JP2004006995A - Integrated circuit device and its manufacture as well as electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small TAB package-type integrated circuit device, thus reducing its packaging area. <P>SOLUTION: On a consecutive flexible tape carrier 1, there are built a device hole 3, many inner leads 6 projecting inwardly from its circumference, and connecting leads 5 extending from the inner leads 6. The shape of the device hole 3 is smaller than the outer shape of the integrated circuit part 2, and the integrated circuit part 2 partly faces the tape carrier 1. <P>COPYRIGHT: (C)2004,JPO

Description

The present invention relates to a TAB tape carrier for mounting integrated circuit components, an integrated circuit device mounted and packaged with integrated circuit components, a method of manufacturing the same, and electronic equipment.

In recent liquid crystal display devices, an integrated circuit device equipped with a driving integrated circuit component is used to connect a driving circuit to an LCD cell. A TAB method using a so-called TAB package (also called a TCP (Tape Carrier Package)) and a COG (Chip On Glass) method in which a driving integrated circuit component is directly connected to a glass substrate are generally applied to this integrated circuit device. ing. In particular, the TAB package is smaller and thinner than other packages, and has advantages such as being suitable for high-density mounting, being capable of electrical inspection on a tape carrier, and being folded and mounted. Are used not only in liquid crystal display devices but also in various electronic devices.

(4) In the conventional TAB package, as shown in FIG. 14, a tape carrier 131 made of polyimide or the like is formed with a device hole 133 having a size larger than that of an integrated circuit component 132 mounted thereon. The inner lead 134 projecting into the device hole 133 is connected to an electrode of the integrated circuit component 132 via a bump 135. Further, in order to prevent short-circuit between the inner leads 134 and contact between the inner leads 134 and the integrated circuit component 132 and to enhance reliability, the surfaces of the inner leads 134 and the integrated circuit component 132 are covered with a protective resin 136. . The electrodes and bumps 135 are typically provided around the periphery of the integrated circuit component 132 to minimize the length of the cantilevered inner leads 134 (ie, only one side of the inner leads 134 is supported by the tape carrier 131). It is arranged along. Further, as disclosed in, for example, JP-A-63-9539, a tape carrier is provided with a lead support portion extending into a device hole in order to mount a large-sized integrated circuit component having a large number of electrodes. There is known a structure in which some leads are extended thereon.

However, in the above-described conventional TAB package, there is a gap between the periphery of the device hole 133 and the periphery of the integrated circuit component 132, and the protection resin 136 is provided in order to prevent the inner lead 134 from being exposed in this gap. Was. Therefore, the external dimensions of the package are considerably larger than the external dimensions of the integrated circuit component 132 to be mounted, and the mounting area is large. In addition, the miniaturization of the integrated circuit component 132 and the narrowing of the pitch of the electrodes and the inner leads 134 make the connection leads 134a supported on the tape carrier 131 finer, which increases the wiring distance and increases the area for routing. Is needed. For this reason, the area of the tape carrier used for mounting one integrated circuit component 132 is increased, the size of the entire package is further increased, the mounting area is increased, and the demand for miniaturization of electronic equipment is defeated. There was a problem.

In particular, in the case of a liquid crystal display device, as shown in FIG. 15, a plurality of TAB packages 138 (only one is shown in FIG. 139 are connected along the outer periphery, and further outside the 139, a printed circuit board 140 forming a drive circuit is connected. In order to increase the liquid crystal display area with respect to the dimensions of the entire liquid crystal display device, the width W of the frame portion must be reduced. For this purpose, it is necessary to reduce the width w1 of the outer peripheral portion 141 of the LCD cell 139 to which the TAB package 138 is connected and the width w2 of the printed circuit board 140, and reduce the width w3 of the TAB package 138 by downsizing. is there. To this end, it is conceivable to first reduce the size of the driving integrated circuit component 137 and design the driving integrated circuit component 137 as narrow as possible. There is a problem that the width W cannot be sufficiently reduced. On the other hand, in the COG method, since the direct drive integrated circuit components are mounted on the outer peripheral portion of the LCD cell 139 and the connection leads are formed, it is more difficult to reduce the width W of the frame portion than in the TAB method. It is.

化 Another problem arises with the miniaturization of electronic devices. For example, an integrated circuit component used in a liquid crystal display device or the like has an elongated shape due to the fine and multi-output pins, electrodes are arranged in two rows along the longitudinal direction of the integrated circuit component, and the wiring drawing direction is May be in two directions. FIG. 16 shows such an integrated circuit component and a tape carrier. In the figure, an integrated circuit component 142 and an inner lead 144 formed on a tape carrier 143 are connected by thermal fusion using a bonding tool (heating jig) not shown. Here, the tape carrier 143 has a larger thermal expansion coefficient than the integrated circuit component 142. Therefore, at the time of thermal fusion of both, the tape carrier 143 is thermally fused to the integrated circuit component 142 in a stretched state. However, after the thermal welding, the tape carrier 143 shrinks due to the temperature drop, so that the tape carrier 143 pulls the inner lead 144 and the tape carrier 143 near the integrated circuit component 142 is bent and deformed. When the tape carrier 143 pulls the inner lead 144, the inner lead 144 may be disconnected.

