WO2009072176A1 - Multiwirer saw and cutting method of ingot - Google Patents

Multiwirer saw and cutting method of ingot Download PDF

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Publication number
WO2009072176A1
WO2009072176A1 PCT/JP2007/073328 JP2007073328W WO2009072176A1 WO 2009072176 A1 WO2009072176 A1 WO 2009072176A1 JP 2007073328 W JP2007073328 W JP 2007073328W WO 2009072176 A1 WO2009072176 A1 WO 2009072176A1
Authority
WO
WIPO (PCT)
Prior art keywords
wire
work
saw
holding
multiwirer
Prior art date
Application number
PCT/JP2007/073328
Other languages
French (fr)
Japanese (ja)
Inventor
Seiichi Mimura
Hirokazu Nishida
Takafumi Kawasaki
Original Assignee
Mitsubishi Electric Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corporation filed Critical Mitsubishi Electric Corporation
Priority to PCT/JP2007/073328 priority Critical patent/WO2009072176A1/en
Priority to TW097108462A priority patent/TW200924933A/en
Publication of WO2009072176A1 publication Critical patent/WO2009072176A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Abstract

In a multiwire saw, a wire string formed by winding a wire between a plurality of rollers having a plurality of wire grooves is traveled, a work is press-fitted to the wire while working fluid comprising grains is supplied to the wire string and the work is cut into a plurality of wafers. The wire saw is provided with a first holding member fixing and holding a face opposite to a face where cutting is started in the work by adhesive through a dummy member and a second holding member sandwiching the work from both sides of the work in an arranging direction of the wire and fixing and holding it.
PCT/JP2007/073328 2007-12-03 2007-12-03 Multiwirer saw and cutting method of ingot WO2009072176A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2007/073328 WO2009072176A1 (en) 2007-12-03 2007-12-03 Multiwirer saw and cutting method of ingot
TW097108462A TW200924933A (en) 2007-12-03 2008-03-11 Multi-wire saw and workpiece cutting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/073328 WO2009072176A1 (en) 2007-12-03 2007-12-03 Multiwirer saw and cutting method of ingot

Publications (1)

Publication Number Publication Date
WO2009072176A1 true WO2009072176A1 (en) 2009-06-11

Family

ID=40717362

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/073328 WO2009072176A1 (en) 2007-12-03 2007-12-03 Multiwirer saw and cutting method of ingot

Country Status (2)

Country Link
TW (1) TW200924933A (en)
WO (1) WO2009072176A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011032599A1 (en) * 2009-09-18 2011-03-24 Applied Materials, Inc. Wire saw work piece support device, support spacer and method of sawing using same
JP2012101310A (en) * 2010-11-09 2012-05-31 Yasunaga Corp Wire saw device, and method for manufacturing wafer using the same
JP2014087911A (en) * 2012-10-31 2014-05-15 Komatsu Ntc Ltd Workpiece cutting method by wire saw
TWI632041B (en) * 2017-09-11 2018-08-11 環球晶圓股份有限公司 Ingot slicing method and slicing abrasive kit
CN109747057A (en) * 2019-02-14 2019-05-14 厦门芯光润泽科技有限公司 Silicon carbide crystal bar multi-line cutting method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113618546A (en) * 2020-10-26 2021-11-09 怀化市健霆竹业有限公司 Stable bamboo wire drawing machine for processing bamboo chopsticks

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0550422A (en) * 1991-08-20 1993-03-02 Sumitomo Metal Ind Ltd Cutting method by means of multiwire saw
JP2004001409A (en) * 2002-03-29 2004-01-08 Sumitomo Mitsubishi Silicon Corp Cutting method for rigid,brittle material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0550422A (en) * 1991-08-20 1993-03-02 Sumitomo Metal Ind Ltd Cutting method by means of multiwire saw
JP2004001409A (en) * 2002-03-29 2004-01-08 Sumitomo Mitsubishi Silicon Corp Cutting method for rigid,brittle material

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011032599A1 (en) * 2009-09-18 2011-03-24 Applied Materials, Inc. Wire saw work piece support device, support spacer and method of sawing using same
CN102574226A (en) * 2009-09-18 2012-07-11 应用材料公司 Wire saw work piece support device, support spacer and method of sawing using same
JP2012101310A (en) * 2010-11-09 2012-05-31 Yasunaga Corp Wire saw device, and method for manufacturing wafer using the same
JP2014087911A (en) * 2012-10-31 2014-05-15 Komatsu Ntc Ltd Workpiece cutting method by wire saw
TWI632041B (en) * 2017-09-11 2018-08-11 環球晶圓股份有限公司 Ingot slicing method and slicing abrasive kit
CN109747057A (en) * 2019-02-14 2019-05-14 厦门芯光润泽科技有限公司 Silicon carbide crystal bar multi-line cutting method

Also Published As

Publication number Publication date
TW200924933A (en) 2009-06-16
TWI334818B (en) 2010-12-21

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