JPH08340058A - Structure and method for connecting hard wiring board to flexible wiring board - Google Patents

Abstract

PURPOSE: To prevent the disconnecting of wiring on a flexible wiring board. CONSTITUTION: The liquid crystal display panel 32 of a liquid crystal display device 31 is electrically connected to a hard wiring board 33 through a flexible wiring board 33. In the area of the flexible substrate 46 where a terminal 49 is formed, an opening 57 in which the part of the terminal 49 from the central part of the terminal 49 in the length direction to the end section of the terminal on one end section 46b side of the substrate 46 is exposed is formed. Terminals 42 and 49 which are respectively formed on one surfaces 41a and 46a of the substrates 41 and 46 of the wiring boards 33 and 34 are electrically connected to each other through an adhesive layer 62. The terminals 42 and 49 are joined to each other by melting solder which is previously applied to either one of the terminals 42 and 49 or supplied to the terminal 49 from the opening 57 by heating the terminal 49 from the substrate side 46 after the terminal 49 is set above the terminal 42. The connecting section between the terminal 49 of the flexible substrate 46 and wiring 47 is reinforced, because the section is covered with the board 46.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible wiring board including an integrated circuit for driving a liquid crystal in a liquid crystal display device and an electric field applied to a liquid crystal layer of a liquid crystal display panel through the flexible wiring board. The present invention relates to a connection structure and a connection method for a connection portion with a hard wiring board that is connected to a board member including wiring.

[0002]

2. Description of the Related Art For example, in a liquid crystal display device, in order to electrically connect the wiring of a substrate member of a liquid crystal display panel and the wiring of a hard wiring board on which circuits and the like are mounted, an integrated circuit for driving a liquid crystal is mounted. Tape carrier package (Tape
Carrier Package; hereinafter referred to as "TCP") is used as a flexible printed wiring board. The terminals for connecting the substrate member of the liquid crystal display panel and the terminals for connecting the hard wiring board are respectively connected to terminals connected to both ends of the wiring of the TCP, and the wiring of the liquid crystal display panel and the wiring of the hard wiring board are connected. And are electrically connected.

FIG. 12 is a partial sectional view of a liquid crystal display device, which is a first conventional example in which a liquid crystal display panel and a hard wiring substrate are connected by TCP. FIG. 13 is a partial plan view of the liquid crystal display device of FIG. FIG. 14 is a partial cross-sectional view showing an enlarged connection portion between the hard wiring board 2 and the TCP 3 in the liquid crystal display device of FIG.

Wiring of liquid crystal display panel 1 and hard wiring board 2
The wiring is connected via TCP3. The liquid crystal display panel 1 is configured by interposing a liquid crystal layer between a pair of substrate members 1a and 1b, at least one of which is translucent. For example, when the liquid crystal display panel 1 is of a simple matrix drive type, the substrate members 1a, 1b have a plurality of strip-shaped display electrodes formed in parallel with each other, and each substrate member 1a, 1b
The substrate member is arranged so that the display electrodes of b are orthogonal to each other. The display electrodes are formed on the insulating substrate, and the terminals 4 for connection are formed at the ends of each electrode.

The hard wiring board 2 is constructed by arranging a plurality of strip-shaped wirings (not shown) on a hard board 5 having an insulating property, and forming terminals 6 for connection on each of the wirings.

The TCP 3 is constructed by forming a plurality of strip-shaped wirings 8 and 9 on one surface of an insulating flexible substrate 7 and mounting a liquid crystal drive circuit 11 on the other surface thereof as described later. . The wiring 8 is arranged from one end of the flexible substrate 7 to the central portion, and the wiring 9
Is formed from the central portion of the flexible substrate 7 to the other end portion. In the central part of the flexible substrate 7,
An opening 10 is formed having a size such that the ends of the wirings 8 and 9 on the central portion side of the flexible substrate 7 are exposed. The liquid crystal drive circuit 11 is connected to the wirings 8 and 9 exposed by the opening 10 from the other surface side of the flexible substrate 7. A region of the flexible substrate 7 that covers the opening 10, the liquid crystal drive circuit 11, and the portions of the wirings 8 and 9 exposed from the opening 10 are covered with the protective resin layer 12.

A plurality of connecting terminals 13 are formed on one end of one surface of the flexible substrate 7, and each of the wiring 8
Is connected to the end of. A plurality of connecting terminals 15 are formed on the other end of the one surface of the flexible substrate 9,
Each is connected to the end of the wiring 9. The terminal 13 is connected to the terminal 4 of the liquid crystal display panel 1. The wiring 8 is formed so that its center interval is the same as that of the display electrode connected to the terminal 4 of the liquid crystal display panel 1. The terminal 15 is connected to the terminal 6 of the hard wiring board 2. The wiring 9 is formed with the same width and the same interval as the wiring connected to the terminal 6 of the hard wiring board 2.

An opening 14 is formed in the area of the flexible substrate 7 where the terminal 15 is arranged. As a result, the terminal 15 can be seen from both sides of the flexible substrate 7.

A protective film 21 shown in FIG. 14 is formed on the surfaces of the wirings 8 and 9 to cover the wirings 8 and 9.

The terminal 4 of the liquid crystal display panel 1 is connected to the terminal 13 of the TCP 3 via the anisotropic conductive film 17. The terminal 6 of the hard wiring board 2 is connected to the TC via the solder 16.
It is connected to the terminal 15 of P3. As a result, the liquid crystal display panel 1 and the hard wiring board 2 are connected in order of the terminal 4, the terminal 13, the wiring 8, the liquid crystal drive circuit 11, the wiring 9, the terminal 15, and the terminal 6, and are electrically connected.

The terminals 6 of the hard wiring board 2 and the terminals 15 of the TCP 3 are connected via solder 16. For example, solder 1 is applied to either or both of terminals 6 and 15.
After applying 6, the terminals 6 and 15 are overlapped, and the terminals 15 are heated from the opening 14 of the TCP 3 using the heating tool 19 shown in FIG. This melts the solder and bonds the terminals 6 and 15 together.
And the terminal 15 are electrically connected. At this time, the heating tool 19 directly contacts the terminal 15 through the opening 14. As a result, the terminal 15 can be directly heated, so that the heat from the heating tool 19 can be efficiently transferred to the solder.

The connected terminals 6 and 15 are TCP
It is possible to visually confirm the connection state from the TCP 3 side through the opening 14 of No. 3. At this time, if the solder does not completely permeate from one end to the other, the excess solder will be
It jumps out from the gap of 15. This protrusion is for terminal 1
It is more likely that the TCP 14 has the opening 14 formed on it. Therefore, if the opening 14 is formed in the TCP 3, the connection state of the terminals 6 and 15 can be surely visually confirmed. In the conventional technology, heat is efficiently transferred to the entire terminal 15 so that the terminals 6 and 15 can be connected securely.
Further, the opening portion 14 of the TCP 3 is formed in the entire terminal 15 so that the connection state of the terminals 6 and 15 can be surely confirmed.

