200950647 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種電子裝置殼體及其製造方法。 . 【先前技術】 隨著電子技術之迅速發展，筆記本電腦、移動電話、 個人數位助理（PDA)等電子裝置得到了越來越廣泛地應 用。同時，人們對於電子裝置之外觀要求亦越來越高。電 子裝置殼體一般由金屬或塑膠製成，由於金屬殼體具有強 〇 度高、電磁遮罩效果好等特點而被廣泛應用於電子裝置 中。 當採用金屬殼體時，為了防止電磁遮罩影響作號收 發，電子裝置殼體之天線蓋部位通常採用塑膠製造，然後 藉由卡勾卡合或鉚接等方式將塑膠製造之天線蓋固定於 金屬殼體上即可。惟，卡勾卡合及鉚接之方式容易產生間 隙大、易鬆動等缺陷，而影響產品之強度及外觀。隨著電 ❹ 子產品日趨輕、薄、短、小之發展趨勢，電子裝置殼體之 厚度亦將越來越趨向於薄型化，當電子裝置殼體之厚度減 小到一定程度’採用卡勾卡合及鉚接之方式容易產生斷裂 應力而影響產品之強度。上述結合方式之缺陷及局限性會 伴隨電子產品薄型化之趨勢愈發突出。 【發明内容】 鑒於上述狀況’有必要提供一種電子裝置殼體及其製 造方法’尤其係一種強度高、外形美觀且適於薄型化設計 之電子裝置殼體及其製造方法。 7 200950647 一種電子裝置殼體，包括金屬本體及塑膠天線蓋，該 金屬本體與該塑膠天線蓋採用嵌入成型技術一體成型，其 結合處之外表面為一平滑面，且該平滑面上形成有一連貫 . 之塗層。 一種電子裝置殼體之製造方法，包括以下步驟：提供 一金屬本體；將該金屬本體作為嵌件，藉由嵌入成型技術 將一塑膠天線蓋與該金屬本體一體成型，且該金屬本體與 該塑膠天線蓋之結合處之外表面為一平滑面；對該一體成 〇 型後之電子裝置殼體之外表面進行塗裝，而於該平滑面上 形成一連貫之塗廣。 上述電子裝置殼體之金屬本體與塑膠天線蓋藉由嵌 入成型技術一體成型，具有較高之結合強度。且金屬本體 與塑膠天線蓋之結合處之外表面為一平滑面，並形成有一 連貫之塗層，該塗層對電子裝置殼體起到保護及裝飾作 用，使得金屬本體與塑膠天線蓋之結合處看不到接合痕 跡，產品外形美觀。同時，嵌入成型技術可滿足較為多樣 化之產品設計需求，適於製造具有較薄厚度之電子裝置殼 體。 【實施方式】 下面將結合附圖及較佳實施例對本發明之電子裝置 殼體及其製造方法作進一步地詳細說明。 請參見圖1，所示為本發明較佳實施例之電子裝置殼 體10,其包括一金屬本體11及一塑膠天線蓋12。 金屬本體11大體為一矩形金屬蓋板，其一侧邊設置有 8 200950647 複數扣合部110,用以於成型過程中與塑膠天線蓋i2緊密 扣合而形成扣合結構。金屬本體u採用合金材料製造，優 選採用鎮合金、銘合金或鈦合金製造。 ， ㈣天線蓋12大體為—長條裝蓋板，其可成型於金屬 •本體11設置有扣合部110之-側邊處。塑膠天線蓋12之材料 要求與金屬本體11之材料具有較好之融合性，例如具有較 小之縮水率及與金屬本體i i之材料近似之線膨脹係數。 故，塑膠天線蓋12優選採用液晶高分子聚合物（ΐχ：ρ)、聚 苯硫喊（PPS)、聚對苯二甲酸丁二醇醋(ρΒτ)等工程塑料 製造。 請同時參見圖2與圖3，電子裝置殼體1〇之金屬本體η 與塑膠天線蓋12之結合處之外表面為一平滑面，且形成有 一連貫之塗層13，使金屬本體u與塑膠天線蓋12之結合處 看不到接合痕跡。同時，金屬本體u與塑膠天線蓋12之結 合面為台階面14，採用台階面14可有效增大金屬本體11與 ❹塑膠天線蓋12之間之結合面積，從而有助於提高其結合強 度。 塗層13之厚度為30微米至90微米，其主要成分包括成 膜物質、顏料以及溶劑、助劑等。成膜物質主要為樹脂， 了選自t乙烯（PE)、聚丙婦（pp)、聚氯乙浠（ρν〇）、 1笨乙稀（PS)、聚氨脂（PU)、脲搭樹脂（UF)、紛搭樹 脂（PF)、乙烯橡（ER)、丙烯腈-丁二烯丙烯-苯乙烯共聚 物（ABS )、聚甲基丙稀酸曱酯（PMMA)、聚碳酸脂（PC)、 聚四氟乙烯（PTFE)、聚醯亞胺（PI)等。顏料可選自鈦 9 200950647 添加阻燃劑 白粉、碳黑及氧化鐵紅等。溶劑可選自有機溶劑，如乙醇 丙酮、脂類以及苯類等有機溶劑。助劑可為發泡劑、增塑 劑、潤滑劑、穩定劑、阻燃劑、著色劑、交聯劑等，用r 改進塗層之相應特性。例如，添加發泡劑可改變塗層之密 度、硬度、隔音、吸振、隔熱與輕量等特性 ' 可使塗層產生耐燃特性 上述電子裝置殼體10之製造方法包括以下步驟： Ο200950647 IX. Description of the Invention: [Technical Field] The present invention relates to an electronic device housing and a method of manufacturing the same. [Prior Art] With the rapid development of electronic technology, electronic devices such as notebook computers, mobile phones, and personal digital assistants (PDAs) have become more and more widely used. At the same time, people are increasingly demanding the appearance of electronic devices. The electronic device housing is generally made of metal or plastic, and is widely used in electronic devices due to its high strength and good electromagnetic shielding effect. When the metal casing is used, in order to prevent the electromagnetic shielding from affecting the transmission and reception of the signal, the antenna cover portion of the electronic device casing is usually made of plastic, and then the plastic antenna cover is fixed to the metal by hooking or riveting. It can be on the housing. However, the manner in which the hooks are engaged and riveted is prone to defects such as large gaps and looseness, which affect the strength and appearance of the product. With the trend of lighter, thinner, shorter and smaller electronic products, the thickness of the electronic device housing will become