空洞を備えるメスピン部43を有するメスピンを準備した。
露光装置の焼枠のうち上枠として、図5の(A)に示す様な、厚さ8mmのアクリル製であって、715mmピッチにてφ40mmの貫通穴が幅中心に2箇所づつあけられ、厚さ20mm、外径φ60mmのアクリルをφ50mm、深さ7mmのザグリを有するカプセル70として、上枠50に設けた貫通穴と中心が一致するように合わせ取付けたものを準備した。また、下枠60として、厚さ8mmのアクリル製で、その周囲に幅20mm、高さ5mmの土手ゴム61を配置したものを準備した。
露光装置として、上下の露光光線を、基材の両面に形成された光硬化性膜に、フォトマスクを介して照射する露光装置であって、プリント配線板の製造装置として市販されているHMW−501(株式会社オーク製作所、商品名)を使用した。この装置では、露光光線は紫外線であって、発光源は水銀灯である。
下フォトマスクの下枠への取付け方法は、次の方法で行った。図4(B)に示す通り、下フォトマスクに形成したφ8.00mmの2つのオスピン挿入穴に、オスピン30のフォトマスク取付け部をフォトマスクの上から挿入した。フォトマスクの歪みが発生しないように上枠のカプセル70の中心とオスピン30の中心が一致する位置となるように、下枠にフォトマスクにオスピンを固定する。下枠へのフォトマスク固定は、フォトマスクの4隅に歪みが発生しないようにマイラーテープ(商品名:ポリエステル粘着テープ♯25×30×30、寺岡製作所製)にて固定を行った。
上フォトマスクの上枠への取付け方法は、次の方法で行った。図4の(A)に示すように、上フォトマスク10に形成したφ8.00mmの2つのメスピン挿入穴12に、メスピン40を上フォトマスク10の下側から挿入し、上フォトマスク10の上側からメスピン固定用円盤110を挿入した後、メスピン40の上にバネ座金90を固定し、バネ座金90の上にスプリング100を載せる。その後、上枠50を下降させ、スプリング100によりメスピン40を加重してオスピン30と位置合わせした後、下枠50の4隅に設けた吸引口から吸引することにより上下枠間を真空密着させて嵌め合わせられた状態を維持する。上下枠が真空密着した後、メスピン固定用円盤取付穴内120にネジを挿入し、ネジを締めこむことにより、メスピン固定用円盤110をカプセル70に固定する。これにより上フォトマスク10を上枠50に固定した。
上記方法にて、フォトマスク取付けして位置合わせを実施後、上下焼枠間にドライフィルム状のエッチング用レジスト材をラミネートした両面銅張り積層板を挿入して真空密着後、紫外線を照射した。基板挿入、紫外線照射を120枚連続で行い、その後、10枚露光毎に計12枚の両面銅張り積層板をエッチングし、プリント配線板とした。
【0015】
【比較例】
比較例で用いたオスピン及びメスピンを図6の(A)及び(B)に示す。比較例では、ストレートピンのオスピン130とメスピン140とを使用し、実施例と同一の方法でプリント配線板を作製した。
使用したメスピン140の内径はφ5.00mmとした。オスピン130のメスピン140との嵌合部分の外径は、メスピン140に対し小さくしないと焼枠上下の駆動ができなくなってしまうため、φ4.95mmとした。
【0016】
実施例および比較例で得られたプリント配線板の表裏パターン位置精度について測定した結果を表1に示す。本発明によって得られた表裏パターン位置精度は比較例と比べて優れた結果であることが確認できた。
【0017】
【表1】

Figure 2004037940
【0018】
【発明の効果】
以上に説明したとおり、本発明によって、安価で上下2枚のフォトマスクを高精度に位置合せすることが可能な露光装置とその装置を用いたプリント配線板の製造方法を提供することができる。
また、本発明によると、高価なCCDカメラを用いずに高精度の位置合せをすることが可能となるため、安価な露光装置を提供することができる。
【図面の簡単な説明】
【図1】本発明の上下フォトマスク穴あけ位置の一例を示す。
【図2】本発明のオスピン、メスピンの正面及び上視の一例を示す。
【図3】本発明の上下フォトマスク位置合せ状態の一例を示す断面図である。
【図4】本発明のオスピン、メスピンを用いた焼枠へのフォトマスク取付け方法の一例を示す断面図である。
【図5】本発明の上下焼枠の上視および断面図の一例である。
【図6】比較例で用いたストレートタイプのオスピン、メスピンの正面及び上視図である。
【符号の説明】
10 上フォトマスク
11、21 パターン
12 メスピン挿入穴
20 下フォトマスク
22 オスピン挿入穴
30 オスピン
40 メスピン
50 上枠
60 下枠
70 カプセル
90 バネ座金
100 スプリング
110 メスピン固定用円盤
120 メスピン固定用円盤取付穴[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a photomask alignment method, a photomask exposure apparatus, and a method for manufacturing a printed wiring board.
