JP2003527560A5 - - Google Patents

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Publication number
JP2003527560A5
JP2003527560A5 JP2000577483A JP2000577483A JP2003527560A5 JP 2003527560 A5 JP2003527560 A5 JP 2003527560A5 JP 2000577483 A JP2000577483 A JP 2000577483A JP 2000577483 A JP2000577483 A JP 2000577483A JP 2003527560 A5 JP2003527560 A5 JP 2003527560A5
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JP
Japan
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JP2000577483A
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JP2003527560A (ja
JP4667599B2 (ja
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Priority claimed from PCT/US1999/024444 external-priority patent/WO2000023794A1/en
Publication of JP2003527560A publication Critical patent/JP2003527560A/ja
Publication of JP2003527560A5 publication Critical patent/JP2003527560A5/ja
Application granted granted Critical
Publication of JP4667599B2 publication Critical patent/JP4667599B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2000577483A 1998-10-16 1999-10-15 基板の表面地形を写像するための方法および装置 Expired - Lifetime JP4667599B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10449098P 1998-10-16 1998-10-16
US60/104,490 1998-10-16
PCT/US1999/024444 WO2000023794A1 (en) 1998-10-16 1999-10-15 Method and apparatus for mapping surface topography of a substrate

Publications (3)

Publication Number Publication Date
JP2003527560A JP2003527560A (ja) 2003-09-16
JP2003527560A5 true JP2003527560A5 (ja) 2011-01-20
JP4667599B2 JP4667599B2 (ja) 2011-04-13

Family

ID=22300783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000577483A Expired - Lifetime JP4667599B2 (ja) 1998-10-16 1999-10-15 基板の表面地形を写像するための方法および装置

Country Status (5)

Country Link
US (1) US6621581B1 (ja)
EP (1) EP1129338A1 (ja)
JP (1) JP4667599B2 (ja)
AU (1) AU1212000A (ja)
WO (1) WO2000023794A1 (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1581781B1 (en) * 2003-01-09 2011-09-21 Orbotech Ltd. Method and apparatus for simultaneous 2-d and topographical inspection
EP1588127A1 (en) * 2003-01-14 2005-10-26 Koninklijke Philips Electronics N.V. Reconstruction of a surface topography
JP3926362B2 (ja) * 2003-10-24 2007-06-06 エーディーイー コーポレーション 半導体ウエーハ検査システムにおける半導体ウエーハ表面上の欠陥のサイズを判定する方法
DE10359723B4 (de) * 2003-12-19 2014-03-13 Vistec Semiconductor Systems Gmbh Vorrichtung und Verfahren zur Inspektion eines Wafers
US7196801B1 (en) 2004-02-03 2007-03-27 Kla-Tencor Technologies Corporation Patterned substrate surface mapping
US20100153024A1 (en) * 2005-06-28 2010-06-17 Koninklijke Philips Electronics, N.V. Mapping a surface profile
US7385768B2 (en) * 2005-11-22 2008-06-10 D + S Consulting, Inc. System, method and device for rapid, high precision, large angle beam steering
JP2008032669A (ja) * 2006-07-27 2008-02-14 Oputouea Kk 光走査式平面外観検査装置
US8402785B2 (en) * 2007-11-09 2013-03-26 Corning Incorporated Method and apparatus for measuring surface shape profile
CN101650170B (zh) * 2009-07-24 2012-03-28 上海宏力半导体制造有限公司 晶圆表面粗糙度检测方法
FR2981197B1 (fr) * 2011-10-07 2013-11-01 Altatech Semiconductor Dispositif et procede pour l'inspection de produits semi-conducteurs.
DE102014108789A1 (de) * 2014-06-24 2016-01-07 Byk-Gardner Gmbh Mehrstufiges Verfahren zur Untersuchung von Oberflächen sowie entsprechende Vorrichtung
JP6460953B2 (ja) * 2015-09-30 2019-01-30 株式会社日立ハイテクファインシステムズ 光学式表面検査装置及び光学式表面検査方法
DE102020003850A1 (de) 2020-06-26 2021-12-30 Baumer Inspection Gmbh Vorrichtung zum Bestimmen eines Höhenprofils eines Objekts
US20240162074A1 (en) * 2022-11-10 2024-05-16 Kla Corporation Methods And Systems For Measurement Of Semiconductor Structures With Active Tilt Correction

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3037622A1 (de) 1980-10-04 1982-04-22 Theodor Prof. Dr.-Ing. 1000 Berlin Gast Optoelektronisches messverfahren und einrichtungen zum bestimmen der oberflaechenguete streuend reflektierender oberflaechen
US4364663A (en) 1980-11-17 1982-12-21 Caterpillar Tractor Co. Surface roughness gauge and method
US4511800A (en) 1983-03-28 1985-04-16 Rca Corporation Optical reflectance method for determining the surface roughness of materials in semiconductor processing
US5046847A (en) 1987-10-30 1991-09-10 Hitachi Ltd. Method for detecting foreign matter and device for realizing same
US4844616A (en) 1988-05-31 1989-07-04 International Business Machines Corporation Interferometric dimensional measurement and defect detection method
US5369286A (en) 1989-05-26 1994-11-29 Ann F. Koo Method and apparatus for measuring stress in a film applied to surface of a workpiece
GB9009110D0 (en) 1990-04-23 1990-06-20 Europ Vision Syst Centre Improvements relating to optical measuring systems
US5189481A (en) 1991-07-26 1993-02-23 Tencor Instruments Particle detector for rough surfaces
US5436464A (en) 1992-04-13 1995-07-25 Nikon Corporation Foreign particle inspecting method and apparatus with correction for pellicle transmittance
JP3144661B2 (ja) * 1992-09-29 2001-03-12 富士通株式会社 立体電極外観検査装置
US5923430A (en) * 1993-06-17 1999-07-13 Ultrapointe Corporation Method for characterizing defects on semiconductor wafers
US5883710A (en) 1994-12-08 1999-03-16 Kla-Tencor Corporation Scanning system for inspecting anomalies on surfaces
US5712701A (en) 1995-03-06 1998-01-27 Ade Optical Systems Corporation Surface inspection system and method of inspecting surface of workpiece
US5903342A (en) 1995-04-10 1999-05-11 Hitachi Electronics Engineering, Co., Ltd. Inspection method and device of wafer surface
JPH08285531A (ja) * 1995-04-13 1996-11-01 Mitsubishi Electric Corp チップマッピング装置およびその方法
WO1997026529A1 (en) * 1996-01-19 1997-07-24 Phase Metrics Surface inspection apparatus and method
US6046801A (en) * 1997-12-23 2000-04-04 Analog Technologies, Inc. Laser-based inspection system for optical disks

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