thinner and thinner. When the thickness of the electronic device housing is reduced to a certain extent, The manner of snapping and riveting is prone to break stress and affects the strength of the product. The shortcomings and limitations of the above-mentioned combination methods are accompanied by the trend of thinning electronic products. SUMMARY OF THE INVENTION In view of the above circumstances, it is necessary to provide an electronic device housing and a method of manufacturing the same, which is particularly an electronic device housing having a high strength, a beautiful appearance, and a thin design, and a method of manufacturing the same. 7 200950647 An electronic device housing comprising a metal body and a plastic antenna cover, the metal body and the plastic antenna cover are integrally formed by insert molding technology, the outer surface of the joint is a smooth surface, and the smooth surface is formed with a coherent surface . Coating. A manufacturing method of an electronic device housing, comprising the steps of: providing a metal body; using the metal body as an insert, integrally molding a plastic antenna cover with the metal body by insert molding technology, and the metal body and the plastic body The outer surface of the joint of the antenna cover is a smooth surface; the outer surface of the integrated electronic device casing is coated, and a continuous coating is formed on the smooth surface. The metal body of the electronic device housing and the plastic antenna cover are integrally formed by the insert molding technology, and have high bonding strength. The outer surface of the joint between the metal body and the plastic antenna cover is a smooth surface, and a continuous coating is formed, which protects and decorates the electronic device casing, so that the metal body and the plastic antenna cover are combined. The joint marks are not visible, and the appearance of the product is beautiful. At the same time, the insert molding technology can meet the needs of more diverse product designs and is suitable for the manufacture of electronic device housings with thinner thicknesses. [Embodiment] Hereinafter, an electronic device casing and a method of manufacturing the same according to the present invention will be further described in detail with reference to the accompanying drawings and preferred embodiments. Referring to FIG. 1, an electronic device housing 10 according to a preferred embodiment of the present invention includes a metal body 11 and a plastic antenna cover 12. The metal body 11 is generally a rectangular metal cover plate, and one side of the metal body 11 is provided with 8 200950647 plurality of fastening portions 110 for tightly engaging with the plastic antenna cover i2 during the forming process to form a fastening structure. The metal body u is made of an alloy material, preferably made of a town alloy, an alloy or a titanium alloy. (4) The antenna cover 12 is generally a long-length cover plate which can be formed on the metal. The body 11 is provided at the side of the fastening portion 110. The material of the plastic antenna cover 12 is required to