JP2003206584A - Manufacturing method for wall corner structure and wall corner structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a wall corner structure capable of causing transition to the next work process and a wall corner structure, capable of quickly exhibiting initial bonding force without heating or the like after a wall member is bonded with an adhesive or the like in forming a structure of a wall corner part of an outer wall or the like, and a wall corner structure. <P>SOLUTION: According to the manufacturing method for this wall corner structure and the wall corner structure, photo-curing adhesive or curing pressure sensitive adhesive tape is applied or stuck to the end edge of a wall material formed by treating the end edge to form a corner by butting a plurality of wall materials to achieve bonding of wall materials. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a wall corner structure having excellent productivity and a wall corner structure.

2. Description of the Related Art Conventionally, in an outer wall used in a prefabricated house or the like, a two-component adhesive or a one-component moisture-curing adhesive is used to form a flat outer wall member at a corner portion such as a projecting corner or an entering corner. It was manufactured by butting and joining. However,
If a two-component adhesive is used when manufacturing a wall corner using the adhesive as described above, a curing failure may occur due to the variation in the mixing ratio of the main agent and the curing agent, and the predetermined adhesive strength may not be exhibited. However, there was a problem that it was necessary to leave it still until the next work process such as painting and to cure it. In addition, even when using a one-component moisture-curable adhesive, there is a problem that it is necessary to leave it to stand by the next working process after curing in order to obtain a balance between curability and pot life. It was In order to solve the above problems, Japanese Patent Laid-Open No. 8-197349 and Japanese Patent Laid-Open No.
Japanese Patent Publication No. 8-257852 discloses a manufacturing method using a manufacturing apparatus for an outer wall corner. In other words, a method has been proposed in which an adhesive is applied and bonded together, and then temporarily fixed with a nail or the like so that the line can be conveyed. However, in such a method, a portion where a nail or the like has been exposed is exposed, and thus a hiding process may be required separately. Furthermore, when the room temperature curable adhesive or the moisture curable adhesive as described above is used, heat curing is often performed in order to quickly cure, but shrinkage due to heat of the wall member occurs, In some cases, warpage occurred and it was difficult to manufacture a desired wall corner.

[0002]

SUMMARY OF THE INVENTION In view of the above, the present invention provides a wall corner structure capable of promptly shifting to the next working step without heating after joining the wall members, and a method for manufacturing the same. The purpose is to

[0003]

In order to achieve the above object, the present invention provides a photocurable adhesive on the edge of a wall material which can form a corner by abutting a plurality of wall materials. Provided is a method for producing a wall corner structure, which comprises coating and irradiating light to start a curing reaction, and then joining the edge of another wall material.

Further, according to the present invention, a curable adhesive tape is affixed to the edge of a wall material which can form a corner by abutting a plurality of wall materials together with the edge of another wall material. Provided is a method for manufacturing a wall corner structure, which is characterized by joining.

Further, according to the present invention, the edge of the wall material capable of forming a corner by abutting a plurality of wall materials has a cured product of a photo-curable adhesive or a cured curable adhesive tape. There is provided a wall corner structure characterized by being bonded via.

In the present invention, an edge of a wall material capable of forming a corner by abutting a plurality of wall materials is, for example, a wall corner structure as shown in FIG. For example, a portion (FIG. 1) obtained by obliquely cutting the edge of the wall member may be used. Further, as in the wall corner structure of FIG. 3, if the wall corner structure is formed even if the end edge is not subjected to any special treatment, the thickness of the wall member or the surface end of the wall member, etc. It refers to a portion where a plurality of wall members forming a corner are directly joined.

As the wall material used in the present invention, for example, sizing board, slate board, gypsum board, calcium silicate board, plywood board, wood board, MDF, cement board, concrete board, mortar board, particle board, stone board,
Examples of the wall material include an inner wall and an outer wall such as a ceramic plate, and these may be used alone or in combination of two or more kinds.

The photo-curable adhesive used in the present invention is an adhesive that begins to cure when it is irradiated with light such as visible light, ultraviolet light, or electron beam. When a photo-curable adhesive is used when manufacturing a wall corner structure, the cohesive force increases rapidly due to light irradiation, so that the initial adhesive strength that can withstand shaking during the transportation of a conveyor etc. You can move to the next step. It is preferable to use a photocurable adhesive that has a cohesive force of about the same as that of a pressure-sensitive adhesive immediately after light irradiation, and that immediately improves cohesive force after bonding.

Examples of the photo-curable adhesive include acrylic UV-curable adhesive, unsaturated polyester UV-curable adhesive, ene-thiol UV-curable adhesive, photocationic curable adhesive, A compound (A) having a functional group represented by the following general formula (1) and the following general formula (2)
Examples thereof include an ultraviolet curable adhesive containing the compound (B) having a functional group represented by and an adhesive in which they are combined with another curable adhesive. An ultraviolet-curable adhesive containing the compound (A) and the compound (B) is preferable because it has excellent strain absorption.

