JP2003343036A - Outer wall panel structure and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an outer wall panel structure which has excellent strength against external pressure and vibrations, expels moisture from the interior thereof, and exhibits stable properties over a long period of time, and to provide a method for manufacturing the same. <P>SOLUTION: The outer wall structure consists of a steel plate 3 having a recessed saucer shape, a plaster board 1, and a cured material 2 of a photo- curing adhesive (preferably a compound having a specific functional group). The plaster board 1 is bonded to a recessed surface of the steel plate 3 via the cured material 2 of the photo-curing adhesive. The method for manufacturing the outer wall structure is also provided. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an outer wall panel structure used for an outer wall of a building or the like and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, the outer wall portion of a building is disclosed in Japanese Patent Publication No. 63-
As described in Japanese Patent No. 56380, an outer wall material (outer wall material) is fixed on the outdoor side and an inner wall material (inner wall material) is fixed on the indoor side (see FIG. 1 of the publication). It was being done. As such an outer wall material, a material having excellent water resistance, fire resistance, and durability is usually desired, and, for example, a concrete block, ALC, a steel plate or the like has been used. Further, as the inner wall material, a material excellent in heat insulation and fire resistance is desired, and for example, gypsum board and the like have been used.

However, recently, an outer wall panel in which an inner wall material such as a gypsum board and an outer wall material are integrated has begun to be used.
This outer wall panel is suitable in that the outer wall material and the inner wall material can be provided at the same time only by attaching the outer wall panel to the outdoor side of the outer wall portion such as a building.

[0004]

However, according to the studies made by the present inventors, in the conventional outer wall panel, an emulsion adhesive is usually used as an adhesive for joining the inner wall material and the outer wall material. Therefore, the elasticity after curing becomes too high, and the outer wall panel may be broken or peeled when external pressure or vibration is applied due to an earthquake or the like.
Further, even after the adhesive is hardened, water tends to remain inside the outer wall panel structure, which may cause mold, deterioration, and damage of the outer wall panel.

In view of the above-mentioned problems of the conventional outer wall panel, an object of the present invention is to have excellent strength against external pressure and vibration and to have stable performance for a long period of time without water remaining inside. An object of the present invention is to provide an outer wall panel structure that can be exhibited and a method for manufacturing the same.

[0006]

An outer wall panel structure according to claim 1 comprises a steel plate having a concave saucer shape, a cured product of a gypsum board and a photo-curing adhesive, and is provided on the concave side of the steel plate. It is characterized in that a gypsum board is adhered via a cured product of a photocurable adhesive. The outer wall panel structure according to claim 2 is the outer wall panel structure according to claim 1, wherein the photocurable adhesive has a compound (A) having a functional group represented by the following general formula (1) and the following: It is characterized by comprising a compound (B) having a functional group represented by the general formula (2).

[Chemical 3] [In the formula, m represents an integer of 2 or 3, X represents a hydrolyzable functional group, and R represents a hydrocarbon group. ]

[Chemical 4] [In the formula, m is an integer of 2 to 5, Y ^(m) is an element having m covalent substituents, and when m = 2, Y ⁽²⁾ is oxygen, and when m = 3, Y ⁽ m ³⁾ is nitrogen or phosphorus, when m = 4 Y ⁽⁴⁾ is carbon, and when m = 5 Y ⁽⁵⁾ is phosphorus, Z is a hydrocarbon group or an oxide group (provided that the oxide group is m = 4.
Or 5). The outer wall panel structure according to claim 3 is the outer wall panel structure according to claim 2, wherein the compound (B) is at least one selected from a carboxylic acid anhydride, a carboxylic acid imide and a diacylphosphine oxide. It is characterized by The method of manufacturing an outer wall panel structure according to any one of claims 1 to 3, wherein a light-curing adhesive is applied to the concave side of a steel plate having a concave saucer shape, and applied. The gypsum board is adhered after the adhesive is irradiated with light to initiate a curing reaction.

The present invention will be described in detail below. The photo-curable adhesive used in the present invention is an adhesive that starts to cure upon irradiation with light such as visible light, ultraviolet light, and electron beam. Examples of the above-mentioned adhesive include an acrylic ultraviolet curable adhesive, an unsaturated polyester ultraviolet curable adhesive, an ene-thiol ultraviolet curable adhesive, a photocationic curable adhesive, the compound (A) and a compound. Examples thereof include an ultraviolet curable adhesive composed of (B) and an adhesive obtained by combining them with another curable adhesive. Above all,
The compound consisting of the compound (A) and the compound (B) is preferable in terms of excellent strain absorption.