have a good fusion with the material of the metal body 11, for example, a smaller shrinkage ratio and a linear expansion coefficient similar to that of the metal body i i . Therefore, the plastic antenna cover 12 is preferably made of an engineering plastic such as liquid crystal polymer (ΐχ:ρ), polyphenylene sulfide (PPS), or polybutylene terephthalate (ρΒτ). Referring to FIG. 2 and FIG. 3 simultaneously, the outer surface of the joint of the metal body η of the electronic device housing 1 and the plastic antenna cover 12 is a smooth surface, and a continuous coating 13 is formed to make the metal body u and the plastic. No joint marks are seen at the junction of the antenna cover 12. At the same time, the joint surface of the metal body u and the plastic antenna cover 12 is a stepped surface 14. The use of the stepped surface 14 can effectively increase the joint area between the metal body 11 and the plastic antenna cover 12, thereby contributing to the improvement of the bonding strength. The thickness of the coating layer 13 is from 30 μm to 90 μm, and its main components include a film-forming substance, a pigment, and a solvent, an auxiliary agent and the like. The film-forming substance is mainly a resin selected from the group consisting of t-ethylene (PE), polypropylene (pp), polychloroethylene (ρν〇), 1 stupid (PS), polyurethane (PU), and urea resin ( UF), versatile resin (PF), ethylene rubber (ER), acrylonitrile-butadiene propylene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polycarbonate (PC) , polytetrafluoroethylene (PTFE), polyimine (PI), and the like. The pigment may be selected from titanium 9 200950647 Adding flame retardant White powder, carbon black and iron oxide red. The solvent may be selected from organic solvents such as ethanol, acetone, lipids, and organic solvents such as benzene. The auxiliary agent may be a foaming agent, a plasticizer, a lubricant, a stabilizer, a flame retardant, a colorant, a crosslinking agent, etc., and the corresponding characteristics of the coating are improved by r. For example, the addition of a foaming agent can change the density, hardness, sound insulation, vibration absorption, heat insulation and light weight of the coating. The flame retardant properties of the coating can be produced. The manufacturing method of the electronic device housing 10 includes the following steps:
(1) 提供一金屬本體11。提供金屬本體1;1之方法可 為：利用鑄造、擠出、鍛造、沖壓等各種金屬生產方法製 備該金屬本體11，優選採用壓铸方法製備金屬本體η。 (2) 將金屬本體11作為嵌件，藉由嵌入成型技術將一 塑膠天線蓋12與該金屬本體1:1一體成型，且金屬本體11與 塑膠天線蓋12之結合處之外表面為一平滑面。即將金屬本 體11作為嵌件放入射出成型模具之模腔内，然後將熔融之 塑膠注入射出成型模具之模腔内，熔融之塑膠與金屬本體 11接合固化即形成塑膠天線蓋12。 (3) 對一體成型後之電子裝置殼體1〇之外表面進行塗 裝’而於該電子裝置殼體1〇之外表面形成一連貫之塗層 13。首先對電子裝置殼體1〇進行清洗、脫脂，並進行化成 處理以形成塗裝前之底層，然後再對電子裝置殼體1〇之外 表面進行塗裝，塗裝工序可採用烤漆或喷漆等方式，優選 以烤漆之方式於電子裝置殼體10之外表面形成連貫之塗 層13。 可以理解，步驟（1)後，可首先對金屬本體21進行打磨 200950647 去除毛邊，並對金屬本體11進行化學處理’如微弧氧化、 陽極氧化等，用以於金屬本體11與塑膠天線蓋12之結合面 上形成一層接合膜，從而增強其結合力。步驟(2)後’可對 .一體成型後之金屬本體11及塑膠天線蓋12進行打磨’去除 . 塑膠天線蓋12之澆口及毛邊。 請同時參見圖4至圖6,為了進一步增強金屬本體11與 塑膠天線蓋12之間之結合強度，其結合處還形成有第一扣 合結構15、第二扣合結構16、第三扣合結構17以及第四扣 ❹ 合結構18。該第一扣合結構15藉由以下方式形成：步驟（1) 後，採用數控機床(Computer Number Control，CNC)於金 屬本體11之一側邊加工形成一階梯孔111，階梯孔111位於 電子裝置殼體10内表面一端之孔徑大於位於電子裝置殼 體10外表面一端之孔徑；嵌入成型時，熔融之塑膠流入階 梯孔111中並將階梯孔111充滿，冷卻後即於金屬本體1：^與 塑膠天線蓋12之結合處形成第一扣合結構15。 ❹ 請同時參見圖5與圖7,該第二扣合結構“藉由以下方 式形成：採用數控機床於金屬本體u之一側邊處加工形成 至少一卡勾112;嵌入成型時，熔融之塑膠包覆該卡勾112, 冷卻後即於金屬本體11與塑膠天線蓋12之結合處形成第 二扣合結構16。 凊同時參見圖5與圖8，該第三扣合結構17藉由以下方 式形成：採用數控機床於金屬本體u之一侧邊處加工形成 至> 一通孔113 ,嵌入成型時，熔融之塑膠流入通孔113内 並將通孔113充滿’冷卻後即於金屬本體1;1與塑膠天線蓋12 11 200950647 之結合處形成第三扣合結構17。 請同時參見圖5與圖9，該第四扣合結構18藉由以下方 式形成：採用數控機床於金屬本體11之一側邊處加工形成 . 至少一凸台114 ’該凸台114上形成有二卡勾1141 ;嵌入成 . 型時，熔融之塑膠包覆該凸台114之外表面，並包覆二卡 勾1141，冷卻後即於金屬本體11與塑膠天線蓋12之結合處 形成第四扣合結構18。 可以理解’階梯孔111、卡勾112、通孔113以及凸台114 ❾ 除採用數控機床加工形成以外，亦可於採用鑄造方式製備 金屬本體11之過程中直接形成。 由於電子裝置殼體10之金屬本體11與塑膠天線蓋12 藉由嵌入成型技術一體成型，其結合處貼合緊密，無間 隙’從而具有較高之結合強度。且金屬本體U與塑膠天線 蓋12之結合面為台階面14，結合面積較大，有助於提高其 結合強度。進一步地’金屬本體11與塑膠天線蓋12之結合 ❹ 處還形成有第一扣合結構15、第二扣合結構16、第三扣合 結構17以及第四扣合結構18 ’確保電子裝置殼體1〇具有更 高之強度。同時，金屬本體11與塑膠天線蓋12之結合處之 外表面為一平滑面，且形成有一連貫之塗層該塗層13 對電子裝置殼體10起到保護及裝飾作用，使得金屬本體 與塑膠天線蓋12之結合處看不到接合痕跡，產品外形美 觀。另，嵌入成型技術可滿足較為多樣化之產品設計需 求’適於製造較薄之電子裝置殼體。同時金屬本體只與塑 膠天線蓋12之結合處之台階面14與第一扣合結構15、第二 12 200950647 彳&釔構16、第二扣合結構ι7及第四扣合結構“可保證較 薄之電子裝置殻體具有較高之強度。 可以理解，扣合部110除階梯孔111、卡勾112、通孔113 .以及凸台114以外，還可變更為其他結構，以滿足產品多 合方式。根據產品之設計要求，金屬本體11與塑 ΓΠ2結合處可選用台階面14、第-扣合結構15、第 其第三扣合結構17以及第一 ❹ 出合發明專利要件’麦依法提 舉凡熟悉本案技蔹之人士為本發明之較佳實施例， 效修飾或變化，；應包含於明精神所作之等 【圖式簡單說明】、以下之申凊專利範圍内。 圖1係本發明電子裝置殼體之立體分解圖。 圖 ❹ 圖2係本發明電子裝置殼體-體成型後之正面示意 圖3係圖2所示電子裝置殼體之局部立體剖視圖。 圖 圖4係本發明電子裝置殼體—體成型後之背面示意 圖5係圖4所示電子裝置殼體另一方向之局部放大圖。 圖6係圖5所示電子襄置殼體沿νι_νι線之局部剖視圖。 圖 圖7係圖5所示電子裝置殼體沿νιι_νπ線之局部剖視 圖8係圖5所示電子裂置殼體沿vm_ vm線之局部剖視 13 200950647 圖。 圖9係圖5所示電子裝置殼體沿IX-IX線之局部剖視圖。 【主要元件符號說明】 電子裝置殼體 10 金屬本體 11 扣合部 110 塑膠天線蓋 12 塗層 13 台階面 14 第一扣合結構 15 第二扣合結構 16 第三扣合結構 17 第四扣合結構 18 階梯孔 111 卡勾 112 通孔 113 凸台 114 卡勾 1141(1) A metal body 11 is provided. The method of providing the metal body 1; 1 may be: preparing the metal body 11 by various metal production methods such as casting, extrusion, forging, stamping, etc., preferably by using a die casting method to prepare the metal body η. (2) Using the metal body 11 as an insert, a plastic antenna cover 12 is integrally formed with the metal body 1:1 by insert molding technology, and the outer surface of the joint of the metal body 11 and the plastic antenna cover 12 is smoothed. surface. That is, the metal body 11 is placed as an insert into the cavity of the molding die, and then the molten plastic is injected into the cavity of the injection molding die, and the molten plastic is bonded to the metal body 11 to form the plastic antenna cover 12. (3) The outer surface of the integrally formed electronic device casing 1 is coated, and a continuous coating 13 is formed on the outer surface of the electronic device casing 1 . First, the electronic device casing 1 is cleaned, degreased, and chemicalized to form a bottom layer before painting, and then the outer surface of the electronic device casing 1 is coated. The painting process may be painted or painted. In a manner, a continuous coating 13 is preferably formed on the outer surface of the electronic device housing 10 in a manner of baking paint. It can be understood that, after the step (1), the metal body 21 can be first polished 200950647 to remove the burrs, and the metal body 11 is chemically treated, such as micro-arc oxidation, anodizing, etc., for the metal body 