JP2003334843A - Method for manufacturing plated injection molding - Google Patents

Method for manufacturing plated injection molding

Info

Publication number
JP2003334843A
JP2003334843A JP2002148112A JP2002148112A JP2003334843A JP 2003334843 A JP2003334843 A JP 2003334843A JP 2002148112 A JP2002148112 A JP 2002148112A JP 2002148112 A JP2002148112 A JP 2002148112A JP 2003334843 A JP2003334843 A JP 2003334843A
Authority
JP
Japan
Prior art keywords
plating
resin
cavity
injection
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002148112A
Other languages
Japanese (ja)
Inventor
Kazuyoshi Nakamichi
一喜 中道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2002148112A priority Critical patent/JP2003334843A/en
Publication of JP2003334843A publication Critical patent/JP2003334843A/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a plated injection molding in which manufacturing steps can be simplified and which is not restricted by a product design surface. <P>SOLUTION: The method for manufacturing the plated injection molding comprises the steps of: injection filling a polymer alloy or a polymer blend in the cavity of a mold having a gradual thickness-changing part corresponding to a plating unnecessary part in the cavity so that the sectional shape of the gradual thickness-changing part satisfies formula (1) of 10≤(W/Δt)≤100 so as to flow from a part side corresponding to the plating necessary part of the cavity toward the side corresponding to a plating unnecessary part; obtaining a resin base; and then chemically plating at least the entire surface of the resin base, (wherein W is the length from the starting end to the terminal of the resin flowing direction of the injected resin of the thickness changing part of the cavity, and Δt is the thickness change of the cavity from the starting end to the terminal of the resin flowing direction of the injected resin of the thickness-changing part). <P>COPYRIGHT: (C)2004,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、メッキ付き射出成
形品の製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a plated injection-molded product.

【0002】[0002]

【従来の技術】樹脂成形品には、樹脂基材表面に、ま
ず、化学メッキを施した後、電気メッキ層を化学メッキ
層の上に形成し、金属調の表面にすることによって高級
感や重厚感を付与するようにしたものがあるが、成形品
によっては表面の一部にメッキ不要部が存在する場合が
ある。従来、このようにメッキ不要部が一部に存在する
メッキ付き樹脂成形品を製造する場合、まず、予め成形
された樹脂基材のメッキ不要部にレジスト塗料を塗布し
たのち、樹脂基材表面のレジスト塗料が塗布されていな
い部分にメッキを施す方法、あるいは、樹脂基材表面全
体にメッキを施したのち、メッキ不要部にメッキの上か
ら加飾用塗料を塗布し、メッキを隠蔽する方法等が実施
されている。
2. Description of the Related Art A resin molded article has a high-class feeling by first chemically plating the surface of a resin substrate and then forming an electroplating layer on the chemical plating layer to form a metal-like surface. Although some have been made to give a solid feeling, there is a case where a plating unnecessary portion exists on a part of the surface depending on the molded product. Conventionally, in the case of producing a resin-molded product with plating in which a part requiring no plating exists in this way, first, a resist coating is applied to the part requiring no plating of a preformed resin base material, and then the surface of the resin base material is coated. A method of plating the area where the resist coating is not applied, or a method of coating the entire surface of the resin base material and then applying a decorative coating from above the plating to the areas that do not require plating to hide the plating, etc. Is being implemented.

【0003】しかしながら、いずれの方法もメッキ工程
以外にレジスト塗料や加飾用塗料を塗布する工程が必要
で非効率であるとともに、メッキ材料や塗料が余分に必
要であるためコストの面でも問題がある。一方、特許第
2947024号に記載の方法では、樹脂基材のメッキ
不要部の周囲にV字溝を形成しておき、この樹脂基材に
まず化学メッキを施す。この時、V字溝の底の部分に化
学メッキされない。したがって、メッキ必要部の化学メ
ッキ層と、メッキ不要部の化学メッキ層とがV字溝部分
で電気的に縁切りされた状態になる。そして、メッキ必
要部のみに通電してメッキ必要部のみに電気メッキを施
すとともに、メッキ不要部の化学メッキ層を除去するこ
とによって、メッキ部と、非メッキ部とを備えるメッキ
付き成形品を製造するようにしている。
However, each of these methods requires an additional step of applying a resist coating or a decorative coating in addition to the plating step, and is inefficient, and the plating material and the coating material are additionally required, which causes a problem in cost. is there. On the other hand, in the method described in Japanese Patent No. 2947024, a V-shaped groove is formed around the unnecessary plating portion of the resin base material, and the resin base material is first subjected to chemical plating. At this time, the bottom of the V-shaped groove is not chemically plated. Therefore, the chemical plating layer of the plating required portion and the chemical plating layer of the non-plating portion are electrically cut off at the V-shaped groove portion. Then, by energizing only the plating-required portion and electroplating only the plating-required portion, and removing the chemical plating layer of the plating-unnecessary portion, a plated molded product having a plated portion and a non-plated portion is manufactured. I am trying to do it.