[0010]

[Chemical 3] (In the formula, m represents an integer of 2 or 3. R represents a hydrocarbon. X represents a functional group having hydrolyzability.)

[Chemical 4] (In the formula, n represents an integer of 2 to 5. Y ⁽ⁿ⁾ represents oxygen, nitrogen, phosphorus, or carbon having n covalent bond functional groups.
Z represents a hydrocarbon group or an oxide group (however, the oxide group is limited to the case where n is 4 or 5)

The above compound (A) is a compound having a functional group structure in which a silicon atom is substituted with 2 to 3 hydrolyzable functional groups (X). Here, the hydrolyzable group X is a functional group in which the bond between silicon and the functional group X exhibits hydrolyzability. Specifically, for example, an alkoxy group, an oxime group,
Examples thereof include those substituted with an alkenyloxy group, an acetoxy group, and a halogen group such as chlorine and bromine / iodine. From the viewpoint of storage stability, an alkoxy group is preferable. Examples of the alkoxy group include a methoxy group, an ethoxy group, a propyloxy group, an isopropyloxy group, a butoxy group, a tert-butoxy group, a phenoxy group and a benzyloxy group. In the case of a dialkoxysilyl group or a trialkoxysilyl group, the same alkoxy group may be used, or different alkoxy groups may be used in combination. Further, different kinds of functional groups X may be used in combination, or different compound A may be used in combination.

Examples of the hydrocarbon group R include hydrocarbon groups such as aliphatic hydrocarbon groups, unsaturated aliphatic hydrocarbon groups and aromatic hydrocarbon groups. In addition, these hydrocarbon groups have a functional group or a bond that does not inhibit a crosslinking reaction such as an amino group, a hydroxyl group, an ether group, an epoxy group, a polymerizable unsaturated group, a urethane group, a urea group, an imide group, and an ester group. It may be.

The compound (A) may be a compound having a plurality of functional groups represented by the general formula (1) in one molecule. Also, compounds having different types of functional groups may be used. For example, polymers having alkylene glycol such as propylene glycol, ethylene glycol, butylene glycol as a monomer unit, polyester having an ester bond, polyamide having an amide bond, polycarbonate having a carbonate bond, polymethacrylate, polyacrylate, polystyrene, polyolefin, etc. Examples thereof include polymers and compounds in which these copolymers contain the functional group represented by the general formula (1). Regarding the substitution position of the functional group to the polymer, there is no problem even if it is located at the terminal, side chain, or both the terminal and side chain of the polymer. As the above compound (A), trade name MS from Kanegafuchi Chemical Industry Co., Ltd.
MS polymer S-203, S-303, S-903,
Silyl SAT-20 as a silyl polymer such as Epion
0, MA-403, MA-447, etc. from Asahi Glass Co., Ltd. to Exester E
SS-2410, ESS-2420, ESS-3630, Acetoxy-terminated polydimethylsiloxane (PS363.5), Dimethylamino-terminated polydimethylsiloxane (PS383), Ethoxy-terminated polydimethylsiloxane (PS393), Stearyloxy-terminated poly Dimethylsiloxane (PS053.5), triethoxysilyl modified poly (1,2-butadiene) (PS078.
5), (N-trimethoxysilylpropyl) polyazamide (PS075), (N-trimethoxysilylpropyl) polyethyleneimine (PS076), (N-trimethoxysilylpropyl) -O-polyethylene oxide urethane (PS077)
You may use commercially available compounds, such as.

The compound (B) may be any compound having a functional group represented by the general formula (2),
It may be a compound having a plurality of functional groups in one molecule, or may be a compound having different types of functional groups. Further, a plurality of different kinds of compounds (B) may be used in combination in the photocurable adhesive of the present invention.
Here, the functional group represented by the general formula (2) is a compound in which two carbonyl groups are bonded to an atom Y selected from oxygen, sulfur, nitrogen, phosphorus, and carbon, and the valence of the atom Y is It optionally has a hydrocarbon substituent or an oxide group Z. Examples of the hydrocarbon group include hydrocarbon groups such as an aliphatic hydrocarbon group, an unsaturated aliphatic hydrocarbon group, and an aromatic hydrocarbon group. In addition, these hydrocarbon groups have a functional group or a bond that does not inhibit a crosslinking reaction such as an amino group, a hydroxyl group, an ether group, an epoxy group, a polymerizable unsaturated group, a urethane group, a urea group, an imide group, and an ester group. It may be. Further, different types of substituents Z may be used in combination.

Further, examples of the compound (B) include a cyclic compound having an organic group and a compound having a plurality of the same or different functional groups represented by the general formula (2) in the same cyclic chain. Can be mentioned. Furthermore, a compound in which a plurality of these same or different cyclic compounds are bound by an organic group and a bicyclic compound containing at least one of the same or different cyclic compounds as a unit can be exemplified.