[0002]
[Prior art]
Conventionally, the pattern formation of a printed wiring board is performed by attaching a photomask to a copper-clad laminate laminated with a dry film using a straight type male pin, aligning the pins with the pins, and applying a photomask to the copper-clad laminate. After the mask was brought into close contact with the vacuum, ultraviolet light was irradiated to form a pattern having the same shape as the photomask on the dry film. However, as the area of the grill increases, the amount of deformation such as warping of the grill member increases, so when using a straight type pin, it is more difficult to insert and remove the male pin unless the clearance of the male pin is increased. there were. Therefore, for example, it was necessary to make the cavity diameter of the mespin about 0.1 mm larger than the diameter of the male pin. Therefore, it is difficult to accurately align the two upper and lower photomasks only by using the straight type pins.
[0003]
Therefore, in addition to using the straight type pins, two or more alignment marks are provided on each of the two upper and lower photomasks, and the displacement of the two upper and lower photomasks is measured with a CCD camera, and the servomotor and the servomotor are used. A printed wiring board with high interlayer positional accuracy has been manufactured using an exposure apparatus that moves the printing frame in the X, Y, and θ directions using a ball screw and minimizes the displacement between the upper and lower photomasks. .
[0004]
[Problems to be solved by the invention]
However, in the above-described exposure apparatus that drives a printing frame by using a CCD camera, only one photomask can be aligned for each printing frame, and circuit forming of a large substrate that forms a multi-sided pattern can be performed. Couldn't. Further, an apparatus capable of forming a multi-sided pattern is expensive (JP-A-2000-066418).
[0005]
An object of the present invention is to provide a method for aligning a plurality of sets of photomasks with high accuracy at low cost, an exposure apparatus using the method, and a method for manufacturing a printed wiring board using the apparatus. Aim.
[0006]
[Means for Solving the Problems]
In the method for aligning a photomask of the present invention, two or more holes are formed in each of two upper and lower photomasks, and the holes formed in the first photomask have the same outer diameter as the hole diameter. Insert a tapered male pin in the part, insert a female pin having the same outer diameter as the hole diameter and a tapered cavity inside the hole drilled in the second photomask, and a female pin and male pin Is fitted.
[0007]
When fitting the male pin or the female pin, the male pin or the female pin may be weighted.
[0008]
Further, the exposure apparatus for a printed wiring board according to the present invention may further comprise an upper photomask having a tapered male pin, a female pin having a tapered cavity therein and fitted with the male pin, and a plurality of capsules for accommodating the female pin. And a grilling frame for attaching a lower photomask (hereinafter, referred to as a lower frame).
Further, the photomask exposure method of the present invention, the photomask is attached to the upper frame and the lower frame, respectively, the photocurable film is formed on both sides of the substrate, and fixed between the upper frame and the lower frame, A method of irradiating an exposure light beam from above and below, using a male pin having a tapered male pin and a tapered cavity when attaching the photomask, and using the male pin and the female pin of the above-mentioned photomask when fixing the photomask. Are positioned by fitting them.
[0009]
Further, the method for manufacturing a printed wiring board of the present invention may use such an exposure apparatus for printed wiring boards.