The object of the present invention is to provide a tape carrier, an integrated circuit device, a method of manufacturing the same, and an electronic device that can reduce the size of the electronic device and can solve the problems associated with the downsizing of the electronic device.

(1) A TAB tape carrier according to the present invention has an insulating and elongated shape, and has a base member having an opening for disposing an integrated circuit component;
A plurality of connection leads extending into the opening from a pair of opposing edges of the edge forming the opening of the base member;
At least one dummy lead extending into the opening from a pair of opposite peripheral edges different from the pair of peripheral edges of the base member,
Having.
According to the present invention, after the integrated circuit component is mounted, the heated base member tends to shrink. However, the dummy lead projecting in the shrinking direction supports the base member. Disconnection can be prevented.
Here, the dummy lead refers to all of the components that are not used for transmitting and receiving signals and the like, that is, all components that are not electrically exchanged, and whether or not they are connected to the electrodes of the integrated circuit component is not particularly limited.
(2) A plurality of dummy leads may extend from each of the pair of peripheral edges.
(3) The width of each dummy lead may be smaller than the width of the connection lead.
According to this, each dummy lead is formed thin, but the dummy lead can support the force generated by the reduction of the base member. Further, since the dummy leads are thin, when the sealing material is injected after mounting the integrated circuit component, the sealing material can be reliably flowed to the back side of each dummy lead, and bubbles can be prevented from remaining.
(4) At least one protrusion may be formed on the dummy lead in a direction substantially orthogonal to the extending direction.
According to this, when the sealing material is injected after mounting the integrated circuit component, a surface tension is generated between the protrusion and the integrated circuit component, and a large amount of the sealing material flows from the gap between the integrated circuit component and the opening. Can be prevented from flowing out. Therefore, the thickness of the sealing material can be made uniform.
(5) The dummy lead is formed on one surface of the base member, and has a bent portion that is bent in a direction facing the other surface of the base member in the opening,
The protrusion may be formed on the bent portion of the dummy lead.
According to this, since a height difference between the protrusion and the integrated circuit component can be ensured, a sufficient surface tension of the sealing material can be obtained by utilizing the height difference. Further, since the bent portion has a difference in height, the projection can be formed longer than a flat state within a certain distance. For this reason, it is possible to prevent a large amount of the sealing material from flowing out into the opening, and to make the thickness of the sealing material uniform.
(6) The width of the dummy lead may be wider than the width of the connection lead.
According to this, even when the periphery of the opening where the plurality of connection leads extend is cooled, and the opening is about to be enlarged, the dummy lead can receive the force without being cut.
(7) The connection lead extends along a longitudinal direction of the base member,
The dummy lead may extend in a direction substantially orthogonal to a direction in which the connection lead extends.
According to this, since the connection lead can be drawn out in the longitudinal direction of the base member without bending, the area of the base member can be effectively used.
(8) An integrated circuit device according to the present invention includes a base member having an insulating property and an opening formed therein;
A plurality of connection leads extending from the base member into the opening;
An integrated circuit component connected to the connection lead in the opening;
Has,
A first portion, wherein the integrated circuit component is located in a region of the opening and is exposed through the opening and provided with a plurality of electrodes electrically connected to the connection lead; A second portion facing the other surface of
The connection lead is provided on the base member at a portion of the integrated circuit component facing the second portion.
According to this, since the first portion of the integrated circuit component located in the opening is smaller than the opening, a gap is formed between the periphery of the opening and the first portion. Therefore, the fluidity of the sealing material on the integrated circuit component is secured in the first portion exposed from the opening, and the sealing material is on the opposite side in the gap between the periphery of the opening and the first portion. You can turn around. In addition to the advantage, since the connection lead can be provided at the portion where the second portion of the integrated circuit component and the base member face each other, the external dimensions of the integrated circuit device can be made smaller than before.
(9) The pitch of the connection lead may be changed at a portion of the base member facing the second portion of the integrated circuit component.
According to this, since the pitch of the connection lead is changed in a region where the integrated circuit component and the base member overlap on the projection surface, the external dimensions of the integrated circuit device can be made smaller than before.
(10) The outer shape of the opening may be smaller than the outer shape of the integrated circuit component.
According to this, by increasing the area where the integrated circuit component and the base member face each other, the area can be used as a pitch conversion area of the connection lead or can be used as a routing area of the connection lead. The design flexibility of the lead is improved. In addition, since connection leads can be formed in the region of the base member facing the integrated circuit component around the opening, the outer dimensions of the entire base member can be made smaller than before.
(11) the integrated circuit component has a rectangular shape, the first portion includes an end forming one long side,
The electrodes of the integrated circuit component may be arranged in a line along the long side.
According to this, the connection lead can be provided in the direction orthogonal to the longitudinal direction of the integrated circuit component, and the connection lead can be shortened.
(12) the integrated circuit component has a rectangular shape, the first portion includes an end forming one long side,