The compound (A) is not particularly limited as long as it has a functional group represented by the general formula (1), and a hydrolyzable functional group represented by X on a silicon atom (hereinafter, referred to as " It is also a compound having a structure in which two or three functional groups (X) are bonded. The hydrolyzable functional group (X) is one in which a bond of a silicon atom (Si) -functional group (X) exhibits hydrolyzability, and specific examples thereof include an alkoxy group, an oxime group, Examples thereof include an alkenyloxy group, an acetoxy group and a halogen group such as chlorine, bromine and iodine. Among them, an alkoxy group is preferable from the viewpoint of storage stability.

Examples of the alkoxy group include methoxy group, ethoxy group, propyloxy group, isopropyloxy group, butoxy group, tert-butoxy group, phenoxy group and benzyloxy group. In the case of a dialkoxysilyl group or a trialkoxysilyl group, the same alkoxy group may be used, or different alkoxy groups may be used in combination. Further, different kinds of functional groups (X) may be used in combination. Furthermore,
A plurality of different compounds (A) may be used in combination in the photocurable adhesive of the present invention.

In the general formula (1), the hydrocarbon group represented by R (hereinafter also referred to as "hydrocarbon group (R)") is not particularly limited, and examples thereof include an aliphatic hydrocarbon group,
Examples thereof include unsaturated aliphatic hydrocarbon groups and aromatic hydrocarbon groups. These hydrocarbon groups have a substituent such as an amino group, a hydroxyl group, an ether group, an epoxy group, a polymerizable unsaturated group, a urethane group, a urea group, an imide group, and an ester group as long as the object of the present invention is not impaired. It may be.

Specific examples of the compound (A) include dimethoxydimethylsilane, cyclohexyldimethoxymethylsilane, diethoxydimethylsilane, dimethoxymethyloctylsilane, diethoxymethylvinylsilane, chloromethyl (diisopropoxy) methylsilane, dimethoxy. Methylphenylsilane, diethoxydiphenylsilane, trimethoxysilane, triethoxysilane, methyltrimethoxysilane, trimethoxypropylsilane, isobutyltrimethoxysilane, octyltrimethoxysilane, octadecyltrimethoxysilane, methyltriethoxysilane, ethyltriethoxy Silane,
Isobutyltriethoxysilane, octyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyltriethoxysilane, (3-chloropropyl) trimethoxysilane, chloromethyltriethoxysilane, tris (2-methoxyethoxy) vinylsilane, 3-glycidoxypropyltrimethoxysilane, diethoxy (3-glycidoxypropyl) methylsilane,
Chlorotrimethoxysilane, chlorotriethoxysilane, chlorotris (1,3-dimethylbutoxy) -silane, dichlorodiethoxysilane, 3- (triethoxysilyl) -propionitrile, 4- (triethoxysilyl) -butyronitrile, 3 -(Triethoxysilyl)-
Propyl isocyanate, 3- (triethoxysilyl)
-Propylthioisocyanate, phenyltrimethoxysilane, phenyltriethoxysilane, tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetrabutoxysilane, 1,3,5,7-tetraethoxy-1,3,5,7- Tetramethylcyclotetrasiloxane, 1,3,5,7-tetramethyl-1,3,
5,7-tetraproxylcyclotetrasiloxane, 1,
3,5,7-Tetraisopropoxy-1,3,5,7-
Tetramethylcyclotetrasiloxane, 1,3,5,7
-Tetrabutoxy-1,3,5,7-tetramethylcyclotetrasiloxane, 1,3,5,7,9-pentaethoxy-1,3,5,7,9-pentamethylcyclopentasiloxane, octamethylcyclo Tetrasiloxane, decamethylcyclopentasiloxane, dodecamethylcyclohexasiloxane, hexaphenylcyclotrisiloxane, octaphenylcyclotetrasiloxane, 1,3
5,7-tetramethylcyclotetrasiloxane, 1,
3,5,7-Tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane, 1,1,3,3,5,
5-hexamethylcyclotrisilazane, 1,1,3
3,5,5,7,7-octamethylcyclotetrasilazane, 1,7-diacetoxyoctamethyltetrasiloxane, 1,7-dichlorooctamethyltetrasiloxane,
1,1,3,3,5,5-hexamethyl-1,5-dichlorotrisiloxane, 1,3-dichlorotetraisopropyldisiloxane, 1,3-diethoxytetramethyldisiloxane, 1,3-dimethoxytetramethyl Disiloxane, 1,1,3,3-tetramethyl-1,3-dichlorodisiloxane, 1,2-bis (methyldichlorosilyl) ethane, diacetoxydiphenylsilane, methyltris (ethylmethylketoxime) silane, methyltris ( N, N-diethylaminoxy) silane, bis (ethylmethylketoxime) methylisopropoxysilane,
Bis (ethylmethylketoxime) ethoxymethylsilane, tris (1-methylvinyloxy) vinylsilane, methyltriisopropenoxysilane, ethyltriacetoxysilane, methyltriacetoxysilane, diacetoxydimethylsilane, triacetoxyvinylsilane, tetraacetoxysilane , Diacetoxymethylphenylsilane, dimethoxyethylmethylketoxime methylsilane and the like.