The hard wiring board 2 connected to the liquid crystal display panel 1 through the TCP 3 in this manner is folded on the TCP 3 in a "Z" shape, for example, on the side opposite to the display surface of the liquid crystal display panel 1. It is arranged around the display surface and is housed in a predetermined case.

The wiring 9 and the terminal 15 of the TCP 3 are integrally formed of a copper foil material, for example. Wiring 9 and terminal 1
5 is very thin and thin. Therefore, the strength of the wiring 9 and the terminal 15 is weak and they are easily broken. FIG.
In the connection structure shown in FIGS. 2 to 14, the connection terminal 15 in the opening 14 is in a state of being unsupported by the flexible substrate 7 and not covered by the protective film 21. In addition, in the vicinity of the connection portion 20 between the wiring 9 and the terminal 15, which is near the boundary of the opening 14, the amount of the solder 16 connecting the terminal 15 and the terminal 6 is relatively small, and the terminal 15 is almost peeled off. It will be put out.

Although the terminal 15 is adhered and fixed to the terminal 6 of the hard wiring board 2 with the solder 16, the TC
Portions other than the terminal 15 of P3 are not fixed. As a result, when TCP3 is vibrated, for example, when folding TCP3 or moving the liquid crystal display device,
TCP3 floats up from the hard wiring board 2 and TCP3
Is displaced, or the flexible substrate 7 is twisted. At this time, a large force is applied to the connecting portion 20 due to the displacement of the TCP 3 and the twisting of the flexible substrate 7.

As described above, since the connecting portion 20 is in a bare state and the strength of the terminal 15 is weak, in such a case, the connecting portion 20 between the wiring 9 and the terminal 15 may be broken. . When the connection portion 20 is broken, the electric signal to be transmitted between the liquid crystal display panel 1 and the hard wiring board 2 is not transmitted from the liquid crystal display panel 1 to the hard wiring board 2. On the contrary, it becomes impossible to send an electric signal from the hard wiring board 2 to the liquid crystal display panel 1. Therefore, a display defect occurs in the liquid crystal display device. In particular, stress is likely to concentrate on the connecting portion 20 when the TCP 3 is folded after the liquid crystal display device is completed. In this way, when a defect such as a disconnection occurs after the liquid crystal display device is completed, the device itself becomes a defective product. Further, unlike the case where the terminals 6 and 15 are poorly soldered, the disconnection of the connection portion 20 is difficult to restore once broken, which causes the yield of the device to be deteriorated.

FIGS. 15 and 16 show a second conventional connection structure for preventing such disconnection of terminals and wirings. FIG. 15 is a plan view of a connecting portion between the TCP 3 and the hard wiring board 2 which is the second conventional example. 16 is a cross-sectional view taken along the line AA of the connection portion of FIG. In this conventional technique, the connection portion 2 between the wiring 9 and the terminal 15 which is easily broken.
The TCP 3 in the region near 0 and the hard wiring board 2 are bonded with the adhesive 22, and the region is covered with the adhesive 22 for protection.

As a third conventional connection structure for preventing the disconnection, there is a connection structure with the TCP 3 and the hard wiring board 2 having the structure shown in FIGS. 17 and 18. FIG. 17 is a plan view of a connection portion between the hard wiring board 2 and the TCP 3 which is the third conventional example. Figure 18
It is sectional drawing of the connection part of FIG. In the conventional technique, the T near the center of the flexible substrate 7 with respect to the opening 14.
On the surface of the CP3, which is the surface on the side of the hard wiring board 2, an adhesive fixing tape 24 having adhesiveness is adhered on both surfaces, and TC
The P3 and the hard substrate 5 are bonded and fixed. As a result, the TCP 3 in the vicinity of the connecting portion 20 is firmly fixed, so that even if a force that distorts or lifts the TCP 3 is applied, the TCP 3 is not displaced and the flexible substrate 7 is not twisted. It is possible to prevent disconnection of terminals and wiring.

[0019]

As mentioned above, the TC
It is near the boundary of the opening 14 of P3, and the wiring 9 and the terminal 15
In the connection portion 20 with the terminal 15, the terminal 15 is arranged in a state of being exposed. In the TCP3 having such a structure, the connecting portion 20 is easily broken.

In the second and third conventional examples for preventing the breakage, the connecting portion 20 between the wiring 9 and the terminal 15 and the wiring 9 or the terminal 15 around the connecting portion 20 are adhered to each other with an adhesive agent 22 or bonded. It is reinforced by fixing with a fixing tape 24.

In order to carry out such reinforcement, the adhesive 2
2, adhesive fixing tape 24, etc. are required. Further, in the connecting step of connecting the terminal 15 and the terminal 6, as compared with the case where the connecting portion 20 is not reinforced, the step of applying the adhesive 22, the step of adhering the adhesive fixing tape 24, or the like, the connecting step of the terminal. It is necessary to add a new process to.
As a result, there are problems that the manufacturing cost of the product formed by connecting the hard wiring board 2 and the TCP 3 increases, and the time required for manufacturing increases.

An object of the present invention is to provide a connecting structure and a connecting method for a hard wiring board and a flexible wiring board, which can easily and surely connect the flexible wiring board and the hard wiring board.

[0023]