The electrodes of the integrated circuit component may be arranged in two rows along the long side.
According to this, it is possible to arrange the electrodes of the integrated circuit component according to the number of electrodes, connection conditions with external devices / circuits, etc. while reducing the size of the base member.
(13) The present invention provides a sealing material for sealing at least a connection portion between the electrode of the integrated circuit component and the connection lead,
At least one dummy lead extending into the opening from a pair of opposed edges of the periphery forming the opening,
Has,
The connection lead may be extended into the opening from a pair of opposite peripheral edges different from the pair of peripheral edges on which the dummy lead is provided.
According to this, after the integrated circuit component is mounted, the heated base member shrinks in the direction of arrangement of the electrodes in the integrated circuit component so that the opening tends to widen. Since the base member is supported, disconnection of the connection lead can be prevented.
(14) The width of each dummy lead may be smaller than the width of the connection lead.
According to this, each dummy lead is formed thin, but the dummy lead can support the force generated by the reduction of the base member. Further, since the dummy leads are thin, when the sealing material is injected after mounting the integrated circuit component, the sealing material can be reliably flowed to the back side of each dummy lead, and bubbles can be prevented from remaining.
(15) The dummy lead may have at least one protrusion in a direction substantially orthogonal to the extending direction.
According to this, when the sealing material is injected after the mounting of the integrated circuit component, a surface tension is generated between the protrusion and the integrated circuit component, and the sealing material is filled through the gap between the opening and the integrated circuit component. It can be prevented from flowing out. Therefore, the thickness of the sealing material can be made uniform.
(16) The dummy lead has a bent portion bent in the opening,
The protrusion may be formed on the bent portion of the dummy lead.
According to this, a height difference between the protrusion and the integrated circuit component can be ensured, so that a sufficient surface tension of the sealing material can be obtained. Therefore, it is possible to prevent the sealing material from flowing out from the gap between the peripheral edge of the opening and the integrated circuit component, and to make the thickness of the sealing material uniform.
(17) The width of the dummy lead may be wider than the width of the connection lead.
According to this, the periphery of the opening in which the plurality of connection leads extend can be reduced by cooling, and even if the opening is to be enlarged, the dummy lead can receive the force without cutting.
(18) The dummy lead may be electrically insulated from the electrode of the integrated circuit component.
According to this, the connection between the dummy lead and the integrated circuit component does not need to consider various conditions for conduction, and a mode that only improves the bonding strength can be applied.
(19) A majority of the connection leads may be formed on a portion of the base member facing the second portion of the integrated circuit component.
According to this, the majority of the connection leads can be provided at the portion facing the integrated circuit component, so that the external dimensions of the integrated circuit device can be made smaller than before.
(20) a first group of the connection leads is formed on a portion of the base member facing the second portion of the integrated circuit component;
A second group of the connection leads is formed avoiding a portion of the base member facing the second portion of the integrated circuit component;
The first group of connection leads are connected to an output electrode of the electrodes of the integrated circuit component,
The connection leads of the second group may be connected to an input-side electrode of the electrodes of the integrated circuit component.
According to this, the present invention can be applied to an integrated circuit component used for driving a liquid crystal display device, that is, an integrated circuit component having an extremely large number of output terminals as compared with input terminals.
(21) The integrated circuit device according to the present invention includes a base member having a rectangular opening having insulation properties, and a pair of opposing peripheral edges of the peripheral edge forming the opening, the interior of which is formed in the opening. A TAB tape carrier having a plurality of connection leads extending, and at least one dummy lead extending into the opening from a pair of opposite peripheral edges different from the pair of peripheral edges provided with the connection leads,
An integrated circuit component located in the opening, electrically connected to the connection lead, and connected to the dummy lead;
Having.
According to the present invention, after the integrated circuit component is mounted, the heated base member tends to shrink. However, since the dummy lead extending in the shrinking direction supports the base member, the connection lead is disconnected due to the shrinkage of the base member. Can be prevented.
(22) An electronic device according to the present invention includes the above integrated circuit device.
(23) In the method of manufacturing an integrated circuit device according to the present invention, a base member having an insulating property, an opening formed therein, and having a plurality of connection leads extending in the opening on one surface is provided.
An integrated circuit component, with a portion positioned inside the opening, and a remaining portion arranged with a gap facing the other surface of the base member,
Electrically connecting the connection lead and the integrated circuit component through the opening;
A sealing material is fed into the integrated circuit component through the opening while heating the integrated circuit component.
According to this, since the integrated circuit component is heated when the sealing material is injected, the viscosity of the sealing material is reduced, so that the integrated circuit component can also enter between the sealing material base member and the integrated circuit component. . Then, after the injection of the sealing material is completed, if the heating of the integrated circuit component is stopped, the viscosity of the sealing material increases, so that the sealing material can remain between the base member and the integrated circuit component.