As another specific example of the compound (A), a compound having two or more functional groups represented by the general formula (1) in one molecule is a combination of the functional groups having different structures. May be a compound, for example, propylene glycol or ethylene glycol, a polymer having an alkylene glycol such as butylene glycol as a monomer unit, a polyester having an ester bond, a polyamide having an amide bond, a polycarbonate having a carbonate bond, polymethacrylate, Examples thereof include polymers such as polyacrylate, polystyrene, and polyolefin, and copolymers thereof in which two or more functional groups represented by the general formula (1) are introduced into one molecule. The substitution position of the functional group in the polymer may be located at the end of the polymer or may be located at the side chain of the polymer. It may be located at both the polymer end and the side chain.

Among the above compounds (A), commercially available compounds include, for example, MS polymers S-203, S-303, and S as trade name MS polymers manufactured by Kaneka Corporation.
-903, Epion, etc., as Cyryl polymers such as Cyryl SAT-200, MA-403, MA-447, etc., Exastar ESS-2410, ESS-2 manufactured by Asahi Glass Co., Ltd.
420, ESS-3630, acetoxy-terminated polydimethylsiloxane (PS363.5), dimethylamino-terminated polydimethylsiloxane (PS383) manufactured by Chisso Corporation,
Ethoxy-terminated polydimethylsiloxane (PS393),
Stearyloxy-terminated polydimethylsiloxane (PS05
3.5), triethoxysilyl modified poly (1,2-butadiene) (PS078.5), (N-trimethoxysilylpropyl) polyazamide (PS075), (N-trimethoxysilylpropyl) polyethyleneimine (PS0).
76), (N-trimethoxysilylpropyl) -O-polyethylene oxide urethane (PS077) and the like.

The compound (B) is a compound having a functional group represented by the above general formula (2), which is a compound in which a plurality of different functional groups represented by the general formula (2) are combined in one molecule. May be Moreover, in the photocurable adhesive of the present invention, a plurality of different compounds (B) may be used in combination.

As the functional group represented by the general formula (2), for example, a compound in which two carbonyl groups are bonded to the atom represented by Y ^(m) selected from oxygen, sulfur, nitrogen, phosphorus and carbon. And has a hydrocarbon group or oxide group represented by Z as appropriate depending on the valence of the atom represented by Y ^(m) .

Examples of the above hydrocarbon group include hydrocarbon groups such as aliphatic hydrocarbon groups, unsaturated aliphatic hydrocarbon groups and aromatic hydrocarbon groups. These hydrocarbon groups have a substituent such as an amino group, a hydroxyl group, an ether group, an epoxy group, a polymerizable unsaturated group, a urethane group, a urea group, an imide group, and an ester group as long as the object of the present invention is not impaired. It may be. Also, different hydrocarbon groups may be used in combination.

The compound (B) may be a cyclic compound, for example, having one or two or more functional groups represented by the general formula (2), which are the same or different, in the cyclic chain. A compound etc. are mentioned. Further, a compound in which a plurality of these same or different cyclic compounds are bound by an appropriate organic group and a bicyclic compound containing at least one of the same or different cyclic compounds as a unit can be exemplified. .

Among the above compounds (B), carboxylic acid anhydrides, carboxylic acid imides and diacylphosphine oxides are preferable because they are excellent in photoreactivity, solubility in the compound (A), and economical efficiency. .