The present invention provides a hard substrate having an insulating property, a plurality of strip-shaped wirings formed in parallel with each other on one surface of the hard substrate, and a connection terminal formed on each wiring. A hard wiring board having, a flexible board having an insulating property, a plurality of strip-shaped wirings formed in parallel with each other on one surface of the flexible board, and a flexible wiring board having a connection terminal formed on each wiring, In a connection structure of a hard wiring board and a flexible wiring board in which connection terminals are connected to face each other, the flexible board is a region where at least the connection terminals are formed, and from one end of a wiring side of the region. , A region having a length shorter than the length of the connection terminal in the direction parallel to the longitudinal direction of the wiring and the other end on the opposite side of the wiring from the longitudinal direction of the wiring The connection portions have been formed an opening in a region excluding a region having a length shorter than the length of the parallel direction of the connection terminals, and connected to both connection terminals,
A connection structure between a hard wiring board and a flexible wiring board, which has a portion exposed from an opening and a portion covered with a flexible wiring board. Further, the present invention provides a hard wiring board having an insulating hard board, a plurality of strip-shaped wirings formed in parallel with each other on one surface of the hard board, and a hard wiring board having a connection terminal formed on each wiring. A flexible substrate having a plurality of strip-shaped wiring formed in parallel to each other on one surface of the flexible substrate,
And a flexible wiring board having a connection terminal formed on each wiring, respectively, in the connection structure of the hard wiring board and the flexible wiring board in which the connection terminals are connected to each other, the flexible substrate, at least the connection terminal A region to be formed, from one end on the wiring side of the region to a region having a length shorter than the length of the connection terminal in the direction parallel to the longitudinal direction of the wiring, or on the opposite side to the one end. From the other end of the wiring, an opening is formed in a region having a length shorter than the length of the connection terminal in the direction parallel to the longitudinal direction of the wiring, and the connection portion connecting both connection terminals has an opening. A connection structure between a hard wiring board and a flexible wiring board, characterized in that it has a portion exposed from and a portion covered with a flexible wiring board. Further, the present invention is characterized in that the opening of the flexible substrate is formed in a region between regions of the flexible substrate where connection terminals are formed. Further, the present invention provides a hard wiring substrate having a plurality of strip-shaped wirings formed in parallel with each other on one surface of an insulating hard substrate, and a connection terminal formed on each wiring, and an insulating flexible substrate. On one surface, a plurality of wirings are formed in parallel with each other, connection terminals are formed on the respective wirings, and the flexible substrate is an area in which at least the connection terminals are formed, A region having a length shorter than the length of the connecting terminal in the direction parallel to the longitudinal direction of the wiring from one end, and a connecting terminal in the direction parallel to the longitudinal direction of the wiring from the other end opposite to the wiring. A flexible wiring board having an opening in an area excluding an area having a length shorter than the length of the flexible wiring board, and the flexible wiring board having the opening on the connection terminal of the hard wiring board or the connection terminal of the flexible wiring board. Of the adhesive member having the property, one surface of each wiring board is opposed to each other, the wirings of each wiring board are parallel to each other, and the connection terminals of each wiring board are overlapped with each other. The hard wiring board and the flexible wiring board are characterized in that the wiring board and the flexible wiring board are superposed, and the connection terminal portion is heated from the flexible board side of the flexible wiring board to connect the connection terminals of each wiring board. The connection method. Further, the present invention provides a hard wiring substrate having a plurality of strip-shaped wirings formed in parallel with each other on one surface of an insulating hard substrate, and a connection terminal formed on each wiring, and an insulating flexible substrate. A plurality of wirings are formed in parallel with each other on one surface of the
Connection terminals are formed on the respective wirings, and the flexible substrate is an area in which at least the connection terminals are formed. An opening is formed in a region having a length shorter than the length or from the other end opposite to the one end in a region having a length shorter than the length of the connection terminal in the direction parallel to the longitudinal direction of the wiring. A flexible wiring board having is prepared, an adhesive member having conductivity is arranged on the connection terminal of the hard wiring board or on the connection terminal of the flexible wiring board, one surface of each wiring board faces each other, and each wiring The hard wiring board and the flexible wiring board are overlapped with each other so that the wirings of the boards are parallel to each other and the connection terminals of the wiring boards are overlapped with each other. A rigid wiring board and the flexible wiring board and the connection method characterized by heating the connection terminal portion from the flexible substrate side of the plate for connecting the connection terminals of the wiring board. Further, the present invention provides a hard wiring substrate having a plurality of strip-shaped wirings formed in parallel with each other on one surface of an insulating hard substrate, and a connection terminal formed on each wiring, and an insulating flexible substrate. A plurality of wirings are formed in parallel with each other on one surface of the
Connection terminals are formed on the respective wirings, and the flexible substrate is an area in which at least the connection terminals are formed, and from one end portion on the wiring side of the area, the connection terminals in the direction parallel to the longitudinal direction of the wirings are formed. An opening is formed in a region excluding a region having a length shorter than the length and the other end opposite to the wiring from a region having a length shorter than the length of the connection terminal in a direction parallel to the longitudinal direction of the wiring. Prepare a flexible wiring board having, one surface of each wiring board faces each other,
Make the wiring of each wiring board parallel to each other,
And, so that the connection terminals of each wiring board overlap with each other, the hard wiring board and the flexible wiring board are superposed, and a conductive adhesive member is arranged on the connection terminal exposed from the opening of the flexible wiring board. A method for connecting a hard wiring board and a flexible wiring board, characterized in that the connection terminal portion is heated from the flexible board side of the flexible wiring board to connect the connection terminals of each wiring board. Further, the present invention, on one surface of a hard substrate having an insulating property, a plurality of strip-shaped wirings are formed in parallel with each other,
A hard wiring board on which a connection terminal is formed on each wiring, and on one surface of a flexible board having insulation,
A plurality of wirings are formed in parallel with each other, connection terminals are formed on the respective wirings, and the flexible substrate is a region in which at least the connection terminals are formed, In the area having a length shorter than the length of the connecting terminal in the direction parallel to the length of the connecting terminal in the direction parallel to the longitudinal direction of the wiring, from the other end opposite to the one end. Also prepare a flexible wiring board having an opening in a region having a short length,
The hard wiring board and the flexible wiring board are overlapped so that one surface of each wiring board faces each other, the wirings of each wiring board are parallel to each other, and the connection terminals of each wiring board overlap each other. Together, the conductive adhesive member is disposed on the connection terminals exposed from the opening of the flexible wiring board, and the connection terminal portion is heated from the flexible board side of the flexible wiring board to connect the connection terminals of the respective wiring boards. A method for connecting a hard wiring board and a flexible wiring board, which is characterized in that the connection is made.

[0024]

According to the present invention, the hard wiring board to be connected is
A plurality of strip-shaped wirings are formed in parallel with each other on one surface of an insulating hard substrate, and a connection terminal is formed on each wiring. The flexible wiring board is one surface of the flexible board having an insulating property.
A plurality of strip-shaped wirings are formed in parallel with each other, and a connection terminal is formed on each wiring. For example,
The distance between the centers in the width direction of the connection terminals formed on both wiring boards is equal. The hard wiring board and the flexible wiring board are superposed with one surface of each of the boards facing each other,
The connection terminals of the hard substrate and the connection terminal of the flexible substrate, which are opposed to each other, are respectively connected and electrically connected.

An opening is formed in at least a region of the flexible substrate where the connection terminal is formed. The opening has a region having a length shorter than the length of the connection terminal in the direction parallel to the longitudinal direction of the wiring from one end on the wiring side of the region, and the length of the wiring from the other end on the side opposite to the wiring. It is formed by removing the flexible substrate in the region except the region having a length shorter than the length of the connection terminal in the direction parallel to the direction.

Further, according to the present invention, the opening formed in at least the region where the connection terminal is formed on the flexible substrate extends from one end of the region on the wiring side in a direction parallel to the longitudinal direction of the wiring. A flexible substrate of a region having a length shorter than the length of the connection terminal or a region having a length shorter than the length of the connection terminal in the direction parallel to the longitudinal direction of the wiring from the other end opposite to the wiring is formed. It is formed by removing.

Thus, the connection portion where the connection terminals of the two wiring boards are connected can be visually observed from the surface of the flexible board opposite to the side where the wiring is formed. Therefore, it is possible to easily visually confirm from the opposite surface that the connecting portion is securely connected by, for example, soldering.

Further, one or both of one end of the connection terminal of the flexible wiring board connected to the wiring and the other end on the opposite side thereof are covered with the flexible board. As a result, it is possible to cover the connection portion between the connection terminal and the wiring, which has been conventionally exposed, without using a new reinforcing member that covers the portion. As a result, when stress is applied to the connection portion of the wiring board, the force is distributed not only to the connection portion of the wiring and the connection terminal but also to the flexible substrate. As a result, breakage is less likely to occur at the connection portion between the wiring and the connection terminal.