【0004】しかし、この方法によれば、メッキ不要部
にメッキ層の大部分をしめる電気メッキ層が形成されな
いので、メッキ材料コストを低減できるものの、意匠面
である成形品表面にV字溝を設ける必要があるため、製
品のデザイン上の自由度が制約されるという欠点があ
る。
However, according to this method, since the electroplating layer for covering most of the plating layer is not formed in the unnecessary plating portion, the cost of the plating material can be reduced, but a V-shaped groove is formed on the surface of the molded product which is the design surface. Since it has to be provided, there is a drawback in that the degree of freedom in product design is restricted.

【0005】[0005]

【発明が解決しようとする課題】本発明は、上記事情に
鑑みて、製造工程が簡略化できるとともに、製品意匠面
で制約を受けないメッキ付き射出成形品の製造方法を提
供することを目的としている。
SUMMARY OF THE INVENTION In view of the above circumstances, the present invention has an object to provide a method for manufacturing a plated injection-molded product which can simplify the manufacturing process and is not restricted by the design of the product. There is.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
に、本発明にかかるメッキ付き射出成形品の製造方法
は、メッキ必要部に隣接してメッキ不要部を有する樹脂
基材の、前記メッキ必要部のみにメッキ層を形成するメ
ッキ付き射出成形品の製造方法において、キャビティ内
にメッキ不要部に対応する厚み徐変部分を有し、この厚
み徐変部分の断面形状が、10≦(W/Δt)≦100
の式(1)を満足する金型のキャビティ内に、ポリマー
アロイまたはポリマーブレンドを、キャビティの前記メ
ッキ必要部に対応する部分側からキ前記メッキ不要部に
対応する側に向かって流れるように射出充填し、樹脂基
材を得たのち、少なくとも樹脂基材の表面全体に化学メ
ッキ処理を行うことを特徴としている(但し、式(1)
中、Wは、キャビティの厚み徐変部分の射出樹脂の樹脂
流れ方向の始端から終端にかけての長さ、Δtは、厚み
徐変部分の射出樹脂の樹脂流れ方向の始端から終端にか
けてのキャビティの厚み変化寸法である。)。
In order to achieve the above object, a method for producing an injection-molded article with plating according to the present invention is a method for producing a resin base material having a plating-free portion adjacent to a plating-requiring portion. In a method for manufacturing an injection-molded article with plating, in which a plating layer is formed only in a required portion, a cavity has a gradually changing thickness portion corresponding to the unnecessary plating portion, and the gradually changing thickness portion has a cross-sectional shape of 10 ≦ (W / Δt) ≦ 100
The polymer alloy or the polymer blend is injected into the cavity of the mold satisfying the formula (1) so as to flow from the side of the cavity corresponding to the portion requiring plating to the side corresponding to the portion requiring no plating. After the resin base material is filled to obtain a resin base material, at least the entire surface of the resin base material is subjected to chemical plating treatment (however, the formula (1)
In the figure, W is the length of the gradually changing thickness portion of the injection resin from the start end to the end in the resin flow direction, and Δt is the thickness of the cavity of the gradually changing thickness injection resin from the start end to the end in the resin flow direction. It is a variable dimension. ).