As a specific example of the above compound (B), Y
^{When the} atom represented by ^(m) is an oxygen atom, for example, acetic anhydride, propionic anhydride, butyric anhydride, isobutyric anhydride, valeric anhydride, 2-methylbutyric anhydride, trimethylacetic acid. Anhydride, hexanoic acid anhydride, heptanoic acid anhydride, decanoic acid anhydride, lauric acid anhydride, myristylic acid anhydride, palmitic acid anhydride, stearyl acid anhydride, docosanoic acid anhydride, crotonic acid anhydride, acrylic acid Anhydride, methacrylic anhydride, oleic anhydride, linoleic anhydride, chloroacetic anhydride, iodoacetic anhydride, dichloroacetic anhydride, trifluoroacetic anhydride, chlorodifluoroacetic anhydride, trichloroacetic anhydride, Pentafluoropropionic anhydride, heptafluorobutyric anhydride, succinic anhydride, methylsuccinic anhydride, 2,2- Methyl succinic anhydride, isobutyl succinic anhydride, 1,2-cyclohexanedicarboxylic anhydride, hexahydro-4-methylphthalic anhydride, itaconic anhydride, 1,2,3,6-tetrahydrophthalic anhydride, 3 , 4,5,6-Tetrahydrophthalic anhydride, maleic anhydride, 2-methylmaleic anhydride, 2,3-dimethylmaleic anhydride, 1-cyclopentene-1,2-dicarboxylic anhydride, glutar Acid anhydride, 1-naphthyl acetic acid anhydride, benzoic acid anhydride, phenyl succinic anhydride, phenyl maleic anhydride, 2,
3-diphenyl maleic anhydride, phthalic anhydride, 4
-Methylphthalic anhydride, 3,3 ', 4,4'-benzophenone tetracarboxylic acid dianhydride, 4,4'-(hexafluoropropylidene) diphthalic anhydride, 1,2,
4,5-Benzenetetracarboxylic anhydride, 1,8-naphthalenedicarboxylic anhydride, 1,4,5,8-naphthalenetetracarboxylic anhydride, etc .; having maleic anhydride and radically polymerizable double bond As a compound copolymer,
Examples thereof include a copolymer of maleic anhydride and (meth) acrylate, a copolymer of maleic anhydride and styrene, and a copolymer of maleic anhydride and vinyl ether. ADEKA Hardener E
H-700, ADEKA HARDNER EH-703, ADEKA HARDNER EH-705A; RINKASHID TH, RIKACID HT-1, RIKACID HH, RIKACID MH-700, RIKACID MH-700H, RIKACID MH, RIKACID SH, RIKARESIN manufactured by Shin Nippon Rika Co., Ltd. TMEG; HN-5000, HN-2000 manufactured by Hitachi Chemical Co., Ltd .; Epicure 134A, Epicure YH3 manufactured by Yuka Shell Epoxy Co., Ltd.
06, epicure YH307, epicure YH308
H ,; Sumicure MS manufactured by Sumitomo Chemical Co., Ltd., and the like.

As a specific example of the compound (B), Y
^{When the} atom represented by ^(m) is a nitrogen atom, for example, succinimide, N-methylsuccinimide, α, α-dimethyl-β-methylsuccinimide, α-methyl-α-propylsuccinimide, and maleimide. , N-methylmaleimide, N-ethylmaleimide, N-propylmaleimide, N-tert-butylmaleimide, N-laurylmaleimide, N-cyclohexylmaleimide, N-phenylmaleimide, N- (2-chlorophenyl) maleimide, N-benzyl Maleimide, N- (1-pyrenyl) maleimide, 3-methyl-N-phenylmaleimide, N,
N'-1,2-phenylenedimaleimide, N, N'-
1,3-phenylenedimaleimide, N, N'-1,4-
Phenylene dimaleimide, N, N '-(4-methyl-
1,3-phenylene) bismaleimide, 1,1 ′-(methylenedi-1,4-phenylene) bismaleimide, phthalimide, N-methylphthalimide, N-ethylphthalimide, N-propylphthalimide, N-phenylphthalimide, N- Examples thereof include benzylphthalimide and pyromellitic acid diimide.

