JP2003347776A - Mounted structure of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounted structure of electronic components wherein modules generating no heat and components generating no heat are forced to receive no thermal effect from modules generating heat and components generating heat, and the modules are forced not to interfere with each other. <P>SOLUTION: The components generating heat or the modules including the components generating heat are provided on one surface of a heat sink, and the components generating no heat or the modules configured out of the components generating no heat are provided on the other surface of the heat sink. <P>COPYRIGHT: (C)2004,JPO

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting structure in which a heat-generating component and a non-heat-generating component are mounted on the same electronic device.

[0002]

2. Description of the Related Art In electronic equipment, a component that generates a large amount of heat (hereinafter referred to as a heat generating component) and a component that generates a small amount of heat (hereinafter referred to as a non-heat generating component) are often mounted in the same housing. Components are susceptible to heat, and will not operate normally when the temperature rises, the failure rate will increase, the characteristics will change due to the application of mechanical stress, and the characteristics will deteriorate due to chemical change. Cause.

For this reason, conventionally, a heat-generating component has been mounted on a heat sink, radiated heat through the heat sink, and cooled so that the electronic component does not reach a predetermined temperature or higher.

A conventional electronic component mounting structure will be described with reference to FIGS.

In FIG. 1, reference numeral 1 denotes a front panel, 2 denotes a heat sink, 3 denotes a bottom cover, 4 denotes an upper cover, and 5 denotes a handle. The illustrated electronic device is mounted on a rack (not shown) via the front panel 1, and the rack is provided with a fan for forced cooling.

The heat sink 2 is arranged so that the fins 6 are located on the upper surface side, and a portion of the front panel 1 facing the fins 6 is cut off.

A power supply unit 8, an error amplification unit 9, a main amplification unit 11, and a control unit 1 are provided on the back surface of the base 7 of the heat sink 2.
2. The power supply unit 8, the error amplification unit 9, the main amplification unit 11, the control unit 12,
The receiving unit 13 is shielded to avoid mutual interference. In particular, since the receiving unit 13 is easily affected by the power supply unit 8, the error amplifying unit 9, and the main amplifying unit 11, the receiving unit 13 is mounted separately. The power supply unit 8, the error amplification unit 9, the main amplification unit 11, the control unit 12, and the reception unit 13 are covered by a bottom cover 3.

In FIG. 15, the fin 6 is cut off at a part of the upper left corner of the heat sink 2, and a circulator 14, a coupler 15, and a terminating resistor 16 are provided on the upper surface of the base 7.
Etc. are mounted, and these are covered by the upper surface cover 4, and the fins 6 are exposed.

The power supply unit 8, the error amplifying unit 9, and the main amplifying unit 11 have heat-generating components having a large heat value.
Further, the control section 12 and the receiving section 13 do not have components having a large heat value.

As mentioned above, electronic components are susceptible to heat and must be cooled below a predetermined temperature. In the above-described conventional electronic component mounting structure, the fins 6 are exposed, and the cooling air passes through the notches of the front panel 1 to the rear side through the fins 6. . Heat generated from a heat generating module such as the power supply unit 8 is radiated through the fins 6.

[0011]

In the above-mentioned conventional electronic component mounting structure, each module is mounted on one surface of the heat sink 2 and further radiates heat through the fins 6 of the heat sink 2.

That is, the heat generated from the power supply unit 8, the error amplifying unit 9, and the main amplifying unit 11 is once transmitted to the base 7 of the heat sink 2, and
More heat is dissipated. Therefore, the control unit 12 and the receiving unit 13 attached to the base 7 are affected by heat from the power supply unit 8 and the like via the base 7.

Many of the control unit 12 and the receiving unit 13 are more susceptible to heat than the components included in the heat generating module such as the power supply unit 8 and the like. In addition to cooling, the cooling structure must be such that the non-heat-generating module does not exceed a predetermined temperature.

For this reason, the apparatus has to be provided with a cooling capacity higher than required by the power supply section 8, the error amplification section 9, and the main amplification section 11, and the like.