【0007】本発明においてキャビティのメッキ不要部
にあたる厚み徐変部分は、10≦(W/Δt)≦100
の式を満足する断面形状に限定され、20≦(W/Δ
t)≦50の式を満足することが好ましいが、その理由
は、W/Δtが100より大きいと、肉厚変化による樹
脂の相分離効果が小さくなり、化学メッキ層の非付着効
果が小さくなり、W/Δtが10より小さいと化学メッ
キ層の非付着効果に問題はないが、通常の1mm〜3m
m程度の肉厚の射出成形品では、Wの寸法が短くなって
しまうので、メッキ不要部の幅が小さいものになって、
その効果が十分期待できないためである。
In the present invention, the gradual thickness change portion corresponding to the unnecessary plating portion of the cavity is 10 ≦ (W / Δt) ≦ 100.
Is limited to a cross-sectional shape that satisfies the formula of 20 ≦ (W / Δ
It is preferable that t) ≦ 50 is satisfied, because the reason is that if W / Δt is larger than 100, the phase separation effect of the resin due to the change in the wall thickness becomes small and the non-adhesion effect of the chemical plating layer becomes small. , W / Δt is less than 10, there is no problem in the non-adhesion effect of the chemical plating layer, but the normal 1 mm to 3 m
In the case of an injection-molded product having a wall thickness of about m, the W dimension is shortened, so the width of the unnecessary plating portion becomes small,
This is because the effect cannot be expected sufficiently.

【0008】本発明において、ポリマーアロイまたはポ
リマーブレンドとしては、メッキ可能であれば特に限定
されないが、たとえば、ポリカーボネート(以下、「P
C」と記す)、ポリプロピレン、ポリアセタール、ポリ
アミド、ポリブチレンテレフタレート、アクリロニトリ
ル−スチレン−ブタジエン共重合体(以下、「ABS」
と記す)のなどのポリマーアロイまたはポリマーブレン
ドが挙げられ、請求項2のように、ABS系樹脂のポリ
マーアロイまたはポリマーブレンドが好適に用いられ
る。
In the present invention, the polymer alloy or polymer blend is not particularly limited as long as it can be plated. For example, polycarbonate (hereinafter, referred to as "P
C "), polypropylene, polyacetal, polyamide, polybutylene terephthalate, acrylonitrile-styrene-butadiene copolymer (hereinafter," ABS ").
A polymer alloy or a polymer blend such as those described above), and as in claim 2, a polymer alloy or a polymer blend of an ABS resin is preferably used.

【0009】[0009]

【発明の実施の形態】以下に、本発明を、その実施の形
態をあらわす図面を参照しつつ詳しく説明する。この製
造方法は、樹脂基材成形工程と、メッキ工程とを備えて
いる。
BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below in detail with reference to the drawings showing the embodiments thereof. This manufacturing method includes a resin base material molding step and a plating step.

【0010】樹脂基材成形工程では、メッキ可能なポリ
マーアロイまたはポリマーブレンドを後で詳述する図2
に示す金型2のキャビティ3内に射出充填することによ
って、図1に示すような、メッキ必要部11の周囲にメ
ッキ不要部12を有する樹脂基材1を成形するようにな
っている。
In the resin substrate molding process, the plateable polymer alloy or polymer blend will be described in detail later.
By injection filling into the cavity 3 of the mold 2 shown in FIG. 1, the resin base material 1 having the plating unnecessary portion 12 around the plating required portion 11 as shown in FIG. 1 is molded.

【0011】すなわち、キャビティ3は、メッキ必要部
11に対応する部分(以下、「第1部分」と記す)31
の周囲にメッキ不要部12に対応する部分(以下、「第
2部分」と記す)32が設けられ、樹脂が、第1部分3
1の中央に設けられたゲート33からキャビティ3に充
填されるようになっているとともに、第1部分31が、
その厚みを全体にわたって略均一なクリアランスに形成
され、第2部分32が、射出樹脂の樹脂流れ方向の始端
から終端にかけての長さをW、射出成形時の樹脂の流れ
方向の始端から終端にかけての厚み徐変寸法をΔt(始
端の厚さt1−終端の厚さt2)としたとき、10≦(W
/Δt)≦100の式(1)を満足するクリアランスに
形成されている。
That is, the cavity 3 has a portion corresponding to the plating required portion 11 (hereinafter referred to as "first portion") 31.
A portion (hereinafter, referred to as a “second portion”) 32 corresponding to the plating unnecessary portion 12 is provided on the periphery of the
The cavity 33 is filled from the gate 33 provided at the center of the first portion 1, and the first portion 31 is
The second portion 32 is formed with a substantially uniform clearance throughout its thickness, and the second portion 32 has a length W from the start end to the end in the resin flow direction of the injection resin and from the start end to the end in the resin flow direction at the time of injection molding. Assuming that the thickness grading dimension is Δt (thickness t 1 at start end−thickness t 2 at end), 10 ≦ (W
/ Δt) ≦ 100, the clearance is formed to satisfy the expression (1).