As a specific example of the compound (B), Y
^{When the} atom represented by ^(m) is a phosphorus atom, for example, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide, bis (2,4,6-trimethylbenzoyl) ) -Phenylphosphine oxide and the like.

As a specific example of the above compound (B), Y
^{When the} atom represented by ^(m) is a carbon atom, for example,
2,4-pentanedione, 3-methyl-2,4-pentanedione, 3-ethyl-2,4-pentanedione, 3-
Chloro-2,4-pentanedione, 1,1,1-trifluoro-2,4-pentanedione, 1,1,1,5
5,5-hexafluoro-2,4-pentanedione,
Diketones such as 2,2,6,6-tetramethyl-3,5-heptanedione, 1-benzoylacetone and dibenzoylmethane; dimethyl malonate, diethyl malonate, dimethyl methyl malonate, tetraethyl 1,
Examples include polycarboxylic acid esters such as 1,2,2-ethanetetracarboxylic acid; and α-carbonyl-acetic acid esters such as methylacetylacetonate, ethylacetylacetonate, and methylpropionylacetate.

The compounding amount of the compound (B) is preferably 0.01 to 100 parts by weight of the compound (A).
30 parts by weight. If the blending amount is less than 0.01 parts by weight, photoreactivity may not be exhibited, and the blending amount is 30
If the amount is more than parts by weight, the light transmittance of the photocurable adhesive in the present invention is likely to be lowered, and only the light-irradiated surface may be polymerized or crosslinked, resulting in a marked decrease in deep reactivity. More preferably, it is 0.1 to 20 parts by weight.

The cured product of the photocurable adhesive in the present invention is obtained by irradiating the photocurable adhesive with light such as ultraviolet rays or electron beams (hereinafter, also simply referred to as "light irradiation"). The light source that can be used for the light irradiation is not particularly limited as long as the photocurable adhesive is exposed to light and a curing reaction is initiated, for example, a low pressure mercury lamp, a medium pressure mercury lamp,
Examples thereof include high-pressure mercury lamps, ultra-high-pressure mercury lamps, excimer lasers, chemical lamps, black light lamps, microwave-excited mercury lamps, metal halide lamps, sodium lamps, halogen lamps, xenon lamps, fluorescent lamps, sunlight, and electron beam irradiation devices. These may be used in combination.

The photocurable adhesive in the present invention may be a cross-linking accelerator, as long as the effect of the present invention is not impaired.
Various additives such as a sensitizer, a thickener / thixotropic agent, a physical property modifier, a filler, a reinforcing agent, a plasticizer, a colorant, and a flame retardant may be added. The cross-linking accelerator is used to accelerate the polymerization or cross-linking reaction of the compound (A) after light irradiation, and for example, an organometallic compound is suitable. This organometallic compound is preferably used in a situation where a light non-irradiated portion is accidentally or inevitably generated during light irradiation.

Examples of the above-mentioned organometallic compounds include germanium, tin, lead, boron, aluminum, gallium,
Examples thereof include organometallic compounds obtained by substituting an organic group with a metal element such as indium, titanium, and zirconium. Examples of the organometallic compound include dibutyltin dilaurate, dibutyltin oxide, dibutyltin diacetate, dibutyltin phthalate, bis (dibutyltin lauric acid) oxide, dibutyltin bisacetylacetonate, dibutyltin bis (monoester malate). Tin compounds such as tin octylate, dibutyltin octoate and dioctyltin oxide, tetra-n-butoxy titanate,
Examples thereof include titanate compounds such as tetraisopropoxy titanate, and these can be used alone or in combination of two or more kinds.

The amount of the organometallic compound added is not particularly limited, but is preferably 0.01 to 10 parts by weight with respect to 100 parts by weight of the photocurable adhesive. If the addition amount is less than 0.01 part by weight, the reaction of the compound (A) after light irradiation may not be promoted, and the addition amount is 1
If it exceeds 0 part by weight, the reaction may be promoted too much and the reaction product may be adversely affected. More preferably 0.1-8
Parts by weight.

