JP2004034175A5 - - Google Patents

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Publication number
JP2004034175A5
JP2004034175A5 JP2002191402A JP2002191402A JP2004034175A5 JP 2004034175 A5 JP2004034175 A5 JP 2004034175A5 JP 2002191402 A JP2002191402 A JP 2002191402A JP 2002191402 A JP2002191402 A JP 2002191402A JP 2004034175 A5 JP2004034175 A5 JP 2004034175A5
Authority
JP
Japan
Prior art keywords
grooves
polishing
recesses
formed uniformly
polishing surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002191402A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004034175A (ja
JP3849593B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2002191402A external-priority patent/JP3849593B2/ja
Priority to JP2002191402A priority Critical patent/JP3849593B2/ja
Priority to TW092114938A priority patent/TWI250572B/zh
Priority to US10/449,196 priority patent/US20040014413A1/en
Priority to KR1020030035237A priority patent/KR100669301B1/ko
Priority to EP03012509A priority patent/EP1369204B1/en
Priority to DE60308946T priority patent/DE60308946T2/de
Priority to CNB031406815A priority patent/CN100492597C/zh
Publication of JP2004034175A publication Critical patent/JP2004034175A/ja
Publication of JP2004034175A5 publication Critical patent/JP2004034175A5/ja
Publication of JP3849593B2 publication Critical patent/JP3849593B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002191402A 2002-06-03 2002-06-28 研磨パッド及び複層型研磨パッド Expired - Fee Related JP3849593B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2002191402A JP3849593B2 (ja) 2002-06-28 2002-06-28 研磨パッド及び複層型研磨パッド
EP03012509A EP1369204B1 (en) 2002-06-03 2003-06-02 Polishing pad and process for manufacturing a polishing pad
US10/449,196 US20040014413A1 (en) 2002-06-03 2003-06-02 Polishing pad and multi-layer polishing pad
KR1020030035237A KR100669301B1 (ko) 2002-06-03 2003-06-02 연마 패드 및 복층형 연마 패드
TW092114938A TWI250572B (en) 2002-06-03 2003-06-02 Polishing pad and multi-layer polishing pad
DE60308946T DE60308946T2 (de) 2002-06-03 2003-06-02 Polierkissen und Verfahren zur Herstellung eines Polierkissens
CNB031406815A CN100492597C (zh) 2002-06-03 2003-06-03 抛光垫及其制备、使用方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002191402A JP3849593B2 (ja) 2002-06-28 2002-06-28 研磨パッド及び複層型研磨パッド

Publications (3)

Publication Number Publication Date
JP2004034175A JP2004034175A (ja) 2004-02-05
JP2004034175A5 true JP2004034175A5 (cg-RX-API-DMAC7.html) 2005-05-26
JP3849593B2 JP3849593B2 (ja) 2006-11-22

Family

ID=31700989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002191402A Expired - Fee Related JP3849593B2 (ja) 2002-06-03 2002-06-28 研磨パッド及び複層型研磨パッド

Country Status (1)

Country Link
JP (1) JP3849593B2 (cg-RX-API-DMAC7.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5105391B2 (ja) * 2005-06-15 2012-12-26 ニッタ・ハース株式会社 研磨パッド
JP5132830B2 (ja) * 2012-06-28 2013-01-30 ニッタ・ハース株式会社 研磨パッド
CN105517758B (zh) 2013-09-25 2020-03-31 3M创新有限公司 复合陶瓷研磨抛光液
EP3050082B1 (en) * 2013-09-25 2021-05-05 3M Innovative Properties Company System for polishing a substrate
JP2022145322A (ja) * 2021-03-19 2022-10-04 株式会社ノリタケカンパニーリミテド 研磨体
JP7650180B2 (ja) * 2021-03-31 2025-03-24 ノリタケ株式会社 研磨パッド及びウェハ研磨方法
JP7654217B2 (ja) * 2021-03-31 2025-04-01 ノリタケ株式会社 ウェハ研磨方法
JP2023150173A (ja) * 2022-03-31 2023-10-16 株式会社ノリタケカンパニーリミテド 研磨パッド

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