Further, the photomask alignment method of the present invention using a tapered male pin and a tapered female pin may be applied to other devices, for example, a mounting device (thermocompression device) and a laminating device.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
(Photomask alignment method)
In the method of aligning two upper and lower photomasks according to the present invention, two or more holes are formed in each photomask, and the holes formed in the first photomask have the same outer diameter as the hole diameter. Insert a tapered male pin that has a part, insert a female pin having the same outer diameter as the hole diameter and a tapered cavity inside the hole drilled in the second photomask, and Is fitted.
The photomask alignment method of the present invention will be described below with reference to the drawings. FIG. 1A shows a specific example of the upper photomask 10 and FIG. 1B shows a specific example of the lower photomask 20. These photomasks have patterns 11 and 21 in the center, and have pin insertion holes, that is, female pin insertion holes 12 or male pin insertion holes 22. The diameter of these holes is the same as the diameter of the male pin to be inserted and the same as the outer diameter of the female pin. Here, the same or the same diameter means substantially the same diameter, and includes a case where the hole diameter is slightly larger than the pin diameter so that accurate positioning can be performed.
The number of holes per photomask may be at least two or more, but it is preferable to provide three or more holes in order to increase reliability. There is no problem if the hole position is a position other than the pattern drawn on the upper and lower photomasks, but it is preferable to arrange the hole positions at the corners of the photomask.
FIG. 2A shows an example of the male pin 30 used in the present invention, and FIG.
The male pin 30 shown in FIG. 2A has a photomask mounting portion 31 for insertion into the male pin insertion hole 22 (FIG. 1), and the upper portion thereof prevents the photomask from coming off upward. And a conical male pin portion 33 on the upper portion thereof. The male pin 30 preferably does not have to include a seat 32, but may. Although not shown, a means for fixing the male pin 30 to the lower frame may be provided below the photomask attaching portion 31. The male pin used in the present invention is a tapered male pin, and the “tapered male pin” refers to an male pin having an male pin portion whose cross-sectional area decreases as the distance from the bottom surface increases. Such male pin portions include, for example, cones, truncated cones, polygonal pyramids, hemispheres, parts of spheres, and cones and polygonal pyramids with rounded tips. The male pin portion preferably has a conical shape as shown in FIG. When the male pin portion has a conical shape, a straight line connecting the center point and the vertex of the bottom of the cone and a straight line connecting the points and vertices on the bottom circumference of the cone when the cone is cut along a plane including the central axis of the cone. The angle formed by the above, the optimal value is determined in advance by experiment in consideration of the required alignment accuracy and the size of the laminated plate, preferably 10 to 60 °, more preferably 10 to 45 ° And more preferably 10 to 30 °. The outer diameter of the bottom surface of the male pin is determined in the same manner as above, but is preferably 3 to 50 mm, more preferably 5 to 30 mm, and still more preferably 5 to 20 mm.
The female pin 40 shown in FIG. 2B has a columnar portion 44 for insertion into the insertion hole of the photomask, and a seat 41 therebelow for preventing the photomask from falling down. The inside of the female pin has a female pin portion 43 which is a tapered cavity. The mespin used in the present invention is a mespin having a mespin portion 43 which is a tapered cavity therein, and a “tapered cavity” is a cavity in which the cross-sectional area of the cavity becomes smaller as it enters the cavity from the entrance of the cavity. In addition, it refers to the shape in close contact with the above-mentioned male pin. The shape of the female pin is preferably conical.
FIG. 3 shows a specific example of the alignment of the upper and lower photomasks. First, the female pin 40 is inserted into the upper photomask 10, and the male pin 30 is inserted into the lower photomask 20. Next, by fitting the female pin 40 inserted into the upper photomask 10 with the male pin 30 inserted into the lower photomask 20, the positioning between the photomasks can be performed with high precision.
At this time, if the positions of the tops of all the male pins inserted in the lower photomask are within a circle formed by projecting the shape of the bottom outer shape of the mespin in parallel from the upper part of the lower photomask onto the lower photomask surface, alignment is performed. The weighting causes a so-called self-alignment function in which the top of the male pin travels along the side surface inside the cavity of the mespin and reaches the top of the female pin. Therefore, high-accuracy alignment can be performed without requiring accurate alignment using a CCD camera, which has been conventionally performed in a subsequent step.