The above-mentioned sensitizer is used for improving the photoreactivity of the photocurable adhesive in the present invention, that is, for shortening the light irradiation time, lowering the light irradiation energy, or improving the deep reactivity. It is used for the purpose of, for example, 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-
Acetophenone derivative compounds such as α, α′-dimethylacetophenone, methoxyacetophenone and 2,2-dimethoxy-2-phenylacetophenone; benzoin ether compounds such as benzoin ethyl ether and benzoin propyl ether; ketal derivative compounds such as benzyl dimethyl ketal; Halogenated ketone; Acylphosphine oxide; Acylphosphonate; 2-Methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-N, N
-Dimethylamino-1- (4-morpholinophenyl)
-1-butanone; bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide bis- (2,6
-Dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide; bis (η5-cyclopentadienyl) -bis (pentafluorophenyl) -titanium, bis (η5-cyclopentadienyl) -bis [2, 6-difluoro-3- (1H-pyrid-1-yl)
Phenyl] -titanium; anthracene, perylene, coronene, tetracene, benzanthracene, phenothiazine, flavin, acridine, ketocoumarin, thioxanthone derivative, benzophenone, acetophenone, 2-
Examples thereof include chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone and isopropylthioxanthone. These may be used alone,
You may use together 2 or more types.

The thickening agent is appropriately selected from polymer compounds having a high compatibility with the compound (A) in order to adjust the viscous properties of the photocurable adhesive. Polymer, methacrylic polymer,
Polyvinyl alcohol derivative, polyvinyl acetate, polystyrene derivative, polyesters, polyethers, polyisobutene, polyolefins, polyalkylene oxides, polyurethanes, polyamides, natural rubber, polybutadiene, polyisoprene, NBR, SBS, SI
S, SEBS, hydrogenated NBR, hydrogenated SBS, hydrogenated SIS,
Examples include hydrogenated SEBS and functional group modified products of these copolymers. These may be used alone or in combination of two or more.

The above thixotropic agent is appropriately selected from substances whose composition exhibits thixotropic properties in order to adjust the viscosity characteristics of the above photocurable adhesive,
Examples thereof include colloidal silica, polyvinylpyrrolidone, hydrophobized calcium carbonate, glass balloons, glass beads and the like. The thixotropic agent preferably has a surface having a high affinity for the compound (A).

As the physical property adjusting agent, various silane coupling agents and the like are used in order to improve tensile properties and the like, and examples thereof include vinyltrimethoxysilane, dimethyldimethoxysilane, methyltrimethoxysilane, methyltriethoxysilane and tetra. Methoxysilane, tetraethoxysilane, phenyltrimethoxysilane, diphenyldimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropylmethyldimethoxysilane, 3-
Aminopropyltriethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, N
-(2-aminoethyl) -3-aminopropyltriethoxysilane, N, N'-bis- [3- (trimethoxysilyl) propyl] ethylenediamine, N, N'-bis-
[3- (triethoxysilyl) propyl] ethylenediamine, N, N'-bis- [3- (trimethoxysilyl)
Propyl] hexaethylenediamine, N, N'-bis-
Examples include [3- (triethoxysilyl) propyl] hexaethylenediamine. These may be used alone or in combination of two or more.

The extender is not particularly limited, but those having little influence on the thixotropic property of the photocurable adhesive of the present invention are suitable, and examples thereof include talc, clay, calcium carbonate, magnesium carbonate and anhydrous. Examples thereof include silicon, hydrous silicon, calcium silicate, titanium dioxide, carbon black and the like. These may be used alone or in combination of two or more.

Examples of the plasticizers include phosphoric acid esters such as tributyl phosphate and tricresyl phosphate, phthalic acid esters such as dioctyl phthalate, fatty acid-basic acid esters such as glycerin monooleyl acid ester, and adipine. Fatty acid dibasic acid esters such as dioctyl acid, polypropylene glycols and the like can be mentioned. These may be used alone or in combination of two or more.

In addition to the above, anti-sagging agents, antioxidants, anti-aging agents, ultraviolet absorbers, solvents, fragrances, pigments, dyes, etc. may be added to the photocurable adhesive in the present invention, if necessary. Good.

The steel plate used in the present invention is not particularly limited as long as it has a concave saucer shape as illustrated in FIG. With the concave saucer shape, it is difficult for the photocurable adhesive to flow out from the steel plate 3 when the adhesive is applied, and the contact adhesion area between the gypsum board 1 and the cured product 2 of the photocurable adhesive is increased. Can be demonstrated. The saucer may have any shape as long as the steel plate 3 has a saucer shape on at least both sides thereof, but may have a saucer shape on all four sides of the steel sheet.