FIG. 1 partially shows an embodiment of a tape carrier to which the present invention is applied. The tape carrier 1 serving as a base member is made of a continuous plastic film tape having flexibility and insulating properties, such as polyimide resin, polyester, and glass epoxy resin. A device hole 3 serving as an opening corresponding to the integrated circuit component 2 to be mounted is formed substantially at the center. On one surface 4 of the tape carrier 1, a plurality of metal connection leads 5 such as a copper foil are formed. In order to connect the connection leads 5 to the bumps 8 provided on the corresponding electrodes of the integrated circuit component 2, the inner leads 6 that are a part of each connection lead 5 project inward beyond the periphery of the device hole 3. It is provided. The integrated circuit component 2 of the present embodiment is an integrated circuit component for driving an LCD cell of a liquid crystal display device, and has an elongated rectangular shape in order to reduce a frame portion of the liquid crystal display device during mounting.

(4) The device hole 3 is formed to be elongated in a direction orthogonal to the longitudinal direction of the tape carrier 1 and is formed in a rectangle smaller than the surface area of the integrated circuit component 2. One side constituting the long side of the outer shape of the integrated circuit component 2 is located inside the device hole 3. It is preferable that the tape carrier 1 and the integrated circuit component 2 overlap with a certain width on the long side of the integrated circuit component 2 opposite to the long side described above.

As described above, since the integrated circuit component 2 is an LCD cell driving integrated circuit component, the inner lead 6 extends from each of the peripheral edges of the device hole 3 at the long sides orthogonal to the longitudinal direction of the tape carrier 1. Extending to the vicinity of the center of the device hole 3 where the bumps 8 of the integrated circuit component 2 are to be arranged.

According to the present embodiment, the outer shape of the device hole 3 is smaller than the outer shape of the integrated circuit component 2, and one long side of the integrated circuit component 2 is located in the device hole 3. Therefore, the gap between the device hole and the integrated circuit component of the conventional structure, that is, the dead space, can be eliminated, and the connection lead 5 can be provided in the overlapping area between the tape carrier 1 and the integrated circuit component 2. The use area of the tape carrier 1 is reduced. In particular, in the present embodiment, when used as an integrated circuit component for driving an LCD cell of a liquid crystal display device, the difference between the number of input terminals and the number of output terminals (for example, 30 input terminals and 300 output terminals). Is very large, a wiring area for connecting leads can be provided in the overlapping area in order to match the terminal spacing between the integrated circuit component 2 and the liquid crystal display device. In addition, since the shape of the device hole 3 is greatly reduced in the longitudinal direction of the tape carrier 1, the number of integrated circuit components 2 that can be mounted on a tape reel with a fixed length can be significantly increased. As a result, the number of times of exchanging the tape reel in the production of the TAB package is reduced, the workability and productivity are improved, and the production cost can be reduced. Further, the dimensions of the integrated circuit device manufactured from the tape carrier 1 can be significantly reduced, and the mounting area can be reduced.

The edge of the device hole 3 along the longitudinal direction of the tape carrier 1, that is, the position of the short side of the device hole 3 is located outside the integrated circuit component 2 or within the area of the integrated circuit component 2. It does not matter. When the short side of the device hole 3 is arranged outside the integrated circuit component 2, the formation area of the inner leads 6 is widened, so that the number of the inner leads 6 can be increased or the pitch between the inner leads 6 can be reduced. Can be spread widely. On the other hand, if the short side of the device hole 3 is arranged in the area of the integrated circuit component 2, the area where the connection lead 5 can be routed can be made wider.

FIG. 2 shows a TAB package type integrated circuit device using the tape carrier of FIG. In this integrated circuit device 7, the integrated circuit component 2 is a long and narrow rectangular LCD cell driving integrated circuit component, and a plurality of bumps 8 are arranged in a straight line along the longitudinal direction. The device hole 3 is formed substantially at the center of the tape carrier 1, and the bump 8 is located at the center. One side of the device hole 3 is positioned inside the periphery of the integrated circuit component 2.

As in the conventional packaging, the tape carrier 1 of FIG. 1 is aligned with the integrated circuit component 2 as described above, and each inner lead 6 is thermocompression-bonded to the corresponding electrode bump 8 using a bonding tool. After a protective resin 9 is applied to a predetermined portion including the integrated circuit component 2 and the inner lead 6, an electrical characteristic test is performed, and finally, a punching process is performed along a cutting position 10 shown in FIG. .

The protective resin 9 is formed using, for example, an epoxy-based thermosetting resin so as to slightly protrude from the periphery of the integrated circuit component 2 to the outside, and the length L of the protruding portion is determined by the integrated circuit component 2 and the tape carrier 1. It is convenient to provide the gap l or less (0 <L ≦ l). By providing this protruding portion, it can be easily confirmed from the outside that the protective resin 9 is completely applied to the necessary portion.

According to the present embodiment, as described with reference to FIG. 1, the shape of the device hole 3 is smaller than the outer shape of the integrated circuit component 2, and one side of the device hole 3 is arranged inside the periphery of the integrated circuit component 2. I have. As a result, the portion of the protective resin formed outside the integrated circuit component in the conventional structure is substantially eliminated, and the use area of the tape carrier 1 is reduced. The size is greatly reduced, and the mounting area can be reduced. In particular, in the present embodiment, since the inner leads 6 are led out in a direction perpendicular to the longitudinal direction of the integrated circuit component 2, the width of the integrated circuit device 7 can be made very small as compared with the related art.