As the compound (B), a carboxylic acid anhydride or a carboxylic acid imide can be preferably used because it is excellent in photoreactivity and solubility in the compound (A). Examples of the compound (B) include acetic anhydride, propionic anhydride, butyric anhydride, isobutyric anhydride, valeric anhydride, 2-methylbutyric anhydride and trimethyl when Y is oxygen. Acetic anhydride, hexanoic anhydride, heptanoic anhydride, decanoic anhydride, lauric anhydride, myristylic anhydride,
Palmitic anhydride, stearyl anhydride, docosanoic anhydride, crotonic anhydride, acrylic anhydride, methacrylic anhydride, oleic anhydride, linoleic anhydride, chloroacetic anhydride, iodoacetic anhydride, Dichloroacetic anhydride, trifluoroacetic anhydride, chlorodifluoroacetic anhydride, trichloroacetic anhydride, pentafluoropropionic anhydride, heptafluorobutyric anhydride, succinic anhydride, methylsuccinic anhydride, 2,2- Dimethyl succinic anhydride, isobutyl succinic anhydride, 1,2-cyclohexanedicarboxylic anhydride, hexahydro-4-methylphthalic anhydride, itaconic anhydride, 1,2,3,6-tetrahydrophthalic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, maleic anhydride, 2-methylmaleic anhydride,
2,3-dimethylmaleic anhydride, 1-cyclopentene-1,2
-Dicarboxylic acid anhydride, glutaric acid anhydride, 1-naphthyl acetic acid anhydride, benzoic acid anhydride, phenyl succinic acid anhydride, phenyl maleic acid anhydride, 2,3-diphenyl maleic acid anhydride, phthalic acid anhydride, 4-methylphthalic anhydride, 3,3 ', 4,4'-benzophenone tetracarboxylic acid dianhydride, 4,4'-(hexafluoropropylidene) diphthalic anhydride, 1,2,4,5-benzene Tetracarboxylic anhydride, 1,
Examples thereof include 8-naphthalenedicarboxylic acid anhydride and 1,4,5,8-naphthalenetetracarboxylic acid anhydride.

Commercially available compounds of the above compound (B) include Asahi Denka Co., Ltd. ADEKA HARDNER EH-700, ADEKA HARDNER EH-703, ADEKA HARDNER EH-705A; RIKACID TH, RIKACID HT- manufactured by Shin Nippon Rika Co., Ltd. 1, RIKACID HH,
RIKACID MH-700, RIKACID MH-700H, RIKACID M
H, RIKACID SH, RIKARESIN TMEG; HN- manufactured by Hitachi Chemical
5000, HN-2000; Epicure 1 made by Yuka Shell Epoxy Co., Ltd.
34A, Epicure YH306, Epicure YH307, Epicure
YH308H, manufactured by Sumitomo Chemical Co., Ltd., Sumicure MS, and the like.

Further, a copolymer of maleic anhydride and a compound having a radical-polymerizable double bond may be mentioned. Examples thereof include a copolymer of maleic anhydride and (meth) acrylate, a copolymer of maleic anhydride and styrene, and a copolymer of maleic anhydride and vinyl ether. As more specific examples of the compound (B), for example, when Y is nitrogen, succinimide, N-methylsuccinimide, α, α-dimethyl-β-methylsuccinimide, α
Methyl-α-propyl succinimide, maleimide, N-methyl maleimide, N-ethyl maleimide, N-propyl maleimide, N-tert-butyl maleimide, N-lauryl maleimide, N-cyclohexyl maleimide, N-phenyl maleimide, N- (2-chlorophenyl) maleimide, N-benzylmaleimide, N- (1-pyrenyl) maleimide, 3-methyl-N
-Phenylmaleimide, N, N'-1,2-phenylenedimaleimide, N, N'-1,3-phenylenedimaleimide, N, N'-1,4-phenylenedimaleimide, N, N '-(4 -Methyl-1,3-phenylene) bismaleimide, 1,1 '-(methylenedi-1,4-phenylene) bismaleimide, phthalimide, N-methylphthalimide, N-ethylphthalimide, N-propylphthalimide, N-phenylphthalimide , N-benzylphthalimide, pyromellitic acid diimide and the like.

Examples of the compound (B) include bis (2,6-dimethoxybenzoyl) when Y is phosphorus.
-2,4,4-trimethyl-pentylphosphine oxide,
Examples thereof include bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide. Examples of the compound (B) include 2,4-pentanedione, 3-methyl-2,4-pentanedione, 3-ethyl-2,4-pentanedione and 3-chloro-when Y is carbon. 2,4-pentanedione, 1,1,1-
Trifluoro-2,4-pentanedione, 1,1,1,5,5,5-hexafluoro-2,4-pentanedione, 2,2,6,6-tetramethyl-3,5-heptanedione, Diketones such as 1-benzoylacetone and dibenzoylmethane; dimethyl malonate,
Polycarboxylic acid esters such as diethyl malonate, dimethyl methyl malonate, tetraethyl 1,1,2,2-ethanetetracarboxylic acid; methylacetylacetonate,
Examples include α-carbonyl-acetic acid esters such as ethyl acetylacetonate and methyl propionyl acetate.