As a method for manufacturing the outer wall panel structure, for example, a photocurable adhesive is applied to the concave side of a steel plate 3 having a concave saucer shape, and the applied adhesive is irradiated with light. After starting the curing reaction, the gypsum board 1 is inserted and bonded. In the above, the photocurable adhesive is exposed to light to start a curing reaction by being exposed to light and a cured product 2 of the photocurable adhesive is formed after the gypsum board 1 is inserted. It is possible to obtain an outer wall panel structure in which the steel plate 3 having a flat saucer shape is firmly bonded.

The method of light irradiation in the above is not particularly limited, but an unnecessary wavelength component may be appropriately reduced or removed by using a filter or the like, or various light sources may be used in combination. Further, as a procedure for irradiating the photocurable adhesive with various light sources, simultaneous irradiation with various light sources may be performed or sequential irradiation may be performed with a time difference, or a method in which simultaneous irradiation and sequential irradiation are combined is used. Good.

(Function) In the outer wall panel structure of the present invention, the gypsum board is adhered to the concave side of the steel plate having the concave saucer shape through the cured product of the photo-curable adhesive, so that the heat insulation, An integrated structure that has the characteristics of gypsum board with excellent fire resistance, and the high strength of a steel plate, and has good elasticity and light that does not leave moisture after the adhesive cures. Due to the characteristics of the curable adhesive, even when external pressure or vibration is applied to the outer wall panel, it is possible to easily follow the deformation and prevent peeling or destruction, as well as the occurrence of mold, deterioration or damage. It becomes difficult, and stable performance can be exhibited over a long period of time.

[0039]

EXAMPLES The present invention will be specifically described by showing Examples and Comparative Examples below. The present invention is not limited to the following examples. (Example) [Preparation of photocurable adhesive] Alkoxysilyl-modified polypropylene glycol (“S-303” manufactured by Kanegafuchi Chemical Co., Ltd.) as compound (A) in a 0.2 L beaker under light shielding 7
0 g, 5 g of maleic anhydride as the compound (B), 1 g of diacylphosphine oxide (“Irgacure 819” manufactured by Ciba Specialty Chemicals), acrylic monomer (“Aronix M-110” manufactured by Toagosei Co., Ltd.) 15
g and 10 g of isomyristyl acrylate, 40 g of surface-treated calcium carbonate (“Viscolite U” manufactured by Shiraishi Calcium Co., Ltd.) as a thixotropic agent, and silica (SC).
R. "Civerite M-6000" manufactured by SIBELCO)
A photocurable adhesive was prepared by heating 100 g to 60 ° C. and mixing with a stir bar until uniform. [Preparation of outer wall panel structure]
Is applied to the concave side of the steel plate 3 having a concave saucer shape as shown in FIG. ² so that the applied amount is 500 g / m ^2, and then the applied adhesive is applied with a high pressure mercury lamp to obtain a strength of 10 at 365 nm.
Ultraviolet rays were irradiated for 60 seconds so as to obtain mW / cm ² .
After starting the curing reaction by irradiating with ultraviolet rays, the gypsum board 1 is quickly inserted and aged for 15 minutes to be cured, and the plaster board 1 and the concave saucer shape are formed through the cured product 2 of the photocurable adhesive. An outer wall panel structure to which the steel plate 2 having the same was adhered was obtained. [Evaluation] The obtained outer wall panel structure was conveyed by a conveyor, but it was able to withstand vibration and could be conveyed without causing a defect such as "shift". The shear adhesive strength between the gypsum board and the steel sheet was measured for the adhesive part 1 minute after the gypsum board 1 was inserted in the above-mentioned production according to JIS K6850, and was 0.89 kg / cm ² , which was the cured adhesive part. The shear adhesive strength was 2.0 kg / cm ² . The failure mode of the adhesive part was the material failure of the gypsum board part. In addition, the obtained cured product 2 of the photocurable adhesive of the outer wall panel structure was subjected to a vibration load test corresponding to a seismic intensity of 7 (JIS K6.
A steel plate or gypsum board of a test piece prepared according to 850 was fixed and a vibration test was performed for 10 minutes),
And, as a result of performing a load test with a strain rate of 5% [shearing, tensioning, and compression (with a strain rate of 5% for each of the same test pieces was repeated 10 times) 10 times], the structural body was not broken in any of the tests. I couldn't see it.