Further, according to the invention, the opening of the flexible substrate is also formed in a region between regions of the flexible substrate where connection terminals are formed. The opening formed by this has an integrated shape including a plurality of regions in which the respective connection terminals are formed. Therefore,
The presence or absence of a short circuit between the terminals can be visually confirmed from the opposite surface of the flexible substrate.

Further, according to the present invention, when connecting the hard wiring board and the flexible wiring board described above, first, the hard wiring board and the flexible wiring board are prepared. The flexible wiring board has an opening having a length shorter than the length of the connection terminal in the longitudinal direction in a region where the connection terminal is formed, and the connection terminal has one end connected to the wiring and the other end thereof. Both or one of the other ends is covered with the flexible substrate. A conductive adhesive member is connected to the connection terminal of the hard wiring board or the connection terminal of the flexible wiring board. Subsequently, one surface of each wiring board is opposed to each other, corresponding wirings of each wiring board are parallel to each other, and connection terminals of each wiring board are overlapped with each other, so that a hard wiring board and a flexible wiring board are provided. Overlap. Finally, from the surface opposite to the surface on which the wiring of the flexible board is formed, the connection terminal portion exposed from the opening of the overlapping connection terminal and the connection terminal portion covered by the substrate are both heated to By connecting the connection terminals of the wiring boards, both wiring boards are electrically connected.

Thus, the connecting portion connecting the connecting terminal of the flexible wiring board and the connecting terminal of the hard wiring board has a portion exposed from the opening and a portion covered with the flexible substrate. Since the portion exposed from the opening directly contacts the heating tool, the heat from the heating tool can be efficiently transferred. Further, since the connection terminals can be visually checked, it can be confirmed whether or not the two connection terminals are securely connected. Further, in the portion covered with the flexible substrate, even when the flexible wiring substrate is displaced or is pulled and a force is applied to the connecting portion, stress is not concentrated only on the connecting portion. Therefore, breakage of terminals and wiring can be prevented.

Further, according to the present invention, when the hard wiring board and the flexible wiring board are connected, the hard wiring board and the opening are provided, and one or both ends of the connection terminal are boards. The covered flexible wiring board is prepared. The two wiring boards are overlapped so that one surface of each wiring board faces each other, the wirings of each wiring board are parallel to each other, and the connection terminals of each wiring board overlap each other. Next, an adhesive member having conductivity is arranged on the connection terminal exposed from the opening of the flexible wiring board, and the portion exposed from the opening of the connection terminal from the flexible board side is heated to melt the adhesive member. The melted adhesive member permeates into the gap between the connection terminals of each wiring board and connects the connection terminals.

Thus, the connecting portion connecting both connecting terminals has a portion exposed from the opening and a portion covered with the flexible substrate. As a result, the heating tool can be brought into direct contact with the portion exposed from the opening. Further, it is possible to easily visually confirm from the exposed portion whether or not the connecting portion is securely connected. Further, both ends of the connection terminal or one end where the force is likely to be concentrated are covered with the flexible substrate. Thereby, it is possible to prevent the force generated when the flexible wiring board is displaced or pulled, from being concentrated only on the connection terminals and the wiring. Further, the adhesive member that connects both connection terminals is supplied to the connection terminals through the openings of the flexible board after the boards are superposed. Therefore, the adhesive member can be easily supplied to the connection terminal, and the adhesive member can be easily replenished even when the connection terminal is heated. Therefore, the connection terminals can be connected easily and reliably.

As described above, since the connecting portion between the connecting terminal and the wiring is covered with the flexible substrate, the wire is not easily broken. Thus, even if the flexible wiring board is folded and a force is applied to the connection portion after the hard wiring board and the flexible wiring board are connected, it is possible to prevent disconnection or the like. Therefore, the yield of products having this connection structure can be improved.

[0035]

1 is a sectional view of a liquid crystal display device 31 in which a connection structure according to a first embodiment of the present invention is used. The liquid crystal display device 31 includes a liquid crystal display panel 32 and a hard wiring board 33.
And a flexible wiring board 34. The wiring of the liquid crystal display panel 32 and the wiring of the hard wiring board 33 are connected by a flexible wiring board 34 which is TCP.

FIG. 2 is an enlarged plan view showing a connection portion between the flexible wiring board 34 and the hard wiring board 33 of the liquid crystal display device 31 of FIG. FIG. 3 is a cross-sectional view taken along the line CC of the connection portion of FIG. Hereinafter, FIG. 1 to FIG. 3 will be described together.

The liquid crystal display panel 32 includes a pair of substrate members 37 and 38, at least one of which is transparent.
A liquid crystal layer (not shown) interposed therebetween is included. For example, when the liquid crystal display panel 32 is a simple matrix drive type, the substrate members 37 and 38 respectively have a plurality of strip-shaped display electrodes formed in parallel with each other on the surfaces facing each other. The liquid crystal display panel 32 includes the board members 37, 38 so that the display electrodes of the board members 37, 38 are orthogonal to each other.
38 is arranged, and the liquid crystal layer is interposed therebetween. The display electrodes are formed on the insulating substrate, and the terminals 39 for connection are connected to the end portions of each electrode, for example, via wiring. The terminals 39, which are connected to the display electrodes of the substrate members 37 and 38, are both disposed on the substrate member 38, for example.

The hard wiring board 33 comprises a hard board 41 and terminals 42 for connection. On one surface 41a of the hard substrate 41, for example, a plurality of wirings (not shown) arranged in parallel to each other are formed and the terminals 42 are connected. The plurality of terminals 42 are, for example, formed in an extremely thin band shape and are arranged in parallel with each other.

The flexible wiring board 34 includes a flexible board 46, wirings 47 and 48, connection terminals 49 and 50, a liquid crystal drive circuit 51, a protective resin layer 52 and a protective film 53. The flexible substrate 46 is a flexible strip-shaped substrate. An opening 56 is formed in the central portion of the flexible substrate 46. Further, an opening 57 is formed in a portion near the one end 46b of the flexible substrate 46.

A plurality of strip-shaped wirings 47 and 48 are arranged on one surface 46a of the flexible substrate 46, respectively. The wirings 47 are arranged in parallel with each other from one end portion 46b of the substrate 46 toward the central portion. The wiring 48 is arranged from the other end portion 46c of the substrate 46 toward the central portion. The terminals 46, 5 for connection are connected to the ends 46b, 46c of the substrate 46.
0 is formed and connected to the wirings 47 and 48. Terminal 4
The reference numerals 9 and 50 are arranged parallel to each other on the extension line of the wiring 34 in the longitudinal direction. In addition, the terminals 49 are made of a strip-shaped conductor and are arranged at the same intervals as the terminals 42. Further, the terminal 49 may be formed in a row as a conductor that is continuous with the wiring 47. Further, the terminals 42 and 49 may have different terminal widths as long as the centers of the terminals in the width direction are equal. The wiring 47 is covered with the protective film 53. The wiring 50 is also covered with a protective film made of the same material as the protective film 53.