The present invention has been made in view of the above circumstances, and has been made so that the non-heat generating module and the non-heat generating component are not affected by the heat of the heat generating module and the heat generating component, and the interference between the modules is eliminated.

[0016]

SUMMARY OF THE INVENTION The present invention provides an electronic component in which a heat-generating component or a module including a heat-generating component is provided on one surface of a heat sink, and a non-heat-generating component or a module composed of non-heat-generating components is provided on the other surface of the heat sink. The heat-generating component or the module including the heat-generating component is directly attached to the base of the heat sink, and the module including the non-heat-generating component or the non-heat-generating component is the electronic component mounted on the base via a spacer. It relates to a mounting structure.

[0017]

Embodiments of the present invention will be described below with reference to the drawings.

1 to 8, the same components as those shown in FIGS. 9 to 16 are denoted by the same reference numerals.

A power supply unit 8, an error amplification unit 9, and a main amplification unit 11 are mounted on the back surface of the base 7 of the heat sink 2, and the power supply unit 8, the error amplification unit 9, and the main amplification unit 11 are shielded. I have. The power supply section 8, the error amplification section 9, and the main amplification section 11 are covered by a bottom cover 3.

In FIG. 7, the upper half and lower part of the fin 6 on the upper left side of the heat sink 2 are cut away except for the base 6a.
Are arranged and attached to the base 7 via a spacer 20. With the control unit 12 and the receiving unit 13 attached, the height of the control unit 12 and the receiving unit 13 is lower than the upper end of the fin 6.

A circulator 1 is provided on the base 7 at the upper left corner of the heat sink 2 from which the fins 6 are cut off.
4, a coupler 15, a terminating resistor 16, and the like are mounted.

The control unit 12, the receiving unit 13, the circulator 14, the coupler 15, the terminating resistor 16
And the like are covered by a top cover 4, and the fins 6 are exposed.

The fins 6 and the base 6 of the front panel 1
The portion facing a is cut off, so that cooling air passes through the fin 6 and the base 6a.

If there is sufficient height, the upper half of the fin 6 is not cut off, and the upper end of the fin 6 is provided with the heat generated by the control unit 12 and the receiving unit 13 via the spacer 20. Fewer components and modules may be installed. or,
Even in the case of cutting, the height of the control unit 12 and the receiving unit 13 does not need to be lower than the upper end of the fin 6. or,
The control unit 12 and the receiving unit 13 may be directly attached to the fins 6 using a tapping screw or the like that is screwed between the fins 6.

The spacer 20 may be made of a material having low thermal conductivity such as ceramic.

With the above configuration, heat generated in the power supply unit 8, the error amplification unit 9, and the main amplification unit 11 is transmitted to the fins 6 and the base 6a via the base 7,
The heat is radiated to the cooling air flowing through the notch of the front panel 1, and the power supply unit 8, the error amplification unit 9, and the main amplification unit 11 are cooled to a predetermined temperature.

The control section 12 and the receiving section 13 are mounted so as to be floated from the base 7 by the spacer 20. The power supply section 8, the error amplifying section 9, and the main amplifying section 11 are provided.
It is not affected by heat from The control unit 1
2, a receiving unit 13, the power supply unit 8, the error amplifying unit 9,
Since the main amplifying unit 11 is provided with the heat sink 2 interposed, the main amplifying unit 11 is electrically isolated and does not receive interference from other modules.

Further, parts are provided on both sides of the heat sink 2.
By mounting the module, the mounting area is substantially enlarged or the mounting efficiency is improved.

Further, the control unit 12 and the receiving unit 13
Is not located behind the power supply unit 8, the error amplification unit 9, and the main amplification unit 11 and when heat radiation is not required, the fins 6 are cut off without leaving the base 6a, and the spacers 20 are removed.
May be attached to the base 7 via the.

Therefore, the reliability of the electronic equipment, the prevention of deterioration of parts, and the reduction of the failure rate can be achieved, and the electronic equipment can be reduced in size or the degree of freedom in design can be improved.