FIG. 3 shows an integrated circuit device 11 according to a modification of the embodiment of FIG. In the integrated circuit device 7 of FIG. 2, the integrated circuit component 2 is connected face-down to the tape carrier 1, whereas in this modified example, the integrated circuit component 2 is formed with connection leads 5 in the tape carrier 1. And face-up. Also in this case, similarly, the outer dimensions of the TAB package 11 can be reduced.

(4) The integrated circuit device 7 of the present invention is mounted on an LCD cell of a liquid crystal display device as shown in FIG. In the integrated circuit device 7, the output-side outer lead 12 is connected to the panel electrode 15 made of an ITO film or the like of the LCD cell 14 using, for example, an anisotropic conductive adhesive 13 or a photo-curable insulating resin, as in the related art. ing. On the other hand, the outer leads 16 on the input side are connected to corresponding electrode terminals 18 of a printed circuit board 17 made of an ordinary glass epoxy board constituting a liquid crystal drive circuit by soldering or the like. According to the present embodiment, the width of the frame portion can be significantly reduced by connecting the integrated circuit device 7 having a reduced size, particularly, a reduced width.

Further, according to the present embodiment, the bumps 8 are arranged in a plurality of rows according to the shape and dimensions of the integrated circuit component 2 mounted on the tape carrier 1 and the number of electrodes thereof, or conditions for connection with an external device / circuit board. Can be arranged.

In the integrated circuit device 19 according to the second embodiment of the present invention shown in FIG. 5A and FIG. 5B, the electrodes of the integrated circuit component 20 are arranged in two rows by half along the longitudinal direction, and The bumps 21a and 21b are formed thereon. In the tape carrier 22, a device hole 23 having a shape smaller than the outer shape of the integrated circuit component 20 is formed substantially in the center, and inner leads 24a and 24b are opposed to each other from the respective peripheral edges located in the longitudinal direction of the device hole 23 and facing each other. And protrudes toward the bumps 21a and 21b. It is preferable to make the interval between the rows of the bumps 21a and 21b as small as possible to reduce the size of the device hole 23 in order to further reduce the size of the integrated circuit device 19. In the embodiment shown in FIG. 5, only one of the four sides constituting the periphery of the integrated circuit component 20 is located inside the device hole 23.

(4) The number of electrodes on which the bumps 21a are formed and the number of electrodes on which the bumps 21b are formed do not necessarily need to be the same. For example, in the embodiment shown in FIG. 6, the integrated circuit component 25 is a driving integrated circuit component of a liquid crystal display device, and the input electrodes and the bumps 26a are arranged in one of the two rows and the other row. The output electrode and its bump 26b are arranged. While the output-side bumps 26b are all provided at the same constant pitch, the input-side bumps 26a are divided into three blocks 26a-1, 26a-2, and 26a-3. The blocks are separated from each other with a considerably larger interval than the electrode pitch, and the wiring is drawn by changing the electrode pitch for each block. Therefore, the length of the wiring can be considerably shortened at the interval 1a of the pitch conversion as compared with the case of not dividing into a plurality of blocks.

In particular, the number of input electrodes of the driving integrated circuit component of the liquid crystal display device is considerably smaller than the number of output electrodes. In this case, according to the present embodiment, a sufficient separation distance can be secured between the blocks without forcibly narrowing the electrode pitch, and the distance of the input wiring can be easily reduced.

Alternatively, the rows of input-side electrodes and bumps are arranged at the same constant pitch, and the rows of output-side electrodes and bumps are divided into a plurality of blocks that are spaced apart from each other with a considerably larger interval than the electrode pitch. May be. In addition, each row of the electrodes and bumps on the input side and the output side can be similarly divided into a considerable number of blocks to reduce the wiring distance on both the input side and the output side.

Alternatively, a part of the output electrodes may be arranged in the input side row so that the number of electrodes in both rows is substantially equal, and the electrode pitch in one row may not be too narrow. In this case, when the input side columns are divided into blocks as described above, and the output electrodes are arranged in blocks outside the input electrodes, the tape carrier includes the input side inner leads from the input side inner leads along the periphery of the device hole. The wiring can be routed to the outer lead.

FIG. 7 is an enlarged view of a main part of a third embodiment of the tape carrier to which the present invention is applied. As shown in the figure, in the tape carrier 28 according to the third embodiment, a rectangular device hole 30 which is long in a direction orthogonal to the longitudinal direction of the tape carrier 28 is provided. Inner leads 32 extend from the peripheral edges 30L, 30R orthogonal to the longitudinal direction of the device hole 30 inside the device hole 30. In the device hole 30, one dummy lead 34 extends from each of the peripheral edges 30 </ b> U, 30 </ b> D orthogonal to the peripheral edges 30 </ b> L, 30 </ b> R in the direction orthogonal to the inner leads 32, extending between the tips of the inner leads 32 facing each other. Is established.

