JP2004014207A5 - - Google Patents

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Publication number
JP2004014207A5
JP2004014207A5 JP2002163701A JP2002163701A JP2004014207A5 JP 2004014207 A5 JP2004014207 A5 JP 2004014207A5 JP 2002163701 A JP2002163701 A JP 2002163701A JP 2002163701 A JP2002163701 A JP 2002163701A JP 2004014207 A5 JP2004014207 A5 JP 2004014207A5
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JP
Japan
Prior art keywords
electron beam
inspection apparatus
sample
diaphragm
central hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002163701A
Other languages
English (en)
Japanese (ja)
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JP2004014207A (ja
JP4178003B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2002163701A priority Critical patent/JP4178003B2/ja
Priority claimed from JP2002163701A external-priority patent/JP4178003B2/ja
Publication of JP2004014207A publication Critical patent/JP2004014207A/ja
Publication of JP2004014207A5 publication Critical patent/JP2004014207A5/ja
Application granted granted Critical
Publication of JP4178003B2 publication Critical patent/JP4178003B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002163701A 2002-06-05 2002-06-05 半導体回路パターンの検査装置 Expired - Fee Related JP4178003B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002163701A JP4178003B2 (ja) 2002-06-05 2002-06-05 半導体回路パターンの検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002163701A JP4178003B2 (ja) 2002-06-05 2002-06-05 半導体回路パターンの検査装置

Publications (3)

Publication Number Publication Date
JP2004014207A JP2004014207A (ja) 2004-01-15
JP2004014207A5 true JP2004014207A5 (enrdf_load_stackoverflow) 2005-10-06
JP4178003B2 JP4178003B2 (ja) 2008-11-12

Family

ID=30432051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002163701A Expired - Fee Related JP4178003B2 (ja) 2002-06-05 2002-06-05 半導体回路パターンの検査装置

Country Status (1)

Country Link
JP (1) JP4178003B2 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3984521B2 (ja) * 2002-09-20 2007-10-03 松下電器産業株式会社 透過型電子顕微鏡による観察方法
US7256606B2 (en) * 2004-08-03 2007-08-14 Applied Materials, Inc. Method for testing pixels for LCD TFT displays
DE112007003536T5 (de) * 2007-06-08 2010-04-22 Advantest Corp. Ladungsteilchenstrahl-Untersuchungsgerät und einen Ladungsteilchenstrahl verwendendes Untersuchungsverfahren
GB0713276D0 (en) * 2007-07-09 2007-08-15 Medical Res Council Transmission electron microscope
US7994476B2 (en) * 2007-11-05 2011-08-09 Applied Materials Israel, Ltd. Apparatus and method for enhancing voltage contrast of a wafer
EP4264653A1 (en) * 2020-12-16 2023-10-25 ASML Netherlands B.V. Thermal-aided inspection by advanced charge controller module in a charged particle system

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