The compounding ratio of the compound (B) is as follows: 100 parts by weight of the compound (A)
0.01 to 30 parts by weight is preferable. When the amount of the compound (B) is less than 0.01 part by weight, it may be difficult to exhibit photoreactivity, and when it exceeds 30 parts by weight, the light transmittance is remarkably reduced, so that only the light-irradiated surface is present. Polymerization or cross-linking may cause deep reactivity to be significantly reduced. More preferably, 1
~ 20 parts by weight.

The light source that can be used for light irradiation in the manufacturing method of the present invention is not particularly limited as long as it can emit light containing a wavelength component that is absorbed by the sensitizer added for the purpose of improving photosensitivity. Specifically, for example, low pressure mercury lamp, medium pressure mercury lamp, high pressure mercury lamp, ultra high pressure mercury lamp, excimer laser, chemical lamp, black light lamp, microwave excited mercury lamp, metal halide lamp, sodium lamp, halogen lamp, xenon lamp, fluorescent lamp. , Sunlight, electron beam irradiation device, etc. are used.
Further, unnecessary wavelength components may be reduced or removed by using a filter or the like, or various light sources may be used in combination. As a procedure for irradiating the photocurable adhesive with various light sources, simultaneous irradiation with various light sources or a method in which irradiation is performed sequentially with a time difference, or simultaneous irradiation and sequential irradiation may be combined.

The photocurable adhesive used in the present invention includes:
If necessary, a crosslinking accelerator having a functional group represented by the general formula (1), a sensitizer for improving photosensitivity, and a viscosity property are adjusted as long as the effects and objects of the present invention are not impaired. For this purpose, various additives having known functions such as a thickener / thixotropic material, a physical property modifier for improving tensile properties, a bulking agent, a reinforcing agent, a plasticizer, a colorant, a flame retardant and the like may be added.

Further, an organometallic compound for accelerating the polymerization or crosslinking reaction of the compound (A) after light irradiation may be added. It is preferably used in a situation where a light non-irradiated portion occurs accidentally or inevitably. Examples of the organometallic compound include organometallic compounds obtained by substituting an organic group with a metal element such as germanium, tin, lead, boron, aluminum, gallium, indium, titanium, and zirconium. As the organometallic compound, for example, dibutyltin dilaurate, dibutyltin oxide,
Dibutyltin diacetate, dibutyltin phthalate, bis (dibutyltin lauric acid) oxide, dibutyltin bisacetylacetonate, dibutyltin bis (monoester malate), tin octylate, dibutyltin octoate,
Tin compounds such as dioctyltin oxide, titanate compounds such as tetra-n-butoxy titanate and tetraisopropoxy titanate, and these can be used alone or in combination of two or more. The mixing ratio of the organometallic compound is not particularly limited as long as it accelerates the reaction of the compound (A) after light irradiation, but is preferably 0.01 to 10 parts by weight with respect to 100 parts by weight of the photocurable adhesive. If it is less than 0.01 part by weight, it may not be possible to expect the reaction acceleration of the compound (A) after the light irradiation, and if it exceeds 10 parts by weight, the reaction after the light irradiation is promoted, but the influence on the reaction product. May appear significantly. More preferably 0.1-8
Parts by weight.