{Circle around (2)} On such a tape carrier 28, an integrated circuit component 36 in which electrodes are arranged in two rows along the longitudinal direction and electrodes for connecting dummy leads 34 are provided at both ends in the longitudinal direction is mounted.

Here, a procedure for mounting the integrated circuit component 36 on the tape carrier 28 provided with the inner leads 32 and the dummy leads 34 will be described. First, the integrated circuit component 36 grasped by a vacuum suction jig (not shown) is transferred to a position where the electrodes come into contact with the inner leads 32 and the dummy leads 34. Thereafter, the bonding tool (heating jig) approaches from the side opposite to the vacuum suction jig, that is, the surface on which the electrodes of the integrated circuit component 36 are provided, and heat-welds the inner leads 32 and the dummy leads 34 to the electrodes. . Here, since the coefficient of thermal expansion of the tape carrier 28 is larger than the coefficient of thermal expansion of the integrated circuit component 36, the tape carrier 28 is expanded, and the pitch between the inner leads 32 is wider than the pitch between the electrodes. Is connected. After the connection, the bonding tool (heating jig) moves away from the integrated circuit component 36 and the tape carrier 28, so that the temperature of the connecting portion decreases, and the tape carrier 28 starts to shrink in the electrode arrangement direction. However, in the arrangement direction of the electrodes, a pair of dummy leads 34 are provided at the top and bottom in the figure, so that the force of contracting the tape carrier 28 is received. For this reason, the reduction amount of the tape carrier 28 is suppressed, and disconnection of the inner lead 32 due to the reduction of the tape carrier 28 can be prevented.

FIG. 8 shows an application example of the third embodiment of the tape carrier. 7, a plurality (two) of dummy leads 34a having a width smaller than that of the dummy lead 34 shown in FIG. 7 is extended from each of the peripheral edges 30U and 30D, and the other configuration is the same as that of FIG. As shown in FIG. 8, by providing a plurality of thin dummy leads 34 a, after the integrated circuit component 36 is mounted on the tape carrier 28, when a sealing material is applied around the integrated circuit component 36, the gap between the dummy leads 34 a is reduced. It becomes easier for air to escape from the gap. Therefore, it is possible to prevent bubbles from remaining on the back surface of the dummy lead 34a. Further, since the dummy lead 34a is narrow, excess heat dissipation is reduced when heating is performed by a bonding tool (heating jig), and the bonding property of the inner lead 32 around the dummy lead 34a can be improved. .

FIG. 9 is an enlarged view of a main part in which an inner lead and a dummy lead are connected to an integrated circuit component arranged inside a device hole, and FIG. 10 shows a modification thereof.
As shown in these figures, even when the integrated circuit component 36 is located inside the device hole 30, the dummy lead 34 receives the reduction of the tape carrier 28 in the same manner as in the third embodiment. , 30R can be prevented from being disconnected.

FIG. 11 is an enlarged view of a main part of the fourth embodiment of the tape carrier. A tape carrier 40 shown in the same drawing has a projection 38 formed on one side of a dummy lead 34 in the third embodiment of the tape carrier shown in FIG. FIG. 12 shows an embodiment of an integrated circuit device in which the integrated circuit component 36 is mounted on the tape carrier 40. As shown in these figures, the projections 38 are provided on the forming portions 42 of the dummy leads 34 which are bent corresponding to the steps between the surface of the tape carrier 40 where the dummy leads 34 are formed and the surface of the integrated circuit component 36 where the electrodes are formed. Has been. Further, the protrusion 38 in the forming portion 42 protrudes in the direction toward the gap 44 formed between the peripheral edge 30L of the device hole 30 and the integrated circuit component 36 (the input side of the integrated circuit component 36). By forming the projections 38 on the forming portions 42 of the dummy leads 34 in this manner, the sealing material 46 is prevented from moving to the back side of the tape carrier 40 through the gaps 44, and Of the sealing material 46 can be prevented from fluctuating (thinning). The sealing material 46 is applied around the integrated circuit component 36 after connecting the integrated circuit component 36 to the inner lead 32 and the dummy lead 34.

More specifically, at the portion where the tape carrier 40 and the integrated circuit component 36 face each other (the output side of the integrated circuit component 36), since the interval between them is narrow, the sealing material 46 It does not move a lot to the back side. On the other hand, a large amount of sealing material can move from the gap 44 in the device hole 30 to the back side of the tape carrier 40 along the path of the arrow 50 due to the opening area. However, since the projection 38 corresponding to the width of the dummy lead 34 is formed in the forming portion 42 of the dummy lead 34, surface tension is generated in the sealing material 46, and the sealing material 46 is Can be reduced. Therefore, the applied thickness of the sealing material 46 can be kept constant. The dummy leads 34 shown in FIGS. 7 to 12 are not electrically connected to the integrated circuit components 36. Therefore, the connection between the dummy lead 34 and the integrated circuit component 36 does not need to take into account various conditions for conduction, and a mode that only improves the bonding strength can be applied.