Comparative Example An outer wall panel structure was obtained in the same manner as in the example except that a conventionally used emulsion adhesive was used in place of the photocurable adhesive. [Evaluation] An attempt was made to convey the obtained outer wall panel constituents by a conveyor, but the improvement in the adhesive strength was insufficient, and the conveyor could not withstand the conveyance, and a defect due to "shift" occurred. The shear adhesive strength of the bonded portion after 1 minute from the time of inserting the gypsum board 1 in the above production was 0.9 kg / cm ² , and the shear adhesive strength of the bonded portion after curing was 2.0 kg / c.
It was m ² . In addition, the obtained cured product of the adhesive (emulsion-based adhesive) for the outer wall panel structure has too high elasticity,
As a result of performing a vibration load test equivalent to a seismic intensity of 7 and a load test with a strain rate of 5% in the same manner as in Example 1, compositional deformation or destruction of the constituents was observed in any of the tests.

[0041]

The outer wall panel structure of the present invention comprises a steel plate having a concave saucer shape, a cured product of a gypsum board and a photocurable adhesive, and the photocurable adhesive on the concave side of the steel plate. Since the gypsum board is characterized by being bonded via a cured product, the characteristics of the gypsum board excellent in heat insulation, fire resistance, etc., and an integrated structure having a high strength of the steel sheet. Also, even when external pressure or vibration is applied to the outer wall panel, it can easily follow deformation and prevent peeling or destruction, and it will be less likely to cause mold, deterioration or damage, and will last for a long time. And can exhibit stable performance.

The photocurable adhesive is the compound (A).
And the compound (B), and when the compound (B) is at least one selected from a carboxylic acid anhydride, a carboxylic acid imide and a diacylphosphine oxide, the above effect is further secured.

The method of manufacturing the outer wall panel structure of the present invention comprises:
The concave side of the steel plate having a concave saucer shape, a photo-curing adhesive is applied, after the applied adhesive is irradiated with light to start a curing reaction, a gypsum board is bonded. Therefore, the same effect as described above can be exhibited.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an example of an outer wall panel structure of the present invention.

[Explanation of symbols]

1 gypsum board 2 Photocurable adhesive 3 Steel plate with concave saucer shape

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) E04F 13/08 E04C 2/46 JF term (reference) 2E110 AA23 AA27 AA65 AB04 AB22 AB23 BA02 BA12 BA15 BA21 BD02 BD05 DC21 EA09 GA05Z GA13 GA23 GA29Z GA34 GB02W GB02X GB16W GB16X GB42Z GB44Z GB48Z GB52Z 2E162 CA16 CB01 4F100 AB03A AE06B AH02J AH06J AK52G BA02 CB04 EH012 EH462 EJ522 EJ542 GB07 JK06 4J040 DF021 ED001 EJ001 HB22 HC26 HD23 HD30 JB07 MA02 MA06 NA12

Claims (4)

[Claims] 1. A steel plate having a concave saucer shape, a cured product of a gypsum board and a photocurable adhesive, and a gypsum board bonded to the concave side of the steel plate via a cured product of the photocurable adhesive. An outer wall panel structure characterized by being formed. 2. A photocurable adhesive comprising a compound (A) having a functional group represented by the following general formula (1) and a compound (B) having a functional group represented by the following general formula (2). The outer wall panel structure according to claim 1, wherein: [Chemical 1] [In the formula, m represents an integer of 2 or 3, X represents a hydrolyzable functional group, and R represents a hydrocarbon group. ] [Chemical 2] [In the formula, m is an integer of 2 to 5, Y ^(m) is an element having m covalent substituents, and when m = 2, Y ⁽²⁾ is oxygen, and when m = 3, Y ⁽ m ³⁾ is nitrogen or phosphorus, when m = 4 Y ⁽⁴⁾ is carbon, and when m = 5 Y ⁽⁵⁾ is phosphorus, Z is a hydrocarbon group or an oxide group (provided that the oxide group is m = 4.
Or 5). ] 3. The compound (B) is at least one selected from carboxylic acid anhydrides, carboxylic acid imides and diacylphosphine oxides.
The outer wall panel structure described. 4. A gypsum board is adhered after applying a photo-curing adhesive to the concave side of a steel plate having a concave saucer shape, irradiating the applied adhesive with light to initiate a curing reaction. The method for manufacturing an outer wall panel structure according to claim 1, wherein the outer wall panel structure is manufactured.