The opening 5 at the center of the flexible substrate 46
6 is formed in such a size that the terminals on the central side of the wirings 47 and 48 are exposed. The liquid crystal drive circuit 51 is connected to the wirings 47 and 48 exposed by the opening 56 from the other surface 46d side of the flexible substrate 46. The liquid crystal drive circuit 51, the portions of the wirings 47 and 48 exposed from the opening 56, and the region of the flexible substrate 46 that covers the opening 56 are covered and protected by the protective resin layer 52.

The above-mentioned opening 57 is formed by cutting a part of the region of the flexible substrate 46 where the terminals 49 are formed into a rectangle, and cutting the substrate 46 between the rectangular portions of each region. . The length d1 of the opening 57 is equal to that of the terminal 4
9 is shorter than the length d2 of the terminal 49, for example, the length d2 of the terminal 49.
Of 30% to 70%. Also the opening 5
The length d3 in the direction orthogonal to the length d1 of 7 is equal to or larger than the width in which the plurality of terminals 49 are arranged in parallel with each other.
As a result, the substrate 46 is removed from the center of the terminal 49 in the longitudinal direction.
The part up to the end on the one end 33b side can also be viewed from the other surface 46d side of the flexible substrate 46.

The terminal 50 on the side of the other end 46c of the substrate 46 of the flexible wiring board 34 has an anisotropic conductive film 61.
Through the terminal 39 of the liquid crystal display panel 32. The terminal 49 on the one end 46 b side of the board 46 of the flexible wiring board 34 is connected to the terminal 42 of the hard wiring board 33 via the adhesive layer 62. The adhesive layer 62 is realized by, for example, solder or the like. As a result, the wiring of the liquid crystal display panel 32 and the wiring of the hard wiring board 33 are the terminal 39, the terminal 50, the wiring 48, the liquid crystal drive circuit 51, and the wiring 4.
7, the terminal 49, and the terminal 42 are connected in this order and electrically connected.

The hard wiring board 33 connected to the liquid crystal display panel 32 by the flexible wiring board 34 has a liquid crystal display by folding the flexible wiring board 34 into a "Z" shape as shown in the schematic view of FIG. Panel 32
It is arranged on a portion opposite to the display surface and a portion around the display surface, and is housed in a predetermined case (not shown). As a storage method, as shown in the schematic view of FIG. 5, the liquid crystal display device 31 and the flexible wiring board 34 are “closed”.
The hard wiring board 33 is bent into a letter shape, and the hard wiring board 33 is attached to the liquid crystal display panel 3.
It is conceivable that it is arranged on the side opposite to the display surface of No. 2 and accommodated in a predetermined case.

When this storage method is used, the connection structure of the second embodiment of the present invention shown in FIG. 6 may be used. The hard wiring board 33 and the flexible wiring board 34a of this embodiment
The connection part with has a structure similar to the connection part of FIG.
The same structures will be denoted by the same reference symbols and description thereof will be omitted. The flexible wiring board 34a has a structure in which the opening 57a of the flexible board 46 is wired from the center of the terminal 49 in the longitudinal direction to the wiring 4.
7 is formed so that the portion up to the connection portion 71 between the terminal 7 and the terminal 49 is exposed, and the portion from the central portion of the terminal 49 to the end portion on the opposite side of the connection portion 71 is covered with the substrate 46 for reinforcement.

Further, the connection structure of the third embodiment of the present invention shown in FIG. 7 may be used. The connection portion between the hard wiring board 33 and the flexible wiring board 34b of this embodiment has a similar structure to the connection portion of FIG. 2, and the same structures are denoted by the same reference numerals and the description thereof is omitted. Flexible wiring board 34b
Covers the opening 57b of the flexible substrate 46 and the terminal 49
The both ends in the longitudinal direction of the are covered with the substrate 46 so that the central portion is exposed, and the both ends of the terminal 49 in the longitudinal direction are covered with the substrate 46 for reinforcement.

Furthermore, when the flexible wiring board is bent into a "Z" shape, the fourth embodiment of the present invention shown in FIG.
The connection structure of the embodiment may be used. The connection portion between the hard wiring board 33 and the flexible wiring board 34c of the present embodiment has a similar structure to the connection portion of FIG. 2, and the same structures will be denoted by the same reference numerals and description thereof will be omitted. The flexible wiring board 34c has an opening 57c in the flexible board 46.
Are formed into a plurality of strips excluding only the region of the substrate 46 where the terminals 49 are formed.

The connection structures of the second to fourth embodiments are implemented, for example, in a device having the same structure as the liquid crystal display device of the first embodiment.

9 and 10 are partial cross-sectional views of the wiring boards 33 and 34 for explaining the connection method for connecting the hard wiring board 33 and the flexible wiring board 34 of FIG. FIG. 9 shows a state in which the wiring boards 33 and 34 are faced to each other and aligned. FIG. 10 shows wiring boards 33, 3
4 shows a state in which 4 are overlapped and heated.

One surface 4 of the terminal 42 of the hard wiring board 33
2a and the terminal 49 of the flexible wiring board 34,
At least one of the one surface 49a facing the one surface 42a of the terminal 42 is coated with solder 66 which is an adhesive member before the wiring boards 33 and 34 are superposed. For example, in FIG. 9, the flexible wiring board 34
The solder 66 is applied to the one surface 49a of the terminal 49 of FIG. After applying the solder 66 to the terminals 49, the one surface 46a of the substrate 46 of the flexible wiring board 34 and the one surface 41a of the substrate 41 of the hard wiring board 33 are opposed to each other. At this time, the wiring boards 33 and 34 are connected to the boards 41 and 4 respectively.
6 terminals 42, 4 formed on one surface 41a, 46a
The terminals 9 and 9 are aligned so that the corresponding terminals overlap each other, and the terminals 42 and 49 are overlapped.

Subsequently, for example, heating tools 67 and 68 are used to heat the terminals 42 and 49 that are superposed from the other surface 46d side of the substrate 46 of the flexible wiring board 34. For example, the heating tool 67 is used to heat the portion exposed from the opening 57 of the terminal 49, and the heating tool 68 is used to move the portion of the terminal 49 covered by the flexible substrate 46 to the other side of the flexible substrate 46. The surface 46d is heated from above. As a result, the solder applied to at least one of the terminals 42 and 49 is melted and the terminal 4
2, 49 are adhered, and an adhesive layer 62 is formed between the terminals 42, 49. At this time, the heating temperature is increased by 100 ° C., for example, as compared with the temperature which is conventionally used. Accordingly, even when the terminal 49 is heated via the substrate 46, the solder 66 can be sufficiently heated.

