JP2003527560A5 - - Google Patents
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- Publication number
- JP2003527560A5 JP2003527560A5 JP2000577483A JP2000577483A JP2003527560A5 JP 2003527560 A5 JP2003527560 A5 JP 2003527560A5 JP 2000577483 A JP2000577483 A JP 2000577483A JP 2000577483 A JP2000577483 A JP 2000577483A JP 2003527560 A5 JP2003527560 A5 JP 2003527560A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10449098P | 1998-10-16 | 1998-10-16 | |
US60/104,490 | 1998-10-16 | ||
PCT/US1999/024444 WO2000023794A1 (en) | 1998-10-16 | 1999-10-15 | Method and apparatus for mapping surface topography of a substrate |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2003527560A JP2003527560A (ja) | 2003-09-16 |
JP2003527560A5 true JP2003527560A5 (ja) | 2011-01-20 |
JP4667599B2 JP4667599B2 (ja) | 2011-04-13 |
Family
ID=22300783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000577483A Expired - Lifetime JP4667599B2 (ja) | 1998-10-16 | 1999-10-15 | 基板の表面地形を写像するための方法および装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6621581B1 (ja) |
EP (1) | EP1129338A1 (ja) |
JP (1) | JP4667599B2 (ja) |
AU (1) | AU1212000A (ja) |
WO (1) | WO2000023794A1 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1581781B1 (en) * | 2003-01-09 | 2011-09-21 | Orbotech Ltd. | Method and apparatus for simultaneous 2-d and topographical inspection |
EP1588127A1 (en) * | 2003-01-14 | 2005-10-26 | Koninklijke Philips Electronics N.V. | Reconstruction of a surface topography |
JP3926362B2 (ja) * | 2003-10-24 | 2007-06-06 | エーディーイー コーポレーション | 半導体ウエーハ検査システムにおける半導体ウエーハ表面上の欠陥のサイズを判定する方法 |
DE10359723B4 (de) * | 2003-12-19 | 2014-03-13 | Vistec Semiconductor Systems Gmbh | Vorrichtung und Verfahren zur Inspektion eines Wafers |
US7196801B1 (en) | 2004-02-03 | 2007-03-27 | Kla-Tencor Technologies Corporation | Patterned substrate surface mapping |
US20100153024A1 (en) * | 2005-06-28 | 2010-06-17 | Koninklijke Philips Electronics, N.V. | Mapping a surface profile |
US7385768B2 (en) * | 2005-11-22 | 2008-06-10 | D + S Consulting, Inc. | System, method and device for rapid, high precision, large angle beam steering |
JP2008032669A (ja) * | 2006-07-27 | 2008-02-14 | Oputouea Kk | 光走査式平面外観検査装置 |
US8402785B2 (en) * | 2007-11-09 | 2013-03-26 | Corning Incorporated | Method and apparatus for measuring surface shape profile |
CN101650170B (zh) * | 2009-07-24 | 2012-03-28 | 上海宏力半导体制造有限公司 | 晶圆表面粗糙度检测方法 |
FR2981197B1 (fr) * | 2011-10-07 | 2013-11-01 | Altatech Semiconductor | Dispositif et procede pour l'inspection de produits semi-conducteurs. |
DE102014108789A1 (de) * | 2014-06-24 | 2016-01-07 | Byk-Gardner Gmbh | Mehrstufiges Verfahren zur Untersuchung von Oberflächen sowie entsprechende Vorrichtung |
JP6460953B2 (ja) * | 2015-09-30 | 2019-01-30 | 株式会社日立ハイテクファインシステムズ | 光学式表面検査装置及び光学式表面検査方法 |
DE102020003850A1 (de) | 2020-06-26 | 2021-12-30 | Baumer Inspection Gmbh | Vorrichtung zum Bestimmen eines Höhenprofils eines Objekts |
US20240162074A1 (en) * | 2022-11-10 | 2024-05-16 | Kla Corporation | Methods And Systems For Measurement Of Semiconductor Structures With Active Tilt Correction |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3037622A1 (de) | 1980-10-04 | 1982-04-22 | Theodor Prof. Dr.-Ing. 1000 Berlin Gast | Optoelektronisches messverfahren und einrichtungen zum bestimmen der oberflaechenguete streuend reflektierender oberflaechen |
US4364663A (en) | 1980-11-17 | 1982-12-21 | Caterpillar Tractor Co. | Surface roughness gauge and method |
US4511800A (en) | 1983-03-28 | 1985-04-16 | Rca Corporation | Optical reflectance method for determining the surface roughness of materials in semiconductor processing |
US5046847A (en) | 1987-10-30 | 1991-09-10 | Hitachi Ltd. | Method for detecting foreign matter and device for realizing same |
US4844616A (en) | 1988-05-31 | 1989-07-04 | International Business Machines Corporation | Interferometric dimensional measurement and defect detection method |
US5369286A (en) | 1989-05-26 | 1994-11-29 | Ann F. Koo | Method and apparatus for measuring stress in a film applied to surface of a workpiece |
GB9009110D0 (en) | 1990-04-23 | 1990-06-20 | Europ Vision Syst Centre | Improvements relating to optical measuring systems |
US5189481A (en) | 1991-07-26 | 1993-02-23 | Tencor Instruments | Particle detector for rough surfaces |
US5436464A (en) | 1992-04-13 | 1995-07-25 | Nikon Corporation | Foreign particle inspecting method and apparatus with correction for pellicle transmittance |
JP3144661B2 (ja) * | 1992-09-29 | 2001-03-12 | 富士通株式会社 | 立体電極外観検査装置 |
US5923430A (en) * | 1993-06-17 | 1999-07-13 | Ultrapointe Corporation | Method for characterizing defects on semiconductor wafers |
US5883710A (en) | 1994-12-08 | 1999-03-16 | Kla-Tencor Corporation | Scanning system for inspecting anomalies on surfaces |
US5712701A (en) | 1995-03-06 | 1998-01-27 | Ade Optical Systems Corporation | Surface inspection system and method of inspecting surface of workpiece |
US5903342A (en) | 1995-04-10 | 1999-05-11 | Hitachi Electronics Engineering, Co., Ltd. | Inspection method and device of wafer surface |
JPH08285531A (ja) * | 1995-04-13 | 1996-11-01 | Mitsubishi Electric Corp | チップマッピング装置およびその方法 |
WO1997026529A1 (en) * | 1996-01-19 | 1997-07-24 | Phase Metrics | Surface inspection apparatus and method |
US6046801A (en) * | 1997-12-23 | 2000-04-04 | Analog Technologies, Inc. | Laser-based inspection system for optical disks |
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1999
- 1999-10-15 US US09/418,722 patent/US6621581B1/en not_active Expired - Fee Related
- 1999-10-15 AU AU12120/00A patent/AU1212000A/en not_active Abandoned
- 1999-10-15 JP JP2000577483A patent/JP4667599B2/ja not_active Expired - Lifetime
- 1999-10-15 WO PCT/US1999/024444 patent/WO2000023794A1/en not_active Application Discontinuation
- 1999-10-15 EP EP99970734A patent/EP1129338A1/en not_active Ceased