JP2004001409A5

JP2004001409A5 -

Info

Publication number: JP2004001409A5
Application number: JP2003066182A
Authority: JP
Filing date: 2003-03-12
Publication date: 2004-11-04
Anticipated expiration: 2023-03-12

Description

【0012】
すなわち、この発明は、
結晶構造を有する柱状硬脆性材料の長手方向及び周方向の結晶方位を測定する工程、
該材料の外周面の一長手方向に治具を固着する工程、
該材料の結晶面の傾き角度を設定する工程、
該材料端面の一方又は両方に当て板を接着又は押圧する工程、
前記治具に固着した該材料の拘束していない外周面側から該材料の中心軸を横断する方向に該治具側へワイヤーソーを相対的に移動させて前記当て板と共に多数の円板状ウェーハにスライスする工程、
を有することを特徴とする硬脆性材料の切断方法である。
また、この発明は、上記工程を有する切断方法において、
当て板が、柱状硬脆性材料と略同径の円板又はリング状板あるいは孔あき円板である構成、
当て板が、柱状硬脆性材料と同材質又はガラス、セラミック、カーボン、レジンのいずれかからなる構成、
押圧する手段が、円板又はリング状板あるいは孔あき円板を複数のピンで該端面へ押圧する構成、からなる硬脆性材料の切断方法を併せて提案する。[0012]
That is, the present invention
Measuring longitudinal and circumferential crystallographic orientations of the columnar hard and brittle material having a crystalline structure,
Affixing an longitudinally jig outer circumferential surface of the material,
Setting an inclination angle of a crystal plane of the material;
Bonding or pressing a pressure plate to one or both of the material end faces,
Multiple circles together with the backing plate by relatively to move the wire saw to the jig-side in a direction transverse to the central axis of the material from the outer peripheral surface side which is not bound of the material which is fixed to the jig Slicing into plate-like wafers,
It is a cutting method of the hard brittle material characterized by having.
Further, in the present invention, in the cutting method having the above steps,
A configuration in which the backing plate is a disc or ring-like plate or a perforated disc having substantially the same diameter as the columnar hard and brittle material,
The backing plate is made of the same material as the columnar hard and brittle material, or made of glass, ceramic, carbon, or resin,
A method of cutting a hard and brittle material comprising a structure in which a pressing means presses a disc or a ring-like plate or a perforated disc against the end face with a plurality of pins is also proposed.

Claims

Step of setting the longitudinal direction and the circumferential direction of the step of measuring the crystal orientation, affixing the jig to the outer peripheral surface of the axial material, the inclination angle of the crystal plane of the material of the columnar hard brittle material having a crystal structure Bonding or pressing a contact plate to one or both of the end faces of the material , the jig side extending in a direction transverse to the central axis of the material from the unrestrained outer peripheral side of the material fixed to the jig relatively slicing to thereby move a number of disk-shaped wafer with the backing plate, hard cutting method of the brittle material with a wire saw to.

2. The method for cutting a hard and brittle material according to claim 1, wherein the backing plate is a disk, a ring-like plate or a perforated disk having substantially the same diameter as the columnar hard and brittle material.

The method for cutting a hard and brittle material according to claim 1, wherein the backing plate is made of the same material as the columnar hard and brittle material, or glass, ceramic, carbon, or resin.

The method for cutting a hard and brittle material according to claim 1, wherein the pressing means presses the disc or ring plate or the perforated disc to the end face with a plurality of pins.