When heating the overlapping portions of the terminals 42 and 49, separate heating tools 67 and 68 are used as described above to remove the portion exposed from the opening 57 of the terminal 49 and the portion covered by the flexible substrate 46. You may heat simultaneously. Also, using only one heating tool, the terminals 42, 4
After heating the exposed part of 9 and connecting,
You may make it connect by heating the part covered with the flexible substrate 46 of 2,49. Further, the entire surface of the terminal 49 is collectively heated by using a heating tool having a shape in which the heating tools 67 and 68 are integrated, that is, a tool having a step on the contact surface of the heating tool by the thickness of the flexible substrate 46. You may connect it. As a result, the terminal 4
2, 49 are electrically connected via an adhesive layer 62 made of solder 66.

The portion from the central portion in the longitudinal direction of the terminal 49 to the end portion side connected to the wiring 47 is the flexible substrate 46.
Is covered by. For example, as shown in FIG. 4, the liquid crystal display device 31 of FIG.
Wiring 4 when folding and storing in a specified case
Stress due to the repulsive force of the bent flexible substrate 46 to return to its original state is likely to concentrate on the connecting portion 71 between the terminal 7 and the terminal 49, the adhesive layer 62 in the vicinity thereof, and the like, and breakage easily occurs. In particular, the connecting portion 71 has a small amount of attached solder and is not covered with the protective film 53 either, so that the connecting portion 71 is easily broken.

In the flexible wiring board 34 of this embodiment, the flexible board 46 covers from the wiring 47 to the central portion of the terminal 49 in the longitudinal direction, and the connecting portion 71 is covered by the flexible board 46. As a result, the above-mentioned force is distributed to the flexible substrate 46 as well as the connecting portion 71 and the adhesive layer 62. Therefore, it is possible to prevent the stress from concentrating only on the connecting portion 71, and thus to prevent the connecting portion 71 from breaking.

FIG. 11 is a wiring board 33, 3 for explaining another connection method for connecting the terminal 42 of the hard wiring board 33 of FIG. 1 and the terminal 49 of the flexible wiring board 34.
It is sectional drawing of the connection part of FIG. In this embodiment, after the terminals 42 and 49 of the wiring boards 33 and 34 are superposed, solder is supplied between the terminals 42 and 49 which are superposed,
Connect 49.

First, the one surface 41a of the substrate 41 of the hard wiring board 33 and the one surface 46a of the substrate 46 of the flexible wiring board 34 are opposed to each other. Then terminal 4
The terminals 42 and 49 are overlapped with each other by aligning the corresponding two and 49 so as to overlap each other. Next, the solder 75 is supplied to the portion of the terminal 49 exposed from the opening 57 from the other surface 46 d side of the substrate 46 through the opening 57. For example, solder is applied to the surface 49b of the terminal 49 on the substrate 46 side, or thread-shaped solid solder is pressed.

Then, the other surface 46d of the flexible substrate 46 is exposed at the portion exposed from the opening 57 of the terminal 49.
From the side, the heating tool 76 is brought into contact. The heating tool 76 is
For example, it is realized by a soldering iron. The terminal 49 and the solder 7 applied to the terminal 49 by the heating tool 76.
5 is heated to melt the solder 75. In advance, a minute gap d4 is formed between the terminal 49 and the terminal 42. The melted solder 57 flows into the gap between the terminals 42 and 49. Since the distance d4 between the terminals 42 and 49 is extremely small, the solder flowing into the gap penetrates from the exposed portion of the terminal 49 to the portion covered with the flexible substrate 46 due to the capillary phenomenon, and the adhesive layer 62 is formed. To form. At this time, the flow rate and pressure of the melted solder are adjusted by adjusting the weight of the heating tool 76 and the speed at which the heating tool 76 is moved over the terminals 49.

As a result, the terminals 42 and 49 are formed so that the surfaces 42a, 49a of the terminals 42, 49 facing each other are formed.
Soldered and connected on the entire surface. Therefore, FIG.
It is possible to obtain a connection part similar to that of.

As described above, by heating only the portion of the terminal 49 exposed from the opening 57, the terminals 42, 4
It is possible to solder and connect the entire surfaces 42a, 49a of the nine members 9 facing each other. Therefore, as shown in FIG.
Also, in the connection method described with reference to FIG. 10, it is possible to reduce the heating portion existing at two locations to one location.

Further, the wiring 47 formed continuously with the terminal 49 is covered with the protective film 53 as described above. As a result, the molten solder 75 permeates and is supplied to the gap between the terminals 42 and 49, and the terminals 49 and the wiring 4 are connected.
7 penetrates beyond the connection portion 71 with the wiring 7, and for example, the wiring 47
Even when the temperature reaches the limit, the protective film 53 is in direct contact with the solder 75, and the solder does not adhere to the wiring 47. Therefore, it is possible to prevent unnecessary solder from adhering to the wiring 47. As a result, it is possible to prevent the occurrence of a defect such as a short circuit between the adjacent wiring 47 and the terminal 49.

As described above, according to this embodiment, the hard wiring board 33 and the flexible wiring board 34 having the opening 57 in the region where the terminal 49 is formed are connected. Wiring 4
The connecting portion 71 between the terminal 7 and the terminal 49 is the flexible substrate 4
Covered by 6. Therefore, as described above, when the flexible wiring board 34 is folded and the liquid crystal display device 31 is housed in a predetermined case, the flexible wiring board 34 is displaced or lifted, and the adhesive layer Even when a force is applied to the connecting portion 71 between the wiring 62 and the wiring 47 and the terminal 49, it is possible to prevent the force from being concentrated only on the connecting portion 71. This can prevent breakage of the adhesive layer 62 and the connection portion 71.

The flexible wiring board 34 used in this embodiment is preferably implemented when the flexible wiring board 34 is folded and stored in a case as shown in FIG. Further, as shown in FIG. 5, in the liquid crystal display device, the flexible wiring board 34 is bent in a V-shape, and the hard wiring board 33 is arranged on the side opposite to the display surface of the liquid crystal display panel 32, and the predetermined shape is obtained. In the case of housing in the case, stress is likely to be concentrated on the end portion of the terminal 49 on the side opposite to the connecting portion 71 and the adhesive layer 62 in the vicinity thereof.

In such a case, as shown in FIG.
A portion from the central portion of the terminal 49 in the longitudinal direction to the connecting portion 71 is exposed on the flexible substrate 46, and a portion from the central portion of the terminal 49 to the end portion on the side opposite to the connecting portion 71 is covered with the flexible substrate 46 and reinforced. The opening 57a is formed so that As a result, the stress concentrated on the opposite end can be dispersed in the flexible substrate 46 as well, so that breakage can be prevented from occurring at the end or its periphery.

Further, as shown in FIG. 7, in the flexible substrate 46, in the region where the terminals 49 of the flexible substrate are formed, the length of the terminal 49 in the direction parallel to the terminal 49 from both longitudinal ends of the terminal 49 is the terminal 49. Regions excluding, for example, half or less of the length d2 in the longitudinal direction, that is, the central portion of the region is cut off to form the opening 57b, and the central portion of the terminal 49 is exposed from the opening. The part may be covered and reinforced by the flexible substrate 46. By forming a flexible wiring board in this way,
It is possible to prevent stress from concentrating on the end portions of the terminals 49 regardless of whether the wiring board is bent into a “Z” shape or a “<” shape.