【0012】そして、このキャビティ3内にポリマーア
ロイまたはポリマーブレンドを充填するのであるが、第
1部分31の中央に設けられたゲート33から第1部分
31に入り込んだ樹脂は、第1部分31の周囲方向に放
射状に広がり、第2部分32の先端に向かって流れる。
この時、第2部分32は、10≦(W/Δt)≦100
の式(1)を満足するクリアランスに形成されているの
で、第2部分32に達した樹脂は、その流速、圧力、層
流状態などの流動条件が変化し、ポリマーアロイまたは
ポリマーブレンドが相分離して変性する。したがって、
この変性によりメッキ不要部12が化学メッキしにくい
状態になる。
The cavity 3 is filled with a polymer alloy or a polymer blend, and the resin that has entered the first portion 31 from the gate 33 provided in the center of the first portion 31 has the same shape as that of the first portion 31. It spreads radially in the circumferential direction and flows toward the tip of the second portion 32.
At this time, the second portion 32 has 10 ≦ (W / Δt) ≦ 100.
Since the resin having reached the second portion 32 has a clearance satisfying the equation (1), the flow conditions such as the flow velocity, the pressure and the laminar flow state are changed, and the polymer alloy or the polymer blend is phase-separated. And degenerate. Therefore,
Due to this modification, the plating unnecessary portion 12 becomes difficult to be chemically plated.

【0013】メッキ工程では、このようにして得た樹脂
基材1の表面にまず化学メッキ処理を行うが、上記のよ
うに、メッキ不要部12は、化学メッキしにくい状態に
なっているので、ほぼメッキ必要部11のみの表面に化
学メッキ層が形成される。つぎに、樹脂基材1のメッキ
必要部11上に形成された化学メッキ層に通電して電気
メッキ層を形成し、メッキ部と、非メッキ部とを備えた
メッキ付き射出成形品を得るようになっている。
In the plating step, the surface of the resin base material 1 thus obtained is first subjected to chemical plating. However, as described above, the unnecessary plating portion 12 is in a state where it is difficult to perform chemical plating. A chemical plating layer is formed on the surface of only the plating required portion 11. Next, the chemical plating layer formed on the plating-required portion 11 of the resin base material 1 is energized to form an electroplating layer, and an injection-molded article with plating having a plating portion and a non-plating portion is obtained. It has become.

【0014】この製造方法は、以上のように、樹脂基材
としてメッキ不要部12の肉厚を10≦(W/Δt)≦
100の式を満足るように射出成形されているので、レ
ジスト塗料を塗布したり、加飾用塗料を塗布したりする
ことなく、メッキ部と非メッキ部とを備えたメッキ付き
射出成形品を得ることができる。すなわち、製造工程が
簡略化できるとともに、無用なメッキも不要となり、メ
ッキ材料も必要最小限に止めることができ、製造コスト
を低減できる。また、製品表面の溝等を設けなくてもよ
いため、意匠面での制約もなくなる。
In this manufacturing method, as described above, the wall thickness of the plating unnecessary portion 12 as the resin base material is 10 ≦ (W / Δt) ≦.
Since it is injection-molded so as to satisfy the formula of 100, a plated injection-molded article having a plated portion and a non-plated portion can be obtained without applying a resist paint or a decorative paint. Obtainable. That is, the manufacturing process can be simplified, unnecessary plating is unnecessary, the plating material can be kept to a necessary minimum, and the manufacturing cost can be reduced. Further, since it is not necessary to provide a groove or the like on the surface of the product, there is no restriction in terms of design.

【0015】本発明は、上記の実施の形態に限定されな
い。たとえば、上記の実施の形態では、ゲート33が1
点であったが、多点ゲートを用いるようにしても構わな
い。また、上記の実施の形態では、樹脂基材1のメッキ
必要部11の周囲にメッキ不要部12が設けられていた
が、樹脂基材1の一端がメッキ必要部で他端がメッキ不
要部となっているようなものでも構わない。
The present invention is not limited to the above embodiment. For example, in the above embodiment, the gate 33 is 1
Although it is a point, a multipoint gate may be used. Further, in the above embodiment, the plating unnecessary portion 12 is provided around the plating required portion 11 of the resin base material 1. However, one end of the resin base material 1 is a plating required portion and the other end is a plating unnecessary portion. It does not matter if it is

【0016】[0016]

【実施例】以下に、本発明の具体的な実施例をその比較
例と対比させながら詳しく説明する。
EXAMPLES Specific examples of the present invention will be described in detail below in comparison with comparative examples.