[0011]
In order to fit the male pin 30 and the female pin 40, the male pin 30 or the female pin 40 may be weighted. The weight may be applied by, for example, pressing the pin from above or below with a spring or an air cylinder.
[0012]
(Exposure equipment for printed wiring boards)
4A and 4B show an example of a printed wiring board exposure apparatus of the present invention. This apparatus is an exposure apparatus that irradiates, via a photomask, exposure light beams from above and below to photocurable films formed on both surfaces of a substrate. FIG. 4 shows an example in which an upper photomask 10 and a lower photomask 20 are mounted on an exposure apparatus. This exposure apparatus includes a female pin 40, a capsule 70 for storing the female pin, an upper frame 50 to which the capsule 70 is attached, an male pin 30 fitted to the female pin 40, and a lower frame 60. The capsule 70 includes a spring 100 for pressing the female pin from above, a spring washer 90 located between the spring and the female pin for transmitting the pressure of the spring to the female pin, and a female pin for fixing and stabilizing the female pin inside the capsule. A fixing disk 110 and a female pin fixing disk mounting hole 120 for mounting the female pin fixing disk in the capsule with screws are provided. As such an apparatus, a commercially available exposure apparatus for printed wiring boards may be used. For example, an ultraviolet ray is used as the exposure light beam, and a mercury lamp can be used as the light emission source.
FIGS. 5A and 5B show an upper frame 50 and a lower frame 60 of the present invention. A plurality of capsules 70 for storing female pins are attached to the upper frame 50. The number and position of the capsules attached to the upper frame are determined in consideration of the number, position and shape of the pin insertion holes formed in the photomask, the number of photomasks to be aligned, and the number of laminates to be patterned. . The lower frame 60 may be provided with a bank rubber 61 along the periphery of the lower frame so as to be in vacuum contact with the upper frame 50, and a suction port for vacuum adhesion is provided inside the bank rubber at four corners of the lower frame. May be provided.
By using the photomask alignment method of the present invention and the exposure apparatus of the present invention, a printed wiring board with high interlayer positional accuracy can be manufactured.
[0013]
(Method of manufacturing printed wiring boards)
Among the base materials used in the method for manufacturing a printed wiring board of the present invention, commercially available double-sided copper-clad laminates having copper foils bonded to both surfaces thereof can be used. Examples of commercially available copper-clad laminates include MCL-E-67 (trade name, manufactured by Hitachi Chemical Co., Ltd.) and MCL-E-679 (trade name, manufactured by Hitachi Chemical Co., Ltd.).
As a photocurable film formed on the surface, a thermosetting resin such as an epoxy resin and a photocuring agent, a curing accelerator, and if necessary, a pigment, a fluidity adjusting agent, a viscosity adjusting agent, etc. A varnish that has been mixed and dispersed can be directly applied to the surface of a substrate and dried to form a varnish. Alternatively, the varnish may be applied to a carrier film and dried, and a semi-cured dry film may be laminated on a substrate to be used as a photocurable film.
As such a varnish-like etching resist material, a commercially available one may be used. As a commercially available varnish-like etching resist material, for example, Opto ERN-350 (trade name, manufactured by Nippon Paint Co., Ltd.) can be mentioned. A commercially available dry film-shaped etching resist material may be used. As a commercially available dry film-shaped etching resist material, for example, PHOTEC H-930 (trade name, manufactured by Hitachi Chemical Co., Ltd.) can be mentioned.
After forming the etching resist, an etching solution is used to remove the etching of the uncured portion of the etching resist. Examples of the etchant include a ferric chloride solution and a cupric chloride solution. By spraying and spraying these etching liquids, the uncured portions of the etching resist can be removed by corrosion to obtain printed wiring boards.
[0014]
【Example】
As the upper photomask 10 and the lower photomask 20, of the shape shown in FIG. 1, holes having an inner diameter of 8.00 mm were formed at a pitch of 715 mm, and two pin insertion holes 12 and 22 were formed at the center of the width of the photomask. A photomask was prepared.