11 and the plastic antenna cover 12 A bonding film is formed on the bonding surface to enhance the bonding force. After the step (2), the metal body 11 and the plastic antenna cover 12 after the integral molding are polished and removed. The gate and the burr of the plastic antenna cover 12. Referring to FIG. 4 to FIG. 6 simultaneously, in order to further strengthen the bonding strength between the metal body 11 and the plastic antenna cover 12, the joint portion is further formed with a first fastening structure 15, a second fastening structure 16, and a third fastening. Structure 17 and fourth snap fit structure 18. The first fastening structure 15 is formed by the following steps: after step (1), a stepped hole 111 is formed on one side of the metal body 11 by using a computer numerical control (CNC), and the stepped hole 111 is located in the electronic device. The aperture of one end of the inner surface of the housing 10 is larger than the aperture of one end of the outer surface of the electronic device housing 10; when insert molding, the molten plastic flows into the stepped hole 111 and fills the stepped hole 111, and after cooling, the metal body is: The junction of the plastic antenna cover 12 forms a first fastening structure 15. ❹ Referring to FIG. 5 and FIG. 7 simultaneously, the second fastening structure is formed by: forming at least one hook 112 on one side of the metal body u by using a numerical control machine tool; and melting the plastic when insert molding After the hook 112 is covered, the second fastening structure 16 is formed at the junction of the metal body 11 and the plastic antenna cover 12 after cooling. Referring to FIG. 5 and FIG. 8 simultaneously, the third fastening structure 17 is obtained by the following manner. Forming: using a numerical control machine tool to form a through hole 113 at one side of the metal body u, insert molding, the molten plastic flows into the through hole 113 and fills the through hole 113 'cooled, that is, the metal body 1; 1 and a combination of the plastic antenna cover 12 11 200950647 to form a third fastening structure 17. Referring to FIG. 5 and FIG. 9 simultaneously, the fourth fastening structure 18 is formed by using a numerical control machine tool in one of the metal bodies 11 Formed at the side. At least one boss 114' has two hooks 1141 formed on the boss 114; when embedded into the type, the molten plastic covers the outer surface of the boss 114 and is covered with the two hooks 1141 After cooling, the metal body 11 and the plastic antenna The joint of the cover 12 forms a fourth fastening structure 18. It can be understood that the stepped hole 111, the hook 112, the through hole 113 and the boss 114 are formed by machining by a numerically controlled machine tool, and the metal body 11 can also be prepared by casting. The metal body 11 of the electronic device housing 10 and the plastic antenna cover 12 are integrally formed by insert molding technology, and the joints thereof are tightly fitted, without gaps, thereby having a high bonding strength. The bonding surface of the U and the plastic antenna cover 12 is a stepped surface 14, and the bonding area is large, which helps to improve the bonding strength. Further, the first fastening structure is formed at the joint of the metal body 11 and the plastic antenna cover 12. 