【0017】(実施例1)図2に示す各部の寸法が以下
の通りである金型2にPC/ABSポリマーアロイを射
出成形して得た樹脂基材に化学メッキ処理した。 〔各部寸法〕 L1=130mm,L2=100mm,L3=74mm,
4=45mm,t1=2.0mm,t2=3.0mm,
W=40mm,W/Δt=40
Example 1 A resin base material obtained by injection-molding a PC / ABS polymer alloy in a mold 2 whose dimensions shown in FIG. 2 are as follows was subjected to chemical plating. [Dimensions of each part] L 1 = 130 mm, L 2 = 100 mm, L 3 = 74 mm,
L 4 = 45 mm, t 1 = 2.0 mm, t 2 = 3.0 mm,
W = 40mm, W / Δt = 40

【0018】(実施例2)図2に示す各部の寸法が以下
の通りである金型2にPC/ABSポリマーアロイを射
出成形して得た樹脂基材に化学メッキ処理した。 〔各部寸法〕 L1=130mm,L2=100mm,L3=74mm,
4=45mm,t1=2.5mm,t2=3.0mm,
W=40mm,W/Δt=80
Example 2 A resin base material obtained by injection-molding a PC / ABS polymer alloy into a mold 2 having the dimensions shown in FIG. 2 as follows was subjected to chemical plating. [Dimensions of each part] L 1 = 130 mm, L 2 = 100 mm, L 3 = 74 mm,
L 4 = 45 mm, t 1 = 2.5 mm, t 2 = 3.0 mm,
W = 40mm, W / Δt = 80

【0019】(比較例1)図2に示す各部の寸法が以下
の通りである金型2にPC/ABSポリマーアロイを射
出成形して得た樹脂基材に化学メッキ処理した。 〔各部寸法〕 L1=130mm,L2=100mm,L3=74mm,
4=45mm,t1=2.5mm,t2=2.8mm,
W=40mm,W/Δt=133
(Comparative Example 1) A resin base material obtained by injection-molding a PC / ABS polymer alloy into a mold 2 whose dimensions shown in FIG. 2 are as follows was subjected to chemical plating. [Dimensions of each part] L 1 = 130 mm, L 2 = 100 mm, L 3 = 74 mm,
L 4 = 45 mm, t 1 = 2.5 mm, t 2 = 2.8 mm,
W = 40mm, W / Δt = 133

【0020】上記実施例1,2および比較例1で得られ
たメッキ付き射出成形品のメッキ不要部のメッキ非付着
性を目視で調べその結果を表1に示した。なお、表1
中、○は表面にメッキが付着しなかった、×は表面にメ
ッキが付着した、をそれぞれ表す。
The non-plating properties of the non-plating portions of the plated injection-molded articles obtained in Examples 1 and 2 and Comparative Example 1 were visually examined and the results are shown in Table 1. In addition, Table 1
In the table, ◯ means that the plating did not adhere to the surface, and x means that the plating adhered to the surface.

【0021】[0021]

【表1】 [Table 1]

【0022】上記表1から、本発明の製造方法によれ
ば、樹脂基材の非メッキ部となるメッキ不要部の肉厚を
制御するだけで、メッキ時にメッキ不要部表面にメッキ
が付着しないことがよくわかる。
From Table 1 above, according to the manufacturing method of the present invention, the plating does not adhere to the surface of the unplated portion at the time of plating, only by controlling the thickness of the unplated portion which is the non-plated portion of the resin base material. Understand well.