In order to improve the photoreactivity, that is, the irradiation time of light is shortened, the irradiation energy of light is lowered,
Alternatively, a sensitizer may be added for the purpose of improving the deep reactivity. Examples of the sensitizer include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α'-dimethylacetophenone, methoxyacetophenone and 2,2-dimethoxy-2-. Acetophenone derivative compounds such as phenylacetophenone; Benzoin ether compounds such as benzoin ethyl ether and benzoin propyl ether; Ketal derivative compounds such as benzyl dimethyl ketal; Halogenated ketones; Acylphosphine oxides; Acylphosphonates; 2-Methyl-1 -[4- (Methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-N, N-dimethylamino-1-
(4-morpholinophenyl) -1-butanone; bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide bis- (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide Bis (η5-cyclopentadienyl) -bis (pentafluorophenyl) -titanium, bis (η5-cyclopentadienyl) -bis [2,6-difluoro-3
-(1H-pyrid-1-yl) phenyl] -titanium;
Anthracene, perylene, coronene, tetracene, benzanthracene, phenothiazine, flavin, acridine, ketocoumarin, thioxanthone derivative, benzophenone, acetophenone, 2-chlorothioxanthone, 2,
Examples thereof include 4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone and isopropylthioxanthone. The thickener is selected from polymer compounds having high compatibility with the compound (A), and is appropriately selected depending on the kind of the compound (A) to be blended. For example, acrylic polymer, methacrylic polymer, polyvinyl alcohol derivative, polyvinyl acetate, polystyrene derivative, polyesters, polyethers, polyisobutene, polyolefins, polyalkylene oxides, polyurethanes, polyamides, natural rubber, polybutadiene , Polyisoprene, NBR, SBS, SI
S, SEBS, hydrogenated NBR, hydrogenated SBS, hydrogenated SIS, hydrogenated SEBS and the like can be mentioned. Moreover, these copolymers and functional group modified compounds can be mentioned, and these may be combined suitably. The above-mentioned thixotropic material is appropriately selected from materials that allow the photo-curable adhesive before curing to exhibit thixotropic properties. For example, colloidal silica, polyvinylpyrrolidone, hydrophobized calcium carbonate, glass balloon,
Examples thereof include glass beads. It is preferable to select one having a surface having a high affinity with the compound (A). As the physical property adjusting agent, various silane coupling agents are used, for example, vinyltrimethoxysilane, dimethyldimethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, tetramethoxysilane, tetraethoxysilane, phenyltrimethoxysilane. , Diphenyldimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropylmethyldimethoxysilane, 3-
Aminopropyltriethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, N- (2-
Aminoethyl) -3-aminopropyltriethoxysilane, N, N'-bis- [3- (trimethoxysilyl) propyl] ethylenediamine, N, N'-bis- [3- (triethoxysilyl) propyl] ethylenediamine, N, N'-bis-
Examples include [3- (trimethoxysilyl) propyl] hexaethylenediamine and N, N′-bis- [3- (triethoxysilyl) propyl] hexaethylenediamine, which may be used alone or in combination of two or more. As the above-mentioned extender, those that do not exhibit thixotropic properties by being added to the photo-curable adhesive before curing can be suitably used, for example,
Talc, clay, calcium carbonate, magnesium carbonate,
Examples thereof include anhydrous silicon, hydrous silicon, calcium silicate, titanium dioxide, carbon black and the like, and these may be used alone or in combination of two or more kinds. As the plasticizer,
For example, phosphates such as tributyl phosphate and tricresyl phosphate, phthalates such as dioctyl phthalate, and fatty acids such as glycerin monooleate.
-Basic acid esters, dibasic acid esters of fatty acids such as dioctyl adipate, polypropylene glycols and the like can be mentioned, and these can be used alone or in combination of two or more kinds. In addition, an anti-sagging agent, an antioxidant, an antiaging agent, an ultraviolet absorber, a solvent, a fragrance, a pigment, a dye and the like may be added, if necessary.

A wall characterized in that a curable adhesive tape is attached to an edge of a wall material capable of forming a corner by abutting a plurality of wall materials, and another flat wall material is joined. The method for manufacturing the corner structure is also one of the present inventions, and the curable adhesive tape will be described below. The wall material and the bonded portion are as described above.

The curable tacky-adhesive tape used in the present invention has the initial tackiness at the time of applying the tape, and then the curing progresses so that the final strength is the same as that of the conventional adhesive. Some can maintain the degree. Since it has an initial tackiness, it exhibits an initial adhesive strength that can withstand shaking during conveyance by a conveyor or the like, and thus can be immediately transferred to the next step. When a curable adhesive tape is used when manufacturing a wall corner structure, exudation due to excessive application, contamination on the design part, and removal of the exuded adhesive are more complicated than conventional liquid adhesives. It is possible to eliminate the problem. Further, since it is a tape, the coating thickness can be made uniform efficiently. When a conventional permanent pressure-sensitive adhesive tape is used, although it is possible to express initial adhesiveness that can be conveyed, it is difficult to develop bonding strength that is sufficient to develop durability, but a curable pressure-sensitive adhesive tape. Then, since the cohesive force rapidly increases due to light irradiation, moisture, etc., there is no problem in durability.

The curable tacky-adhesive tape used in the present invention may be one that can be adhesively cured by some action after bonding, and for example, a thermosetting adhesive tape that is cured by heat treatment before or after bonding. Adhesive tape, UV-curable adhesive tape that is cured by post-curing by irradiating ultraviolet rays before joining, Moisture-curable adhesive tape that cures by absorbing moisture in the air, absorbs oxygen in the air An oxygen-curing adhesive / adhesive tape or the like that starts to cure can be given. A moisture-curable adhesive tape, which does not require operations such as heating and UV irradiation at the time of joining, is preferred.

As the moisture-curing adhesive / adhesive tape, a composition comprising a resin having an isocyanate group and a resin for exhibiting adhesiveness is formed into a tape shape, and a resin having a hydrolyzable silyl group is adhesive. Examples of the composition include a tape-shaped composition made of a resin for expressing the above.