The present invention includes the following embodiments.

[0032]

[Supplementary Note 1] A heat-generating component or a module including a heat-generating component is provided on one surface of a heat sink, and a non-heat-generating component or a module composed of non-heat-generating components is provided on the other surface of the heat sink. A mounting structure for an electronic component, wherein the module is mounted on a base of a heat sink, and the non-heat-generating component or the module composed of the non-heat-generating component has a heat sink fin interposed therebetween.

(Supplementary note 2) Mounting of the electronic component according to Supplementary note 1, wherein the fin is cut off while leaving the base of the fin, and a non-heat-generating component or a module composed of non-heat-generating components is attached to the heat sink via the base. Construction.

[0034]

As described above, according to the present invention, a heat-generating component or a module including a heat-generating component is provided on one surface of a heat sink, and a non-heat-generating component or a module composed of non-heat-generating components is provided on the other surface of the heat sink. Therefore, a non-heat-generating component or a module composed of non-heat-generating components can suppress the influence of heat from a heat-generating component or a module including a heat-generating component, and can improve the mounting efficiency of components and modules, The degree of freedom increases. Furthermore, since the heat-generating component or the module including the non-heat-generating component and the module including the heat-generating component or the heat-generating component are separated by the heat sink, interference between the modules is suppressed.

Since the heat-generating component or the module including the heat-generating component is directly mounted on the base of the heat sink, and the non-heat-generating component or the module including the non-heat-generating component is mounted on the base via the spacer, the heat transfer from the heat sink is achieved. Is suppressed, and the non-heat-generating component or a module constituted by the non-heat-generating component is exerted an excellent effect such as further reducing the thermal effect.

[Brief description of the drawings]

FIG. 1 is a front view showing an embodiment of the present invention.

FIG. 2 is a plan view showing the embodiment of the present invention.

FIG. 3 is a right side view showing the embodiment of the present invention.

FIG. 4 is a bottom view showing the embodiment of the present invention.

FIG. 5 is a rear view showing the embodiment of the present invention.

FIG. 6 is a front view showing a mounted state of a heat sink and components according to the embodiment of the present invention.

FIG. 7 is a plan view showing a mounting state of a heat sink and components in the embodiment of the present invention.

FIG. 8 is a bottom view showing a mounting state of a heat sink and components according to the embodiment of the present invention.

FIG. 9 is a front view of a conventional example.

FIG. 10 is a plan view of a conventional example.

FIG. 11 is a right side view of the conventional example.

FIG. 12 is a bottom view of a conventional example.

FIG. 13 is a rear view of the conventional example.

FIG. 14 is a front view showing a mounting state of a heat sink and components of a conventional example.

FIG. 15 is a plan view showing a mounting state of a heat sink and components of a conventional example.

FIG. 16 is a bottom view showing a mounting state of a heat sink and components of a conventional example.

[Explanation of symbols]

1 Front panel 2 heat sink 6 fins 6a base 7 Base 8 Power supply section 9 Error amplification section 11 Main amplifier 12 control unit 13 Receiver

   ────────────────────────────────────────────────── ─── Continuation of front page    (72) Inventor Joe Sakamoto             3-14-20 Higashinakano, Nakano-ku, Tokyo Stock             Hitachi Kokusai Electric Inc. F term (reference) 5E322 AA01 AA03                 5F036 AA01 BA04 BA26 BB08 BC17

Claims (2)

[Claims] 1. A mounting structure for an electronic component, wherein a heat-generating component or a module including a heat-generating component is provided on one surface of a heat sink, and a non-heat-generating component or a module composed of non-heat-generating components is provided on the other surface of the heat sink. . 2. The electronic device according to claim 1, wherein the heat-generating component or a module including the heat-generating component is directly mounted on a base of a heat sink, and the module including the non-heat-generating component or the non-heat-generating component is mounted on the base via a spacer. Component mounting structure.