When the terminals 42 and 49 are not connected, they may be connected again by using solder or a heating tool.
The yield of the device 31 itself can be improved as compared with the case where the terminal is broken.

In this embodiment, solder is used as the material for connecting the terminals 42 and 49, but any other material may be used as long as it is conductive and melts when heated. Good.

The connection structure between the hard wiring board 33 and the flexible wiring board 34 of this embodiment is not limited to the liquid crystal display device, and may be used for other devices.

[0068]

As described above, according to the present invention, a hard wiring board having a plurality of strip-shaped wirings having connection terminals formed on a hard substrate, and a plurality of strip-shaped wirings having connection terminals formed on a flexible substrate. When the flexible wiring board on which the wiring is formed is electrically connected by making the connection terminals face each other, an opening is formed in the flexible board. The opening is a region in which the connection terminal is formed, and is formed in a region excluding a region whose length parallel to the wiring is shorter than both ends of the connection terminal in the longitudinal direction of the connection terminal. It Alternatively, from one of the both ends of the connection terminal, the length parallel to the wiring is formed in a region equal to or less than the length in the longitudinal direction of the connection terminal.

Therefore, the connecting portion connecting the connecting terminals of both wiring boards can be visually observed from the surface side of the flexible board opposite to the surface on which the wiring is formed. As a result, it is possible to easily visually confirm that the connection terminals of both wiring boards are securely connected.

Further, at least one of the connection between the wiring of the flexible wiring board and the connection terminal and the end of the connection terminal opposite to the wiring is covered with the flexible board. As a result, it is possible to cover and reinforce the end portions of the wiring and the connection terminal, which have been conventionally exposed, without adding any member. Therefore, even if the flexible wiring board is displaced due to floating or the like and stress is applied to the connection portion between the wiring and the connection terminal, the force is dispersed to other portions than the connection portion, for example, the flexible substrate, and only the connection portion is formed. It is possible to prevent concentration of stress. Therefore, breakage is unlikely to occur at the connection portion between the connection terminal and the wiring, and the reliability of the connection structure using the connection terminal having the portion can be improved. Therefore, the yield of products using the flexible wiring board and the hard wiring board having such a connection structure can be improved.

Further, according to the present invention, the opening formed in the flexible substrate is also formed in a region between the regions where the connection terminals are formed. Since the openings are integrated with each other, it is possible to form the openings by collectively cutting off the entire region where the connection terminals arranged in a comb shape are formed, and thus it is easy to form the openings. Becomes

Further, according to the present invention, when connecting the hard wiring board and the flexible wiring board, an adhesive member that is melted by heat is arranged in advance on the surface of one of the connection terminals of both wiring boards. Then, the surfaces of the two wiring boards on which the wirings are formed are opposed to each other, and the connection terminals are aligned so that they overlap with each other, and then overlapped. The overlapping connection terminals are heated to melt the adhesive member and bond the connection terminals.

As a result, it is possible to reinforce the connection portion between the connection terminal and the wiring, which easily breaks, without adding a new reinforcing member. Further, since the opening of the flexible substrate in which the connection terminal is formed is partially exposed, the connection state of the connection terminal can be easily visually confirmed.

Further, according to the present invention, when connecting the hard wiring board and the flexible wiring board, first, the wiring boards are opposed to each other, and the connection terminals are aligned and overlapped so that they overlap each other. An adhesive member is supplied to the connection terminal through the opening of the flexible wiring board.
The adhesive member and the connection terminal thus supplied are heated to connect the connection terminals of both wiring boards. As a result, it is possible to reinforce the connection portion between the connection terminal and the wiring, which is apt to break, without newly adding a reinforcing member. In addition, you can easily visually check the connection status of the connection terminals,
The adhesive member can be easily replenished even after the wiring boards are stacked.

Furthermore, the connecting method of the present invention does not increase the number of steps as compared with the conventional connecting method, so that the working time can be shortened.

[Brief description of drawings]

FIG. 1 is a first embodiment of the present invention, a hard wiring board 33.
FIG. 6 is a cross-sectional view of a liquid crystal display device 31 using a connection structure between a flexible wiring board and a flexible wiring board.

FIG. 2 is a hard wiring board 33 of the liquid crystal display device 31 of FIG.
FIG. 6 is an enlarged plan view of a connecting portion between the flexible wiring board and the flexible wiring board.

3 is a cross-sectional view taken along line CC of the connection portion of FIG.

FIG. 4 is a schematic diagram for explaining a state in which the liquid crystal display device 31 of FIG. 1 is bent in a “Z” shape on a flexible wiring board 34 and stored in a predetermined case.

FIG. 5 is a schematic diagram for explaining a state in which the liquid crystal display device 31 of FIG. 1 is bent in a flexible wiring board 34 in a V-shape and housed in a predetermined case.

FIG. 6 is a second embodiment of the present invention, a hard wiring board 33.
FIG. 6 is an enlarged plan view of a connecting portion between the flexible wiring board 34a and the flexible wiring board 34a.

FIG. 7 is a third embodiment of the present invention, a hard wiring board 33.
FIG. 6 is an enlarged plan view of a connection portion between the flexible wiring board 34b and the flexible wiring board 34b.

FIG. 8 is a fourth embodiment of the present invention, a hard wiring board 33.
FIG. 6 is an enlarged plan view of a connecting portion between the flexible wiring board 34c and the flexible wiring board 34c.

FIG. 9 shows a hard wiring board 33 and a flexible wiring board 34.
FIG. 6 is a partial cross-sectional view of a flexible wiring board 34 coated with solder 66 and a hard wiring board 33, for explaining a connection method with.

FIG. 10: Hard wiring board 33 and flexible wiring board 3
4, heating tools 67, 68 for explaining the connection method
It is sectional drawing which shows the state which heated the connection terminal 49 using.

FIG. 11: Hard wiring board 33 and flexible wiring board 3
4 is a cross-sectional view showing a state in which a solder 75 is supplied from an opening 57 and the connection terminal 49 is heated by using a heating tool 76, for explaining a connection method with the connection terminal 4 of FIG.

FIG. 12 is a cross-sectional view of a liquid crystal display device as a first conventional example.

13 is a plan view of the hard wiring board 2 and T of the liquid crystal display device of FIG.
It is a top view of the connection part which connects with CP3.

FIG. 14 is a cross-sectional view for explaining a connection method for forming the connection part of FIG.

FIG. 15 is a plan view showing a second conventional connection method for reinforcing and forming the connection portion between the hard wiring board 2 and the TCP 3.

16 is a cross-sectional view taken along the line AA of the connection portion of FIG.

FIG. 17 is a plan view showing a connection method of a third conventional example in which a connection portion between the hard wiring board 2 and the TCP 3 is reinforced and formed.