Examples of the resin for exhibiting the tackiness include poly (meth) acrylate, polyester, polycarbonate, polyamide, thermoplastic elastomer, natural rubber and synthetic rubber. As the resin having a hydrolyzable silyl group, for example, a resin having at least two silyls having a hydrolyzable group such as an alkoxysilyl group or an acetoxysilyl group in one molecule can be mentioned. Includes a polymer having an alkylene glycol such as propylene glycol, ethylene glycol or butylene glycol as a monomer unit, a polyester having an ester bond, a polyamide having an amide bond, a polycarbonate having a carbonate bond,
Examples thereof include polymers such as polymethacrylate, polyacrylate, polystyrene and polyolefin, and compounds in which a hydrolyzable silyl group is contained in these copolymers. As such a resin, Kanegafuchi Chemical Industry Co., Ltd.
Product name: MS Polymer as MS Polymer S-203, S
-303, S-903, Epion, etc. as Cyryl polymers such as Cyryl SAT-200, MA-403, MA-447, etc., Asahi Glass Co., Ltd., EXESTAR ESS-2410, ESS-2420, ESS-3630, Chisso (stock) ) To acetoxy-terminated polydimethylsiloxane (PS
363.5), dimethylamino-terminated polydimethylsiloxane (PS383), ethoxy-terminated polydimethylsiloxane (PS3)
93), stearyloxy-terminated polydimethylsiloxane (PS
053.5), triethoxysilyl modified poly (1,2-butadiene) (PS078.5), (N-trimethoxysilylpropyl)
Polyazamide (PS075), (N-trimethoxysilylpropyl) polyethyleneimine (PS076), (N-trimethoxysilylpropyl) -O-polyethylene oxide urethane (PS077), etc. are commercially available.

The curable pressure-sensitive adhesive tape of the present invention may be added to the curable pressure-sensitive adhesive tape of the present invention as needed, as long as the effects and objects of the present invention are not impaired.
Known functions such as hydrolyzable silyl group cross-linking accelerator, tackifying resin for adjusting tackiness, physical property modifier for improving tensile properties, extender, reinforcing agent, plasticizer, colorant, flame retardant, etc. Various additives having a may be blended. Examples of the crosslinking accelerator for the hydrolyzable silyl group include organometallic compounds, and organometallic compounds formed by substituting an organic group with a metal element such as germanium, tin, lead, boron, aluminum, gallium, indium, titanium, or zirconium. Compounds are preferably used. Specifically, dibutyltin dilaurate, dibutyltin oxide, dibutyltin diacetate, dibutyltin phthalate, bis (dibutyltin lauric acid) oxide, dibutyltin bisacetylacetonate, dibutyltin bis (monoester malate), octyl acid Tin compounds such as tin, dibutyltin octoate and dioctyltin oxide, tetra-n-butoxy titanate,
Titanate compounds such as tetraisopropoxy titanate can be used alone or in combination of two or more. Examples of the tackifying resin, for example, rosin-based tackifying resin, rosin ester-based tackifying resin, terpene-based tackifying resin, terpene phenol-based tackifying resin,
Examples thereof include petroleum resin-based tackifying resin, C5-based tackifying resin, C8-based tackifying resin, xylene-based tackifying resin, and styrene-based tackifying resin.

As the physical property adjusting agent, various silane coupling agents such as vinyltrimethoxysilane, dimethyldimethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, tetramethoxysilane, tetraethoxysilane, phenyltrimethoxysilane can be used. , Diphenyldimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropylmethyldimethoxysilane, 3-aminopropyltriethoxysilane, N- (2
-Aminoethyl) -3-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltriethoxysilane, N, N'-bis- [3- (trimethoxysilyl)
Propyl] ethylenediamine, N, N'-bis- [3- (triethoxysilyl) propyl] ethylenediamine, N, N '
-Bis- [3- (trimethoxysilyl) propyl] hexaethylenediamine, N, N'-bis- [3- (triethoxysilyl) propyl] hexaethylenediamine and the like,
These may be used alone or in combination of two or more. As the above-mentioned extender, those which do not exhibit thixotropic properties even when compounded with a curable adhesive tape can be suitably used, and examples thereof include talc, clay, calcium carbonate, magnesium carbonate, anhydrous silicon, hydrous silicon, and calcium silicate. , Titanium dioxide, carbon black and the like, and these may be used alone or in combination of two or more kinds. Examples of the plasticizer include phosphates such as tributyl phosphate and tricresyl phosphate, phthalates such as dioctyl phthalate, fatty acid-basic acid esters such as glycerin monooleyl ester, dioctyl adipate and the like. Examples of the fatty acid dibasic acid esters, polypropylene glycols, etc. may be used alone or in combination of two or more kinds. In addition, anti-sagging agent, antioxidant, anti-aging agent, ultraviolet absorber, solvent, fragrance, pigment, if necessary.
You may add dyes

A cured product of a photocurable adhesive or a cured adhesive / adhesive tape is attached to an edge of a wall material whose edges are processed so as to form a corner by abutting a plurality of wall materials. A wall corner structure, which is characterized in that it is bonded via the above, is also one aspect of the present invention, and a cured product or a curable adhesive of a photo-curable adhesive that constitutes such a wall corner structure. Examples of the cured product of the tape include the above-mentioned photocurable adhesive and curable adhesive tape. The method of manufacturing the wall corner structure is not limited to the above method.

