JP2003338580A5 - - Google Patents

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Publication number
JP2003338580A5
JP2003338580A5 JP2002146210A JP2002146210A JP2003338580A5 JP 2003338580 A5 JP2003338580 A5 JP 2003338580A5 JP 2002146210 A JP2002146210 A JP 2002146210A JP 2002146210 A JP2002146210 A JP 2002146210A JP 2003338580 A5 JP2003338580 A5 JP 2003338580A5
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JP
Japan
Prior art keywords
semiconductor device
adhesive
semiconductor
value
sheet
Prior art date
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Application number
JP2002146210A
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English (en)
Japanese (ja)
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JP3956771B2 (ja
JP2003338580A (ja
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Publication date
Application filed filed Critical
Priority to JP2002146210A priority Critical patent/JP3956771B2/ja
Priority claimed from JP2002146210A external-priority patent/JP3956771B2/ja
Publication of JP2003338580A publication Critical patent/JP2003338580A/ja
Publication of JP2003338580A5 publication Critical patent/JP2003338580A5/ja
Application granted granted Critical
Publication of JP3956771B2 publication Critical patent/JP3956771B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002146210A 2002-05-21 2002-05-21 半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置 Expired - Fee Related JP3956771B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002146210A JP3956771B2 (ja) 2002-05-21 2002-05-21 半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002146210A JP3956771B2 (ja) 2002-05-21 2002-05-21 半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置

Publications (3)

Publication Number Publication Date
JP2003338580A JP2003338580A (ja) 2003-11-28
JP2003338580A5 true JP2003338580A5 (enExample) 2005-10-06
JP3956771B2 JP3956771B2 (ja) 2007-08-08

Family

ID=29705262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002146210A Expired - Fee Related JP3956771B2 (ja) 2002-05-21 2002-05-21 半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置

Country Status (1)

Country Link
JP (1) JP3956771B2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2679822B1 (fr) * 1991-07-30 1995-07-21 Protechnic Sa Procede de fabrication d'un produit thermocollant, dispositif pour la mise en óoeuvre de ce procede et produit ainsi obtenu.
JP2007067245A (ja) * 2005-08-31 2007-03-15 Sumitomo Bakelite Co Ltd フィルム状配線テープ及びその製造方法、並びにフィルム状配線テープを用いた半導体装置の製造方法
JP2009029843A (ja) * 2007-07-24 2009-02-12 Sekisui Chem Co Ltd 半導体用接着剤及び半導体用接着テープ
JP5445187B2 (ja) * 2010-02-05 2014-03-19 日立化成株式会社 回路部材接続用接着剤及びこれを用いた半導体装置
US8676284B2 (en) 2010-10-15 2014-03-18 Novanex, Inc. Method for non-invasive blood glucose monitoring
JP6244684B2 (ja) * 2013-06-24 2017-12-13 日立化成株式会社 素子封止用エポキシ樹脂成形材料及び電子部品装置
JP2014074181A (ja) * 2013-12-25 2014-04-24 Hitachi Chemical Co Ltd 半導体装置の製造方法及びこれを用いて製造されてなる半導体装置
JP6579949B2 (ja) * 2015-12-24 2019-09-25 日東電工株式会社 グラファイトシート用粘着シート
JP6528801B2 (ja) * 2017-06-05 2019-06-12 日立化成株式会社 素子封止用エポキシ樹脂成形材料及び電子部品装置
JP6405482B1 (ja) * 2018-03-27 2018-10-17 タツタ電線株式会社 導電性接着剤層用キャリアフィルム及びそれを備えたボンディングフィルム
KR102710946B1 (ko) * 2019-01-28 2024-09-27 가부시끼가이샤 레조낙 접착제 조성물, 필름상 접착제, 접착 시트, 및 반도체 장치의 제조 방법
JP2023072930A (ja) * 2021-11-15 2023-05-25 株式会社レゾナック 熱硬化性接着剤組成物、積層フィルム、接続体及びその製造方法

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