15. The second fastening structure 16, the third fastening structure 17, and the fourth fastening structure 18' ensure that the electronic device housing 1 has a higher strength. Meanwhile, the metal body 11 and the plastic antenna cover 12 are combined. The outer surface is a smooth surface, and a continuous coating is formed. The coating 13 protects and decorates the electronic device casing 10, so that the metal body and the plastic antenna cover 12 are combined. The product has a beautiful appearance. In addition, the embedded molding technology can meet the needs of more diversified product design. It is suitable for manufacturing a thin electronic device housing. At the same time, the metal body only has a stepped surface at the junction with the plastic antenna cover 12. 14 and the first fastening structure 15, the second 12 200950647 彳 & structure 16, the second fastening structure ι7 and the fourth fastening structure "can ensure a relatively thin electronic device housing has a higher strength. It can be understood that the engaging portion 110 can be changed to other structures in addition to the stepped hole 111, the hook 112, the through hole 113, and the boss 114 to satisfy the product multiplexing mode. According to the design requirements of the product, the joint of the metal body 11 and the plastic raft 2 can be selected from the step surface 14, the first-fastening structure 15, the third fastening structure 17 and the first ❹ 发明 invention patent element The person skilled in the art is a preferred embodiment of the invention, and the modifications or variations thereof are included in the scope of the following claims. 1 is an exploded perspective view of a housing of an electronic device of the present invention. Figure 2 is a front perspective view of the electronic device housing of the present invention. Figure 3 is a partial perspective cross-sectional view of the electronic device housing of Figure 2. Figure 4 is a rear view of the electronic device housing of the present invention after body molding. Figure 5 is a partial enlarged view of the electronic device housing shown in Figure 4 in another direction. Figure 6 is a partial cross-sectional view of the electronic housing of Figure 5 taken along the line νι_νι. Figure 7 is a partial cross-sectional view of the electronic device housing of Figure 5 taken along the line νιινν. Figure 8 is a partial cross-sectional view of the electronically-split housing of Figure 5 along the line vm_vm 13 200950647. Figure 9 is a partial cross-sectional view of the electronic device housing of Figure 5 taken along line IX-IX. [Description of main component symbols] Electronic device housing 10 Metal body 11 Fastening portion 110 Plastic antenna cover 12 Coating 13 Stepped surface 14 First fastening structure 15 Second fastening structure 16 Third fastening structure 17 Fourth fastening Structure 18 stepped hole 111 hook 112 through hole 113 boss 114 hook 1141