[0033]

The method of manufacturing a wall corner structure and the wall corner structure of the present invention are as described above, and since the initial adhesive strength at the time of joining is high, the productivity can be rapidly changed to the next step. It is expensive. Further, since the curing proceeds after joining, it is possible to provide a wall corner structure having good final adhesive strength.

[0034]

BEST MODE FOR CARRYING OUT THE INVENTION The embodiments of the present invention will be described in more detail below with reference to Examples, but the present invention is not limited to these Examples.

Preparation of Photo-curing Adhesive Reference Example 1 Bisphenol A type epoxy resin (Japan Epoxy Resin Co., Epicoat
828) 100 g of propylene glycol (molecular weight 3000) 20
g, and 2 g of a photocation catalyst (SP-170, manufactured by Asahi Denka Co., Ltd.) were mixed with a stir bar until they were uniform, to prepare a photocurable adhesive A.

Reference Example 2 Alkoxysilyl-modified polypropylene glycol (S-303 manufactured by Kanegafuchi Chemical Co., Ltd.) 70 in a 0.2 L beaker under light shielding.
g, maleic anhydride 5 g, diacylphosphine oxide (Ciba Specialty Chemicals, Irgacure 819) 1 g, acrylic monomer (Toagosei Aronix M-110) 15 g, isomyristyl acrylate 10
g, surface treated calcium carbonate (Biscolite U manufactured by Shiraishi Industry Co., Ltd.) 40g, silica (Civerite M-6 manufactured by SCRSIBELCO)
000) 100 g was heated to 60 ° C. and mixed until uniform using a stirring bar to prepare a photocurable adhesive B.

Preparation of Moisture-Curable Adhesive Reference Example 3 Alkoxysilyl-modified polypropylene glycol (S-303 manufactured by Kanebuchi Chemical Co., Ltd.) 100 in a 0.2 L beaker under light shielding.
g, dibutyltin bisacetylacetonate 2g, surface treated calcium carbonate (Biscolite U manufactured by Shiraishi Industry Co., Ltd.) 40g,
Silica (SCRIBELCO Civerite M-6000) 100g
Was mixed using a stir bar until uniform, to prepare a moisture-curable adhesive A.

Adjustment of moisture-curable adhesive tape Reference example 4 In a 2 L separable flask, protected from light with
Denatured polypropylene glycol (S-30 manufactured by Kanegafuchi Chemical Co., Ltd.
3) 600g, acrylic monomer (Aronic manufactured by Toagosei Co., Ltd.
S-110) 300g, acrylic oligomer (Toagosei Co., Ltd.)
  Aronix M-1310) 250 g, diacylphosphine
Kiside (Irga made by Ciba Specialty Chemicals)
Cure 819) 10g, 1,1,3,3-tetrabutyl-1,3-dilau
Ryloxycarbonyl-distannoxane (Nitto Kasei Co., Ltd.
  U-130) 10g with stirring and mixing until uniform, then nitrogen
Dissolved by bubbling with gas for 20 minutes
Light to remove oxygen and obtain moisture-curing adhesive tape
A polymerizable composition was obtained. The above photopolymerizable composition is applied to polyethylene.
Coated on the film to a thickness of 0.5 mm.
The coating film was covered with a polyethylene film. this
Has a maximum emission wavelength at 400 nm
Fluorescent lamp is used and its light intensity is 2W / cm ²So that
Moisture-curing adhesive tape A is obtained by light irradiation for 10 minutes
It was

Example 1 A cut portion of a wall material (sizing board, thickness 20 mm) obtained by cutting the photocurable adhesive A obtained as described above at an edge portion at an angle of 45 ° as shown in FIG. Coating amount of 500g / m ²
And a strength of 4 at 365 nm using a high-pressure mercury lamp.
Ultraviolet rays were radiated for 60 seconds so as to obtain 0 mW / cm ² . After irradiating with ultraviolet rays, the wall members not coated with the adhesive are immediately joined, and
A wall corner structure as shown in Fig. 3 was obtained. After a few minutes of joining, when the conveyor was tried to be conveyed, it could withstand vibration and could be conveyed to a predetermined position without shifting. The shear adhesive strength of the bonded portion after 1 minute after bonding was 0.75 kg / cm ² , and the shear adhesive strength of the bonded portion after complete curing (after 7 days of curing, the same hereinafter) was 75 kg / cm ² .

Example 2 A wall corner structure was obtained in the same manner as in Example 1 except that the photocurable adhesive B obtained as described above was changed to have a UV irradiation intensity of 10 mW / cm ² . . After a few minutes of joining, when the conveyor was tried to be conveyed, it could withstand vibration and could be conveyed to a predetermined position without shifting. The shear adhesive strength of the joint after 1 minute from joining was 0.89 kg kg / cm ² , and the shear adhesive strength of the joint after complete curing was 37 kg / cm ² . The adhesive cured product at the joint shows rubber elasticity, so 5%
No fracture of the wall corner structure was observed even if a splitting strain was applied to some extent.

