JP2004031970A5 - - Google Patents

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Publication number
JP2004031970A5
JP2004031970A5 JP2003187828A JP2003187828A JP2004031970A5 JP 2004031970 A5 JP2004031970 A5 JP 2004031970A5 JP 2003187828 A JP2003187828 A JP 2003187828A JP 2003187828 A JP2003187828 A JP 2003187828A JP 2004031970 A5 JP2004031970 A5 JP 2004031970A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2003187828A
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Japanese (ja)
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JP2004031970A (ja
JP4464631B2 (ja
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Priority to JP2003187828A priority Critical patent/JP4464631B2/ja
Priority claimed from JP2003187828A external-priority patent/JP4464631B2/ja
Publication of JP2004031970A publication Critical patent/JP2004031970A/ja
Publication of JP2004031970A5 publication Critical patent/JP2004031970A5/ja
Application granted granted Critical
Publication of JP4464631B2 publication Critical patent/JP4464631B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003187828A 2003-06-30 2003-06-30 半導体素子の製造方法 Expired - Fee Related JP4464631B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003187828A JP4464631B2 (ja) 2003-06-30 2003-06-30 半導体素子の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003187828A JP4464631B2 (ja) 2003-06-30 2003-06-30 半導体素子の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2001253099A Division JP2003068705A (ja) 2001-08-23 2001-08-23 半導体素子の製造方法

Publications (3)

Publication Number Publication Date
JP2004031970A JP2004031970A (ja) 2004-01-29
JP2004031970A5 true JP2004031970A5 (cg-RX-API-DMAC7.html) 2007-01-11
JP4464631B2 JP4464631B2 (ja) 2010-05-19

Family

ID=31185459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003187828A Expired - Fee Related JP4464631B2 (ja) 2003-06-30 2003-06-30 半導体素子の製造方法

Country Status (1)

Country Link
JP (1) JP4464631B2 (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4101280B2 (ja) 2006-07-28 2008-06-18 住友精密工業株式会社 終点検出可能なプラズマエッチング方法及びプラズマエッチング装置
DE102012200211A1 (de) * 2012-01-09 2013-07-11 Carl Zeiss Nts Gmbh Vorrichtung und Verfahren zur Oberflächenbearbeitung eines Substrates
JP2015032780A (ja) * 2013-08-06 2015-02-16 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理方法
JP2015060934A (ja) * 2013-09-18 2015-03-30 株式会社日立ハイテクノロジーズ プラズマ処理方法
US10460988B2 (en) * 2017-12-21 2019-10-29 Tokyo Electron Limited Removal method and processing method
JP7231683B1 (ja) * 2021-08-30 2023-03-01 株式会社Kokusai Electric 半導体装置の製造方法、基板処理装置およびプログラム

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