As shown in FIG. 2, a pin used for positioning the photomask has a photomask mounting portion 31 having an outer diameter of 8.00 mm and a thickness of 0.2 mm, and a photomask having an outer diameter of 12 mm and a thickness of 0.2 mm. A male pin having a seat 32 for preventing the falling off, and further having a tapered male pin portion 33 having a lower outer diameter of 6.00 mm and a height of 6.00 mm was prepared thereon. The female pin 40 has a seat 41 having an outer diameter of 12 mm and a thickness of 0.2 mm for preventing the photomask from coming off, and a columnar portion 44 having an outer diameter of 8.00 mm and a height of 8 mm is provided thereon. A female pin having a female pin portion 43 having a tapered cavity with a lower outer diameter φ6.00 mm and a height of 6.00 mm inside the female pin 40 was prepared.
As the upper frame of the baking frame of the exposure apparatus, as shown in FIG. 5A, a through hole of 8 mm thick acrylic and having a diameter of 40 mm at a pitch of 715 mm is formed in two places at the center of the width. An acrylic having a thickness of 20 mm and an outer diameter of φ60 mm was prepared as a capsule 70 having a counterbore of φ50 mm and depth of 7 mm so as to be aligned with the center of a through hole provided in the upper frame 50. A lower frame 60 made of acrylic having a thickness of 8 mm and having a bank rubber 61 having a width of 20 mm and a height of 5 mm disposed therearound was prepared.
An exposure apparatus for irradiating a photocurable film formed on both surfaces of a substrate with upper and lower exposure light beams through a photomask as an exposure apparatus, which is commercially available as a printed wiring board manufacturing apparatus. 501 (Oak Manufacturing Co., Ltd., trade name) was used. In this apparatus, the exposure light is ultraviolet light and the light source is a mercury lamp.
The lower photomask was attached to the lower frame by the following method. As shown in FIG. 4B, the photomask mounting portion of the male pin 30 was inserted from above the photomask into two male pin holes of φ8.00 mm formed in the lower photomask. The male pin is fixed to the photomask in the lower frame such that the center of the capsule 70 in the upper frame coincides with the center of the male pin 30 so that distortion of the photomask does not occur. The photomask was fixed to the lower frame with a mylar tape (trade name: polyester adhesive tape # 25 × 30 × 30, manufactured by Teraoka Seisakusho) so as not to cause distortion at the four corners of the photomask.
The upper photomask was attached to the upper frame by the following method. As shown in FIG. 4A, a female pin 40 is inserted from below the upper photomask 10 into two female pin insertion holes 12 of φ8.00 mm formed in the upper photomask 10, and After inserting the female pin fixing disk 110 from above, the spring washer 90 is fixed on the female pin 40, and the spring 100 is placed on the spring washer 90. After that, the upper frame 50 is lowered, the female pin 40 is weighted by the spring 100 and positioned with the male pin 30, and the upper and lower frames are brought into vacuum contact with each other by suction from suction ports provided at four corners of the lower frame 50. Maintain the fitted state. After the upper and lower frames are brought into vacuum contact, a screw is inserted into the female pin fixing disk mounting hole 120 and the screw is tightened, thereby fixing the female pin fixing disk 110 to the capsule 70. Thus, the upper photomask 10 was fixed to the upper frame 50.
After the photomask was attached and alignment was performed by the above-described method, a double-sided copper-clad laminate in which a dry film-shaped etching resist material was laminated was inserted between the upper and lower firing frames, and vacuum-adhered, followed by irradiation with ultraviolet rays. Insertion of the substrate and irradiation of ultraviolet rays were continuously performed on 120 sheets, and thereafter, a total of 12 double-sided copper-clad laminates were etched every 10 exposures to obtain printed wiring boards.
[0015]
[Comparative example]
FIGS. 6A and 6B show the male pin and the female pin used in the comparative example. In the comparative example, a printed wiring board was manufactured using the straight pin male pin 130 and the female pin 140 in the same manner as in the example.
The inner diameter of the female pin 140 used was φ5.00 mm. The outer diameter of the fitting portion of the male pin 130 with the female pin 140 is set to φ4.95 mm because unless it is smaller than the female pin 140, it becomes impossible to drive the upper and lower portions of the grill.