Comparative Example 1 A wall corner structure was obtained in the same manner as in Example 1 except that the moisture-curable adhesive A obtained as described above was not irradiated with ultraviolet rays. After a few minutes of joining, when it was conveyed by a conveyor, a deviation of about 5 mm was found after the completion of the conveyance, and there was a part where peeling occurred.
Further, the time required to obtain a bonding force sufficient to withstand conveyance was measured and found to be about 60 minutes at 25 ° C. The shear adhesive strength of the joint after one minute from joining was 0.15 kg / cm ² , and the shear adhesive strength of the joint after complete curing was 34 kg / cm ² .

Example 3 Moisture-curing adhesive / bonding tape A obtained as described above
2 is attached to the cut portion of the wall material (sizing board, thickness 20 mm) whose end edge is cut at an angle of 45 ° as shown in FIG. 1, and the wall member without the tape is quickly joined, as shown in FIG. Got a wall corner structure like this. After a few minutes of joining, when the conveyor was tried to be conveyed, it could withstand vibration and could be conveyed to a predetermined position without shifting. The shear adhesive strength of the bonded portion 1 minute after bonding was 0.91 kg / cm ² , and the shear adhesive strength of the bonded portion after complete curing was 49 kg / cm ² .

[0043]

According to the method for manufacturing a wall corner structure of the present invention, since the photo-curable adhesive is used, it is possible to obtain a joining force that can withstand conveyor transportation immediately after joining. Therefore, the productivity of the wall corner structure can be dramatically improved. Further, according to the method for manufacturing a wall corner structure of the present invention, since the curable tacky adhesive tape is used, it is possible to obtain a joint that can withstand conveyor transportation immediately after joining. Therefore, the productivity of the wall corner structure can be dramatically improved.
Further, since the wall corner structure of the present invention uses a photo-curable adhesive or a curable cohesive adhesive tape, curing proceeds after bonding, and a wall corner structure having good bonding strength is finally obtained. Obtainable.

[0044]

[Brief description of drawings]

FIG. 1 is a diagram showing a state in which an adhesive or a tacky adhesive tape is applied to a wall material whose edge portion is cut at an angle of 45 °.

FIG. 2 is a diagram showing a joined state of wall materials in a wall corner structure.

FIG. 3 is a diagram showing a joined state of wall materials in a wall corner structure.

[Explanation of symbols]

1 wall material 2 Adhesive or adhesive tape

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) E04B 2/56 621 E04B 2/56 621N C09J 5/02 C09J 5/02 183/04 183/04 E04B 1 / 02 E04B 1/02 D 1/61 1/60 504E F term (reference) 2E002 EA04 EC00 FB02 FB05 FB07 GA06 2E125 AA53 AE01 AE11 AE16 AG07 AG56 CA81 4J040 EK031 HB43

Claims (7)

[Claims] 1. A photocurable adhesive is applied to an edge of a wall material capable of forming a corner by abutting a plurality of wall materials, and after irradiating light to start a curing reaction, A method for manufacturing a wall corner structure, which comprises joining with an edge of another wall material. 2. The photocurable adhesive, wherein the compound (A) has at least a functional group represented by the general formula (1) and the compound (B) has a functional group represented by the general formula (2). 2. The method for manufacturing a wall corner structure according to claim 1, comprising: [Chemical 1] (In the formula, m represents an integer of 2 or 3. R represents a hydrocarbon. X represents a functional group having hydrolyzability.) (In the formula, n represents an integer of 2 to 5. Y ⁽ⁿ⁾ represents oxygen, nitrogen, phosphorus, or carbon having n covalent bond functional groups.
Z represents a hydrocarbon group or an oxide group (however, the oxide group is limited to the case where n is 4 or 5) 3. The compound (B) is a carboxylic acid anhydride,
At least one selected from a carboxylic acid imide or a diacyl phosphine oxide, The manufacturing method of the wall corner structure of Claim 1 or 2 characterized by the above-mentioned. 4. A curable adhesive tape is attached to an edge of a wall material capable of forming a corner by abutting a plurality of wall materials, and the curable adhesive tape is joined to the edge of another wall material. A method for manufacturing a featured wall corner structure. 5. The method for manufacturing a wall corner structure according to claim 4, wherein the curable tacky adhesive tape is a moisture curable tacky adhesive tape. 6. The method for producing a wall corner structure according to claim 4, wherein the moisture-curable pressure-sensitive adhesive tape is cured by moisture crosslinking of a compound containing a hydrolyzable silyl group. 7. An edge of a wall material capable of forming a corner by abutting a plurality of wall materials is joined via a cured product of a photocurable adhesive or a cured adhesive tape. Wall corner structure characterized by being