【0023】[0023]

【発明の効果】本発明にかかるメッキ付き射出成形品の
製造方法は、以上のように、樹脂基材の非メッキ部とな
るメッキ不要部の肉厚を制御するだけで、メッキ時にメ
ッキ不要部表面にメッキが付着しない。したがって、製
造工程が簡略化できるとともに、メッキ材料も最小限に
止めることができ、製造コストを低減できる。また、製
品の意匠面で制約もなく、自由な形状にすることができ
る。
As described above, the method of manufacturing an injection-molded product with plating according to the present invention can be achieved by simply controlling the thickness of the non-plating part which is the non-plating part of the resin base material and the plating-free part at the time of plating. No plating adheres to the surface. Therefore, the manufacturing process can be simplified, the plating material can be minimized, and the manufacturing cost can be reduced. Further, there is no restriction on the design of the product, and the product can have any shape.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明にかかるメッキ付き射出成形品の製造方
法の1つの実施の形態に使用する樹脂基材の1例をあら
わし、同図(a)はその平面図、同図(b)は同図
(a)のX−X線断面図である。
1A and 1B show an example of a resin base material used in one embodiment of a method for producing a plated injection-molded product according to the present invention, where FIG. 1A is a plan view thereof and FIG. It is the XX sectional view taken on the line of FIG.

【図2】図1の樹脂基材を成形するための金型の断面図
である。
2 is a cross-sectional view of a mold for molding the resin base material of FIG.

【符号の説明】[Explanation of symbols]

1 樹脂基材 11 メッキ必要部 12 メッキ不要部 2 樹脂基材 3 キャビティ 32 厚み徐変部分(第2部分) 1 resin base material 11 Required plating area 12 No plating required 2 Resin base material 3 cavities 32 Gradual thickness change part (2nd part)

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】メッキ必要部に隣接してメッキ不要部を有
する樹脂基材の、前記メッキ必要部のみにメッキ層を形
成するメッキ付き射出成形品の製造方法において、キャ
ビティ内にメッキ不要部に対応する厚み徐変部分を有
し、この厚み徐変部分の断面形状が、10≦(W/Δ
t)≦100の式(1)を満足する金型のキャビティ内
に、ポリマーアロイまたはポリマーブレンドを、キャビ
ティの前記メッキ必要部に対応する部分側からキ前記メ
ッキ不要部に対応する側に向かって流れるように射出充
填し、樹脂基材を得たのち、少なくとも樹脂基材の表面
全体に化学メッキ処理を行うことを特徴とするメッキ付
き射出成形品の製造方法(但し、式(1)中、Wは、キ
ャビティの厚み徐変部分の射出樹脂の樹脂流れ方向の始
端から終端にかけての長さ、Δtは、厚み徐変部分の射
出樹脂の樹脂流れ方向の始端から終端にかけてのキャビ
ティの厚み変化寸法である。)。
1. A method of manufacturing a plated injection-molded article, wherein a plating layer is formed only on the plating required portion of a resin base material having a plating unnecessary portion adjacent to the plating required portion, wherein There is a corresponding gradually changing thickness portion, and the cross-sectional shape of this gradually changing thickness portion is 10 ≦ (W / Δ
t) ≦ 100 In a cavity of a mold satisfying the formula (1), a polymer alloy or a polymer blend is passed from the side of the cavity corresponding to the portion requiring plating to the side corresponding to the portion requiring no plating. A method for producing a plated injection-molded article, wherein at least the entire surface of the resin base material is subjected to chemical plating after injection-filling in a flowable manner to obtain a resin base material (however, in the formula (1), W is the length from the start end to the end of the injection resin in the resin flow direction of the gradually changing thickness portion of the cavity, and Δt is the thickness change dimension of the cavity from the start end to the end of the injection resin in the resin flow direction of the gradually changing thickness portion. It is.)
【請求項2】ポリマーアロイまたはポリマーブレンド
が、アクリロニトリル−スチレン−ブタジエン共重合体
系樹脂である請求項1に記載のメッキ付き射出成形品の
製造方法。
2. The method for producing a plated injection-molded article according to claim 1, wherein the polymer alloy or polymer blend is an acrylonitrile-styrene-butadiene copolymer resin.
JP2002148112A 2002-05-22 2002-05-22 Method for manufacturing plated injection molding Pending JP2003334843A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002148112A JP2003334843A (en) 2002-05-22 2002-05-22 Method for manufacturing plated injection molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002148112A JP2003334843A (en) 2002-05-22 2002-05-22 Method for manufacturing plated injection molding

Publications (1)

Publication Number Publication Date
JP2003334843A true JP2003334843A (en) 2003-11-25

Family

ID=29706205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002148112A Pending JP2003334843A (en) 2002-05-22 2002-05-22 Method for manufacturing plated injection molding

Country Status (1)

Country Link
JP (1) JP2003334843A (en)

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