[0016]
Table 1 shows the results of measuring the positional accuracy of the front and back patterns of the printed wiring boards obtained in the examples and the comparative examples. It was confirmed that the positional accuracy of the front and back patterns obtained by the present invention was superior to that of the comparative example.
[0017]
[Table 1]
Figure 2004037940
[0018]
【The invention's effect】
As described above, according to the present invention, it is possible to provide an exposure apparatus which is inexpensive and capable of aligning two upper and lower photomasks with high accuracy, and a method for manufacturing a printed wiring board using the exposure apparatus.
Further, according to the present invention, it is possible to perform high-accuracy alignment without using an expensive CCD camera, so that an inexpensive exposure apparatus can be provided.
[Brief description of the drawings]
FIG. 1 shows an example of a position for drilling upper and lower photomasks according to the present invention.
FIG. 2 shows an example of a front view and a top view of a male pin and a female pin of the present invention.
FIG. 3 is a cross-sectional view showing an example of an upper and lower photomask alignment state of the present invention.
FIG. 4 is a cross-sectional view showing an example of a method of attaching a photomask to a burning frame using male pins and female pins according to the present invention.
FIG. 5 is an example of a top view and a sectional view of the upper and lower grilling frames of the present invention.
FIG. 6 is a front view and a top view of a straight type male pin and a female pin used in a comparative example.
[Explanation of symbols]
Reference Signs List 10 Upper photomask 11, 21 Pattern 12 Female pin insertion hole 20 Lower photomask 22 Male pin insertion hole 30 Male pin 40 Female pin 50 Upper frame 60 Lower frame 70 Capsule 90 Spring washer 100 Spring 110 Disk for female pin fixing 120 Disk mounting hole for female pin fixing

Claims (4)

上下2枚のフォトマスクを位置合せする方法において、各フォトマスクに2箇所以上の穴をあけ、一枚目のフォトマスクにあけられた穴にはその穴径と同一の外径を一部に有する先細のオスピンを挿入し、二枚目のフォトマスクにあけられた穴にはその穴径と同一の外径を有し内部に先細の空洞を有するメスピンを挿入し、前記オスピンとメスピンとを嵌め合わせることを特徴とするフォトマスクの位置合せ方法。In the method of aligning the upper and lower two photomasks, two or more holes are formed in each photomask, and the holes formed in the first photomask partially have the same outer diameter as the hole diameter. Insert a tapered male pin, insert a female pin having the same outer diameter as the hole diameter and a tapered cavity inside the hole drilled in the second photomask, and combine the male pin with the female pin. A method for aligning a photomask, which comprises fitting. 前記オスピンとメスピンとを嵌め合わせる際に、前記オスピンまたは前記メスピンを加重することを特徴とするフォトマスクの位置合せ方法。A method of aligning a photomask, comprising: weighting the male pin or the female pin when fitting the male pin and the female pin. 先細のオスピン;
内部に先細の空洞を有し、前記オスピンと嵌合可能なメスピン;
前記メスピンを収納するための複数のカプセルが形成された、上フォトマスクを取り付けるための上枠;及び
下フォトマスクを取り付けるための下枠を備えることを特徴とするフォトマスクの露光装置。
Tapered male pin;
A female pin having a tapered cavity therein and capable of fitting with the male pin;
An exposure apparatus for a photomask, comprising: an upper frame on which a plurality of capsules for accommodating the female pin are formed; an upper frame for attaching an upper photomask; and a lower frame for attaching a lower photomask.
請求項3のフォトマスクの露光装置を用いて作製することを特徴とするプリント配線板の製造方法。A method for manufacturing a printed wiring board, wherein the manufacturing method is performed using the photomask exposure apparatus according to claim 3.
JP2002196378A 2002-07-04 2002-07-04 Photomask alignment method, exposure apparatus, and printed wiring board manufacturing method Expired - Fee Related JP4306194B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112770504A (en) * 2020-11-26 2021-05-07 景德镇市恒耀电子科技有限公司 Method for processing countersunk hole of multilayer circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112770504A (en) * 2020-11-26 2021-05-07 景德镇市恒耀电子科技有限公司 Method for processing countersunk hole of multilayer circuit board

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