FIG. 13 is an explanatory diagram showing a procedure for mounting an integrated circuit component on a tape carrier. After the connection between the inner leads 56 and the electrodes on which the bumps 58 are formed as shown in the drawing, a sealing material 46 is applied to prevent the inner leads 56 and the electrodes from being exposed. Here, in order to improve the degree of embedding of the sealing material 46 into the gap 62 between the tape carrier 54 and the integrated circuit component 52, a vacuum suction jig 64 for holding and transferring the integrated circuit component 52 to the mounting position is provided with a heating means. May be provided. That is, if the heater 66 is provided inside the vacuum suction jig 64, the heater 66 heats the integrated circuit component 52 while the vacuum suction jig 64 is holding the integrated circuit component 52. The sealing material 46 discharged from the sealing material supply pipe 68 by this heating action has a reduced viscosity, and is reliably filled in the gap 62. After the step of applying the sealing material 46 is completed, the vacuum suction jig 64 may be separated from the integrated circuit component 52. By removing the vacuum suction jig 64 from the integrated circuit component 52, the viscosity of the sealing material 46 that has cooled and entered the gap 62 also increases, and the sealing material 46 is removed from the tape carrier 54 and the integrated circuit component 52. Between the two. Further, as the above-described sealing material 46, a resin which is deformed by heat, such as a thermoplastic resin or a thermosetting resin, is preferably used.

Although the present invention has been described with reference to the preferred embodiment, the present invention is not limited to the above embodiment, but can be implemented with various modifications and changes.

FIG. 2 is a plan view partially showing the tape carrier according to the embodiment of the present invention. FIG. 2 is a sectional view showing an embodiment of a TAB package type integrated circuit device according to the present invention using the tape carrier of FIG. 1. It is sectional drawing which shows the modification of embodiment of FIG. FIG. 3 is a cross-sectional view illustrating a part of an LCD cell on which the TAB package according to the embodiment of FIG. 2 is mounted. FIG. 5A is a sectional view showing a second embodiment of the TAB package type integrated circuit device according to the present invention, and FIG. 5B is a plan view thereof. It is a top view showing a modification of an integrated circuit component used for a 2nd embodiment of Drawing 5 (A) and Drawing 5 (B). FIG. 11 is an enlarged view of a main part of a third embodiment of a tape carrier to which the present invention has been applied. 13 shows a modification of the third embodiment of the tape carrier. FIG. 4 is an enlarged view of a main part in which an inner lead and a dummy lead are connected to an integrated circuit component arranged inside a device hole. 10 shows a modification of the embodiment shown in FIG. 9. FIG. 14 is an enlarged view of a main part of a fourth embodiment of the tape carrier. 1 shows an embodiment of an integrated circuit device in which integrated circuit components are mounted on a tape carrier. FIGS. 13 (A) and 13 (B) are explanatory diagrams showing a procedure for mounting an integrated circuit component on a tape carrier. It is sectional drawing which shows the conventional TAB package type integrated circuit device. FIG. 15 is a plan view showing a part of a conventional LCD cell on which the TAB package of FIG. 14 is mounted. FIG. 4 shows a state diagram of a conventional integrated circuit component and a tape carrier.

Explanation of reference numerals

1 tape carrier, 2 integrated circuit component, 3 device hole, 4 sides,
5 connection lead, 6 inner lead, 6-1 to 6-3 block, 7 TAB package, 8 bump, 8a-1 to 8a-3 block, 8b-1 to 8b-3 block, 8c-1 to 8c-3 block , 9 protective resin, 10 cutting line, 11 TAB package, 12 outer lead, 13 anisotropic conductive adhesive, 14 LCD cell, 15 panel electrode, 16 outer lead, 17 printed circuit board, 18 terminal, 19 TAB package, 20 Integrated circuit components, 21a, 21b bump, 22 tape carrier, 23 device hole, 24a, 24b inner lead, 25 integrated circuit component, 26a, 26b bump, 28 tape carrier, 30 device hole, 30R, 30L periphery, 30U, 30D periphery , 32 inner leads, 34 dummy Card, 36 integrated circuit component, 38 protrusion, 40 tape carrier 42 forming part, 44 opening, 46 sealing material, 48 arrow, 50 arrow, 52 integrated circuit component, 54 tape carrier, 56 inner lead, 58 bump, 62 Gap, 64 vacuum suction jig, 66 heater, 68 sealing material supply pipe, 131 tape carrier, 132 integrated circuit component, 133 device hole, 134 inner lead, 135 bump, 136 protective resin, 137 driving integrated circuit component, 138 TAB package, 139 LCD cell 140 Printed circuit board, 141 outer periphery, 142 integrated circuit, 143 tape carrier, 144 inner lead

Claims (23)