18 is a cross-sectional view taken along the line BB of the connection portion of FIG.

[Explanation of symbols]

 33 hard wiring board 34, 34a, 34b, 34c flexible wiring board 41 hard board 42, 49, 50 terminal 46 flexible board 47, 48 wiring 56, 57; 57a; 57b; 57c opening 62 adhesive layer 66; 75 solder 67, 68; 76 heating tools

Claims (7)

[Claims] 1. A hard substrate having an insulating property, a plurality of strip-shaped wirings formed in parallel with each other on one surface of the hard substrate,
And a hard wiring board having connection terminals formed on each wiring, a flexible board having insulation properties, a plurality of strip-shaped wirings formed in parallel with each other on one surface of the flexible board, and formed on each wiring. A flexible wiring board having a connection terminal, a connection structure between a hard wiring board and a flexible wiring board, in which the connection terminals are connected to each other, the flexible board is an area in which at least the connection terminal is formed. , From one end on the wiring side of the area,
A region having a length shorter than the length of the connecting terminal in the direction parallel to the longitudinal direction of the wiring, and from the other end on the side opposite to the wiring, shorter than the length of the connecting terminal in the direction parallel to the longitudinal direction of the wiring. An opening is formed in a region excluding a region having a length, and a connecting portion connecting both connection terminals has a portion exposed from the opening and a portion covered with a flexible substrate. A connection structure between a hard wiring board and a flexible wiring board. 2. A hard substrate having an insulating property, a plurality of strip-shaped wirings formed in parallel with each other on one surface of the hard substrate,
And a hard wiring board having connection terminals formed on each wiring, a flexible board having insulation properties, a plurality of strip-shaped wirings formed in parallel with each other on one surface of the flexible board, and formed on each wiring. A flexible wiring board having a connection terminal, a connection structure between a hard wiring board and a flexible wiring board, in which the connection terminals are connected to each other, the flexible board is an area in which at least the connection terminal is formed. , From one end on the wiring side of the area,
The length of the connecting terminal in the direction parallel to the longitudinal direction of the wiring from the area having a length shorter than the length of the connecting terminal in the direction parallel to the longitudinal direction of the wiring, or from the other end opposite to one end. An opening is formed in a region having a length shorter than the length, and the connecting portion connecting both connecting terminals has a portion exposed from the opening and a portion covered with a flexible substrate. A connection structure between a hard wiring board and a flexible wiring board. 3. The hard wiring board and the flexible wiring according to claim 1, wherein the opening of the flexible board is also formed in an area between areas of the flexible board where connection terminals are formed. Connection structure with the board. 4. A hard wiring substrate having a plurality of strip-shaped wirings formed in parallel with each other on one surface of an insulating hard substrate, and a connection terminal formed on each wiring, and a flexible substrate having an insulating property. On one surface, a plurality of wirings are formed in parallel with each other, connection terminals are formed on the respective wirings, and the flexible substrate is an area in which at least the connection terminals are formed, A region having a length shorter than the length of the connecting terminal in the direction parallel to the longitudinal direction of the wiring from one end, and a connecting terminal in the direction parallel to the longitudinal direction of the wiring from the other end opposite to the wiring. A flexible wiring board having an opening in a region other than a region having a length shorter than the length of the flexible wiring substrate, and the flexible wiring substrate having the opening on the connection terminal of the hard wiring substrate or the connection terminal of the flexible wiring substrate. Adhesive member having a property of being arranged, one surface of each wiring board faces each other, the wirings of each wiring board are parallel to each other, and the connection terminals of each wiring board are overlapped with each other. A hard wiring board and a flexible wiring board, characterized in that the wiring board and the flexible wiring board are superposed, and the connection terminal portion is heated from the flexible board side of the flexible wiring board to connect the connection terminals of each wiring board. How to connect. 5. A hard wiring substrate having a plurality of strip-shaped wirings formed in parallel with each other on one surface of an insulating hard substrate, and a connection terminal formed on each wiring, and a flexible substrate having an insulating property. On one surface, a plurality of wirings are formed in parallel with each other, connection terminals are formed on the respective wirings, and the flexible substrate is an area in which at least the connection terminals are formed, A direction parallel to the longitudinal direction of the wiring, from one end to a region having a length shorter than the length of the connection terminal in the direction parallel to the longitudinal direction of the wiring, or from the other end opposite to the one end. A flexible wiring board having an opening in a region having a length shorter than the length of the connection terminal, and conductive on the connection terminal of the hard wiring board or on the connection terminal of the flexible wiring board. A hard wiring is provided by arranging an adhesive member having one surface of each wiring board facing each other, the wirings of each wiring board being parallel to each other, and the connection terminals of each wiring board overlapping each other. Connection between the hard wiring board and the flexible wiring board, characterized in that the board and the flexible wiring board are superposed, and the connection terminal portion is heated from the flexible board side of the flexible wiring board to connect the connection terminals of each wiring board. Method. 6. A hard wiring board having a plurality of strip-shaped wirings formed in parallel with each other on one surface of an insulating hard board, and a connection terminal formed on each wiring, and an insulating flexible board. On one surface, a plurality of wirings are formed in parallel with each other, connection terminals are formed on the respective wirings, and the flexible substrate is an area in which at least the connection terminals are formed, A region having a length shorter than the length of the connecting terminal in the direction parallel to the longitudinal direction of the wiring from one end, and a connecting terminal in the direction parallel to the longitudinal direction of the wiring from the other end opposite to the wiring. A flexible wiring board having an opening in an area excluding the area having a length shorter than the length of the wiring board, one surface of each wiring board faces each other, and the wirings of each wiring board become parallel to each other. And the connection terminals of the respective wiring boards are overlapped with each other so that the hard wiring board and the flexible wiring board are superposed, and the conductive adhesive member is provided on the connection terminals exposed from the opening of the flexible wiring board. And connecting the connection terminals of each wiring board by heating the connection terminal portion from the flexible board side of the flexible wiring board. 7. A hard wiring substrate having a plurality of strip-shaped wirings formed in parallel with each other on one surface of an insulating hard substrate, and a connection terminal formed on each wiring, and an insulating flexible substrate. On one surface, a plurality of wirings are formed in parallel with each other, connection terminals are formed on the respective wirings, and the flexible substrate is an area in which at least the connection terminals are formed, A direction parallel to the longitudinal direction of the wiring, from one end to a region having a length shorter than the length of the connection terminal in the direction parallel to the longitudinal direction of the wiring, or from the other end opposite to the one end. Prepare a flexible wiring board having an opening in a region having a length shorter than the length of the connection terminal, so that one surface of each wiring board faces each other and the wirings of each wiring board are parallel to each other. Then, the hard wiring board and the flexible wiring board are overlapped with each other so that the connection terminals of the respective wiring boards overlap each other, and the conductive adhesive member is provided on the connection terminal exposed from the opening of the flexible wiring board. And connecting the connection terminals of each wiring board by heating the connection terminal portion from the flexible board side of the flexible wiring board.