A base member having an insulating and elongated shape, and having an opening for disposing the integrated circuit component,
A plurality of connection leads extending into the opening from a pair of opposing edges of the edge forming the opening of the base member;
At least one dummy lead extending into the opening from a pair of opposite peripheral edges different from the pair of peripheral edges of the base member,
A TAB tape carrier comprising: The TAB tape carrier according to claim 1,
A TAB tape carrier in which a plurality of the dummy leads extend from each of the pair of peripheral edges. The TAB tape carrier according to claim 2,
A TAB tape carrier, wherein the width of the dummy lead is smaller than the width of the connection lead. The TAB tape carrier according to any one of claims 1 to 3,
A TAB tape carrier, wherein the dummy leads have at least one protrusion formed in a direction substantially perpendicular to the extending direction. The TAB tape carrier according to claim 4,
The dummy lead is formed on one surface of the base member, and has a bent portion that bends in a direction facing the other surface of the base member in the opening,
The TAB tape carrier, wherein the protrusion is formed at the bent portion of the dummy lead. The TAB tape carrier according to any one of claims 1, 2, 4, and 5,
A TAB tape carrier, wherein the width of the dummy lead is wider than the width of the connection lead. The TAB tape carrier according to any one of claims 1 to 6,
The connection lead extends along a longitudinal direction of the base member,
The TAB tape carrier, wherein the dummy leads extend in a direction substantially orthogonal to a direction in which the connection leads extend. A base member having insulation and an opening formed therein,
A plurality of connection leads extending from the base member into the opening;
An integrated circuit component connected to the connection lead in the opening;
Has,
A first portion, wherein the integrated circuit component is located in a region of the opening and is exposed through the opening and provided with a plurality of electrodes electrically connected to the connection lead; A second portion facing the other surface of
The integrated circuit device, wherein the connection lead is provided on the base member at a portion where the second portion of the integrated circuit component faces. The integrated circuit device according to claim 8,
An integrated circuit device in which a pitch of the connection lead is changed at a portion of the base member facing the second portion of the integrated circuit component. 10. The integrated circuit device according to claim 8, wherein
An integrated circuit device wherein an outer shape of the opening is smaller than an outer shape of the integrated circuit component. The integrated circuit device according to any one of claims 8 to 10,
The integrated circuit component has a rectangular shape, the first portion includes an end forming one long side,
The integrated circuit device, wherein the electrodes of the integrated circuit component are arranged in a line along the long side. The integrated circuit device according to any one of claims 8 to 10,
The integrated circuit component has a rectangular shape, the first portion includes an end forming one long side,
The integrated circuit device, wherein the electrodes of the integrated circuit component are arranged in two rows along the long side. The integrated circuit device according to any one of claims 8 to 12,
A sealing material for sealing at least a connection portion between the electrode and the connection lead of the integrated circuit component;
At least one dummy lead extending into the opening from a pair of opposed edges of the periphery forming the opening,
Has,
The integrated circuit device, wherein the connection lead extends into the opening from a pair of opposite peripheral edges different from the pair of peripheral edges on which the dummy lead is provided. The integrated circuit device according to claim 13,
An integrated circuit device wherein the width of each dummy lead is smaller than the width of the connection lead. The integrated circuit device according to claim 13 or claim 14,
The integrated circuit device, wherein the dummy lead has at least one protrusion in a direction substantially orthogonal to an extending direction. The integrated circuit device according to claim 15,
The dummy lead has a bent portion bent in the opening,
The integrated circuit device wherein the protrusion is formed at the bent portion of the dummy lead. The integrated circuit device according to any one of claims 13, 15, and 16,
An integrated circuit device wherein the width of the dummy lead is wider than the width of the connection lead. The integrated circuit device according to any one of claims 13 to 17,
The integrated circuit device, wherein the dummy lead is electrically insulated from the electrode of the integrated circuit component. The integrated circuit device according to any one of claims 8 to 18,
An integrated circuit device in which a majority of the connection leads are formed on a portion of the base member facing the second portion of the integrated circuit component. 20. The integrated circuit device according to claim 8, wherein
A first group of the connection leads is formed on a portion of the base member facing the second portion of the integrated circuit component;
A second group of the connection leads is formed avoiding a portion of the base member facing the second portion of the integrated circuit component;
The first group of connection leads are connected to an output electrode of the electrodes of the integrated circuit component,
The integrated circuit device, wherein the second group of connection leads is connected to an input electrode of the electrodes of the integrated circuit component. A base member having a rectangular opening having an insulating property, a plurality of connection leads extending into the opening from a pair of opposed peripheral edges of the periphery forming the opening, and the connection lead are provided. A TAB tape carrier having at least one dummy lead extending into the opening from a pair of opposite peripheral edges different from the pair of peripheral edges,
An integrated circuit component located in the opening, electrically connected to the connection lead, and connected to the dummy lead;
An integrated circuit device having: An electronic apparatus comprising the integrated circuit device according to any one of claims 8 to 21. An opening is formed while having an insulating property, and a base member having a plurality of connection leads extending in the opening on one surface is prepared,
An integrated circuit component, with a portion positioned inside the opening, and a remaining portion arranged with a gap facing the other surface of the base member,
Electrically connecting the connection lead and the integrated circuit component through the opening;
A method of manufacturing an integrated circuit device, wherein a sealing material is fed into the integrated circuit component through the opening while heating the integrated circuit component.

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